Low-power low-voltage reference using peaking current mirror circuit

A low-power low-voltage bandgap reference using the peaking current mirror circuit with MOSFETs operated in the subthreshold region is presented. A demonstrative chip was fabricated in 0.35 /spl mu/m CMOS technology, achieving the minimum supply voltage 1.4 V, the reference voltage around 580 mV, the temperature coefficient 62 ppm//spl deg/C, the supplied current 2.3 /spl mu/A, and the power supply noise rejection ratio of -84 dB at 1 kHz.     

MOS voltage reference based on polysilicon gate work function difference

A voltage reference in CMOS technology is based upon transistor pairs of the same type except for the opposite doping type of their polysilicon gates. At identical drain currents, the gate voltage difference, close to the silicon bandgap, is 1.2 V/spl plusmn/0.06 V. Circuits for a positive and for a negative voltage reference are presented. Digital voltage tuning improves accuracy. Temperature compensation is provided by proper choice of current ratio or by means of an auxiliary circuit. Voltage drift is about 300 ppm//spl deg/C without compensation, and can be reduced to /spl plusmn/30 ppm//spl deg/C. The circuits work with a supply voltage of 2-10 V and draw a current that is less than 1 /spl mu/A.     

A CMOS voltage reference based on weighted /spl Delta/V/sub GS/ for CMOS low-dropout linear regulators

A CMOS voltage reference, which is based on the weighted difference of the gate-source voltages of an NMOST and a PMOST operating in saturation region, is presented. The voltage reference is designed for CMOS low-dropout linear regulators and has been implemented in a standard 0.6-/spl mu/m CMOS technology (V/sub thn//spl ap/|V/sub thp/|/spl ap/0.9 V at 0/spl deg/C). The occupied chip area is 0.055 mm/sup 2/. The minimum supply voltage is 1.4 V, and the maximum supply current is 9.7 /spl mu/A. A typical mean uncalibrated temperature coefficient of 36.9 ppm//spl deg/C is achieved, and the typical mean line regulation is /spl plusmn/0.083%/V. The power-supply rejection ratio without any filtering capacitor at 100 Hz and 10 MHz are -47 and -20 dB, respectively. Moreover, the measured noise density with a 100-nF filtering capacitor at 100 Hz is 152 nV//spl radic/(Hz) and that at 100 kHz is 1.6 nV//spl radic/(Hz).     

CMOS voltage reference based on gate work function differences in poly-Si controlled by conductivity type and impurity concentration

A new CMOS voltage reference circuit consisting of two pairs of transistors is presented. One pair exhibits a threshold voltage difference with a negative temperature coefficient (-0.49 mV//spl deg/C), while the other exhibits a positive temperature coefficient (+0.17 mV//spl deg/C). The circuit was robust to process variations and exhibited excellent temperature independence and stable output voltage. Aside from conductivity type and impurity concentrations of gate electrodes, transistors in the pairs were identical, meaning that the system was robust with respect to process fluctuations. Measurements of the voltage reference circuit without trimming adjustments revealed that it had excellent output voltage reproducibility of within /spl plusmn/2%, low temperature coefficient of less than 80 ppm//spl deg/C, and low current consumption of 0.6 /spl mu/A.     

A 2-V 23-/spl mu/A 5.3-ppm//spl deg/C curvature-compensated CMOS bandgap voltage reference

A high-order curvature-compensated CMOS bandgap reference, which utilizes a temperature-dependent resistor ratio generated by a high-resistive poly resistor and a diffusion resistor, is presented in this paper. Implemented in a standard 0.6-/spl mu/m CMOS technology with V/sub thn//spl ap/|V/sub thp/|/spl ap/0.9 V at 0/spl deg/C, the proposed voltage reference can operate down to a 2-V supply and consumes a maximum supply current of 23 /spl mu/A. A temperature coefficient of 5.3 ppm//spl deg/C at a 2-V supply and a line regulation of /spl plusmn/1.43 mV/V at 27/spl deg/C are achieved. Experimental results show that the temperature drift is reduced by approximately five times when compared with a conventional bandgap reference in the same technology.     

A low-voltage low-power voltage reference based on subthreshold MOSFETs

In this work, a new low-voltage low-power CMOS voltage reference independent of temperature is presented. It is based on subthreshold MOSFETs and on compensating a PTAT-based variable with the gate-source voltage of a subthreshold MOSFET. The circuit, designed with a standard 1.2-/spl mu/m CMOS technology, exhibits an average voltage of about 295 mV with an average temperature coefficient of 119 ppm//spl deg/C in the range -25 to +125/spl deg/C. A brief study of gate-source voltage behavior with respect to temperature in subthreshold MOSFETs is also reported.     

A high-speed 64K CMOS RAM with bipolar sense amplifiers

A TTL-compatible 64K static RAM with CMOS-bipolar circuitry has been developed using a 1.2-/spl mu/m MoSi gate n-well CMOS-bipolar technology. Address access time is typically 28 ns, with 225 mW active power and 100 nW standby power. A CMOS six-transistor memory cell is used. The cell size is 18/spl times/20 /spl mu/m, and the chip size is 5.95/spl times/6.84 mm. The n-p-n transistors are used in the sense amplifiers, voltage regulators, and level clamping circuits. The bipolar sense amplifiers reduce the detectable bit line swing, thus improving the worst-case bit line delay time and the sensing delay time. In order to reduce the word line delay, the MoSi layer, which has 5 /spl Omega//sheet resistivity, was used for the gate material. The n-well CMOS process is based on a scaled CMOS process, and collector-isolated n-p-n transistors and CMOS are integrated simultaneously without adding any extra process steps and without causing any degradation of CMOS characteristics. The n-p-n transistor has a 2-GHz cutoff frequency at 1 mA collector current.     

A capacitor-free CMOS low-dropout regulator with damping-factor-control frequency compensation

A 1.5-V 100-mA capacitor-free CMOS low-dropout regulator (LDO) for system-on-chip applications to reduce board space and external pins is presented. By utilizing damping-factor-control frequency compensation on the advanced LDO structure, the proposed LDO provides high stability, as well as fast line and load transient responses, even in capacitor-free operation. The proposed LDO has been implemented in a commercial 0.6-/spl mu/m CMOS technology, and the active chip area is 568 /spl mu/m/spl times/541 /spl mu/m. The total error of the output voltage due to line and load variations is less than /spl plusmn/0.25%, and the temperature coefficient is 38 ppm//spl deg/C. Moreover, the output voltage can recover within 2 /spl mu/s for full load-current changes. The power-supply rejection ratio at 1 MHz is -30 dB, and the output noise spectral densities at 100 Hz and 100 kHz are 1.8 and 0.38 /spl mu/V//spl radic/Hz, respectively.     

MOS transistors operated in the lateral bipolar mode and their application in CMOS technology

Operation of an MOS transistor as a lateral bipolar is described and analyzed qualitatively. It yields a good bipolar transistor that is fully compatible with any bulk CMOS technology. Experimental results show that high /spl beta/-gain can be achieved and that matching and 1/f noise properties are much better than in MOS operation. Examples of experimental circuits in CMOS technology illustrate the major advantages that this device offers. A multiple current mirror achieves higher accuracy, especially at low currents. An operational transconductance amplifier has an equivalent input noise density below 0.1 /spl mu/V//spl radic/Hz for frequencies as low as 1 Hz and a total current of 10 /spl mu/A. A bandgap reference yields a voltage stable within 3 mV from -40 to +80/spl deg/C after digital adjustment at ambient temperature. Other possible applications are suggested.     

Characterization of 1.9- and 1.4-nm ultrathin gate oxynitride by oxidation of nitrogen-implanted silicon substrate

For gate oxide thinned down to 1.9 and 1.4 nm, conventional methods of incorporating nitrogen (N) in the gate oxide might become insufficient in stopping boron penetration and obtaining lower tunneling leakage. In this paper, oxynitride gate dielectric grown by oxidation of N-implanted silicon substrate has been studied. The characteristics of ultrathin gate oxynitride with equivalent oxide thickness (EOT) of 1.9 and 1.4 nm grown by this method were analyzed with MOS capacitors under the accumulation conditions and compared with pure gate oxide and gate oxide nitrided by N/sub 2/O annealing. EOT of 1.9- and 1.4-nm oxynitride gate dielectrics grown by this method have strong boron penetration resistance, and reduce gate tunneling leakage current remarkably. High-performance 36-nm gate length CMOS devices and CMOS 32 frequency dividers embedded with 57-stage/201-stage CMOS ring oscillator, respectively, have been fabricated successfully, where the EOT of gate oxynitride grown by this method is 1.4 nm. At power supply voltage V/sub DD/ of 1.5 V drive current Ion of 802 /spl mu/A//spl mu/m for NMOS and -487 /spl mu/A//spl mu/m for PMOS are achieved at off-state leakage I/sub off/ of 3.5 nA//spl mu/m for NMOS and -3.0 nA//spl mu/m for PMOS.     

1.5-V single work-function W/WN/n/sup +/-poly gate CMOS device design with 110-nm buried-channel PMOS for 90-nm vertical-cell DRAM

This letter reports on 1.5-V single work-function W/WN/n/sup +/-poly gate CMOS transistors for high-performance stand-alone dynamic random access memory (DRAM) and low-cost low-leakage embedded DRAM applications. At V/sub dd/ Of 1.5-V and 25/spl deg/C, drive currents of 634 /spl mu/A//spl mu/m for 90-nm L/sub gate/ NMOS and 208 /spl mu/A-/spl mu/m for 110-nm L/sub gate/ buried-channel PMOS are achieved at 25 pA//spl mu/m off-state leakage. Device performance of this single work function technology is comparable to published low leakage 1.5-V dual work-function technologies and 25% better than previously reported 1.8-V single work-function technology. Data illustrating hot-carrier immunity of these devices under high electric fields is also presented. Scalability of single work-function CMOS device design for the 90-nm DRAM generation is demonstrated.     

A 6.7-fF//spl mu/m/sup 2/ bias-independent gate capacitor (BIGCAP) with digital CMOS process and its application to the loop filter of a differential PLL

A linear bias-independent gate capacitor (BIGCAP) with large intrinsic capacitance and low parasitic capacitance is proposed. BIGCAP is composed of a pair of accumulation-mode n-poly gate capacitors in an n-well and a pair of pMOS gate capacitors, which requires no additional fabrication process steps. Measured results with 1.5-V 0.13-/spl mu/m digital CMOS technology show that the intrinsic capacitance is 6.7 fF//spl mu/m/sup 2/ (6.7 times bigger than that of typical MIM capacitors) and the parasitic capacitance is 1.9% of the intrinsic capacitance (1/5 that of typical MIM capacitors). The linearity is /spl plusmn/2.9% and capacitance variation across a wafer is as small as /spl sigma/= 0.096%. For a 0.1-V threshold voltage variation, the capacitance variation was only /spl sigma/= 0.69% and the linearity ranged from /spl plusmn/2.84% to /spl plusmn/2.93%. For three types of BIGCAP using 1.5-V, 2.5-V, and 3.3-V MOSFETs, less than /spl plusmn/4% linearity is achievable by optimizing the ratio (x) of the pMOS gate capacitors' area to the area of the n-poly gate capacitors, and the optimum x value is within a range of 15%-25%. BIGCAP has been applied to the loop filter of a differential phase-locked loop (PLL) and reduces the gate area of the largest loop filter capacitor to only 35% of that of the conventional design while achieving reasonable jitter of 7.0 ps (rms) and 74.4 ps (peak-to-peak) at 840 MHz with a 1.5-V supply.     

CMOS voltage references using lateral bipolar transistors

Two bandgap references are presented which make use of CMOS compatible lateral bipolar transistors. The circuits are designed to be insensitive to the low beta and alpha current gains of these devices. Their accuracy is not degraded by any amplifier offset. The first reference has an intrinsic low output impedance. Experimental results yield an output voltage which is constant within 2 mV, over the commercial temperature range (0 to 70/spl deg/C), when all the circuits of the same batch are trimmed at a single temperature. The load regulation is 3.5 /spl mu/V//spl mu/A, and the power supply rejection ratio (PSRR) at 100 Hz is 60 dB. Measurements on a second reference yield a PSRR of minimum 77 dB at 100 Hz. Temperature behaviour is identical to the first circuit presented. This circuit requires a supply voltage of only 1.7 V.     

Dual tone and modem frequency generator with on-chip filters and voltage reference

A single-chip CMOS circuit is described that contains a dual-tone multifrequency and modem frequency generator. For optimum performance and economy, switched-capacitor techniques are used for the on-chip bandgap reference voltage, digital-to-analog converters, and filter. CEPT recommendations on output level stability and distortion are met without recourse to external filtering and without a stabilized supply or external reference voltage. A self-aligned contact CMOS process with 4-/spl mu/m design rules and with 500-/spl Aring/-thick gate oxide is used to manufacture the circuit.     

High sensitive and wide detecting range MOS tunneling temperature sensors for on-chip temperature detection

This paper examined the feasibility of applying a highly sensitive metal-oxide-semiconductor (MOS) tunneling temperature sensor, which was compatible with current CMOS technology. As the sensor was biased positively at a constant voltage, the gate current increased more than 500 times when the sensor was heated from 20/spl deg/C to 110/spl deg/C. However, when the sensor was biased at a constant-current situation, its gate voltage magnitude changed significantly with substrate temperature, with a sensitivity exceeding -2 V//spl deg/C. The improvement of temperature sensitivity in this paper is one thousand times over the sensitivity of a conventional p-n junction, i.e., namely, about -2 mV//spl deg/C. Regarding a temperature sensor array, this paper proposes a method using gate current gain, rather than absolute gate current, to eliminate the gate current discrepancy among sensors. For constant current operation, a sensitivity exceeding 10 V//spl deg/C can be obtained if the current level is suitable. Finally, this paper demonstrates a real temperature distribution for on-chip detection. With such a high temperature-sensitive sensor, accurate temperature detection can be incorporated into common CMOS circuits.     

High performance 35 nm gate length CMOS with NO oxynitride gate dielectric and Ni salicide

The 35 nm gate length CMOS devices with oxynitride gate dielectric and Ni salicide have been fabricated to study the feasibility of higher performance operation. Nitrogen concentration in gate oxynitride was optimized to reduce gate current I/sub g/ and to prevent boron penetration in the pFET. The thermal budget in the middle of the line (MOL) process was reduced enough to realize shallower junction depth in the S/D extension regions and to suppress gate poly-Si depletion. Finally, the current drives of 676 /spl mu/A//spl mu/m in nFET and 272 /spl mu/A//spl mu/m in pFET at V/sub dd/=0.85 V (at I/sub off/=100 nA//spl mu/m) were achieved and they are the best values for 35 nm gate length CMOS reported to date.     

1 V CMOS current reference with 50 ppm//spl deg/C temperature coefficient

A CMOS current reference circuit is presented, which can work properly with a supply voltage higher than 1 V. By compensating the temperature performance of the resistor, this circuit gives out a current with a temperature coefficient of 50 ppm//spl deg/C over the temperature range of (0/spl deg/C, 110/spl deg/C) and a 0.5% variation for a supply voltage of 1 to 2.3 V.     

HMOS-CMOS-a low-power high-performance technology

HMOS-CMOS, a new high-performance bulk CMOS technology, is described. This technology builds on HMOS II, and features high resistivity p-substrate, diffused n-well and scaled n- and p-channel devices of 2-/spl mu/m channel length and 400-/spl Aring/ gate oxide thickness. The aggressive scaling of n and p devices results in 350-ps minimum gate delay and 0.04-pJ power delay product. HMOS-CMOS is a single poly technology suitable for microprocessor and static RAM applications. A 4K static RAM test vehicle is described featuring fully CMOS six-transistor memory cell, a chip size of 19600 mil/SUP 2/, 75 /spl mu/W standby power, data retention down to a V/SUB cc/ voltage of 1.5 V and a minimum chip select and address access time of 25 ns.     

An 18 ns CMOS/SOS 4K static RAM

A high-speed CMOS/SOS 4K word/spl times/1 bit static RAM is described. The RAM features a MoSi/SUB 2/ gate CMOS/SOS technology with 2 /spl mu/m gate length and 500 /spl Aring/ thick gate oxide. Performance advantage of SOS over bulk is discussed for the scaled-down MOS LSI with 1-2 /spl mu/m gate. A standard 6-transistor CMOS cell and a two-stage sense amplifier scheme are utilized. In spite of the rather conservative 3.5 /spl mu/m design rule except for the 2 /spl mu/m gate length, the cell size of 36/spl times/36 /spl mu/m, the die size of 3.11/spl times/4.07 mm, and the typical read access and cycle time of 18 ns are achieved. The active and standby power dissipation are 200 mW and 50 /spl mu/W, respectively.     

High-density CMOS ROM arrays

A single transistor cell and a precharge signal are used to reduce the memory cell area in bulk CMOS ROM arrays to 1.12 mil/SUP 2//bit. Use of SOS/CMOS technology further reduces the memory cell area to 0.38 mil/SUP 2//bit and makes possible CMOS ROMs of up to 32768 bits. Operation of both the array and the decoders is controlled by a precharge signal which is generated internally in a way which is transparent to the user. The CMOS ROMs thus produced are competitive with NMOS ROMs in both density and speed, yet retain all of the advantages of static CMOS circuits such as 1-/spl mu/W power dissipation, full 2.8-15 V voltage operating range, and full -55/spl deg/C-125/spl deg/C temperature range.