A CMOS 0.25-/spl mu/m continuous-time FIR filter with 125 ps per tap delay as a fractionally spaced receiver equalizer for 1-gb/s data transmission

This paper presents a CMOS 0.25-/spl mu/m continuous-time 6-tap FIR filter that is used as a fractionally spaced receiver equalizer for 1-Gb/s data transmission. Each tap of the FIR filter delay line is realized with a second-order low-pass filter. Simulations show that the tap delay can be tuned from 100 ps to 300 ps while keeping a constant group delay within the bandwidth of 2.1 GHz and 800 MHz correspondingly. Experimental results show that the FIR filter can successfully recover a 1-Gb/s differential digital signal that has been transmitted over a 220-inch PCB trace which causes -31.48-dB attenuation at the symbol rate frequency of 1 GHz. The measured bit error rate after equalization is less than 10/sup -12/ over a 750-ps sampling range, compared to a 10/sup -2/ bit-error rate before equalization. Also presented are the measurement results comparing the horizontal and the vertical openings of the signals before and after equalization for PCB traces with different length. The chip dissipates 45 mW from a 2.5-V supply and occupies 0.33/spl times/0.27 mm/sup 2/ in a 0.25-/spl mu/m CMOS process.     

A 4.8-6.4-Gb/s serial link for backplane applications using decision feedback equalization

In this paper, a serial link design that is capable of 4.8-6.4-Gb/s binary NRZ signaling across 40' of FR4 copper backplane traces and two connectors is described. The transmitter features a programmable two-tap feed forward equalizer and the receiver uses an adaptive four-tap decision feedback equalization to compensate for the losses in the channel at 6.4 Gbps. The transceiver core is built in LSI's 0.13-/spl mu/m standard CMOS technology to be integrated into ASIC designs that require serial links. The transceiver consumes 310 mW per duplex channel at 1.2 V and 6.4 Gb/s under nominal conditions.     

A CMOS mixed-signal clock and data recovery circuit for OIF CEI-6G+ backplane transceiver

A CMOS low-power mixed-signal clock and data recovery circuit is presented in this paper. It is designed for OIF CEI-6G+ LR backplane transceiver, and consists of a phase detector, loop filter, phase control logic, and phase interpolator. A unique subsampled architecture makes it possible for a low-power mixed-signal clock recovery loop running at a rate of 6 Gb/s. The proposed architecture has data pattern independent loop bandwidth. Fabricated in a 0.13-/spl mu/m CMOS technology in an area of 280/spl times/100 /spl mu/m/sup 2/, the clock and data recovery loop exhibits a frequency tracking range up to 2000 ppm. The bit error rate is less than 10/sup -12/ with a pseudorandom bit sequence of length 2/sup 31/-1. The power dissipation is 24 mW for clock and data recovery circuits from a single 1.2-V supply.     

A 10-Gb/s CDR/DEMUX with LC delay line VCO in 0.18-/spl mu/m CMOS

A monolithic 10-Gb/s clock/data recovery and 1:2 demultiplexer are implemented in 0.18-/spl mu/m CMOS. The quadrature LC delay line oscillator has a tuning range of 125 MHz and a 60-MHz/V sensitivity to power supply pulling. The circuit meets SONET OC-192 jitter specifications with a measured jitter of 8 ps p-p when performing error-free recovery of PRBS 2/sup 31/-1 data. Clock and data recovery (CDR) is achieved at 10 Gb/s, demonstrating the feasibility of a half-rate early/late PD (with tri-state) based CDR on 0.18-/spl mu/m CMOS. The 1.9/spl times/1.5 mm/sup 2/ IC (not including output buffers) consumes 285 mW from a 1.8-V supply.     

A 20-Gb/s 0.13-/spl mu/m CMOS serial link transmitter using an LC-PLL to directly drive the output multiplexer

A 20-Gb/s transmitter is implemented in 0.13-/spl mu/m CMOS technology. An on-die 10-GHz LC oscillator phase-locked loop (PLL) creates two sinusoidal 10-GHz complementary clock phases as well as eight 2.5-GHz interleaved feedback divider clock phases. After a 2/sup 20/-1 pseudorandom bit sequence generator (PRBS) creates eight 2.5-Gb/s data streams, the eight 2.5-GHz interleaved clocks 4:1 multiplex the eight 2.5-Gb/s data streams to two 10-Gb/s data streams. 10-GHz analog sample-and-hold circuits retime the two 10-Gb/s data streams to be in phase with the 10-GHz complementary clocks. Two-tap equalization of the 10-Gb/s data streams compensate for bandwidth rolloff of the 10-Gb/s data outputs at the 10-GHz analog latches. A final 20-Gb/s 2:1 output multiplexer, clocked by the complementary 10-GHz clock phases, creates 20-Gb/s data from the two retimed 10-Gb/s data streams. The LC-VCO is integrated with the output multiplexer and analog latches, resonating the load and eliminating the need for clock buffers, reducing power supply induced jitter and static phase mismatch. Power, active die area, and jitter (rms/pk-pk) are 165 mW, 650 /spl mu/m/spl times/350 /spl mu/m, and 2.37 ps/15 ps, respectively.     

8-Gb/s source-synchronous I/O link with adaptive receiver equalization, offset cancellation, and clock de-skew

A source-synchronous I/O link with adaptive receiver-side equalization has been implemented in 0.13-/spl mu/m bulk CMOS technology. The transceiver is optimized for small area (360 /spl mu/m /spl times/ 360 /spl mu/m) and low power (280 mW). The analog equalizer is implemented as an 8-way interleaved, 4-tap discrete-time linear filter. The equalization improved the data rate of a 102 cm backplane interconnect by 110%. On-die adaptive logic determines optimal receiver settings through comparator offset cancellation, data alignment of the transmitter and receiver, clock de-skew and setting filter coefficients for equalization. The noise-margin degradation due to statistical variation in converged coefficient values was less than 3%.     

An adaptive PAM-4 5-Gb/s backplane transceiver in 0.25-/spl mu/m CMOS

This paper describes a backplane transceiver, which uses pulse amplitude modulated four-level (PAM-4) signaling and continuously adaptive transmit-based equalization to move 2.5-GBd/s symbols totalling 5 Gb/s across typical FR-4 backplanes for total distances of up to 50 inches through two sets of backplane connectors. The 17-mm/sup 2/ device is implemented in a 0.25-/spl mu/m CMOS process, operates off of 2.5- and 3.3-V supply voltages, and consumes 1 W.     

A 195-gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package

A wireless interface by inductive coupling achieves aggregated data rate of 195 Gb/s with power dissipation of 1.2W among 4-stacked chips in a package where 195 transceivers with the data rate of 1 Gb/s/channel are arranged in 50-/spl mu/m pitch in 0.25-/spl mu/m CMOS technology. By thinning chip thickness to 10/spl mu/m, the interface communicates at distance of 15 /spl mu/m at minimum and 43 /spl mu/m at maximum. A low-power single-end transmitter achieves 55% power reduction for multiple connections. The transmit power is dynamically controlled in accordance with communication distance to reduce not only power dissipation but also crosstalk.     

A 1.2-V 1.5-Gb/s 72-Mb DDR3 SRAM

A 1.2-V 72-Mb double data rate 3 (DDR3) SRAM achieves a data rate of 1.5 Gb/s using dynamic self-resetting circuits. Single-ended main data lines halve the data line precharging power dissipation and the number of data lines. Clocks phase shifted by 0/spl deg/, 90/spl deg/, and 270/spl deg/ are generated through the proposed clock adjustment circuits. The latter circuits make input data sampled with an optimized setup/hold window. On-chip input termination with a linearity error of /spl plusmn/4.1% is developed to improve signal integrity at higher data rates. A 1.2-V 1.5-Gb/s 72-Mb DDR3 SRAM is fabricated in a 0.10-/spl mu/m CMOS process with five metals. The cell size and the chip size are 0.845 /spl mu/m/sup 2/ and 151.1 mm/sup 2/, respectively.     

DFE architectures for high-speed backplane applications

Embedded and look-ahead decision feedback equalisation (DFE) architectures are proposed to overcome the speed bottleneck of DFE design for high-speed backplane applications. DFE design examples simulated in 0.18 /spl mu/m CMOS technology demonstrate the feasibility of 10Gbit/s operation over a 34-inch FR4 backplane.     

A second-order semidigital clock recovery circuit based on injection locking

A compact (1 mm /spl times/ 160 /spl mu/m) and low-power (80-mW) 0.18-/spl mu/m CMOS 3.125-Gb/s clock and data recovery circuit is described. The circuit utilizes injection locking to filter out high-frequency reference clock jitter and multiplying delay-locked loop duty-cycle distortions. The injection-locked slave oscillator output can have its output clocks interpolated by current steering the injecting clocks. A second-order clock and data recovery is introduced to perform the interpolation and is capable of tracking frequency offsets while exhibiting low phase wander.     

OC-192 transmitter and receiver in standard 0.18-/spl mu/m CMOS

This paper presents the first fully integrated SONET OC-192 transmitter and receiver fabricated in a standard 0.18-/spl mu/m CMOS process. The transmitter consists of an input data register, 16-b-wide first-in-first-out (FIFO) circuit, clock multiplier unit (CMU), and 16:1 multiplexer to give a 10-Gb/s serial output. The receiver integrates an input amplifier for 10-Gb/s data, clock and data recovery circuit (CDR), 1:16 demultiplexer, and drivers for low-voltage differential signal (LVDS) outputs. An on-chip LC-type voltage-controlled oscillator (VCO) is employed by both the transmitter and receiver. The chipset operates at multiple data rates (9.95-10.71 Gb/s) with functionality compatible with the multisource agreement (MSA) for 10-Gb transponders. Both chips demonstrate SONET-compliant jitter characteristics. The transmitter 10.66-GHz output clock jitter is 0.065 UI/sub pp/ (unit interval, peak-to-peak) over a 50-kHz-80-MHz bandwidth. The receiver jitter tolerance is more than 0.4 UI/sub pp/ at high frequencies (4-80 MHz). A high level of integration and low-power consumption is achieved by using a standard CMOS process. The transmitter and receiver dissipate a total power of 1.32 W at 1.8 V and are packaged in a plastic ball grid array with a footprint of 11/spl times/11 mm/sup 2/.     

A four-channel 3.125-Gb/s/ch CMOS serial-link transceiver with a mixed-mode adaptive equalizer

This work presents a quad-channel serial-link transceiver providing a maximum full duplex raw data rate of 12.5Gb/s for a single 10-Gbit eXtended Attachment Unit Interface (XAUI) in a standard 0.18-/spl mu/m CMOS technology. To achieve low bit-error rate (BER) and high-speed operation, a mixed-mode least-mean-square (LMS) adaptive equalizer and a low-jitter delay-immune clock data recovery (CDR) circuit are used. The transceiver achieves BER lower than <4.5/spl times/10/sup -15/ while its transmitted data and recovered clock have a low jitter of 46 and 64 ps in peak-to-peak, respectively. The chip consumes 178 mW per each channel at 3.125-Gb/s/ch full duplex (TX/RX simultaneous) data rate from 1.8-V power supply.     

CMOS wideband amplifiers using multiple inductive-series peaking technique

This work presents the technique of multiple inductive-series peaking to mitigate the deteriorated parasitic capacitance in CMOS technology. Employing multiple inductive-series peaking technique, a 10-Gb/s optical transimpedance amplifier (TIA) has been implemented in a 0.18-/spl mu/m CMOS process. The 10-Gb/s optical CMOS TIA, which accommodates a PD capacitor of 250 fF, achieves the gain of 61 dB/spl Omega/ and 3-dB frequency of 7.2 GHz. The noise measurement shows the average noise current of 8.2 pA//spl radic/Hz with power consumption of 70 mW.     

Parallel-optical interconnects >100 gb/s

A parallel-optical interconnect with 12 channels operating at 8.5 Gb/s giving an aggregate data rate of 102 Gb/s is demonstrated, to the authors' knowledge, for the first time. The paper describes and demonstrates 13 /spl times/ 16-mm cross-section 12-channel parallel-optic transmitter and receiver modules with each channel operating at a data rate of 8.5-10 Gb/s. This was achieved using bottom-emitting 990-nm vertical-cavity surface-emitting lasers and bottom-illuminated InGaAs-InP photodetectors flip-chip bonded directly to 12-channel transmitter and receiver integrated circuits, respectively. In addition, 102-Gb/s link results are demonstrated over 100 m of 50-/spl mu/m-core standard multimode ribbon fiber. A bit-error ratio of <10/sup -13/ was measured on a single channel after transmission through 100 m of multimode fiber at a data rate of 8.5 Gb/s with all 12 channels operating simultaneously.     

0.13-/spl mu/m low-/spl kappa/-Cu CMOS logic-based technology for 2.1-gb high data rate read-channel

High-performance analog/digital elements have been successfully fabricated by a 0.13-/spl mu/m low-/spl kappa/-Cu logic-based mixed-signal CMOS process in a single chip to enable a 2.1-Gb/s read-channel for hard disk drives that is a record-high data rate supported by fully CMOS solution. The high-performance analog devices demonstrate superior drivability, matching, noise immunity, and reliability by a unique dual-gate oxide module to support the aggressive oxide thickness scaling and maintain promisingly good reliability in all aspects.     

A 15-gb/s 2:1 multiplexer in 0.18-/spl mu/m CMOS

By employing the inductive peaking technique and the super-dynamic flip-flops, a 2:1 multiplexer (MUX) is presented for high-speed operations. The proposed circuit is realized in a 0.18-/spl mu/m CMOS process. With a power consumption of 110mW from a 2-V supply voltage, the fully integrated MUX can operate at an output rate up to 15Gb/s. From the measured eye-diagrams, the 15-Gb/s half-rate MUX exhibits an output voltage swing of 225mV and a root-mean-square jitter of 2.7ps.     

A quad 0.6-3.2 Gb/s/channel interference-free CMOS transceiver for backplane serial link

A quad-channel 0.6-3.2 Gb/s/channnel transceiver using eight independent phase-locked loops (PLLs) shows a 1-ps rms random jitter performance without interchannel interference. The PLL employs a folded starved inverter with high supply/substrate noise immunity and an analog coarse-tuning scheme for both seamless frequency acquisition and N-fold voltage-controlled-oscillator (VCO) gain reduction. A fixed-interval charge pumping is adopted for wide pumping-current range and large jitter tolerance. A wide-range delayed-locked loop (DLL) is utilized as a clock and reset generator for an elastic buffer. The transceiver, implemented in a 0.18-/spl mu/m CMOS technology, operates across a 30-in FR-4 backplane up to 3.2 Gb/s/ch with a bit-error rate of less than 10/sup -13/.     

An 8-Gb/s simultaneous bidirectional link with on-die waveform capture

A full-duplex transceiver capable of 8-Gb/s data rates is implemented in 0.18-/spl mu/m CMOS. This equalized transceiver has been optimized for small area (329 /spl mu/m /spl times/ 395 /spl mu/m) and low power (158 mW) for point-to-point parallel links. Source-synchronous clocking and per-pin skew compensation eliminate coding bandwidth overhead and reduce latency, jitter, and complexity. This link is self-configuring through the use of automatic comparator offset trim and adaptive deskew. Comprehensive diagnostic capabilities have been integrated into the transceiver to provide link, interconnect, and circuit characterization without the use of external test equipment. With a resolution of 4 mV and 9 ps, these capabilities enable on-die eye diagram generation, equivalent time waveform capture, noise characterization, and jitter distribution measurements.     

A 27-mW 3.6-gb/s I/O transceiver

This paper describes a 3.6-Gb/s 27-mW transceiver for chip-to-chip applications. A voltage-mode transmitter is proposed that equalizes the channel while maintaining impedance matching. A comparator is proposed that achieves sampling bandwidth control and offset compensation. A novel timing recovery circuit controls the phase by mismatching the current in the charge pump. The architecture maintains high signal integrity while each port consumes only 7.5 mW/Gb/s. The entire design occupies 0.2 mm/sup 2/ in a 0.18-/spl mu/m 1.8-V CMOS technology.