AlGaAs/Ge/GaAs heterojunction bipolar transistors grown bymolecular beam epitaxy

An N-Al_0.22Ga_0.78As emitter, p-Ge base, and n-GaAs collector (AlGaAs/Ge/GaAs) heterojunction bipolar transistor (HBT) in the emitter-up configuration grown by molecular beam epitaxy is discussed. Devices exhibited common-emitter current gains of as high as 300 at a collector current density of 2000 A/cm² and a collector voltage of 4 V. As the device area is reduced from 50×50 to 10×40 μm, the current gain did not show significant changes, suggesting a low surface recombination velocity in the Ge base     

AlGaAs/InGaAs/GaAs strained-layer heterojunction bipolar transistors by molecular beam epitaxy

The growth and characteristics of the first AlGaAs/InGaAs/GaAs HBTs are reported. Layers with up to 10% indium content appeared to be free of misfit dislocations, and resulted in HBTs with good I/V characteristics which scaled with In content according to theory.     

High-speed GaAs heterojunction bipolar phototransistor grown by molecular beam epitaxy

A novel heterojunction phototransistor (HPT) structure is proposed using two base regions such that the emitter-base depletion region is located in the wide-gap material. Very small area HPTs have been fabricated on semi-insulating substrates. Maximum current gain is ? = 300. The response time, with rise time as short as 250 ps and FWHM = 320 ps, has been obtained using a picosecond pulse dye laser.     

A high-gain GaAs/AlGaAs n-p-n heterojunction bipolar transistor on(100) Si grown by molecular beam epitaxy

High-gain GaAs/AlGaAs n-p-n heterojunction bipolar transistors (HBT's) on Si substrates grown by molecular beam epitaxy (MBE) have been fabricated and tested. In this structure, an n⁺-InAs emitter cap layer was grown in order to achieve a nonalloyed ohmic contact. Typical devices with an emitter dimension of 50×50 μm² exhibited a current gain as high as 45 at a collector current density of 2×10³ A/cm² with an ideality factor of 1.4. This is the highest current gain reported for HBT's grown on Si substrates. Breakdown voltages as high as 10 and 15 V were observed for the emitter-base and collector-base junctions respectively. The investigation on devices with varying emitter dimensions demonstrates that much higher current gains can be expected     

Heavily doped base GaInP/GaAs heterojunction bipolar transistor grown by chemical beam epitaxy

The first demonstration of a GaInP/GaAs heterojunction bipolar transistor grown by chemical beam epitaxy is reported. A common-emitter current gain of 30 at a current density of 110 A/cm/sup 2/ is obtained for a beryllium base doping as high as 8*10/sup 19/ cm/sup -3/. The base sheet resistance of 140 Omega / Square Operator is among the lowest reported values.<>     

Hybrid AlGaAs/GaAs/AlGaAs nanowires with a quantum dot grown by molecular beam epitaxy on silicon

Data on the growth features and physical properties of GaAs inserts embedded in AlGaAs nanowires grown on Si(111) substrates by Au-assisted molecular beam epitaxy are presented. It is shown that by varying the growth parameters it is possible to form structures like quantum dots emitting in a wide wavelength range for both active and barrier regions. The technology proposed opens up new possibilities for the integration of direct-band III–V materials on silicon.     

AlGaAs/GaAs JFETs by organo-metallic and molecular beam epitaxy

Normally-off and normally-on AlGaAs/GaAs heterojunction gate GaAs FETs (HJFETs) for high-speed logic applications have been fabricated with molecular beam epitaxy (MBE) and organometallic vapour phase epitaxy (OM-VPE). The best normally-off devices used MBE n-GaAs active layers and OM-VPE gate layers of p+-AlGaAs and p+-GaAs. Saturation currents followed a square law and current scaling constants were the highest on record for HJFETs, greater than 50 ?A/?m-V2.     

High-performance carbon-doped base GaAs/AlGaAs heterojunction bipolar transistor grown by MOCVD

High-performance HBTs with a carbon-doped base layer (p=4*10/sup 19/ cm/sup -3/) are reported. The use of carbon as a p-type dopant allows the emitter-base p-n junction to be accurately positioned relative to the heterojunction, and the MOCVD growth method ensures consistency and uniformity of the wafer epitaxial structure. Microwave HBTs with current gains h/sub FE/=50 and f/sub T/ and f/sub max/ values of 42 GHz and 117 GHz, respectively, are reported.<>     

Inner-stripe AlGaAs/GaAs laser diode by single-step molecular beam epitaxy

A novel fabrication technique for a real refractive-index-guide inner-stripe laser by a single-step crystal growth is reported. The injected current is confined in the p-type silicon-doped GaAs region on the V-shaped groove with (111)A slopes by the crystal-orientation-dependent amphoteric nature of the silicon impurity in GaAs.     

Vertically compact 15 GHz GaAs/AlGaAs multiple quantum well laser grown by molecular beam epitaxy

A GaAs/Al/sub x/Ga/sub 1-x/As multiple quantum well laser with an electrical modulation bandwidth exceeding 15 GHz has been fabricated. Optimised design of the waveguide, including development of high Al mole fraction (x=0.8) cladding layers, together with a coplanar electrode geometry, has resulted in a vertically compact laser structure suitable for integration.<>     

Double-heterostructure AlGaAs/GaAs lasers grown on the mesas of trenched Si substrate by molecular beam epitaxy

The growth and device characteristics of stripe Al/sub 0.26/Ga/sub 0.74/As/GaAs double-heterostructure lasers grown on mesas of trenched Si by MBE is reported. The TE and TM modes lase at different injection levels depending on the laser stripe width. This behaviour is attributed to the variation of the residual thermal stress present in the laser structures as a function of stripe width. By comparing the polarisations of the laser radiations from a narrow and broad stripe laser, it is found that a narrow mesa is effective in reducing the residual thermal stress.<>     

Current-voltage characteristics ofp-Ge/n-GaAs heterojunction diodes grown by molecular beam epitaxy

Electrical characteristics ofp-Ge/n-GaAs heterojunctions on GaAs(l00) grown by molecular beam epitaxy (MBE) have been investigated. Thep-type Ge layer was produced by intentionally doping with Ga atoms, in addition to the diffusion of Ga atoms from the surface of the GaAs layer. The best ideality factor of 1.04 over six decades of the forward current and the lowest reverse current density of the order of 10⁻⁶ A/cm² were obtained for diodes with Ge grown at 500° C. The ideality factor increased slightly up to 1.12 when the operating temperature was decreased to 77 K. By studying the temperature dependence of the forward current, the conduction band discontinuity has been estimated to be 40 ± 10 meV. The suppression of Ga diffusion into the Ge film and its effect on pn-junction characteristics were also studied by growing a thin Ge film on GaAs at less than 300° C prior to the normal Ge film growth at 500° C.     

InGaAs/lnP heterojunction bipolar transistor grown by all-solidsource molecular beam epitaxy

State-of-the-art InGaAs/InP heterojunction bipolar transistors were grown by all-solid source molecular beam epitaxy. Fabricated transistors showed cutoff frequencies of >100 GHz with an emitter area of 1.5×5 μm². Together with recent studies. These results demonstrate that the valved cracker technique is a very competitive nontoxic growth method     

Ion-implanted GaAs/AlGaAs heterojunction FET's grown by MOCVD

The successful fabrication of an ion-implanted GaAs/AlGaAs heterojunction FET device is discussed. Half-micrometer gate-length FET devices are fabricated by ion implantation into GaAs/AlGa heterostructures grown by metalorganic chemical vapor deposition (MOCVD) on 3-in-diameter GaAs substrates. The FET device exhibits a maximum extrinsic transconductance of 280 mS/mm with reduced transconductance variation over 2 V of gate bias. Excellent microwave performance is achieved with an f_t of 40 GHz, which is comparable to results obtained from 0.25-μm gate GaAs MESFETs. The effects of ion implantation on the heterojunction and corresponding device characteristics are also discussed     

AlAs oxidation process in GaAs/AlGaAs/AlAs heterostructures grown by molecular beam epitaxy on GaAs (n11)A substrates

The lateral oxidation of AlAs layers grown on GaAs (100), (110) and (n11)A-oriented substrates (n=1, 2, 3, 4) was studied. The temperature dependence of the oxidation rate was measured between 390°C and 450°C. The oxidation rate is highly anisotropic and the anisotropy is related to the symmetry of the crystal structure. The oxidation process has an activation energy that depends on substrate orientation. The oxidation front line becomes irregular for temperatures higher than 450°C and the surface of the samples was degraded when the temperature exceeded 540°C. The time dependence of the oxidation rate was found to be similar to the Si oxidation process.     

分子束外延生长的GaAs/GaInP双结电池研究

We report the recent result of GaAs/GaInP dual-junction solar cells grown by all solid-state molecularbeamepitaxy(MBE).The device structure consists of a GaIn0.48P homojunction grown epitaxially upon a GaAs homojunction,with an interconnected GaAs tunnel junction.A photovoltaic conversion efficiency of 27% under the AM1.5 globe light intensity is realized for a GaAs/GaInP dual-junction solar cell,while the efficiencies of 26% and 16.6% are reached for a GaAs bottom cell and a GaInP top cell,respectively.The energy loss mechanism of our GaAs/GaInP tandem dual-junction solar cells is discussed.It is demonstrated that the MBE-grown phosphide-containing Ⅲ–V compound semiconductor solar cell is very promising for achieving high energy conversion efficiency.     

A GaAs/GalnP dual junction solar cell grown by molecular beam epitaxy

We report the recent result of GaAs/GalnP dual-junction solar cells grown by all solid-state molecularbeam-epitaxy （MBE）. The device structure consists of a GaIn0.4sP homojunction grown epitaxially upon a GaAs homojunction, with an interconnected GaAs tunnel junction. A photovoltaic conversion efficiency of 27% under the AM1.5 globe light intensity is realized for a GaAs/GaInP dual-junction solar cell, while the efficiencies of 26% and 16.6% are reached for a GaAs bottom cell and a GaInP top cell, respectively. The energy loss mechanism of our GaAs/GalnP tandem dual-junction solar cells is discussed. It is demonstrated that the MBE-grown phosphide-containing Ⅲ-V compound semiconductor solar cell is very promising for achieving high energy conversion efficiency.     

Low-threshold current AlGaAs/GaAs-distributed feedback laser grown by two-step molecular beam epitaxy

AlGaAs/GaAs-distributed feedback (DFB) lasers with oxide-stripe structure were fabricated by a two-step molecular beam epitaxial (MBE) growth for the first time. The large coupling coefficient of 90 cm^-1and the threshold current as low as 165 mA at room temperature were obtained with the second-order gratings. The characteristic temperature T0was as high as 210 K. Single longitudinal-mode oscillation was observed up toI/I_{th} = 1.5and from 0 to 50°C without any mode hopping. The wavelength variation from device to device was ±5 Å. The dependence of the coupling coefficient on the device structure was calculated, and it was shown that MBE is much more advantageous than LPE to enhance the coupling coefficient.     

Submicrometer self-aligned AlGaAs/GaAs heterojunction bipolartransistor process suitable for digital applications

A self-aligned process is developed to obtain submicrometer high-performance AlGaAs/GaAs heterojunction bipolar transistors (HBTs) which can maintain a high current gain for emitter sizes on the order of 1 μm². The major features of the process are incorporation of an AlGaAs surface passivation structure around the entire emitter-base junction periphery to reduce surface recombination and reliable removal of base metal (Ti/W) deposits from the sidewall by electron cyclotron resonance (ECR) plasma deposition of oxide and ECR plasma etching by NF₃. A DC current gain of more than 30 can be obtained for HBTs with an emitter-base junction area of 0.5×2 μm² at submilliampere collector currents. The maximum f_T and f_max obtained from a 0.5×2 μm² emitter HBT are 46 and 42 GHz, respectively at I_C=1.5 and more than 20 GHz even at I_C=0.1 mA     

Direct extraction of the AlGaAs/GaAs heterojunction bipolartransistor small-signal equivalent circuit

The authors describe a novel, direct technique for determining the small-signal equivalent circuit of a heterojunction bipolar transistor (HBT). The parasitic elements are largely determined from measurements of test structures, reducing the number of elements determined from measurements of the transistor. The intrinsic circuit elements are evaluated from y-parameter data, which are DC-embedded from the known parasitics. The equivalent-circuit elements are uniquely determined at any frequency. The validity of this technique is confirmed by showing the frequency independence of the extracted circuit elements. The equivalent circuit models the HBT s-parameters over a wide range of collector currents. Throughout the entire 1-18-GHz frequency range, the computed s-parameters agree very well with the experimental data