Pb掺杂SnO2压敏电阻的晶粒尺寸效应

研究了Pb3O4对(Co，Nb)掺杂SnO2压敏材料电学性质的影响，当Pb3O4的含量从0．00增加到0．75％(摩尔分数，下同)时，(Co，Nb)掺杂SnO2压敏电阻的击穿电压从426V／mm迅速减小到160V／mm，40Hz时的相对介电常数从1240迅速增加到2760，这说明Pb3O4是调控SnO2压敏材料击穿电压和介电常数的敏感添加剂，晶界势垒高度测量表明，在实验范围内Pb的含量对势垒高度的影响很小，随着Pb含量的增加，SnO2的晶粒尺寸的迅速长大是击穿电压迅速减小和介电常数迅速增大的主要原因，对样品的复阻抗进行了测量，发现未掺杂Pb的样品具有最低的晶界电阻，而掺杂0．50％Pb3O4的样品具有最高的晶界电阻，提出了一个修正的缺陷势垒模型，指出了替代Sn的受主不应当处于晶界上，而应处于耗尽层的Sn的晶格位置。     

Al2O3微粉的表面改性及表征

以α—Al2O3微粉为基体，Y(NO3)3溶液为包裹相，采用液相包裹法进行加钇颗粒表面改性。获得了表面均匀包裹Y2O3的α—Al2O3粉体。将此粉体与Al合金复合制备复合材料，复合材料组织更加均匀，对材料进行力学性能测试，结果表明：改性粉体对Al合金增强效果明显增加，抗拉强度提高27．2％，屈服强度提高33．1％，延伸率提高10．3％。     

电磁连续铸造Sn-Pb空心管坯质量控制

为获得高质量的空心管坯，提出了在连续铸造过程中施加电磁场的空心管坯电磁连铸方法，并采用低熔点Sn—4．5％Pb(质量分数)合金模拟高熔点金属，研究了浇注系统及电磁场对空心管坯表面质量和宏观组织的影响．结果表明：在连续铸造过程中施加电磁场，可获得内外质量良好的空心管坯；当施加0．1kw的小功率电磁场时，可获得与强迫对流方向相反的V字型柱状晶组织；当功率增大到0．3kw时．内外相向生长的柱状晶变细变短，并在中部得到细小的等轴晶组织；采用小直径多浇口的雨淋式浇注系统和施加交变电磁场，有利于消除管坯内脏热节瘤，并得到周向均匀性较高的宏观凝固组织．     

聚苯胺/蒙脱土电流变液的稳定性

采用乳液共混插层法制备了高介电常数的聚苯胺／蒙脱土纳米复合材料微粒。聚苯胺／蒙脱土电流变液在外电场下的剪切强度达8.26kPa(3KV/mm DC,5s^-1)，并具有较好的温度稳定性，其剪切应力在10－100℃内随温度变化仅为6．5％（1.5kV/mm,DC,1.61s^-1)，静置60天沉降率仅为1％，IR及XRD分析表明，聚苯胺插入到蒙脱土层间，形成纳米复合颗粒，TEM标示颗粒的粒径约为100nm，在1000Hz，20℃时，聚苯胺／蒙脱土颗粒的介电常数比纯蒙脱土提高2．7倍，比纯聚苯胺提高5．5倍，电导率增加8．5倍。     

电弧气化法制备纳米ITO粉末及高密度ITO靶的研制

以纯度为99．99％的纯金属In和Sn为原料,采用电弧气化法制备了单一立方In2O3结构的纳米ITO合金粉末,所制备的粉末以四方和类球形两种形貌存在,粒度主要位于30-70nm,分散性良好;并在此基础上采用常压烧结制备了相对密度高达99．74％,平均电阻率达到1．52×10^-4Ω·cm,结构成份均匀,晶粒尺寸5—10μm左右的超高密度ITO靶材。     

分子相互作用体积模型在真空蒸馏分离铅锡合金中的应用

运用分子相互作用体积模型(MIVM),结合Pb、Sn的无限稀活度系数γ∞Pb、γ∞Sn,通过牛顿迭代法计算出参数Bij和Bji,利用参数Bij和Bji计算Pb-Sn合金中Pb、Sn的活度系数γPb,γSn.并利用γPb,γsn进一步计算出Pb-Sn合金中Pb的分离系数βPb,结果表明βPb(》)1,Pb、Sn能够彻底地分离.同时用γPb,γsn绘制出气液相平衡图,结果表明,900℃、液相中锡含量为85％时,气相中含锡仅为0.008％.以上热力学分析表明,Pb、Sn能够通过真空蒸馏实现良好分离.进一步实验验证结果表明,900℃、20 min条件下,液相中含锡为85％时,气相中含锡为0.112％,实验结果与预测结果吻合较好.此研究为真空蒸馏分离Pb-Sn合金提供了很好的理论依据和实验基础数据.     

钛合金的腐蚀性能

美国矿务局曾对工业钛(0.44％C、0.027％N_2、0.1％O_2、0.13％Fe、0.076％Mn、<0.02％W、<0.04％Si)及钛基合金:Ti—Mn(8％Mn)、Ti—Al—Sn(5％Al,2.5％Sn),Ti—Cu(1和5％Cu)及Ti—Al(2和6％Al)进行过化学和电镀腐蚀试验。 试验是在下述介质中进行的:合成的海水(按ASTM     

低Co贮氢合金ReNi3.5Co0.3Mn0.3Al0.4Fe0.5-xSnx(x=0～0.4)的相结构和电化学性能

对比研究了铸态和退火态ReNi3.5Co0．3Mn0．3Al0．4Fe0.5—xSnx(x＝0—0．4)贮氢合金的相结构和电化学性能。XRD分析表明，铸态和退火态的无Sn合金均为单相CaCu5型结构；而在含Sn合金中，除CaCu5型结构的主相之外，还存在有LaNiSn第二相，且第二相的含量随合金Sn含量(x)的增加而增多；退火处理可以减少含Sn合金中第二相的含量。电化学测试表明，Sn含量对铸态合金的活化性能没有影响，但Sn含量的增加会导致合金的放电容量降低；退火处理可使Sn含量x≤0．2的合金的活化次数及放电容量略有增加，但使Sn含量更高(x＞0．2)的合金的活化性能及放电容量明显降低。随Sn含量x的增加，铸态合金的放电电位平台、高倍率放电性能及循环稳定性均有所降低；退火处理能显著改善含Sn合金的放电电位平台和循环稳定性，但使合金的高倍率放电性能进一步降低。     

Sb掺杂Sn_2S_3薄膜的制备及光学特性

真空蒸发制备Sb掺杂Sn2S3多晶薄膜(玻璃衬底),研究不同比例Sb掺杂对Sn2S3薄膜的结构、表面形貌、化学组分及光学特性的影响。实验给出5%掺Sb的薄膜经380℃热处理30min(氮气保护)得到正交晶系的Sn2S3∶Sb多晶薄膜,薄膜表面颗粒大小均匀,膜面致密有轻微颗粒聚集现象。薄膜体内Sn与S化学计量比为1∶1.49,掺Sb后为1∶0.543,薄膜中Sn、S、Sb分别以Sn2+、Sn4+、S2-、Sb5+存在。纯Sn2S3薄膜的光透过率在350~500nm波长范围内基本为零,随着波长增大,光透过率增加,其直接光学带隙为2.2eV,吸收边为564nm;掺Sb后薄膜的光透率明显降低,光学带隙为1.395eV比未掺杂时减小0.805eV,吸收边发生红移为889nm。     

Fe3O4/聚苯乙烯中空微球磁性复合微粒的制备及其磁流变性能的研究

用共沉淀法在聚苯乙烯（PS）中空微球表面包覆Fe3O4，制备了Fe3O4/Ps中空微球磁性复合微粒，当磁性包覆层的厚度为30～50nm时，复合微粒的室温表现密度为1．5g/cm^3，为传统磁流变液（MRF）中所用铁粉等软磁性颗粒密度（约7．9g/cm^3）的1/5，更为接近MRF中载液的密度。复合颗粒的磁滞回线比较狭长，呈软磁性，其磁性能和Fe3O4纳米颗粒相差不大。与Fe3O4颗粒相比，Fe3O4/PS中空磁性复合微粒在水载液中的沉降稳定性大大提高，复合微粒含量越高，其沉降稳定性越好。在磁性微粒含量相同的条件下，基于Fe3O4/PS中空磁性复合微粒的MRF的磁流变性能明显优于基于Fe3O4纳米微粒的MRF。     

低银Sn-0. 45Ag-0. 68Cu-X 无铅钎料性能的对比研究

目的制备一种新型低银亚共晶Sn-0.45Ag-0.68Cu-X(SAC-X)无铅钎料,并对其综合性能进行探究。方法参照国家标准,对其漫流性、润湿性及力学性能进行了测试,并与Sn-37Pb,Sn-0.7Cu,Sn-3.5Ag-0.6Cu钎料进行了对比。结果 4种钎料漫流性和润湿性大小依次为:Sn-37Pb,Sn-3.5Ag-0.6Cu,SAC-X,Sn-0.7Cu,其中SAC-X钎料铺展率达78.5%,润湿时间为1.3 s,最大润湿力为3.18 m N;SAC-X钎料抗拉强度(40 MPa)与高银Sn-3.5Ag-0.6Cu钎料(44 MPa)相差不大,但延伸率是高银Sn-3.5Ag-0.6Cu的1.89倍。结论低银SAC-X钎料综合性能优良,与Sn-3.5Ag-0.6Cu钎料相差不大。     

Structure, mechanical properties and electrical resistivity of rapidly solidified Pb-Sn-Cd and Pb-Bi-Sn-Cd alloys

A series of Pb-Sn-Cd alloys containing up to 60 wt % Bi were quenched from the melt to room temperature by melt spinning. The structure of rapidly solidified (melt spun), Pb-30 wt % Sn-10 wt % Cd, Pb-30 wt % Bi-20 wt % Sn-10 wt % Cd, and Pb-60 wt % Bi-10 wt % Sn-10 wt % Cd have been investigated by means of an X-ray diffraction technique. From X-ray analysis a crystalline metastable phase, designated (Pb-Bi) is detected. The formation of a metastable crystalline phase in the range of composition investigated causes a pronounced increase in the electrical resistivity. Desirable values of hardness and elastic constants are critically evaluated. It is also observed that the values of the Fermi energy are a few electron volts. Calculated values for the concentration of the conduction electrons, N, m_-3 of Pb -60 wt % Bi-10 wt % Sn-10 wt % Cd rapidly solidified is found to be 0.985×10₂₈ m_-3.     

Determination of thermophysical properties of 45% Pb‒55% Bi alloy. Thermodynamic simulation

The thermophysical properties of 45% Pb?55% Bi alloy were studied using thermodynamic simulation. Vapor pressure, partial pressures of the components of vapor, heat capacity, entropy, enthalpy, and the thermal conductivity of an alloy depending on temperature were determined. A comparison of the results from published data was made.     

Adsorptive features of polyacrylamide-apatite composite for Pb2+, UO(2)2+ and Th4+

Micro-composite of polyacrylamide (PAA) and apatite (Apt) was prepared by direct polymerization of acrylamide in a suspension of Apt and characterized by means of FT-IR, XRD, SEM and BET analysis. The adsorptive features of PAA-Apt and Apt were then investigated for Pb(2+), UO(2)(2+) and Th(4+) in view of dependency on ion concentration, temperature, kinetics, ion selectivity and reusability. Experimentally obtained isotherms were evaluated with reference to Langmuir, Freundlich and Dubinin-Radushkevich (DR) models. Apt in PAA-Apt had higher adsorption capacity (0.81, 1.27 and 0.69 mol kg(-1)) than bare Apt (0.28, 0.41 and 1.33 mol kg(-1)) for Pb(2+) and Th(4+), but not for UO(2)(2+). The affinity to PAA-Apt increased for Pb(2+) and UO(2)(2+) but not changed for Th(4+). The values of enthalpy and entropy changed were positive for all ions for both Apt and PAA-Apt. Free enthalpy change was DeltaG<0. Well compatibility of adsorption kinetics to the pseudo-second-order model predicated that the rate-controlling step was a chemical sorption. This was consistent with the free energy values derived from DR model. The reusability tests for Pb(2+) for five uses proved that the composite was reusable to provide a mean adsorption of 53.2+/-0.7% from 4x10(-3)M Pb(2+) solution and complete recovery of the adsorbed ion was possible (98+/-1%). The results of this investigation suggested that the use of Apt in the micro-composite form with PAA significantly enhanced the adsorptive features of Apt.     

Sn-0.7Cu无铅钎料对铜引线材料的润湿性

采用改性熔炼工艺制备了Sn-0.7Cu改性合金,用润湿平衡法研究了温度、钎剂中卤素含量、浸渍时间对铜引线材料润湿性的影响,并与Sn-37Pb进行了对比.结果表明:升高温度可明显提高润湿性;当用R(非活性)钎剂时,Sn-0.7Cu对铜引线不润湿;随着钎剂中卤素离子的增加,其润湿性得到显著改善,钎剂中卤素含量以≥0.4wt%为宜;随浸渍时间的延长,润湿力明显降低,表明界面存在"失润现象".     

Simulation of the solidification of gas-atomized Sn-5mass%Pb droplets

A simulation method was developed to predict the solidification microstructure of gas-atomized Sn-5mass%Pb droplets. Both internal nucleation caused by a catalyst present in the melt and surface nucleation caused by oxidation are considered. For a given set of atomizing conditions, the model predicts the mode of nucleation, the undercooling, the recalescence time and duration, the post-recalescence plateau duration, the fraction solid at the end of recalescence, and the dendrite growth rate, composition and tip radius during and after recalescence. Predicted droplet microstructures are presented in contour diagrams of dendrite growth rate, composition and tip radius. A separate analysis indicates that dendrite fragmentation is not likely in gas-atomized Sn-5mass%Pb droplets. The developed model provides a scientific basis for improved classification of gas-atomized powders.     

The electrochemical corrosion behaviour of Pb-free Al-Zn-Sn solders in NaCl solution

The corrosion behaviour of Pb-free X(5Al-Zn)-YSn solders, where X is 9-50 and Fis 91-50, has been investigated with regard to open-circuit potential, galvanic corrosion and potentiodynamic polarization in a 3.5% NaCl solution. The galvanic current densities for 9 (5Al-Zn)-91Sn in NaCl solution are 25, 20 and 12.5 μA/cm² with respect to Cu, Ni-Cu-P and Ni-P, respectively. The corrosion behaviour has been compared with that of 63Sn-37Pb solder. A passivation behaviour is observed for all of the investigated Al-Zn-Sn solders. The magnitudes of the passivation current densities depend on the compositions of the solders and the potentials applied. The polarization behaviour of eutectic 9 (5Al-Zn)-91Sn solder is very similar to that of 63Sn-37Pb solder. SnO₂ is formed at polarization potentials below −330 mV, while SnCl₄ forms when the potential is at 120 mV. ZnCl₂ replaces SnCl₄ on polarizing at 120 mV for an extended period of 1 h.     

添加微量元素的Sn-Ag-Sb-Zn系无铅焊料性能研究

在Sn-Ag-Sb-Zn焊料合金中添加微量元素P、Bi、In和Ga,进行了力学性能和物理性能试验.结果表明:试验合金的密度比Sn-37Pb合金降低9.26%-10.55%;剪切强度比Sn-37Pb合金增加6%-51.3%;但熔点有所提高,结晶温度在6.32-7.88℃之间.微量元素的加入对合金的润湿性能有所改善;并能明显提高接头剪切强度.新开发的焊料合金的综合性能已经超过了Sn-37Pb焊料.     

Sn-58Bi-(0~3)Ga/Cu润湿剪切性能及界面化合物的研究

采用熔炼铸造法制备了Sn-58Bi-(0~3)Ga焊料合金,研究了Ga元素含量对合金熔化特性、润湿和剪切性能的影响,并利用扫描电镜研究了Sn-58Bi-(0~3)Ga/Cu基体界面特征。结果表明,Ga元素的添加降低了合金的熔点,增大了合金的熔程,相比于Sn-58Bi合金,Sn-58Bi-1Ga焊料合金在铜基体的铺展率显著下降,剪切强度略有提高,随着Ga含量提高至2%、3%,合金的铺展率略有下降,剪切强度显著降低;Sn-58Bi/Cu界面主要组成元素为Sn和Cu,Sn-58Bi-(1~3)Ga/Cu界面上出现了明显的Ga和Cu元素偏聚界面层,结合特征点的能谱成分分析,确定了界面化合物的组成。     

Effect of alloying elements on the creep behavior of high Pb-based solders

This study examines the high temperature creep behavior of several Pb-based alloys. All compositions tested were found to follow power-law dislocation creep in the strain rate range of 10⁻⁹-10⁻³ s⁻¹. Both the stress exponent and activation energy were measured from 298 to 473 K to identify the rate controlling mechanism for creep deformation. Creep of 95Pb-5In, 92.5Pb-5Sn-2.5Ag, 93Pb-3Sn-2Ag-2In was rate limited by dislocation climb from the observed stress exponent. A transition in the controlling climb mechanism from pipe diffusion to lattice diffusion was observed around 0.7T_m. Creep of 90Pb-10Sn was, however, rate limited by viscous solute drag rather than dislocation climb due to the greater concentration of Sn in Pb. The enhancement in self-diffusion of Pb was dependent on the degree of solid solution with solute atoms. The outcome of this work identifies variables related to the alloy elements that control creep behavior of Pb-based alloys used in high temperature applications where traditional solders cannot be used.