Effects of transition metal (Ni, Mn, Cu) doping on ferroelectric properties of Bi0.9Nd0.1FeO3 thin films prepared by chemical solution deposition method

Transition metal (Ni, Mn, Cu) doped Bi_0.9Nd_0.1FeO₃ thin films were prepared on Pt(111)/Ti/SiO₂/Si(100) substrates by using a chemical solution deposition method. Compared to pure BiFeO₃ (BFO) thin film, improved ferroelectric and leakage current properties were observed in the transition metal doped thin films. The values of remnant polarization (2P _r ) and coercive electric field (2E _c ) of the transition metal doped thin films were 59 μC/cm² and 690 kV/cm at 700 kV/cm for the Ni-doped Bi_0.9Nd_0.1FeO₃ thin film, 57 μC/cm² and 523 kV/cm at 670 kV/cm for the Mn-doped thin film, and 85 μC/cm² and 729 kV/cm at 700 kV/cm for the Cu-doped thin film, respectively. The 2P _r values observed in the transition metal doped thin films were much larger than that of the BFO thin film, 21 μC/cm² at 660 kV/cm. Also the 2E _c values of in the transition metal doped thin films were lower than that of the BFO thin film, 749 kV/cm at 660 kV/cm. The reduced leakage current density was observed in the transition metal doped thin films, which is approximately two orders of magnitude lower than the BFO thin film, 2.6?×?10^?3 A/cm² at 100 kV/cm.     

Study on the electrical and optical properties of ITO and AZO thin film by oxygen gas flow rate

Transparent conductive oxide (TCO) thin films such as tin doped indium oxide (ITO), zinc doped indium oxide (IZO) and Al doped zinc oxide (AZO) have been widely used as transparent electrode for display. ITO and AZO thin films for display was prepared by the facing targets sputtering (FTS) system. The FTS method is called a plasma-free sputter method because the substrate is located apart from plasma. This system can deposit the thin film with low bombardment by high energetic particles in plasma such as γ-electrons, negative ions and reflected Ar atoms. ITO and AZO thin films were deposited on glass substrate at room temperature with oxygen gas flow rate and input power. And the electrical, structural and optical properties of the thin films were investigated. As a result, the resistivity of ITO, AZO thin film is 6?×?10^?4 Ω cm, 1?×?10^?3 Ω cm, respectively. And the optical transmittance of as-deposited thin films is over 80% at visible range.     

Structural and improved electrical properties of rare earth (Sm, Tb and Ho) doped BiFe0.975Mn0.025O3 thin films

Pure BiFeO₃ (BFO) and rare earth (RE) ion co-doped (Bi_0.9RE_0.1)(Fe_0.975Mn_0.025)O₃ (RE?=?Sm, Tb and Ho, denoted by BSFM, BTFM and BHFM) thin films were prepared on Pt(111)/Ti/SiO₂/Si(100) substrates by using a chemical solution deposition method. Formations of distorted rhombohedral perovskite structure for the thin films were confirmed by using an X-ray diffraction and a Raman scattering analysis. Microstructural features for the thin films were examined by using a scanning electron microscopic analysis. Among the thin films, the lowest leakage current density of 1.22?×?10^?6 A/cm² (at 100 kV/cm), large remnant polarization (2Pr) of 72.4 μC/cm² and low coercive field (2E _c ) of 689 kV/cm (at 980 kV/cm) were measured for the BTFM thin film.     

Enhancement of ferroelectricity in gadolinium (Gd) and transition metal (Ni, Co, Cr) Co-doped BiFeO3 thin films via a chemical solution deposition technique

The BiFeO₃ (BFO) and the gadolinium and transition metal ions co-doped (Bi_0.9Gd_0.1)(Fe_0.975 TM _0.025)O_3-δ (TM?=?Ni, Co and Cr, BGFNi, BGFCo and BGFCr) thin films were prepared on Pt(111)/Ti/SiO₂/Si(100) substrates by using a chemical solution deposition method. Compared to the pure BFO, improved electrical and ferroelectric properties were observed in the co-doped (Bi_0.9Gd_0.1)(Fe_0.975 TM _0.025)O_3-δ thin films. Among the thin films, the BGFCr thin film exhibited large remnant polarization (2P _r ), low coercive field (2E _c ), and reduced leakage current density, which are 136 μC/cm², 1360 kV/cm at 1470 kV/cm, and 5.14?×?10^-6 A/cm² at 100 kV/cm, respectively.     

Electrical and optical properties of fluorine-doped tin oxide (SnOx:F) thin films deposited on PET by using ECR–MOCVD

The electrical, optical, structural and chemical bonding properties of fluorine-doped tin oxide (SnO_x:F) films deposited on a plastic substrate prepared by Electron Cyclotron Resonance–Metal Organic Chemical Vapor Deposition (ECR–MOCVD) were investigated with special attention to the process parameters such as the H₂/TMT mole ratio, deposition time and amount of fluorine-doping. The four point probe method, UV visible spectroscopy, scanning electron microscopy (SEM), transmission electron microscopy (TEM), atomic emission spectroscopy (AES), X-Ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) were employed to characterize the films. Based on our experimental results, the characteristics of the SnO_x:F thin films were significantly affected by the process parameters mentioned above. The amount of fluorine doping was found to be one of the major parameters affecting the surface resistivity, however its excess doping into SnO₂ lead to a sharp increase in the surface resistivity. The average transmittance decreased with increasing film thickness. The lowest electrical resistivity of 5.0?×?10^?3 Ω^.cm and highest optical transmittance of 90% in the visible wavelength range from 380 to700 nm were observed at an H₂/TMT mole ratio of 1.25, fluorine-doping amount of 1.3 wt.%, and deposition time of 30 min. From the XRD analysis, we found that the SnO_x:F films were oriented along the (2 1 1) plane with a tetragonal and polycrystalline structure having the lattice constants, a?=?0.4749 and c?=?0.3198 nm.     

Characterization of PT ferroelectric thin films on porous silica for pyroelectric IR detectors

Ferroelectric PbTiO₃ thin films were deposited on Pt/DS/PS/SiO₂/Si substrates by sol–gel technique. Porous silica (PS) thin film was used as thermal-insulation layer and dense silica (DS) thin film was a buffer layer to reduce surface roughness of PS layer. Root mean square surface roughness can be effectively reduced from 9.7 to 3.5 nm after PS buffer layer was prepared. The average grain size of PT thin films decreased slightly with increasing thickness of porous silica. Dielectric constant of PT increased from 107 to 171 at 1 KHz as thickness of PS layer increased from 0 to 2,000 nm. PT thin film prepared on 2,000 nm porous silica exhibited good dielectric property. The leakage current density was less than 1.6?×?10^-6 A/cm² when the applied electrical field was 200 kV/cm. The composite film is suitable for preparing pyroelectric IR detectors.     

Fabrication and characterization of Au/SBT/LZO/Si MFIS structure

Ferroelectric SrBi₂Ta₂O₉ (SBT) films on a p-type Si (100) wafer with a LaZrO _x (LZO) buffer layer have been fabricated to form a metal-ferroelectric-insulator–semiconductor (MFIS) structure. The LZO thin film and SBT films were deposited by using a sol–gel method. The equivalent oxide thickness (EOT) value of the LZO thin film was about 8.83 nm. Also, the leakage current density of the LZO thin film is about 3.3?×?10^?5 A/cm² at bias sweeping voltage of ±5 V. SBT films were crystallized in polycrystalline phase with highly preferred (115) orientation. Also, the intensity of each pick slightly increased as thickness of SBT films increased. The C–V characteristics of Au/SBT/LZO/Si structure showed clockwise hysteresis loop. The memory window width increased as the thickness of SBT films increased. The leakage current density of Au/SBT/LZO/Si structure decreased as thickness of SBT films increased.     

Electrical and optical studies of transparent conducting ZnO:Al thin films by magnetron dc sputtering

Transparent conducting aluminium-doped Zinc oxide (ZnO:Al) films have been deposited on glass substrates by magnetron dc sputtering using a ceramic target (ZnO with 2 wt% Al₂O₃). The dependence of the electrical and optical properties of these films on substrate temperature, sputtering pressure of Ar and location of substrates were investigated in detail. Target is perpendicular with substrate and we controlled the distance ‘x’ of target and substrate. Optimized films with resistivity of 3.7?×?10^?4 Ω cm, an average transmission in the visible range (300–800 nm) of greater than 85% and the reflectance in the infrared range being greater than 85% have been formed. Substrate temperature, distance ‘x’, and working pressure are optimized for lower resistivity and high concentration of carriers.     

Dielectric characteristics investigation of (Ba0.7Sr0.3)(Ti0.9Zr0.1)O3 ferroelectric thin films

By the radio frequency (RF) magnetron sputtering methods, (Ba_0.7Sr_0.3)(Ti_0.9Zr_0.1)O₃ (BSTZ) ferroelectric thin films were deposited on the Pt/Ti/SiO₂/Si(100) substrates. The crystal structural and microstructure of these thin films were analyzed by means of the XRD, SEM, and AFM. Moreover, the dielectric characteristics were also investigated by the C-V and J-E analyses. The optimal deposition parameters for these BSTZ thin films were: RF power is 160 W, oxygen concentration is 25%, substrate temperature is 580°C, and chamber pressure is 0.075 mPa. Under these optimal deposition conditions, the (111) and (110) oriented polycrystalline of the BSTZ thin films grow easily. And under a bias voltage of 0.5 MV/cm, the dielectric constant and leakage current density of the BSTZ thin films are 191 and 3×10^?8 A/cm², respectively. In addition, under various measured temperatures (0 ～ 80°C) and frequencies (100 kHz ～ 1 MHz), all the dielectric constants remain almost unchanged. Compared to BSTZ thin films reported previously, in this study, the deposited thin films have the advantage of lower leakage current and hence are suitable for the applications of dynamic random access memory.     

Effects of Mg doping concentration on the band gap of ZnO/Mg x Zn1−x O multilayer thin films prepared using pulsed laser deposition method

Epitaxial ZnO/Mg _x Zn_1-x O multilayer thin films (x?=?0~0.15) were prepared on c-Al₂O₃ substrates by pulsed laser deposition and their crystallinity and optical properties were investigated using X-ray diffraction, TEM, and UV-Vis spectroscopy. ZnO/Mg _x Zn_1-x O multilayer thin films were grown by stacking alternate layers of ZnO and Mg _x Zn_1?x O with laser fluence of 3 J/cm², repetition rate of 5 Hz, substrate temperature of 600 °C, and oxygen partial pressure of 5?×?10^–4 Torr. The thickness of individual ZnO and Mg _x Zn_1?x O layers was maintained at 3 and 6 nm, respectively, and the total thickness of the films was kept in 300 nm. X-ray diffraction results showed that the multilayer thin films were grown epitaxially on c-Al₂O₃ substrates with an epitaxial orientation relationship of $\left. {\left( {0001} \right)\left[ {10\bar 11} \right]_{{\text{multilayer}}} } \right\|\left( {0001} \right)\left[ {10\bar 11} \right]_{{\text{Al}}_{\text{2}} {\text{O}}_{\text{3}} } $ . Cross-sectional TEM micrographs showed alternating layers of bright and dark contrast, indicating the formation of ZnO/Mg _x Zn_1?x O multilayer thin films. The 2θ value of Mg _x Zn_1?x O (0002) peak increased from 34.30° at x?=?0 to 34.67° at x?=?0.15 with increasing Mg doping concentration in the multilayer thin films. The absorption edge in the UV-Vis spectra shifted to shorter wavelength from 360 at x?=?0 to 342 nm at x?=?0.15 and the band gap energy increased from 3.27 eV at x?=?0 to 3.54 eV at x?=?0.15.     

DC conduction behavior of Bi3.15Nd0.85Ti3O12 thin films grown by RF-magnetron sputtering

The Bi_3.15Nd_0.85Ti₃O₁₂ (BNT) thin films were deposited on Pt(111)/Ti/SiO₂/Si substrates by using RF-magnetron sputtering method and studied the ferroelectric and leakage current charateristics. The polarization – electric field (P-E) hysteresis loops of BNT film was well saturated with the remnant polarization (2P _r ) of 29.8 μC/cm² and a coercive field (2E _c ) of 121 kV/cm. The leakage current density – electric field (J-E) characteristics of the Pt/BNT/Pt capacitor reveals the presence of two conduction region, having Ohmic behavior at low electric field (below 50 kV/cm) and Schottky-emission or Poole-Frenkel emission at high electric field (above 60 kV/cm). The barrier height and trapped level of BNT films are estimated to be 1.11 eV and 0.90 eV, respectively.     

Photoluminescence and Raman spectroscopy characterization of highly c-axis oriented MgxZn1?xO thin films on Pt-coated silicon substrates

Highly c-axis oriented $ {\text{M}}{{\text{g}}_{\text{x}}}{\text{Z}}{{\text{n}}_{{1 - {\text{x}}}}}{\text{O}}\left( {x = 0 \sim 0.2} \right) $ thin films with pure hexagonal phase were prepared on Pt/TiO₂/SiO₂/Si substrates by chemical solution deposition method, and their structure, photoluminescence, and lattice vibrational properties were studied. For the thin films with Mg contents ranging 0????x????0.20, the room-temperature near-band-edge emission exhibited blueshift up to about 0.35 eV, indicating that the band-gaps of thin films could be tailored by Mg incorporation, meanwhile, the green emission of the thin films enhanced with increasing Mg content. Raman spectra analysis indicated that the decreasing high frequency E₂ Raman modes showed composition-dependent asymmetrically broadening. The difference of electronegativity between Mg²⁺ for Zn²⁺ as well as the potential fluctuation were discussed. Furthermore, longtitudial optical modes exhibited one-mode behavior with observed ~25.8 cm^?1 blueshift. X-ray photoelectron spectroscopy measurements clearly confirmed the Mg incorporation.     

Effects of the Ga-doping concentration on the characteristics of Zn<Subscript>0.7</Subscript>Mg<Subscript>0.3</Subscript>O thin films deposited by metal-organic chemical vapor deposition using an ultrasonic nebulization

Ga-doped Zn_0.7-xMg_0.3O thin films were deposited on glass substrates at 350 °C by metal-organic chemical vapor deposition using an ultrasonic nebulization technique to transport the source precursors, and the effects of the Ga-doping concentration were investigated. The films with Ga-doping concentrations less than 5 mol% grew with [001] preferred orientation perpendicular to the substrate surface and were composed of large crystallites. At Ga content greater than 5 mol%, the films grew with random orientation and very small crystallite size. The charge carrier concentration in the films increased rapidly up to 4 mol% Ga and then decreased gradually with further increases in the Ga-content. The film resistivity decreased with increasing Ga-content up to 4 mol% due mainly to the increase in charge carrier concentration. Then, the resistivity increased gradually with increasing Ga-content due to the decrease in mobility. The lowest resistivity of the Ga-doped Zn_0.7-xMg_0.3O thin film was 3.8?×?10^?1 Ωcm at the Ga doping concentration of 4 mol%. The mean transmittance in the visible range was more than 85% in all films. The optical band gap of the films increased with increasing Ga-doping concentration up to 5 mol% due to the Burstein-Moss effect.     

Effects of sputtering pressure and thickness on properties of ZnO:Al films deposited on polymer substrates

Highly conducting and transparent aluminum doped zinc oxide (ZnO:Al) thin films have been deposited on polyimide substrate by r.f. magnetron sputtering at room temperature. The influence of sputter pressure and thickness on the structural, electrical, and optical properties of ZnO:Al films deposited on polyimide substrate is reported. The crystallinity and degree of orientation was increased by decreasing the sputter pressure. For higher sputtering pressures an increase on the resistivity was observed due to a decrease on the mobility and the carrier concentration. As the film thickness was increased, the crystallite sizes were increased, but the average transmittance in the wavelength range of the visible spectrum was decreased. The electrical performances of the ZnO:Al films deposited on glass substrates are slightly worse than the ones of the films deposited on polyimide substrates with same thickness. The lowest resistivity of 8.6?×?10^?4 Ω cm can be obtained for films deposited on glass substrate with the thickness of 800 nm.     

Preparation of hafnium oxide thin films by sol–gel method

Hafnium oxide (HfO₂) films were grown on SiO₂/Si substrates by a sol–gel method, and their crystalline structure, microstructure and electrical properties were investigated. X-ray diffraction analysis indicated that the monoclinic HfO₂ films could be obtained by annealing at 500 °C. A transmission electron microscopy (TEM) image showed that the films were grown as a spherulite grain structure with a mean grain size of approximately 15 nm. The dielectric constant of the HfO₂ films of 300 nm was approximately 21.6, and the current–voltage measurements showed that the leakage current density of the HfO₂ films was approximately 1.14?×?10^?5 A/cm² at an applied electric field of 100 kV/cm. The sol–gel method-fabricated HfO₂ films are concluded to be feasible for MEMS applications, such as capacitive-type MEMS switches.     

Effects of substrate temperature on electrical and optical properties ITO films deposited by r.f. magnetron sputtering

Indium tin oxide (ITO) films have been prepared by r.f. magnetron sputtering using powder target. X-ray diffraction analysis indicates that the deposited films were polycrystalline and retained a cubic bixbite structure. The ITO films deposited at low substrate temperature (T _s) exhibit a (411) preferred orientation but the films deposited at high T _s prefer a (111) orientation. The substrate temperature was found to significantly affect the electrical properties. As the T _s was increased, the conductivity of ITO films was improved due to thermally induced crystallization. The lowest resistivity (8.7?×?10^?4 Ω-cm) was obtained from ITO films deposited at 450 °C. However, optical properties of the films were somewhat deteriorated. The infrared (IR) reflectance of the film increases with increasing the substrate temperature.     

Characterization of the CeO2 thin films for insulation layer and Pt/SrBi2Ta2O9/CeO2/Si MFISFET structure

Abstract

CeO₂ and SrBi₂Ta₂O₉ (SBT) thin films for MFISFET (metal-fcrroelectrics-insulator-semiconductor field effect transistor) were deposited by rf sputtering and pulsed laser deposition method, respectively. The effects of oxygen partial pressure during deposition for CeO₂ films were investigated. The oxygen partial pressure significantly affected the preferred orientation, grain size and electrical properties of CeO₂ films. The CeO₂ thin films with a (200) preferred orientation were deposited on Si(100) substrates at 600°C. The films deposited under the oxygen partial pressure of 50 % showed the best C-V characteristics among those under various conditions. The leakage current density of films showed order of the 10^?7～10^?8 A/cm² at 100 kV/cm. The SBT thin films on CeO₂/Si substrate showed dense microstructure of polycrystalline phase. From the C-V characteristics of MFIS structure composed of the SBT film annealed at 800°C, the memory window width was 0.9 V at ±5 V. The leakage current density of Pt/SBT/CeO₂/Si structure annealed at 800°C was 4×10^?7 A/cm² at 5 V.     

Growth characteristics and film properties of gallium doped zinc oxide prepared by atomic layer deposition

We carried out comprehensive studies on structural, optical, and electrical properties of gallium-doped zinc oxide (Ga:ZnO) films deposited by atomic layer deposition (ALD). The gallium(III) isopropoxide (GTIP) was used as a Ga precursor, which showed pure Ga₂O₃ thin film with high growth rate. Using this precursor, conductive Ga doped ZnO thin film can be successfully deposited. The electrical, structural and optical properties were systematically investigated as functions of the Ga doping contents and deposition temperature. The best carrier concentration and transmittance (7.2?×?10²⁰ cm^?3 and 83.5 %) with low resistivity (≈3.5?×?10^?3?Ωcm) were observed at 5 at.% Ga doping concentration deposited at 250 °C. Also, low correlation of deposition temperature with the carrier concentration and film structure was observed. This can be explained by the almost same atomic radius of Ga and Zn atom.     

Preparation and characterization of PZT ferroelectric thin films by plasma enhanced metalorganic chemical vapor deposition

Abstract

PZT thin films with a uniform distribution of components were prepared by plasma enhanced chemical vapor deposition (PECVD) using Pb(C₂H₅)₄, Z (O-i-C₄H₉)₄, Ti(O-i-C₃H₇)₄, and oxygen. The crystallization of films was occure after annealing in the temperature range between 450 and 550°C under O₂ ambient for 1 hr. The significant change of Pb concentration in PECVD PZT thin films was not observed in the relation to annealing temperature and time. The dielectric constant PECVD PZT thin films increased with the Ti content, showed the maximum value in the vicinity of morphotropic phase boundary (MPB) composition of PZT material, and decreased with the Ti content. The leakage current density of PZT (65/35) thin film of 180 nm in thickness was 3·37 × 10^?7 A/cm² at the applied voltage of 3 V. Remanent polarization increased with increasing of Zr content in the film and coercive field was nearly independent of the composition. The typical values of electrical properties were ε_r = 570, E_c = 90 kV/cm, and P_r = 19 μC/cm² in the PECVD PZT (54/46) thin film of 220 nm in thickness.     

Low‐resistive and transparent AZO films prepared by PLD in magnetic field

Al₂O₃‐doped ZnO (AZO) thin films have been deposited onto glass substrates using a split target consisting of AZO (1 wt%) and AZO (2 wt%) by pulsed laser deposition with an ArF excimer laser (λ = 193 nm, 15 mJ, 10 Hz, 0.75 J/cm²). By applying a magnetic field perpendicular to the plume, the lowest resistivity of 8.54 × 10^?5Ω·cm and an average transmittance exceeding 91% over the visible range were obtained at a target‐to‐substrate distance of 25 mm for approximately 279‐nm‐thick AZO film (1.8 wt%) grown at a substrate temperature of 230 °C in vacuum. From cross‐sectional TEM observations and the XRD spectrum, a reason why the low resistivity (54 × 10^?5Ω·cm) was reproducibly obtained was considered to be due to the fact that a disorder of crystal growth originating in the vicinity of the interface between the substrate and the film was suppressed by application of the magnetic field and the c‐axis orientation took preference, giving rise to the increase of mobility. © 2005 Wiley Periodicals, Inc. Electr Eng Jpn, 151(2): 40–45, 2005; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/eej.20026