Ni-Ni3Nb共晶合金跃迁变速定向凝固下的组织演化

为了研究非稳态凝固过程对共晶合金凝固组织的影响,在Ni-Ni3Nb共晶合金中采用跃迁变速的方法,研究了凝固组织的变化.研究结果表明:凝固速率从1μm/s跃迁到10μm/s时,共晶层片间距因Ni相分叉而发生细化,跃迁前后的层片间距满足λV1/2=18μm3/2s-1/2;从10μm/s跃迁减速到1μm/s时,共晶层片间距因Ni相合并而发生粗化,粗化过程在一个较长的凝固区域内进行;凝固速率从5μm/s跃迁加速到15μm/s时,部分Ni相失稳长大,而Ni3Nb相保持不变,导致合金凝固组织从规则共晶转变为非规则共晶.     

冷却速度对无铅焊料Sn-3.5Ag合金微观组织和显微硬度的影响

在～102K/s、～103K/s和～104K/s的冷速条件下研究了凝固速度对无铅焊料Sn-3.5Ag合金微观组织和显微硬度的影响.结果表明:由于非平衡凝固条件下动力学过冷的影响,导致了该共晶合金实际凝固过程开始于平衡共晶凝固点以下,合金凝固组织中包含初生β-Sn枝晶,且该初生β-Sn枝晶组织随合金凝固速度的提高而发生细化.另外,维氏硬度测试结果表明,无铅焊料Sn-3.5Ag合金在不同冷速条件下的凝固组织与显微硬度的关系符合经典Hall-Petch关系式,即初生β-Sn枝晶细化能显著提高焊料合金的显微硬度.     

Sn-9Zn无铅焊料合金凝固组织及其在时效中的演变

为了考察Sn-9Zn无铅焊料合金凝固组织及其在时效中的演变,制备了不同冷却条件及不同熔体过热度下Sn-9Zn/Cu焊点,并利用扫描电镜和光学显微镜观察了其组织形貌.观察发现:共晶组织随冷却速率提高而显著细化;同时,随炉缓冷凝固时合金形成完全的层片状共晶组织,而空冷和喷水冷却条件下合金除层片状共晶组织外,还形成了杆状富锌相.实验结果还表明,熔体过热度对出炉空冷合金的共晶组织有显著影响,较高的熔体过热度使共晶组织更细密.在空冷合金的时效过程中,杆状富锌相趋于逐渐溶解消失,90℃时效时还发生了共晶组织的显著粗化.     

冷却速度及铝含量对含Nd的Zn-Al合金组织和耐蚀性的影响

采用扫描电镜(SEM)和能谱(EDS)分析以及电化学极化和中性盐雾试验(NSS)等手段,研究了Zn-x Al(x=4%,5%,7%)-0.06%Nd合金在炉冷,空冷,水冷(冷却速度分别为0.03,1.08和40℃/s)条件下的凝固组织与耐蚀性。结果表明:随着冷却速度的增加,合金组织不断细化,共晶组织的层片间距不断减小,而耐腐蚀性先增大后减小,且稀土Nd的添加有利于进一步减小共晶层片间距和提高合金的耐腐蚀性能。空冷条件下获得的Zn-5%Al-0.06%Nd合金的耐蚀性最佳。Al含量在4%~7%之间变化时,主要引起合金组织的变化,而对合金耐腐蚀性影响不大。     

亚共晶Ni-Si合金的凝固组织特征研究

采用布里奇曼定向凝固技术制备了NiNi3Si亚共晶复合材料,系统地研究了Ni-Ni3Si亚共晶的定向凝固组织特征。在较低的凝固速率R=3μm/s时亚共晶成分的合金为规则的层片共晶组织。随着凝固速率的增大,当R=8μm/s时,平界面失稳,在第二相的旁边出现浅胞状组织。当R=25μm/s时在析出相的旁边出现了突起的胞状组织。当R=40μm/s时由于固液界面前沿的成分过冷逐渐增大,凝固组织生长成为典型的树枝晶组织。并根据"成分过冷"判据,评估了固液界面前沿的"成分过冷"的大小,理论计算与实验结果基本吻合。此外,根据BH模型计算和比较了α-Ni相的界面生长温度和共晶界面生长温度,证明较高速定向凝固下不太可能制备出全耦合生长的共晶组织。随凝固速率的增大,一次枝晶间距减小,组织细化。     

冷却速度对无铅焊料Sn-3．5Ag合金微观组织和显微硬度的影响

在～10^2K／s、～10^3K／s和～10^4K／s的冷速条件下研究了凝固速度对无铅焊料Sn-3．SAg合金微观组织和显微硬度的影响。结果表明：由于非平衡凝固条件下动力学过冷的影响，导致了该共晶合金实际凝固过程开始于平衡共晶凝固点以下，合金凝固组织中包含初生β-Sn枝晶，且该初生β-Sn枝晶组织随合金凝固速度的提高而发生细化。另外，维氏硬度测试结果表明，无铅焊料Sn-3．5ag合金在不同冷速条件下的凝固组织与显微硬度的关系符合经典Hall-Petch关系式，即初生β-Sn枝晶细化能显著提高焊料合金的显微硬度。     

旋转磁场作用下Pb-Sn合金的凝固行为

采用永磁体旋转装置实现了Pb-50wt%Sn亚共晶、Pb-61.9wt%Sn共晶合金旋转磁场条件下的凝固,并对其凝固规律进行了研究.发现与常规条件下相比,旋转磁场导致的合金熔体内部强迫对流加快了合金熔体的冷却速率,提高熔体初始形核温度,促发熔体提前形核并能使凝固时间缩短.Pb-61.9wt%Sn共晶合金的宏观偏析被有效抑制,在整个样品中得到了二元共晶组织,共晶层片粗化,局域地区出现了不规则共晶组织.对于Pb-50wt%Sn亚共晶,初生相(Pb)的生长方式由粗大枝晶转变为细小的球状颗粒,且晶粒显著细化.     

不同热处理工艺对TC4-DT钛合金棒材组织和性能的影响

研究了不同热处理工艺对TC4-DT钛合金棒材显微组织和力学性能的影响。结果表明:TC4-DT合金在两相区经过普通退火和再结晶退火后组织发生再结晶,α相尺寸有所增大,具有较好的塑性。经过两相区固溶+时效处理得到双态组织,通过控制固溶时冷却速度及时效温度来调整次生α片层厚度,使得合金强度和断裂韧性得到改善。经单相区固溶水冷得到马氏体组织,随时效温度提高,α片层厚度增加,但析出的次生α相含量减少,导致合金的强度和断裂韧性有所下降。而在单相区固溶空冷+高温时效处理,获得的α片层厚度进一步增大,有助于提高塑性和断裂韧性。采用950℃/1h/WQ+550℃/6h/AC两相区固溶+时效的热处理工艺,可实现合金强度、塑性、韧性的较好匹配,获得优良的综合性能。     

超重力场凝固对Cu-1.6%Cr共晶合金组织的影响

本实验分别在普通重力场和4230g超重力场下制备了Cu_(98.4)Cr_(1.6)合金的凝固样品,研究了重力场对Cu_(98.4)Cr_(1.6)合金棒状共晶尺寸和宏观偏析情况的影响。结果表明:与普通重力场的凝固组织相比,当Cu_(98.4)Cr_(1.6)合金棒状共晶在4230g超重力场下凝固时,棒状共晶组织得到了明显的细化,其直径由250~350nm降至100~200nm。同时,Cu_(98.4)Cr_(1.6)共晶合金沿超重力场方向的硬度和成分分布基本一致,未出现明显的宏观偏析。     

深过冷Ni—Sn共晶合金的快速凝固机制

本文通过净化法使 Ni-32.5wt-%Sn 共晶合金液获得深过冷,对该合金液在不同过冷条件下的凝固机制和组织进行了研究。结果表明:当过冷度小于约10K 时,该合金液凝固生成 Ni_3Sn相和 Ni(α)相层片共晶。在深过冷条件下,由于 Ni_3Sn 枝晶的自由生长速度远大于 Ni(α)枝晶的自由生长速度,再辉过程中,Ni_3Sn 相和 Ni(α)相不能以匹配方式生长,而由 Ni_3Sn 相作为领先相以枝晶簇方式生长。再辉过程中形成的枝晶簇,其内部 Ni_3Sn 枝晶进一步熔断粗化及 Ni(α)相在Ni_3Sn 枝晶间形成生长,最后形成非规则共晶组织。当过冷度小于130K 时,再辉之后,枝晶簇间存留有较大体积的成分仍为 Ni-32.5wt-%Sn 的合金液,这部分合金液在共晶平台阶段以层片共晶方式凝固,所以试样内部的组织由非规则共晶区和层片共晶区组成。     

Microstructures and Vickers hardness of rapidly solidified Al-Cu alloys near the Al-Al2Cu equilibrium eutectic composition

Al-Cu alloys near the Al-Al₂Cu equilibrium eutectic composition were rapidly solidified by the single-roller method. Two-zone structures were observed in transverse sections of Al-24.8, 30.0, 32.7, 33.2, 37.0 and 40.3 mass % Cu alloy ribbons, which were interpreted on the basis of the difference in cooling rates and of the temperature gradients between the chilled and free-surface sides of the ribbons. Non-equilibrium eutectic structures, cellular and irregular lamellar, were seen at the chilled side because the alloy liquids were directionally solidified with coupled eutectic growth. The coupled zone of the Al-Cu alloy expanded over the composition range 24.8–40.3 mass % Cu by rapid solidification. Dendritic structures were formed at the unchilled side of Al-24.8, 30.0, 37.0 and 40.3 mass % Cu alloys. Vickers hardness values at the chilled side differed from those at the unchilled side due to the difference in the microstructure.     

Investigation of the effect of solidification processing parameters on the rod spacings and variation of microhardness with the rod spacing in the Sn–Cu hypereutectic alloy

Sn–3 wt% Cu hypereutectic alloy was prepared in a graphite crucible under the vacuum atmosphere. The samples were directionally solidified upwards under argon atmosphere with different temperature gradients (G = 4.24–8.09 K/mm) at a constant growth rate (V = 7.64 μm/s) and with different growth rates (V = 2.24–133.33 μm/s) at a constant temperature gradient (G = 4.24 K/mm) by using a Bridgman type directional solidification apparatus. The microstructure of directional solidified Sn–3 wt% Cu alloy seems to be rod eutectic structure. The influence of the growth rate (V) and temperature gradient (G) on the rod spacing (λ) and undercooling (ΔT) were analysed. The values of λ²V, λ²G, ΔTλ, ΔTV^−0.5 and ΔTG^−0.5 were determined by using the Jackson–Hunt eutectic theory. The dependence of microhardness (HV) on the rod spacing (λ) was analyzed. According to present results, it has been found that the value of HV increases with the increasing the value of λ.     

冷却速度对Sn-Ag无铅焊料微观组织和机械性能的影响

研究了不同冷却速度下无铅焊料Sn-3．5％(质量分数)Ag合金的微观形貌(冷却速度从0．08K／s到10^4K／s)。结果表明焊料合金中二次枝晶间距随冷却速度增加而逐渐减小，且符合公式：d=atf^n，其中d为二次枝晶间距，tf是冷却时间，a和n是由材料和其成分所决定的常数，通过计算得到对于Sn-3．5％(质量分数)Ag合金其a为3．7，而n为0．43。维氏硬度测试结果表明：快速冷却条件能使焊料合金晶粒细化，其中作为强化相的金属间化合物Ag3Sn分布更加细密，从而能使整个合金机械性能得到提高。     

快速凝固AlCoCrFeNi2.1共晶高熵合金的微观组织演变和力学性能

使用真空快速凝固设备制备不同直径的AlCoCrFeNi_2.1合金铸棒和薄带,研究了冷却速率对多主元共晶高熵合金的微观组织和力学性能的影响。结果表明,全部试样均由FCC和B2两相组成。不同直径的合金铸棒均为常规共晶组织,只在表层某些位置观察到胞状共晶组织。铸棒的直径越小,冷却速率越大,规则共晶组织的片间距(λ)越小,其屈服强度越高。当铸棒直径由8 mm减小至2 mm时表层区域的λ值由530.4 μm减小至357.0 μm,轴心区域的片间距由712 μm减小至474 μm,合金的屈服强度由690 MPa提高到877 MPa。结合合金薄带的微观组织分析结果表明,随着冷却速率的提高AlCoCrFeNi_2.1合金依次形成规则和非规则混合共晶组织、胞状共晶组织和树枝状组织。     

凝固条件和镁对Al-Si11.0合金组织的影响

研究了宇向凝固时冷却条件和镁元素对Ａｌ－Ｓｉ１１．０合金树枝晶结构和共晶组织的影响。试验结果表明,随着冷却速度的增加,Ａｌ－Ａｉ１１．０合一次枝晶和二镒分枝间距都显著减小,在较小的冷却速度时,加入镁元素后合金的二镒分枝间距明显增大,而在冷却速度大于１６０Ｋ／ｍｉｎ时,则没有影响。试验还发现,加入镁元素后,冷却速度对共晶成分的影响显示减小,是合 共晶组织变细。在试验范围内,Ａｌ－Ｓｉ１１．０合金中加     

Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn–3.5 wt% Ag eutectic solder

The Sn–3.5 wt% Ag eutectic alloy was directionally solidified upward with a constant growth rate (V = 16.5 μm/s) at different temperature gradients (G = 1.43–4.28 K/mm) and with a constant temperature gradient (G = 3.93 K/mm) at different growth rates (V = 8.3–500 μm/s) in a Bridgman-type directional solidification furnace. The rod spacings (longitudinal section, λ _L and transverse section, λ _T ) and mechanical properties (microhardness, HV and ultimate tensile strength, σ _UTS ) of Sn–3.5 wt% Ag eutectic alloy were measured. The dependency of the microhardness, ultimate tensile strength on the temperature gradient, growth rate and rod spacings were determined. According to experimental results, the microhardness and ultimate tensile strength of the solidified samples increase with increasing G and V, but decrease with the increasing the rod spacing.     

Modification of γ-(Fe,Cr)3C pseudo-binary eutectic

The -(Fe, Cr)₃C pseudo-binary eutectic alloy with K, Ce, Sb additives was unidirectionally solidified in a Brigdman-type unit. The quasi-regular, lamellar eutectic carbide was changed into rods and bent blades by the modifiers under well-controlled conditions. At very slow growth, partial modification was common. At growth rates corresponding to a slightly cellular interface, a fully modified structure could be obtained. The modification behaviour as a function of the modifying element, its concentration and the growth rate is described and discussed.     

Dependence of electrical and thermal conductivity on temperature in directionally solidified Sn–3.5 wt% Ag eutectic alloy

Sn–3.5 wt% Ag alloy was directionally solidified upward with a constant growth rate (V = 16.5 μm/s) and a temperature gradient (G = 3.3 K/mm) in a Bridgman-type growth apparatus. The variations of electrical resistivity (ρ) with temperature in the range of 293–476 K for the directionally solidified Sn–3.5 wt% Ag eutectic alloy was measured. The measurements indicate that the electrical resistivity of the directionally solidified Sn–Ag eutectic solder increases with increasing temperature. The variations of thermal conductivity of solid phases versus temperature for the same alloy was determined from the Wiedemann-Franz and Smith-Palmer equations by using the measured values of electrical conductivity. From the graphs of electrical resistivity and thermal conductivity versus temperature, the temperature coefficient of electrical resistivity (α _TCR ) and the temperature coefficient of thermal conductivity (α _TCT ) for the same alloy were obtained. According to experimental results, the electrical and thermal conductivity of Sn–Ag eutectic solder linearly decrease with increasing the temperature. The enthalpy of fusion (ΔH) and the change of specific heat (ΔC _P ) during the transformation at the studied alloy were determined from heating curve during the transformation from eutectic solid to eutectic liquid by means of differential scanning calorimeter (DSC).     

Investigation of microhardness and thermo-electrical properties in the Sn–Cu hypereutectic alloy

Sn–3 wt% Cu hypereutectic alloy was directionally solidified upward with different growth rates (2.24–133.33 μm/s) at a constant temperature gradient (4.24 K/mm) and with different temperature gradients (4.24–8.09 K/mm) at a constant growth rate (7.64 μm/s) in the Bridgman-type growth apparatus. The measurements of microhardness of directionally solidified samples were obtained by using a microhardness test device. The dependence of microhardness HV on the growth rate (V) and temperature gradient (G) were analyzed. According to these results, it has been found that with the increasing the values of V and G the value of HV increases. Variations of electrical resistivity (ρ) and electrical conductivity (σ) for casting samples with the temperature in the range of 300–500 K were also measured by using a standard dc four-point probe technique. The variation of Lorenz coefficient with the temperature for Sn–3 wt% Cu hypereutectic alloy was determined by using the measured values of electrical and thermal conductivities. The enthalpy of fusion for same alloy was determined by means of differential scanning calorimeter from heating trace during the transformation from eutectic liquid to eutectic solid.     

Function of modification and refinement of rapidly solidified master alloy Al—Ti—Sr

The function of modification and refinement of a master alloy Al—Ti—Sr solidified at cooling rates of 10 K s-1 or less and 103 K s-1 or greater for a hypoeutectic Al–10 wt% Si alloy has been studied. The master alloy Al–Ti–Sr solidified at a cooling rate of 103 K s-1 or greater presents a more marked function of modification and refinement than that solidified at a cooling rate of 10 K s-1 or less, both under the casting condition of a sand mould and a permanent mould. The addition amount of the master alloy is reduced by rapid solidification technology, keeping the same degree of modification and refinement.