以TiO_2为缓冲层在GaN上外延生长PZT铁电薄膜

采用脉冲激光沉积技术在(0001)取向的GaN基片上以TiO2为缓冲层外延生长了PZT(111)单晶薄膜。X射线衍射分析表明PZT(111)衍射峰的摇摆曲线半高宽为0.4°,说明薄膜结晶性能良好。PZT薄膜疲劳特性测试结果表明,在经过107次翻转后PZT薄膜的剩余极化强度开始出现下降。P-E电滞回线和I-V测试表明PZT薄膜矫顽场(2Ec)为350 kV/cm,剩余极化(2Pr)约为96μC/cm2,在1 V电压下薄膜的漏电流密度为1.5×10-7A/cm2。以上性能测试结果表明,在半导体GaN上外延生长的PZT铁电薄膜性能基本满足铁电随机存储器的需要。     

MgO缓冲层上钡铁氧体(BaFe_(12)O_(19))薄膜的制备与性能研究

采用脉冲激光沉积(PLD)技术在(0006)取向的蓝宝石基片上,通过MgO缓冲层诱导生长了BaFe12O19(BaM)薄膜,研究了沉积温度对BaM薄膜的晶体结构和磁性能的影响规律。X射线衍射(XRD)分析结果表明,在激光脉冲频率6Hz、激光能量180mJ、MgO缓冲层的厚度50nm和沉积温度为750℃的条件下,制得的BaM薄膜c轴取向最好,其(0008)面的ω摇摆曲线半高宽(FWHM)仅为0.289°。扫描电子显微镜(SEM)结果显示此时薄膜的晶粒已有部分呈六角片状。振动样品磁强计(VSM)测试表明,在750℃时沉积的BaM薄膜面外饱和磁化强度为190A/m,剩磁比0.82,薄膜磁性能良好。     

PZT薄膜厚度对BMT/PZT复合薄膜结构及介电性能的影响

采用液相旋涂法制备了Ba(Mg1/3Ta2/3)O3(BMT)/Pb(Zr0.52Ti0.48)O3(PZT)复合薄膜,研究了PZT薄膜厚度对BMT/PZT复合薄膜结构及介电性能的影响。随着PZT薄膜厚度的增加,BMT/PZT复合薄膜的介电常数呈线性增加。当PZT薄膜的厚度较小时,会明显地增加BMT/PZT复合薄膜的介电损耗;当继续增加PZT薄膜的厚度,介电损耗反而下降直到与BMT薄膜的介电损耗值接近。这是由于PZT的介电常数与介电损耗均明显高于BMT薄膜所致,而异质界面的存在抑制了PZT薄膜中畴壁的运动,使其对复合薄膜介电损耗的影响减弱。研究结果表明,PZT薄膜的引入可以提升BMT薄膜的介电常数而对介电损耗的影响不大。     

PZT含量对PZT/PVDF复合材料性能的影响

采用流延工艺,在ITO玻璃衬底上制备了不同质量分数的锆钛酸铅(PZT)/聚偏氟乙烯(PVDF)热释电复合材料。采用X射线衍射方法对复合材料极化前后的物相变化进行了对比分析,通过扫描电子显微镜分析了不同PZT质量分数复合材料的界面特征。从热释电探测器件的实际要求出发,利用介电阻抗测试仪、动态法热释电系数测试系统等仪器系统地测试了复合材料体系中PZT含量对材料热释电性能和介电性能的影响。结果显示,在PZT质量分数为50%时,制得了热释电系数p为4.1nC/(cm2.K)的性能优良的热释电复合材料。     

沉积气压对电弧离子镀制备MgO薄膜的结构及性能的影响

采用阴极真空电弧离子沉积技术在玻璃及Si衬底上成功地制备了具有择优结晶取向的透明MgO薄膜。利用X射线衍射仪（XRD）、扫描电子显微镜（SEM）及紫外-可见吸收光谱仪分别对MgO薄膜微观结构、表面形貌及可见光透过率进行了测试与分析。XRD结果表明,所制备的MgO薄膜具有NaCl型立方结构的（100）、（110）和（111）3种结晶取向,在沉积气压为0.7～3.0Pa的范围内,薄膜的择优结晶取向随沉积气压的升高先由（100）转变为（110）,最后变为（111）。SEM图表明随着沉积气压的升高,MgO薄膜的晶粒逐渐变小,薄膜结晶质量变差。在380～900nm范围内,沉积气压为0.7Pa下制备的MgO薄膜其可见光透过率高于90%,随着沉积气压的升高,薄膜的可见光透过率有所下降。     

Cu2ZnSnS4/Si异质结器件的制备及特性研究

利用脉冲激光沉积法在不同电阻率的n型Si(100)基片上沉积Cu2ZnSnS4薄膜,制备p-Cu2ZnSnS4/n-Si异质结.利用X射线衍射(XRD)、X射线能谱(EDS)和原子力显微镜(AFM)对Cu2ZnSnS4薄膜的结构、组分和形貌进行表征,并对器件进行I-V测试,讨论不同电阻率的Si对异质结器件光电特性的影响.结果表明,器件有良好的整流特性,Si电阻率大的器件光电响应比较好,而Si电阻率小的器件光伏效应比较明显.     

沉积温度对高温超导带材YBiO3缓冲层外延生长的影响

采用脉冲激光沉积(PLD)方法,在LaAlO3(001)基片上研究了沉积温度对用作高温超导带材缓冲层YBiO3结晶的影响.结果表明,随着沉积温度的升高,YBiO3缓冲层结晶质量提高,取向趋于完美,表面较为平整.当沉积温度为700℃时,单晶外延的YBiO3与LaAlO3基片的外延关系为:YBiO3(001)// LaAlO3(001)和YBiO3[110]//LaAlO3[100],其晶格失配度为1.3%,平均粗糙度约为3.4nm.     

脉冲激光沉积制备的HfO2薄膜的结构与电学性能

采用脉冲激光沉积（PLD）方法在Si（100）基底上制备了有效氧化层厚度为8．6nm，介电常数为29．3的HfO2薄膜．借助C射线衍射（XRD）、原子力显微镜（AFM）、高分辨透射电镜（HRTEM）分析了样品的微观结构，对电容的C-V与I-V电学特性进行了测试。实验结果表明，该方法制得的HfO2薄膜表面光滑，N2500℃下退火30mm后样品表面粗糙度由0．203nm变为0．498nm，薄膜由非晶转变为简单正交结构，界面层得到有效控制，该栅介质电容具有良好的C-V特性，较低的漏电流密度（4．3×10^-7A/cm^2，@-1V），是SiO2栅介质的理想替代物．     

AlN钝化层对AlGaN/GaN异质结及其高温特性的影响

主要研究了A1N钝化介质层对AlGaN/GaN异质结势垒层应力的修改以及应力的变化对二维电子气高温输运性质的影响.研究结果表明:AlN介质层会对AlGaN势垒层产生附加的平面压应变;AlN和传统的si3N4钝化介质都能减轻AlGaN势垒层在高温下的应变弛豫,但AlN介质层效果更明显.和传统的Si,N4钝化介质相比较,AlN钝化层不仅会显著增加AlGaN/GaN异质结二维电子气密度度,还会明显提高二维电子气迁移率,同时,AlN钝化后二维电子气密度的温度稳定性也更好.因此,对AlGaN/GaN异质结器件来说,AIN是一种有潜力的钝化介质.     

氧压对脉冲激光沉积LaNiO_3薄膜结构和电学性能的影响

通过改变氧分压,利用脉冲激光沉积方法在Si(100)衬底上制备了系列LaNiO3导电氧化物薄膜;经XRD测试研究发现,通过调控氧压,可获得具有高(100)取向薄膜,且氧压对薄膜结晶性有很大影响,在氧分压为7.5Pa时获得结晶性最好的薄膜。经XRF分析表明,La、Ni元素化学成分计量比随氧压增大而减小。经四探针法测试,薄膜电阻率最小为2.03×10-4Ω.cm,表现出了良好的金属导电性。经SEM和AFM分析表明,薄膜晶粒为柱状晶,排列均匀致密,薄膜表面均匀,粗糙度较小,表明LaNiO3薄膜可以用作一种良好的铁电薄膜底电极材料。     

Optical properties of PZT thin films deposited on a ZnO buffer layer

The optical properties of lead zirconate titanate (PZT) thin films deposited on ZnO were studied by m-lines spectroscopy. In order to retrieve the refractive index and the thickness of both layers from the m-lines spectra, we develop a numerical algorithm for the case of a two-layer system and show its robustness in the presence of noise. The sensitivity of the algorithm of the two-layer model allows us to relate the observed changes in the PZT refractive index to the PZT structural change due to the ZnO interface of the PZT/ZnO optical waveguide.     

以Al2O3为过渡层脉冲激光法制备PZT铁电薄膜

为实现PZT铁电薄膜与半导体衬底的直接集成引入Al2O3为过渡层，首先用真空电子束蒸发法在Si(100)，多昌金刚石（111）衬底上生长约20nm厚的Al2O3过渡层，接着在上述衬底上采用脉冲激光淀积（PLD）法淀积PZT薄膜，衬底温度为350-550℃。X光电子能谱（XPS）测试表明，在高真空下，电子束蒸发Al2O3固态源能获得化学配比接近蒸发源的Al2O3薄膜。X射线衍射（XRD）测试说明，不论衬底是硅还是多晶金刚石，当衬底温度为550℃时，PZT在Al2O3过渡层上呈现（222）取向的焦绿石相结构，当衬底是金刚石时，通过如下工艺：（1）较低温度（350℃）淀积；（2）空气氛围650℃快速退火5min，可以在Al2O3过渡层上获得高度（101）取向的钙钛矿结构的铁电相PZT薄膜，最后AFM测试显示，在硅衬底上，PZT薄膜的表面均方根粗糙度为9.78nm；而在多晶金刚石衬底上，PZT薄膜的表面均方根粗糙度为17.2nm。     

Improvement of the fatigue and the ferroelectric properties of PZT films through a LSCO seed layer

The ability to optimizate the preparation of Lead Zirconate Titanate (PZT) films on platinized Si substrate by pulsed laser deposition was demonstrated. The effect of the modification of the interface film/electrode through the use of a (La,Sr)CoO₃ (LSCO) seed layer on the remnant polarization, fatigue endurance and stress in PZT films was studied. An improvement on the ferroelectric properties was found with the using of the LSCO layer. A remnant polarization (P_r) of 19.8 μC/cm² and 4.4 μC/cm² for films with and without the LSCO layer were found. In the same way the polarization fatigue decreases significantly after deposition of the LSCO layer between the film and substrate. Atomic force microscopy (AFM) images revealed a different growth process in the films. Current–voltage (I–V) measurements showed that the use of LSCO seed layer improves the leakage current and, on the other hand the conduction mechanisms in the film without LSCO, after the fatigue test, was found to be changed from Schottky to Poole–Frenkel. The trap activation energy (about 0.14 eV) determined from Poole–Frenkel mode agrees well with the energy level of oxygen vacancies. The films stresses were estimated by XRD in order to explain the improvement on the structure and consequentially ferroelectric properties of the films. The model proposed by Dawber and Scott was found to be in agreement with our experimental data, which seems to predict that the oxygen vacancies play an important role on fatigue.     

Effect of Ga doping on micro/structural, electrical and optical properties of pulsed laser deposited ZnO thin films

Undoped and Ga doped ZnO thin films (1% GZO, 3% GZO and 5% GZO) were grown on c-Al₂O₃ substrates using the 1, 3 and 5 at. wt.% Ga doped ZnO targets by pulsed laser deposition. X-ray diffraction studies revealed that highly c-axis oriented, single phase, undoped and Ga doped ZnO thin films with wurtzite structure were deposited. Micro-Raman scattering analysis showed that Ga doping introduces defects in the host lattice. The E₂^High mode of ZnO in Ga doped ZnO thin film was observed to shift to higher wavenumber indicating the presence of residual compressive stress. Appearance of the normally Raman inactive B₁ modes (B₁^Low, 2B₁^Low and B₁^High) due to breaking of local translational symmetry, also indicated that defects were introduced into the host lattice due to Ga incorporation. Band gap of the Ga doped ZnO thin films was observed to shift to higher energy with the increase in doping concentration and is explicated by the Burstein-Moss effect. Electrical resistivity measurements of the undoped and GZO thin films in the temperature range 50 to 300 K revealed the metal to semiconductor transition for 3 and 5% GZO thin films.     

Influence of the PZT film thickness on the structure and electrical properties of the ZnO/PZT heterostructure

In this study, ZnO/PZT films have been continuously deposited on SiO₂/Si substrate using radio frequency reactive magnetron sputtering method. The influence of PZT film thickness on the crystallization, surface microstructure and electrical properties of ZnO films were investigated. The X-ray diffraction results showed that the ZnO/PZT-330-nm-thick films had a perfect c-axis preferred orientation and better crystal structure compared to other samples. Simultaneously, the stress in the films has been shown to change from compressive to tensile with the increase of PZT film thickness. Atomic force microscopy displayed that the microstructures of the ZnO/PZT films with little thickness were loosened, and the grains presented a lamellar structure. However, the ZnO films showed a dense, uniform and crack-free uniform microstructure as increasing the PZT film thickness. The relative dielectric constant and dielectric loss of the ZnO/PZT-330-nm-thick films were approximately 21.7 and 0.52 %, respectively. The leakage current density of the ZnO/PZT films first decreased and then increased with increasing PZT film thickness. The ZnO/PZT-330-nm-thick films had a lowest leakage current density of approximately 10^?6 Acm^?2 at ?5 V, which showed excellent insulating characteristic.     

The effects of buffer growth parameters on heteroepitaxial ZnO films grown by pulsed laser deposition

The effects of buffer layer deposition conditions on subsequent ZnO epitaxy on sapphire (0001) were examined. An initial ZnO buffer layer improves surface roughness for a wide range of buffer layer growth temperatures and pressures. Changes in buffer layer growth pressure and temperature have a moderate effect on the roughness of subsequent film growth. However, the conditions for buffer layer deposition have a large impact on crystallinity of subsequent films. In particular, the out-of-plane X-ray diffraction rocking curve full-width half-maximum decreased as buffer deposition temperature or O₂/O₃ pressure increases. Carrier mobility in the subsequent thick ZnO film was enhanced with increase in buffer layer deposition temperature. Carrier concentration decreased with increasing buffer layer deposition pressure.     

低温制备Pb(Zr0.52Ti0.48)O3铁电薄膜及其性能研究

采用脉冲激光沉积技术（PLD）在（100）p-Si衬底上,低温淀积、快速退火成功地制备了具有完全钙钛矿结构的多晶PZT铁电薄膜,所制备的PZT铁电薄膜致密、均匀,表现出良好的介电和铁电性能,其介电常数和介电损耗100kHz下分别为320和0.08,剩余极化Pr和矫顽场Ec分别为14μC/cm^2和58kV/cm,＋5V电压下漏电流密度低于10^-7A/cm^2。10^7次极化反转后剩余极化仅下降10％,具有较好的疲劳特性。     

Annealing effects on the structural, electrical and H2 sensing properties of transparent ZnO thin films, grown by pulsed laser deposition

Transparent zinc oxide thin films were grown by reactive pulsed laser deposition on glass substrates. The substrates were kept at 200 °C constant temperature. Post-deposition heat treatment, applied to further promote crystallization and overcome any oxygen deficiency, yielded transparent thin films. Structural investigations carried out by atomic force microscopy (AFM) and X-ray diffraction (XRD), have shown a strong influence of deposition technique parameters and post-annealing on the crystallinity of the zinc oxide films. The gas sensing characteristics of these films were investigated towards different hydrogen concentrations (5000-30,000 ppm) at a selected operating temperature within the 150-230 °C range.     

Effect of Annealing on the Optical Properties of GaN Films Grown by Pulsed Laser Deposition

In the present study,gallium nitride thin films were grown by using pulsed laser deposition.After the growth samples were annealed at 400 and 600℃in the nitrogen atmosphere.Surface morphology of the as-grown and annealed samples was observed by atomic force microscopy.Post-growth annealing results in an improved surface roughness of the films.Chemical analysis of the samples was performed by X-ray photoelectron spectroscopy.Stoichiometric gallium nitride thin films were obtained for the samples annealed at 600℃.Optical measurements of the samples were performed to measure the band gap and optical constants of the films.Effect of annealing on the band gap and optical constants of the films was studied.