Numerical study of the inlet/outlet arrangement effect on microchannel heat sink performance

In this study, fluid flow and heat transfer in microchannel heat sinks are numerically investigated. The three-dimensional governing equations for both fluid flow and heat transfer are solved using the finite-volume scheme. The computational domain is taken as the entire heat sink including the inlet/outlet ports, inlet/outlet plenums, and microchannels. The particular focus of this study is the inlet/outlet arrangement effects on the fluid flow and heat transfer inside the heat sinks.The microchannel heat sinks with various inlet/outlet arrangements are investigated in this study. All of the geometric dimensions of these heat sinks are the same except the inlet/outlet locations. Because of the difference in inlet/outlet arrangements, the resultant flow fields and temperature distributions inside these heat sinks are also different under a given pressure drop across the heat sink. Using the averaged velocities and fluid temperatures in each channel to quantify the fluid flow and temperature maldistributions, it is found that better uniformities in velocity and temperature can be found in the heat sinks having coolant supply and collection vertically via inlet/outlet ports opened on the heat sink cover plate. Using the thermal resistance, overall heat transfer coefficient and pressure drop coefficient to quantify the heat sink performance, it is also found these heat sinks have better performance among the heat sinks studied. Based on the results from this study, it is suggested that better heat sink performance can be achieved when the coolant is supplied and collected vertically.     

Three dimensional numerical analyses and optimization of offset strip-fin microchannel heat sinks

This paper presents a numerical study on laminar forced convection of water in offset strip-fin microchannels network heat sinks for microelectronic cooling. A 3-dimensional mathematical model, consisting of N–S equations and energy conservation equation, with the conjugate heat transfer between the heat sink base and liquid coolant taken into consideration is solved numerically. The heat transfer and fluid flow characteristics in offset strip-fin microchannels heat sinks are analyzed and the heat transfer enhancement mechanism is discussed. Effects of geometric size of strip-fin on the heat sink performance are investigated. It is found that there is an optimal strip-fin size to minimize the pressure drop or pumping power on the constraint condition of maximum wall temperature, and this optimal size depends on the input heat flux and the maximum wall temperature. The results of this paper are helpful to the design and optimization of offset strip-fin microchannel heat sinks for microelectronic cooling.     

Experimental investigation of thermoelectric power generation versus coolant pumping power in a microchannel heat sink

The coolant heat sinks in thermoelectric generators (TEG) play an important role in order to power generation in the energy systems. This paper explores the effective pumping power required for the TEGs cooling at five temperature difference of the hot and cold sides of the TEG. In addition, the temperature distribution and the pressure drop in sample microchannels are considered at four sample coolant flow rates. The heat sink contains twenty plate-fin microchannels with hydraulic diameter equal to 0.93 mm. The experimental results show that there is a unique flow rate that gives maximum net-power in the system at the each temperature difference.     

Study of heat transfer enhancement in a nanofluid-cooled miniature heat sink

This paper reports numerical solution for thermally developing temperature profile and analytical solution for fully developed velocity profile in a miniature plate fin heat sink with SiO₂–water nanofluid as coolant. The flow regime is laminar and Reynolds number varies between 0 and 800. The heat sink is modeled using porous medium approach. Modified Darcy equation for fluid flow and the two-equation model for heat transfer between the solid and fluid phases are employed to predict the local heat transfer coefficient in heat sink. Results show that the nanofluid-cooled heat sink outperforms the water-cooled one, having a considerable higher heat transfer coefficient. The effects of channel aspect ratio and porosity on heat transfer coefficient of the heat sink are studied in detail. Based on the results of our analysis, it is found that an increase in the aspect ratio or the porosity of the plate fin heat sink enhances the heat transfer coefficient.     

Effects of shield on thermal-fluid performance of vapor chamber heat sink

This work investigates the effects of a shield on the thermal and hydraulic characteristics of plate-fin vapor chamber heat sinks under cross flow cooling. The surface temperature distributions of the vapor chamber heat sinks are measured using infrared thermography. The thermal-fluid performance of vapor chamber heat sinks with a shield is determined by varying the fin width, the fin height, the fin number and the Reynolds number. The experimental data thus obtained are compared with those without a shield.Experimental results indicate that the maximum surface temperature of the vapor chamber heat sink is effectively reduced by adding the shield, which forces more cooling fluid into the inter-fin channel to exchange heat with the heat sink. However, using the shield increases the pressure drop across the heat sink. The experimental data also show that the enhancement of the heat transfer increases with the Reynolds number, but the improvement declines as the Reynolds number increases. When the pumping power and heat transfer are simultaneously considered, vapor chamber heat sinks with thinner, higher or more fins exhibit better thermal-hydraulic performance.     

Microscale heat transfer enhancement using thermal boundary layer redeveloping concept

We demonstrated a new silicon microchannel heat sink, composing of parallel longitudinal microchannels and several transverse microchannels, which separate the whole flow length into several independent zones, in which the thermal boundary layer is in developing. The redeveloping flow is repeated for all of the independent zones thus the overall heat transfer is greatly enhanced. Meanwhile, the pressure drops are decreased compared with the conventional microchannel heat sink. Both benefits of enhanced heat transfer and decreased pressure drop ensure the possibility to use “larger” hydraulic diameter of the microchannels so that less pumping power is needed, which are attractive for high heat flux chip cooling. The above idea fulfilled in microscale is verified by a set of experiments. The local chip temperature and Nusselt numbers are obtained using a high resolution Infrared Radiator Imaging system. Preliminary explanation is given on the decreased pressure drop while enhancing heat transfer. The dimensionless control parameter that guides the new heat sink design and the prospective of the new heat sink are discussed.     

Effect of geometric configuration on the laminar flow and heat transfer in microchannel heat sinks with cavities and fins

A numerical simulation is performed to investigate the characteristics of flow and heat transfer in microchannels with cavities and fins. Nine microchannels with various shaped cavities and fins are presented and compared to the smooth microchannel. The effect of cavity and fin shapes on the flow field and temperature field is analyzed. Results show that the presence of cavity and fin can increase the heat transfer area, intensify mainstream disturbance, and induce chaotic advection, which result in obvious heat transfer enhancement. The shape of cavity or fin has a great influence on the hydrodynamic and thermal performance for such micro heat sinks. Based on the performance evaluation criterion (PEC), the overall performance of the microchannel is evaluated. The combination of cavities and fins leads to lower bottom temperature, lower net temperature gradient of fluid, and better heat transfer performance, which has the potential to meet the increased heat removal requirement.     

Hotspot management using a hybrid heat sink with stepped pin-fins

A hybrid heat sink design with microchannels and stepped pin-fins is introduced for the hotspot-targeted thermal management of microprocessors. The thermal and hydraulic performance were assessed numerically and compared to that of a hybrid heat sink with uniform pin-fins. Both hybrid heat sinks were designed to have two zones using rectangular microchannels above the processor’s background area and an array of pin-fins (stepped and uniform pin-fins) over the hotspot area. Conjugate heat transfer analysis was performed with the entire heat sink as the computational domain by solving the three-dimensional Navier-Stokes and energy equations. The hybrid heat sink with stepped pin-fins exhibited remarkable improvement in the temperature uniformity at the hotspot as compared to the one with uniform pin-fins, along with ample improvements in the thermal resistance, maximum temperature rise at the hotspot, and pumping power. A parametric investigation was also performed for the hybrid heat sink with uniform pin-fins to find an optimum geometry based on two geometric parameters: the ratio of the diameter of the pin-fins to their pitch and the total number of pin-fins in the array. The results revealed improvements in the thermal performance, but the pumping power was increased.     

Conjugate heat transfer in fractal-shaped microchannel network heat sink for integrated microelectronic cooling application

The hydrodynamic and thermal characteristics of fractal-shaped microchannel network heat sinks are investigated numerically by solving three-dimensional N–S equations and energy equation, taking into consideration the conjugate heat transfer in microchannel walls. It is found that due to the structural limitation of right-angled fractal-shaped microchannel network, hotspots may appear on the bottom wall of the heat sink where the microchannels are sparsely distributed. With slight modifications in the fractal-shaped structure of microchannels network, great improvements on hydrodynamic and thermal performance of heat sink can be achieved. A comparison of the performance of modified fractal-shaped microchannel network heat sink with parallel microchannels heat sink is also conducted numerically based on the same heat sink dimensions. It is found that the modified fractal-shaped microchannel network is much better in terms of thermal resistance and temperature uniformity under the conditions of the same pressure drop or pumping power. Therefore, the modified fractal-shaped microchannel network heat sink appears promising to be used for microelectronic cooling in the future.     

Effect of Serpentine Grooves on Heat Transfer Characteristics of Microchannel Heat Sink with Different Nanofluids

An experimental and numerical investigation of the thermal performance of three different nanofluids ethylene glycol‐based CuO, water‐based CuO, and Al₂O₃ is done in a serpentine‐shaped micorchannel heat sink. The microchannels considered ranged from 810 μm to 890 μm in hydraulic diameter and were made of copper material. The experiments were conducted with the Reynolds number ranging from approximately 100 to 1300. The forced convective heat transfer coefficient of nanofluids shows that there is an improved heat transfer rate compared to base fluids water and ethylene glycol. The experimental results also confirm that there is an earlier transition from laminar to turbulent flow in microchannels. The results prove that as the hydraulic diameter decreases there is increased pressure drop and the heat transfer coefficient increases for both the base fluids and nanofluids. The flow characteristics are discussed based on the pressure drop. While investigating the heat transfer coefficient of the three different nanofluids the nanofluid CuO/EG has the highest heat transfer coefficient as a result of the material's property. This research also will encourage young researchers to work on nanofluids of varying nanoparticle size and concentration to discover new results.     

Critical heat flux for subcooled flow boiling in micro-channel heat sinks

Critical heat flux (CHF) was measured and examined with high-speed video for subcooled flow boiling in micro-channel heat sinks using HFE 7100 as working fluid. High subcooling was achieved by pre-cooling the working fluid using a secondary low-temperature refrigeration system. The high subcooling greatly reduced both bubble departure diameter and void fraction, and precluded flow pattern transitions beyond the bubbly regime. CHF was triggered by vapor blanket formation along the micro-channel walls despite the presence of abundant core liquid, which is consistent with the mechanism of Departure from Nucleate Boiling (DNB). CHF increased with increasing mass velocity and/or subcooling and decreasing hydraulic diameter for a given total mass flow rate. A pre-mature type of CHF was caused by vapor backflow into the heat sink’s inlet plenum at low mass velocities and small inlet subcoolings, and was associated with significant fluctuations in inlet and outlet pressure, as well as wall temperature. A systematic technique is developed to modify existing CHF correlations to more accurately account for features unique to micro-channel heat sinks, including rectangular cross-section, three-sided heating, and flow interaction between micro-channels. This technique is shown to be successful at correlating micro-channel heat sink data corresponding to different hydraulic diameters, mass velocities and inlet temperatures.     

Numerical simulation of fluid flow and heat transfer in a microchannel heat sink with offset fan-shaped reentrant cavities in sidewall

The paper is focused on the investigation of fluid flow and heat transfer characteristics in a microchannel heat sink with offset fan-shaped reentrant cavities in sidewall. In contrast to the new microchannel heat sink, the corresponding conventional rectangular microchannel heat sink is chosen. The computational fluid dynamics is used to simulate the flow and heat transfer in the heat sinks. The steady, laminar flow and heat transfer equations are solved in a finite-volume method. The SIMPLEX method is used for the computations. The effects of flow rate and heat flux on pressure drop and heat transfer are presented. The results indicate that the microchannel heat sink with offset fan-shaped reentrant cavities in sidewall improved heat transfer performance with an acceptable pressure drop. The fluid flow and heat transfer mechanism of the new microchannel heat sink can attribute to the interaction of the increased heat transfer surface area, the redeveloping of the hydraulic and thermal boundary layers, the jet and throttling effects and the slipping over the reentrant cavities. The increased heat transfer surface area and the periodic thermal developing flow are responsible for the significant heat transfer enhancement. The jet and throttling effects enhance heat transfer, simultaneously increasing pressure drop. The slipping over the reentrant cavities reduces pressure drop, but drastically decreases heat transfer.     

Three-dimensional thermal analysis of heat sinks with circular cooling micro-channels

The pressure drop and thermal characteristics of heat sinks with circular micro-channels are investigated using the continuum model consisting of the conventional Navier-Stokes equations and the energy conservation equation. Developing flow (both hydrodynamically and thermally) is assumed in the fluid region and three-dimensional conjugate heat transfer is assumed in the solid region. Thermal results based on this approach are shown to be in good agreement with existing experimental data. Effects of various geometrical parameters, material properties, and Reynolds number on the thermal performance of the sink were investigated. A comparison between circular and rectangular channels at the same Reynolds number and hydraulic diameter showed that sinks with rectangular channels have lower thermal resistance, while sinks with circular channels dissipate more heat per unit pumping power.     

Effects of fin shapes on heat transfer in microchannel heat sinks

In the present study, compact water cooling of high‐density, high‐speed, very‐large‐scale integrated (VLSI) circuits with the help of microchannel heat exchangers were investigated analytically. This study also presents the result of mathematical analysis based on the modified Bessel function of laminar fluid flow and heat transfer through combined conduction and convection in a microchannel heat sink with triangular extensions. The main purpose of this paper is to find the dimensions of a heat sink that give the least thermal resistance between the fluid and the heat sink, and the results are compared with that of rectangular fins. It is seen that the triangular heat sink requires less substrate material as compared to rectangular fins, and the heat transfer rate per unit volume has been almost doubled by using triangular heat sinks. It is also found that the effectiveness of the triangular fin is higher than that of the rectangular fin. Therefore, the triangular heat sink has the ability to dissipate large amounts of heat with relatively less temperature rise for the same fin volume. Alternatively, triangular heat sinks may thus be more cost effective to use for cooling ultra‐high speed VLSI circuits than rectangular heat sinks.     

Constructal Parallel-Flow and Counterflow Microchannel Heat Sinks with Bifurcations

Based on the Constructal Theory, parallel-flow and counterflow microchannels heat sinks with bifurcations are put forward to manage the temperature nonuniformity and further reduce the temperature of microchannel heat sinks bottom plates. Several models with different lengths of bifurcations are designed, and the corresponding laminar fluid flow and heat transfer of all models have been investigated through numerical simulations. The pressure, velocity, temperature distributions, and averaged Nusselt numbers are analyzed in details, and then the overall thermal resistances and overall thermal performance are compared. The results show that the thermal performance of counterflow microchannel heat sinks is better than that of parallel-flow heat sinks for the same geometry, and bifurcation can improve the thermal performance for all cases. It is suggested that a proper design of the length of bifurcation counterflow microchannel can be employed to improve the overall thermal performance of microchannel heat sinks. The study complements and extends previous works.     

Analytical analysis of heat transfer and pumping power of laminar nanofluid developing flow in microchannels

Thermal management issues are limiting barriers to high density electronics packaging and miniaturization. Liquid cooling using micro and mini channels is an attractive alternative to large and bulky aluminum or copper heat sinks. These channels can be integrated directly into a chip or a heat spreader, and cooling can be further enhanced using nanofluids (liquid solutions with dispersed nanometer-sized particles) due to their enhanced heat transfer effects reported in literature. The goals of this study are to evaluate heat transfer improvement of a nanofluid heat sink with developing laminar flow forced convection, taking into account the pumping power penalty. The phrase heat transfer enhancement ratio (HTR) is used to denote the ratio of average heat transfer coefficient of nanofluid to water at the same pumping power. The proposed model uses semi-empirical correlations to calculate nanofluid thermophysical properties. The predictions of the model are found to be in good agreement with experimental studies. The validated model is used to identify important design variables (Reynolds number, volume fraction and particle size) related to thermal and flow characteristics of the microchannel heat sink with nanofluids. Statistical analysis of the model showed that the volume fraction is the most significant factor impacting the HTR, followed by the particle diameter. The impact of the Reynolds number and other interaction terms is relatively weak. The HTR is maximized at smallest possible particle diameter (since smaller particles improve heat transfer but do not impact pumping power). Then, for a given Reynolds number, an optimal value of volume fraction can be obtained to maximize HTR. The overall aim is to present results that would be useful for understanding and optimal design of microchannel heat sinks with nanofluid flow.     

Numerical simulation of heat transfer enhancement in wavy microchannel heat sink

In this paper, heat transfer and water flow characteristics in wavy microchannel heat sink (WMCHS) with rectangular cross-section with various wavy amplitudes ranged from 125 to 500 μm is numerically investigated. This investigation covers Reynolds number in the range of 100 to 1000. The three-dimensional steady, laminar flow and heat transfer governing equations are solved using the finite-volume method (FVM). The water flow field and heat transfer phenomena inside the heated wavy microchannels is simulated and the results are compared with the straight microchannels. The effect of using a wavy flow channel on the MCHS thermal performance, the pressure drop, the friction factor, and wall shear stress is reported in this article. It is found that the heat transfer performance of the wavy microchannels is much better than the straight microchannels with the same cross-section. The pressure drop penalty of the wavy microchannels is much smaller than the heat transfer enhancement achievement. Both friction factor and wall shear stress are increased proportionally as the amplitude of wavy microchannels increased.     

Two-Phase Heat Sinks with Microporous Coating

To minimize flow boiling instabilities in two-phase heat sinks, two different types of microporous coatings were developed and applied on mini- and small-channel heat sinks and tested using degassed R245fa refrigerant. The first coating was epoxy based and was sprayed on heat sink channels, while the second coating was formed by sintering copper particles on heat sink channels. Minichannel heat sinks had overall dimensions 25.4 mm × 25.4 mm × 6.4 mm and 12 rectangular channels with a hydraulic diameter 1.7 mm and a channel aspect ratio of 2.7. Small-channel heat sinks had the same overall dimensions, but only three rectangular channels with hydraulic diameter 4.1 mm and channel aspect ratio 0.6. The microporous coatings were found to minimize parallel channel instabilities for minichannel heat sinks and to reduce the amplitude of heat sink base temperature oscillations from ～6°C to slightly more than 1°C. No increase in pressure drop or pumping power due to the microporous coating was measured. The minichannel heat sinks with porous coating had on average 1.5 times higher heat transfer coefficient than uncoated heat sinks. Also, the small-channel heat sinks with the “best” porous coating had on average 2.5 times higher heat transfer coefficient and the critical heat flux was 1.5 to 2 times higher compared with the uncoated heat sinks.     

Analysis of three-dimensional heat transfer in micro-channel heat sinks

In this study, the three-dimensional fluid flow and heat transfer in a rectangular micro-channel heat sink are analyzed numerically using water as the cooling fluid. The heat sink consists of a 1-cm² silicon wafer. The micro-channels have a width of 57 μm and a depth of 180 μm, and are separated by a 43 μm wall. A numerical code based on the finite difference method and the SIMPLE algorithm is developed to solve the governing equations. The code is carefully validated by comparing the predictions with analytical solutions and available experimental data. For the micro-channel heat sink investigated, it is found that the temperature rise along the flow direction in the solid and fluid regions can be approximated as linear. The highest temperature is encountered at the heated base surface of the heat sink immediately above the channel outlet. The heat flux and Nusselt number have much higher values near the channel inlet and vary around the channel periphery, approaching zero in the corners. Flow Reynolds number affects the length of the flow developing region. For a relatively high Reynolds number of 1400, fully developed flow may not be achieved inside the heat sink. Increasing the thermal conductivity of the solid substrate reduces the temperature at the heated base surface of the heat sink, especially near the channel outlet. Although the classical fin analysis method provides a simplified means to modeling heat transfer in micro-channel heat sinks, some key assumptions introduced in the fin method deviate significantly from the real situation, which may compromise the accuracy of this method.     

Numerical Analysis of Flow and Thermal Performance of Liquid-Cooling Microchannel Heat Sinks with Bifurcation

Single-phase liquid-cooling microchannels have received great attention to remove the gradually increased heat loads of heat sinks. Proper changes of the flow path and/or heat transfer surface can result in much better thermal performance of microchannel heat sinks. In this study, a kind of rectangular straight microchannel heat sink with bifurcation flow arrangement has been designed, and the corresponding laminar flow and heat transfer have been investigated numerically. Four different configurations are considered. The effects of the bifurcation ratio (the initial channel number over the bifurcating channel number) and length ratio (the channel length before bifurcation over the bifurcation channel length) on laminar heat transfer, pressure drop, and thermal resistance are considered and compared with those of the traditional straight microchannel heat sink without bifurcation flow. The overall thermal resistances subjected to inlet Reynolds number and pumping power are compared for the five microchannel heat sinks. Results show that the thermal performance of the microchannel heat sink with bifurcation flow is better than that of the corresponding straight microchannel heat sink. The heat sinks with larger bifurcation ratio and length ratio provide much better thermal performance. It is suggested to employ bifurcation flow path in the liquid-cooling microchannel heat sinks to improve the overall thermal performance by proper design of the bifurcation position and number of channels.