共查询到18条相似文献,搜索用时 156 毫秒
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在异质结双极晶体管(HBT)功率器件中可以引入外延生长的发射极镇流电阻,以改善其热稳定性.通过理论计算和实验表明这种低掺杂的外延层不仅能作为镇流电阻,而且在功率HBT器件中还能非常有效地降低发射极电流集边效应. 相似文献
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在考虑发射结电压随温度的变化和发射极加入镇流电阻的情况下,给出简化的三维热电模型,用以计算功率HBT芯片表面温度分布.分析表明,对于采用均匀发射极镇流电阻设计的功率HBT,芯片中心发射极条温度最高,严重限制了器件的功率处理能力.因此提出非均匀发射极镇流电阻设计方案,并以12指Si0.8Ge0.2HBT为例,详细地给出非均匀发射极镇流电阻设计流程.结果表明,在总发射极镇流电阻阻值(各指发射极镇流电阻并联值)不变的情况下,非均匀发射极镇流电阻设计与传统的均匀设计相比,芯片中心结温显著降低,芯片表面温度趋于一致.还发现当各指发射极镇流电阻阻值从芯片边缘到中心按指数形式分布时,功率HBT的芯片表面温度更容易趋于均匀,大大提高了HBT的功率处理能力,为功率HBT的设计提供了指导. 相似文献
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在考虑发射结电压随温度的变化和发射极加入镇流电阻的情况下,给出简化的三维热电模型,用以计算功率HBT芯片表面温度分布.分析表明,对于采用均匀发射极镇流电阻设计的功率HBT,芯片中心发射极条温度最高,严重限制了器件的功率处理能力.因此提出非均匀发射极镇流电阻设计方案,并以12指Si0.8Ge0.2HBT为例,详细地给出非均匀发射极镇流电阻设计流程.结果表明,在总发射极镇流电阻阻值(各指发射极镇流电阻并联值)不变的情况下,非均匀发射极镇流电阻设计与传统的均匀设计相比,芯片中心结温显著降低,芯片表面温度趋于一致.还发现当各指发射极镇流电阻阻值从芯片边缘到中心按指数形式分布时,功率HBT的芯片表面温度更容易趋于均匀,大大提高了HBT的功率处理能力,为功率HBT的设计提供了指导. 相似文献
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《红外与毫米波学报》2021,(3)
对不添加镇流电阻的非均匀发射极条间距的多发射极条异质结双极晶体管(HBT)的射频功率性能和表面温度分布进行了测量,并与常规采用镇流电阻的多发射极条功率HBT进行了比较。实验结果表明,对具有非均匀发射极条间距的多发射极条HBT,采用USQFITMS红外测量系统测得的最高表面温度、温度分布均匀性以及采用射频测量系统测得的射频功率增益和功率附加效率,分别低于、好于和高于具有镇流电阻的多发射极条功率HBT的情况。这些结果的取得,得益于采用非均匀发射极条间距改善了多发射极条HBT的热电正反馈和不同发射极条之间的热耦合,以及摆脱了传统HBT加镇流电阻带来的对射频功率性能的负作用。 相似文献
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对不添加镇流电阻的非均匀发射极条间距的多发射极条异质结双极晶体管(HBT)的射频功率性能和表面温度分布进行了测量,并与常规采用镇流电阻的多发射极条功率HBT进行了比较.实验结果表明,对具有非均匀发射极条间距的多发射极条HBT,采用US QFI TMS红外测量系统测得的最高表面温度、温度分布均匀性以及采用射频测量系统测得... 相似文献
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在SiGe HBT设计中,采用Al-TiN-Ti多层金属系统,可减小基极电阻,提高器件的频率和功率特性(fmax)。但是,本文的研究表明,如果忽略了发射极电阻的减小和TiN、Ti有较小的热导率,而不在设计中做出适当调整,在相同的大电流工作条件下,多层金属HBT的输出特性在自热效应和能带调节共同作用下,将会表现出明显的负阻效应。分析其原因:1)由于发射极接触电阻减小,即等效的HBT发射极镇流电阻减小,使得器件调节自热效应的能力减弱;2)由于多层金属中TiN和Ti热导率较低,在相同条件下,器件通过金属连线均衡温度分布的能力变差,与Al系统相比,其BE结温度更高。在大电流工作条件下,较差的自热效应调节能力和较高的结温使得多层金属HBT的值减小较快,器件的频率和功率特性变差。 相似文献
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Gao G.-B. Unlu M.S. Morkoc H. Blackburn D.L. 《Electron Devices, IEEE Transactions on》1991,38(2):185-196
A systematic investigation of the emitter ballasting resistor for power heterojunction bipolar transistors (HBTs) is presented. The current handling capability of power HBTs is found to improve with ballasting resistance. An equation for the optimal ballasting resistance is presented, where the effects of thermal conductivity of the substrate material and the temperature coefficient of the ballasting resistor are taken into account. Current levels of 400 to 800 mA/mm of emitter periphery at case temperatures of 25 to -80°C for power AlGaAs/GaAs HBTs have been obtained using an on-chip lightly doped GaAs emitter ballasting resistor. Device temperature has been measured using both an infrared microradiometer and temperature-sensitive electrical parameters. Steady-state and transient thermal modeling are also performed. Although the measured temperature is spatially nonuniform, the modeling results show that such nonuniformities would occur for a uniform current distribution, as would be expected for an HBT with emitter ballasting resistors 相似文献
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Guang-Bo Gao Ming-Zhu Wang Xiang Gui Morkoc H. 《Electron Devices, IEEE Transactions on》1989,36(5):854-863
A theoretical thermoelectro-feedback model has been developed for the thermal design of high-power GaAlAs/GaAs heterojunction bipolar transistors (HBTs). The power-handling capability, thermal instability, junction temperature, and current distributions of HBTs with multiple emitter fingers have been numerically studied. The calculated results indicate that power HBTs on Si substrates (or with Si as the collector) have excellent potential power performance and reliability. The power-handling capability on Si is 3.5 and 2.7 times as large as that on GaAs and InP substrates, respectively. The peak junction temperature and temperature difference on the chip decrease in comparison to the commonly used Si homostructure power transistor with the same geometry and power dissipation. Thereby HBTs are promising for high-speed microwave and millimeter-wave applications. It has been also found that the nonuniform distribution of junction temperature and current can be greatly improved by a ballasting technique that uses unequal-valued emitter resistors 相似文献
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L波段150W宽带硅脉冲功率晶体管 总被引:3,自引:2,他引:1
设计了一种称之为多晶硅覆盖树技状结构的双极型微波功率晶体管。该器件采用掺砷多晶硅发射极,同时具备有覆盖和树枝状两种图形结构的优点。器件引入扩散电阻和分布式多晶硅电阻组合而成的发射极复合镇流电阻,实现对发射极电流二次镇流,器件表现出良好的微波性能和高的可靠性。经内匹配,在L波段脉冲输出大于100W(36V),脉宽150μs,工作比10%,增益大于7.5dB,效率大于45%,器件最大输出达150W(42V)。 相似文献
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T. Johansson J. Soderstrom L. F. Eastman D. W. Woodard 《International Journal of Electronics》2013,100(4):497-510
The feasibility of GaAlAs/GaAs heterojunction bipolar transistors as power output transistors for 24–28V cellular base station applications was studied. A 1W, 25V test vehicle was fabricated, with predictable and uniform electrical parameters. Maximum output power was 1.02W with 9.1dB gain at 2GHz and 18V supply voltage. Characterization at more than 22V destroyed all devices, even if emitter ballasting resistors were used for thermal balance. Analysis indicated that the failures were caused by too wide emitters in combination with the high supply voltage, causing current crowding and large temperature spikes. Small (<2-3µm) horizontal emitter dimensions are required even with low base sheet resistivity, otherwise leading to destructive temperature non-uniformities, unless special arrangements to drastically reduce the thermal resistance can be applied. 相似文献
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Jin Dongyue Zhang Wanrong Shen Pei Xie Hongyun Wang Yang Zhang Wei He Lijian Sha Yongping Li Jia Gan Junning 《Solid-state electronics》2008,52(6):937-940
Multi-finger power SiGe heterojunction bipolar transistors (HBTs) with emitter ballasting resistor and non-uniform finger spacing are fabricated, and temperature profiles of them are measured. Experimental results show that both of them could improve the temperature profile compared with an HBT which has uniform finger spacing. For the HBT with emitter ballasting resistor, the ability to lower the peak temperature is weakened as power increases. However, for the HBT with non-uniform finger spacing, the ability to improve temperature profile is kept over a wide biasing range. Therefore, the experimental results directly prove that the technique of non-uniform finger spacing is a better method for enhancing the thermal stability of power HBTs over a wide biasing range. 相似文献
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《Electron Devices, IEEE Transactions on》2009,56(3):483-491
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Shimura T. Sakai M. Izumi S. Nakano H. Matsuoka H. Inoue A. Udomoto J. Kosaki K. Kuragaki T. Takano H. Sonoda T. Takamiya S. 《Electron Devices, IEEE Transactions on》1995,42(11):1890-1896
High power and high-efficiency multi-finger heterojunction bipolar transistors (HBT's) have been successfully realized at Ku-band by using an optimum emitter ballasting resistor and a plated heat sink (PHS) structure. Output power of 1 W with power-added efficiency (PAE) of 72% at 12 GHz has been achieved from a 10-finger HBT with the total emitter size of 300 μm2. 72% PAE with the output power density of 5.0 W/mm is the best performance ever reported for solid-state power devices with output powers more than 1 W at Ku-band 相似文献
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Jinshu Zhang Hongyong Jia Pei-Hsin Tsien Tai-Chin Lo 《Electron Device Letters, IEEE》1999,20(7):326-328
The emitter ballasting resistor is used to equalize the current distribution between the emitter stripes in power transistor, but it will degrade the output power, power gain, and power added efficiency. Experimental results indicate that the current gain of uniform-base SiGe heterojunction bipolar transistors (HBTs) decreases with the increase of the temperature above 160 K, so the current distribution is equalized by itself to some extent. Therefore, the microwave power SiGe HBTs without emitter ballasting resistor were fabricated for the first time, and the continuous output power of 5 W and power added efficiency of 63% were obtained under Class C operation at a frequency of 900 MHz. Hence, the emitter current density of the SiGe HBT's with emitter width of 6 μm is 0.79 A/cm 相似文献