Low-power embedded SRAM with the current-mode write technique

In the traditional current-mode SRAMs, only the read operation is performed in the current mode. In this paper, we propose to use the current-mode technique in both the read and write operations. Due to the current mode operation, voltage swings at bit lines and data lines are kept very small during both read and write. Then, the ac power dissipation of bit lines and data lines, which is proportional to the voltage swing, can be significantly saved. A new current-mode 128×8 SRAM has been designed based on a 0.6 μm CMOS technology, and the new SRAM consumes only 30% of the power of an SRAM with current-mode read but voltage mode write operations. Besides a test chip for the new SRAM, it has also been embedded in an 8-bit 1.1-controller. Experimental results show good agreement with the simulation results and prove the feasibility of the new technique     

A 90-nm low-power 32-kB embedded SRAM with gate leakage suppression circuit for mobile applications

In sub-100-nm generation, gate-tunneling leakage current increases and dominates the total standby leakage current of LSIs based on decreasing gate-oxide thickness. Showing that the gate leakage current is effectively reduced by lowering the gate voltage, we propose a local dc level control (LDLC) for SRAM cell arrays and an automatic gate leakage suppression driver (AGLSD) for peripheral circuits. We designed and fabricated a 32-kB 1-port SRAM using 90-nm CMOS technology. The six-transistor SRAM cell size is 1.25 /spl mu/m/sup 2/. Evaluation shows that the standby current of 32-kB SRAM is 1.2 /spl mu/A at 1.2 V and room temperature. It is reduced to 7.5% of conventional SRAM.     

90% write power-saving SRAM using sense-amplifying memory cell

This paper describes a low-power write scheme which reduces SRAM power by 90% by using seven-transistor sense-amplifying memory cells. By reducing the bitline swing to V/sub DD//6 and amplifying the voltage swing by a sense-amplifier structure in a memory cell, the charging and discharging component of the power of the bit/data lines is reduced. A 64-kb test chip has been fabricated and correct read/write operation has been verified. It is also shown that the scheme can also have the capability of leakage power reduction with small modifications. Achievable leakage power reduction is estimated to be two orders of magnitude from SPICE simulation results.     

An embedded DRAM with a 143-MHz SRAM interface using a sense-synchronized read/write

This paper describes a 4-Mb embedded DRAM macro using novel fast random cycle architecture with sense-synchronized read/write (SSR/SSW). The test chip has been fabricated with a 0.15-/spl mu/m logic-based embedded DRAM process and the 1.5-V 143-MHz no-wait row random access operation has been confirmed. Data retention power is suppressed to 92 /spl mu/W owing to the hierarchical power supply and SSR. The macro size is 4.59 mm/sup 2/. The cell occupation ratio of the macro is 46%, which is the same as that of a conventional embedded DRAM macro. The macro size and the data retention power are 30% and 4.6%, respectively, of a 4-Mb embedded SRAM macro fabricated by an identical process.     

Sub-1V embedded SRAM with bit-error immune dual-boosted cell technique

A sub-1 V operating SRAM based on the dual-boosted cell technique is described. For each read/write cycle, the wordline and cell power node of selected SRAM cells are boosted into two different voltage levels. This technique enhances the read static noise margin (SNM) to a sufficient amount without an increase of cell size. It also improves the SRAM circuit speed owing to an increase of the cell readout current. A 0.18 mum 256 kbit SRAM macro has been fabricated with the proposed technique, which demonstrated: 0.8 V operation with 50 MHz while consuming a power of 65 muW/MHz; 400 mV read SNM at 0.8 V power supply; and a reduction by 87% in bit-error rate compared with that of a conventional SRAM     

A Comprehensive Study of Cobalt Salicide-Induced SRAM Leakage for 90-nm CMOS Technology

Cobalt salicide-induced static random access memory (SRAM) leakage in 90-nm technology is investigated in this paper. We found that the junction leakages are the origins of abnormal SRAM leakage, leading to a high direct-drain quiescent current and low function yield at wafer level. Cobalt salicide penetration at active edges is a dominant path for the junction leakage current. Both junction-area-intensive and active-edge-intensive test structures are employed to characterize the junction leakage. The SRAM function failure sites are carefully examined using conducting atomic force microscope and transmission electron microscope techniques. A full-factorial design of experiment (DOE) is implemented to systematically study the influences of Co thickness and temperatures of RTP1 and RTP2 on the junction leakage characteristics. Within the DOE window, it is found that both junction area and junction edge leakages increase with the Co thickness. The RTP1 temperature is critical in controlling Co salicide penetration at the active edge, while the RTP2 temperature is the main factor that affects the junction area leakage. SRAM leakage can be minimized by optimizing the salicide process scheme.     

An affordable experimental technique for SRAM write margin characterization for nanometer CMOS technologies

Increased process variability and reliability issues present a major challenge for future SRAM trends. Non-intrusive and accurate SRAM stability measurement is crucial for estimating yield in large SRAM arrays. Conventional SRAM variability metrics require including test structures that cannot be used to investigate cell bit fails in functional SRAM arrays. This work proposes the Word Line Voltage Margin (WLVM), defined as the maximum allowed word-line voltage drop during write operations, as a metric for the experimental characterization of write stability of SRAM cells. Their experimental measurement can be attained with minimal design modifications, while achieving good correlation with existing writability metrics. To demonstrate its feasibility, the distribution of WLVM values has been measured in an SRAM prototype implemented in 65 nm CMOS technology. The dependence of the metric with the width of the transistors has been also analysed, demonstrating their utility in post-process write stability characterization.     

The Impact of Random Device Variation on SRAM Cell Stability in Sub-90-nm CMOS Technologies

The impact of process variation on SRAM yield has become a serious concern in scaled technologies. In this paper, we propose a methodology to analyze the stability of an SRAM cell in the presence of random fluctuations in the device parameters. First, we develop a theoretical framework for characterizing the dc noise margin of a memory cell. The framework is based on the concept that an SRAM cell is on the verge of instability when the gain across the loop formed by the cross-coupled inverters in the cell is unity. The noise margin criteria developed in this manner can be used to verify a cell stability in the presence of arbitrary DC noise offsets at the two storage nodes in the cell. We also develop metrics for estimating the cell stability during read and write operations and verify these models by extensive Monte Carlo simulations in a 65-nm CMOS process. Our results show that the proposed robustness metrics can be used to estimate cell failure probabilities in an efficient and accurate manner.     

A new asymmetric 6T SRAM cell with a write assist technique in 65 nm CMOS technology

A new asymmetric 6T-SRAM cell design is presented for low-voltage low-power operation under process variations. The write margin of the proposed cell is improved by the use of a new write-assist technique. Simulation results in 65 nm technology show that the proposed cell achieves the same RSNM as the asymmetric 5T-SRAM cell and 77% higher RSNM than the standard 6T-SRAM cell while it is able to perform write operation without any write assist at V_DD=1 V. Monte Carlo simulations for an 8 Kb SRAM (256×32) array indicate that the scalability of operating supply voltage of the proposed cell can be improved by 10% and 21% compared to asymmetric 5T- and standard 6T-SRAM cells; 21% and 53% lower leakage power consumption, respectively. The proposed 6T-SRAM cell design achieves 9% and 19% lower cell area overhead compared with asymmetric 5T- and standard 6T-SRAM cells, respectively. Considering the area overhead for the write assist, replica column and the replica column driver of 2.6%, the overall area reduction in die area is 6.3% and 16.3% as compared with array designs with asymmetric 5T- and standard 6T-SRAM cells.     

A 20 K GaAs array with 10 K of embedded SRAM

A 20000-gate GaAs array with 10 K of embedded RAM is presented. The array contains eight scannable fully registered 256×256 RAM macros which have a minimum cycle time of 3.5 ns. The RAM features a scan mode, which can be used to configure the registers into a serial shifter. There is also a RAM test mode which allows independent functional and speed testing of all eight RAMs, easing the task of RAM verification for a given user personalization. The RAM array was fabricated using an advanced high-performance GaAs semiconductor E /D MESFET process featuring self-aligned gates and requiring only 12 masks. Introductory discussion of the Vitesse GaAs process, basic GaAs MESFET characteristics, and GaAs circuit design are provided. The gate array portion contains 20736 user-configurable cells with 10-ps gate delays which are tailored for direct-coupled FET logic (DCFL). The I/O can be personalized for ECL, TTL, or GaAs levels. There are 392 pads on the 13.8-mm×7.7-mm die with a maximum of 256 used for signal I/O. The RAM array is packaged in a multilayer ceramic 344-pin leaded chip carrier (LDCC). Typical power dissipation at 80% utilization is 14 W     

Silicon etched-groove permeable base transistors with 90-nm fingerwidth

Silicon etched-groove permeable base transistors (PBTs) which utilize a new structure to eliminate surface depletion effects are discussed. The 90-nm-wide fingers are n⁺-doped, and the channel region is buried below the bottom of the grooves. Doping and thickness of the active layer were optimized using two-dimensional computer simulations. The maximum measured transconductance of 155 mS/mm is the highest reported for Si PBTs and demonstrates the potential of silicon as substrate material. The measured transit frequency was 12 GHz; f_max reached 13 GHz. It has been recognized that for improved high-frequency performance a reduction of the gate capacitance is necessary, demanding a more precise control of groove depth and geometry     

A 64-bit microprocessor in 130-nm and 90-nm technologies with power management features

The first two members in a family of 64-bit superscalar microprocessors are presented. The 130-nm processor, which was introduced first, offers 5-way instruction dispatch, support for 4-way integer and floating-point single-instruction multiple-data (SIMD) operations, a 512-kB second level (L2) cache, and a high-speed external bus. The 90-nm processor is a technology remap of the 130-nm design. It retains the features of the 130-nm processor and adds others, including a new power management facility. The architecture, device characteristics, power management, and thermal details of these two processors are described. In addition, the dataflow layout, aspects of the circuit design, clocking, and timing are discussed.     

SRAM design on 65-nm CMOS technology with dynamic sleep transistor for leakage reduction

A 70-Mb SRAM is designed and fabricated on a 65-nm CMOS technology. It features a 0.57-/spl mu/m/sup 2/ 6T SRAM cell with large noise margin down to 0.7 V for low-voltage operation. The fully synchronized subarray contains an integrated leakage reduction scheme with dynamically controlled sleep transistor. SRAM virtual ground in standby is controlled by programmable bias transistors to achieve good voltage control with fine granularity under process skew. It also has a built-in programmable defect "screen" circuit for high volume manufacturing. The measurements showed that the SRAM leakage can be reduced by 3-5/spl times/ while maintaining the integrity of stored data.     

A robust and low-power near-threshold SRAM in 10-nm FinFET technology

This paper presents a robust and low-power single-ended robust 11T near-threshold SRAM cell in 10-nm FinFET technology. The proposed cell eliminates write disturbance and enhances write performance by disconnecting the path between cross-coupled inverters during the write operation. FinFETs suffer from width quantization, and SRAM performance is highly dependent to transistors sizing. The proposed structure with minimum sized tri-gate FinFETs operates without failure under major process variations. In addition, read disturbance is reduced by isolating the storage nodes during the read operations. To reduce power consumption this cell uses only one bit-line for both read and write operations. The proposed SRAM cell reduces write delay, average power and PDP by 20, 78 and 62%, respectively as compared to the 9T single-ended SRAM cell. Moreover, the proposed cell enhances write static noise margin by 33% under process variation.     

An autonomous SRAM with on-chip sensors in an 80-nm double stacked cell technology

An active solution is proposed to overcome the uncertainty and fluctuation of the device parameters in nanotechnology SRAM. The proposed scheme is composed of sensing blocks, analysis blocks and control blocks. An on-chip timer, temperature sensor, substrate noise detector, and leakage current monitor are used to monitor internal status of chip during operation. From the sensed data, internal supply voltage, internal timing margin from decoding to sensing time, substrate noise from digital area, and low voltage level of wordline are controlled. A 512-kb test SRAM chip, fabricated with an 80-nm double stacked cell technology, shows that average power consumption is reduced by 9% and the standard deviation decreases by 58%.     

I/Q mismatch compensation using adaptive decorrelation in a low-IF receiver in 90-nm CMOS process

We present a single multiplier based adaptive I/Q mismatch compensation circuit for narrowband quadrature receivers. Adaptive decorrelation between I and Q channel data is used for correcting gain and phase mismatches. Adaptation step size is computed from L/sub 1/-norm inverse power measurement and a gear-shifting mechanism is used that allows fast initial convergence and slow adaptation on actual burst data. Image rejection ratio in excess of 50 dB is reported for GSM receiver after compensation allowing the receiver to use IF frequencies higher than half of the channel bandwidth. The presented mismatch compensation circuit is implemented as part of a single-chip GSM wireless transceiver fabricated in a 90-nm digital CMOS process. The presented techniques are, however, equally applicable to other narrowband packet-based applications.     

A 90-nm CMOS Doherty power amplifier with minimum AM-PM distortion

A linear Doherty amplifier is presented. The design reduces AM-PM distortion by optimizing the device-size ratio of the carrier and peak amplifiers to cancel each other's phase variation. Consequently, this design achieves both good linearity and high backed-off efficiency associated with the Doherty technique, making it suitable for systems with large peak-to-average power ratio (WLAN, WiMAX, etc.). The fully integrated design has on-chip quadrature hybrid coupler, impedance transformer, and output matching networks. The experimental 90-nm CMOS prototype operating at 3.65 GHz achieves 12.5% power-added efficiency (PAE) at 6 dB back-off, while exceeding IEEE 802.11a -25 dB error vector magnitude (EVM) linearity requirement (using 1.55-V supply). A 28.9 dBm maximum Psat is achieved with 39% PAE (using 1.85-V supply). The active die area is 1.2 mm/sup 2/.     

Variation resilient subthreshold SRAM cell design technique

This article presents a circuit technique for designing a variability resilient subthreshold static random access memory (SRAM) cell. The architecture of the proposed cell is similar to the conventional 10T SRAM cell with the exception that dynamic threshold MOS is used for the read/write access FETs and cell content body bias scheme is used for bitline droppers (FETs used to drop bitlines). Moreover, the proposed bitcell utilises single differential port unlike conventional 10T bitcell which utilises dual differential ports. The proposed design offers 2.1× improvement in T _RA (read access time) and 3.2× improvement in T _WA (write access time) compared to CON10T at iso-device-area and 200?mV. It exhibits three roots in its read voltage transfer characteristic (VTC) even at 150?mV showing its ability to function as a bistable circuit. The combination of write and read VTCs for write static noise margin of the proposed design also shows single root signifying its write-ability even at 150?mV. It proves its robustness against process variations by featuring narrower spread in T _RA distribution (by 1.3×) and in T _WA distribution (by 1.2×) at 200?mV.     

Enhanced Static Noise Margin and Increased Stability SRAM Cell with Emerging Device Memristor at 45-nm Technology

Very Large Scale Integrated (VLSI) technology has conquered a momentous transformation and adaption. The glory of achieving these platforms goes to aspect ratio shrinking. Not only the dimensions are scaling down, but the revolution is forcing the designers to switch all circuits from one device level to another emerging devices. In this conflict, memristors are capable of making their roots stronger in VLSI domain as compared to other emerging devices. In this paper it is presented the research of static noise margin, highlighting the new fidelity issue i.e. the noise that has great impact on retention voltage of SRAM cell and this effect in memristive cell is less as compared to conventional 7T SRAM cell. Simulations and results have been performed and obtained from 7T SRAM and memristive 7T SRAM cell at 45 nm technology. In this paper, impact of the cell and pull-up ratio with their comparisons is also discussed.     

A 3-GHz 70-mb SRAM in 65-nm CMOS technology with integrated column-based dynamic power supply

Column-based dynamic power supply has been integrated into a high-frequency 70-Mb SRAM design that is fabricated on a high-performance 65-nm CMOS technology. The fully synchronized design achieves a 3-GHz operating frequency at 1.1-V power supply. The power supply at SRAM cell array is dynamically switched between two different voltage levels during READ and WRITE operations. Silicon measurement has proven this method to be effective in achieving both good cell READ and WRITE margins, while lowering the overall SRAM leakage power consumption.