微米金刚石薄膜的制备与场发射研究

利用微波等离子体化学气相沉积（MPCVD）法,在镀金属钛层的陶瓷基底上面,调整优化沉积参数,制备出了碳膜。通过各种仪器分析了碳膜的内部结构和表面形貌,证明该碳膜是微米金刚石薄膜。进一步将微米金刚石薄膜作为场发射阴极材料,测试了其场致电子发射特性。稳定发射状态下的开启电场为1.15V/μm, 在3.35V/μm的电场下,其场发射电流密度为0.81mA/cm2,发射点密度约为104/ cm2。并对其发射机理进行了研究。     

过渡层对类球状微米金刚石聚晶的场发射影响

在陶瓷衬底上通过磁控溅射方法镀上金属Ti层后,改用CH4为溅射气体制备一层碳化物过渡层,利用微波等离子体化学气相沉积(MPCVD)法制备出类球状微米金刚石聚晶薄膜。利用扫描电子显微镜、拉曼光谱和x-射线衍射分析了薄膜的结构和表面形貌。测试了类球状微米金刚石聚晶膜的场致电子发射特性,有过渡层制备的类球状微米金刚石聚晶膜的场发射开启电场仅为0.9V/μm,在2.5V/μm的发射电场下电流密度是10.8mA/cm2,而无过渡层制备的类球状微米金刚石聚晶膜的开启电场为1.27V/μm,在2.5V/μm的发射电场下电流密度是0.5mA/cm2。实验结果表明,有碳化物过渡层的类球状微米金刚石聚晶薄膜的场发射特性效果更好。     

脉冲激光沉积非晶碳-聚酰亚胺复合薄膜的场致电子发射研究

利用脉冲激光沉积技术制备出非晶碳-聚酰亚胺复合薄膜,并观察到其场发射阈值场强(4V/μm)比类金刚石薄膜(>12V/μm)有较大的降低,最大发射电流密度为1.2mA/cm~2.利用透明导电薄膜阳极技术可观察电子在薄膜阴极表面的发射位置.并对该复合薄膜的场电子发射机理进行了初步探讨.实验表明该复合薄膜有可能作为一种新型的场发射冷阴极材料.在平面显示器件中得到应用.     

衬底温度对氧化锌薄膜场发射性能的影响

利用射频磁控溅射法制备了不同衬底温度的氧化锌(ZnO)薄膜.研究了其场发射特性,分析了场发射特性和衬底温度的变化关系.实验结果表明, 开启电场随着衬底温度的增加呈先增大后减小的趋势,场发射特性的变化是由于衬底温度的改变引起表面形貌的变化所致.衬底温度为300 ℃时沉积的ZnO薄膜样品粗糙度最小,场发射性能最差,其开启场强为1.7 V/μm,场强为3.8 V/μm时电流密度仅为0.001 97 A/cm2;衬底温度为400 ℃时沉积的ZnO薄膜样品表面粗糙度最大,场发射特性也优于其他薄膜;开启场强为0.82 V/μm, 场强为3.8 V/μm时电流密度稳定在0.03 A/cm2.Fowler-Nordheim(F-N)曲线为直线表明, 电子是在外加电场的作用下隧穿表面势垒束缚发射到真空的.     

多孔硅衬底微波CVD金刚石薄膜的制备及其场电子发射

研究了多孔硅衬底微波CVD金刚石薄膜的制备工艺及其场电子发射特性.以多孔硅作为生长金刚石突起阵列的模板,生长出带多微尖的微晶金刚石晶粒,使场电子发射阈值下降(<1V/ μm) ,发射电流增大(>90 m A/ cm2 ) ,场发射性能稳定,并对这种场发射特性做出了理论解释.     

大功率准分子激光制备类金刚石膜及场发射性能

采用大功率高重复频率准分子激光溅射热解石墨靶制备了类金刚石膜,研究了激光功率密度和重复频率对类金刚石膜的结构及场发射性能的影响.保持重复频率不变,提高激光功率密度可提高膜中sp3键碳的含量和膜的场发射性能;在最佳激光功率密度下,当重复频率由200 Hz提高到500 Hz,膜中sp3键碳的含量和膜的场发射性能先提高,后降低,在300 Hz时达到最佳.在300 Hz重复频率、1010W/cm2激光功率密度下.膜的发射阈值电场为26 V/μm,在34 V/μm的电场下测得电流密度为14μA/cm2.根据类金刚石膜的场发射机理对上述结果进行了分析解释.     

CuCr合金催化剂制备条件对大电流CNTs阴极的影响

通过改变溅射功率以磁控溅射法制备了Cu/Cr合金催化剂,研究了化学气相沉积法制备的碳纳米管(CNTs)作为大电流密度场发射阴极的场发射性能。采用扫描电镜和场发射测试仪分别对不同功率催化剂制备的CNTs进行了形貌及性能分析。结果表明,根据溅射功率与催化剂颗粒的关系,可以通过调节溅射功率改变CNTs的长径比及密度,在250WCu/Cr催化剂制备的CNTs薄膜具备了良好的场发射性能,阴极电子发射的开启电场仅为1.47V/μm,当电场为3.23V/μm,发射电流密度可高达3259μA/cm2。     

沉积气压对氮化硼薄膜场发射特性的影响

利用等离子体增强脉冲激光沉积系统,在n型Si(100)基底上沉积了不同沉积气压下的纳米BN薄膜,利用红外光谱(FTIR)对BN薄膜进行了表征.通过原子力显微镜(AFM)观察了薄膜的表面形貌.在超高真空(＜5.0×10-7 Pa)情况下测量了薄膜的场致发射特性.实验结果表明,沉积气压对BN薄膜的场发射特性影响很大.BN薄膜的阈值电场随着沉积气压的升高而升高,发射极限电流随着沉积气压的升高而较小,但耐压特性提高.沉积气压为2 Pa时沉积的BN薄膜的场发射的阈值电场最低,为12 V/μm,当电场升高到27 V/μm时,场发射电流密度为140.6 μA/cm2;当沉积气压升高到5 Pa时,阈值电场升高为26 V/μm,当电场升高到59 V/μm时,发射电流密度为187.5 μA/cm2;沉积气压升高到15 Pa时的样品的阈值电场已经高达51 V/μm.所有BN薄膜的F-N曲线都符合F-N理论,表明电子发射是通过隧穿表面势垒完成的.     

多孔硅衬底微波CVD金刚石薄膜的制备及其场电子发射

研究了多孔硅衬底微波CVD金刚石薄膜的制备工艺及其场电子发射特性.以多孔硅作为生长金刚石突起阵列的模板,生长出带多微尖的微晶金刚石晶粒,使场电子发射阈值下降(＜1V/μm),发射电流增大(＞90mA/cm2),场发射性能稳定,并对这种场发射特性做出了理论解释.     

Al_2O_3衬底上制备非晶碳薄膜及其场发射特性研究

在Al2O3陶瓷衬底上用直流磁控溅射技术沉积过渡层Mo,再利用微波等离子体化学沉积系统在Mo过渡层上制备非晶碳薄膜,利用X线衍射(XRD)、拉曼(Raman)和电镜扫描(SEM)技术分析了薄膜的结构和表面形貌,测试了所制备样品的场发射及其发光特性,研究了薄膜的场发射特性。结果表明,所制备的薄膜为非晶碳和Mo2C的复合薄膜。所制备的薄膜具有较好的场发射特性,开启场强为0.74V/μm,1.8V/μm的场强下发射电流密度达到6 800μA/cm2,且发光点分布均匀,利用迭代法计算了所制备薄膜的有效场发射面积和其功函数。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks     

Call for Papers—Feature Topic,Vol.12,No.7,2015

正Information Centric Networking Information-Centric Networking(ICN) is an emerging direction in Future Internet architecture research,gaining significant tractions among academia and industry.Aiming to replace the conventional host-to-host communication model by a data-centric model,ICN treats data content as the first