退火处理对不同RF功率下制备ZnO薄膜的结晶性能的影响

采用RF磁控溅射法,在不同溅射功率下在玻璃衬底上制备了ZnO薄膜,并对所制备的ZnO薄膜在空气气氛中进行了不同温度（350-600℃）的退火处理.利用X射线衍射仪（XRD）、扫描电子显微镜（SEM）等研究了退火对不同溅射功率条件下制备的ZnO薄膜晶体性能和应力状态的影响.研究表明,在衬底没有预热的情况下,较低功率（190W）下制备的ZnO薄膜,当退火温度为500℃时,能获得单一c轴择优取向和最小半高宽,张应力在350℃退火时最小;较高功率（270W）下,薄膜最佳c轴取向和晶粒度在600℃退火温度获得,张应力最小的退火温度在350-500℃之间.当衬底预热至300℃时,退火处理对两种功率下制备的薄膜的结晶性能和应力的影响基本一致.     

Influence of oxygen partial pressure on properties of N-doped ZnO films deposited by magnetron sputtering

N-doped ZnO films were radio frequency(RF)sputtered on glass substrates and studied as a function of oxygen partial pressure(OPP)ranging from 3.0×10-4 to 9.5×10-3 Pa.X-ray diffraction patters confirmed the polycrystalline nature of the deposited films.The crystalline structure is influenced by the variation of OPP.Atomic force microscopy analysis confirmed the agglomeration of the neighboring spherical grains with a sharp increase of root mean square(RMS)roughness when the OPP is increased above 1.4×10-3 Pa.X-ray photoelectron spectroscopy analysis revealed that the incorporation of N content into the film is decreased with the increase of OPP,noticeably N 1s XPS peaks are hardly identified at 9.5×10-3 Pa.The average visible transmittance(380-700 nm) is increased with the increase of OPP(from～17%to 70%),and the optical absorption edge shifts towards the shorter wavelength.The films deposited with low OPP(≤3.0×10-4 Pa)show n-type conductivity and those deposited with high OPP(≥9.0×10-4 Pa)are highly resistive(105Ω·cm)     

Properties of doped ZnO transparent conductive thin films deposited by RF magnetron sputtering using a series of high quality ceramic targets

To obtain high transmittance and low resistivity ZnO transparent conductive thin films,a series of ZnO ceramic targets (ZnOAl,ZnO(Al,Dy),ZnO(Al,Gd),ZnO(Al,Zr),ZnO(Al,Nb),and ZnO(Al,W)) were fabricated and used to deposit thin films onto glass substrates by radio frequency (RF) magnetron sputtering.X-ray diffraction (XRD) analysis shows that the films are polyerystalline fitting well with hexagonal wurtzite structure and have a preferred orientation of the (002) plane.The transmittance of above 86% as well as the lowest resistivity of 8.43 x 10-3 Ω·cm was obtained.     

磁控溅射TiO2薄膜的相结构转变温度

利用射频磁控溅射制备了TiO2致密薄膜,并通过退火处理实现TiO2的相转变,采用扫描电镜,X射线衍射等手段对薄膜相结构进行表征并做了详细的分析,结果表明,退火后TiO2薄膜结构致密,表面呈现出大小均匀的纳米晶粒。400 ℃退火时,TiO2薄膜为单一的锐钛矿相,500～600 ℃退火时为锐钛矿和金红石混合相,700 ℃以上退火时则完全转变为金红石相。     

直流、射频磁控溅射制备钌薄膜的微观结构及电学性能分析

为了探索直流和射频磁控溅射制备钌薄膜的微观结构及性能差异,进而指导薄膜制备工艺优化。采用直流和射频磁控溅射法在SiO2/Si(100)衬底上沉积不同时间和温度的钌薄膜;通过高分辨场发射扫描电镜、X射线衍射仪、原子力显微镜、四探针等方法研究不同溅射电源下制备的钌薄膜的微观结构和电学性能。结果表明,在相同溅射条件下,DC-Ru薄膜的结晶性优于RF-Ru薄膜;其厚度大于RF-Ru薄膜,满足tDC≈2tRF;其沉积速率高于RF-Ru薄膜,满足vDC≈2vRF。然而,其电阻率却高于RF-Ru薄膜,这主要得益于RF-Ru薄膜的致密度较高,从而降低了电子对缺陷的散射效应。     

Conductive and transparent Bi-doped ZnO thin films prepared by rf magnetron sputtering

Bi-doped ZnO thin films were grown on glass substrates by ratio frequency (rf) magnetron sputtering technique and followed by annealing at 400 °C for 4 h in vacuum (~ 10^− 1 Pa). The effect of argon pressure on the structural, optical, and electrical properties of the Bi-doped films were investigated. The XRD patterns show that the thin films were highly textured along the c-axis and perpendicular to the surface of the substrate. Some excellent properties, such as high transmittance (about 85%) in visible region, low resistivity value of 1.89 × 10^− 3 W cm and high carrier density of 3.45 × 10²⁰ cm^− 3 were obtained for the film deposited at the argon pressure of 2.0 Pa. The optical band gap of the films was found to increase from 3.08 to 3.29 eV as deposition pressure increased from 1 to 3 Pa. The effects of post-annealing treatments had been considered. In spite of its low conductivity comparing with other TCOs, Bi-doping didn't appreciably affect the optical transparency in the visible range of ZnO thin films.     

Influence of oxygen gas content on the structural and optical properties of ZnO thin films deposited by RF magnetron sputtering at room temperature

Zinc oxide (ZnO) thin films were deposited on sapphire (0001) substrates at room temperature by radiofrequency (RF) magnetron sputtering at oxygen gas contents of 0%,25%,50% and 75%,respectively.The influence of oxygen gas content on the structural and optical properties of ZnO thin films was studied by a surface profile measuring system,X-ray diffraction analysis,atomic force microscopy,and UV spectrophotometry.It is found that the size of ZnO crystalline grains increases first and then decreases with the increase of oxygen gas content,and the maximum grain size locates at the 25% oxygen gas content.The crystalline quality and average optical transmittance (>90%) in the visible-light region of the ZnO film prepared at an oxygen gas content of 25% are better than those of ZnO films at the other contents.The obtained results can be attributed to the resputtering by energetic oxygen anions in the growing process.     

磁控溅射制备SiC薄膜及其高温抗氧化性

用射频磁控溅射法在单晶Si(100)基片上制备了SiC薄膜.将制备的薄膜分别在800、900和1000℃空气气氛中退火120 min.用X射线衍射仪和傅里叶变换红外光谱仪测试了薄膜的结构,用X射线光电子能谱仪测试了薄膜元素的组成和状态,用场发射扫描电子显微镜测试了薄膜表面的形貌.结果表明:经800℃空气退火后,薄膜表面生成了一层SiO2保护层,阻止了内部SiC薄膜的继续氧化,因此SiC薄膜在800℃具有较好的高温抗氧化性;随着退火温度的升高,SiC薄膜被进一步氧化,经1000℃空气退火后,薄膜已大部分转变为SiO2.     

Fabrication of ZnO films by radio frequency magnetron sputtering and annealing

ZnO thin films were deposited on Si（111） substrates through a radio frequency （rf） magnetron sputtering system. Then the samples were annealed at different temperatures in air ambience and ammonia ambience respectively. The structure and composition of the ZnO films were studied by X-ray diffraction （XRD） and X-ray photoelectron spectroscopy （XPS）. The morphology of the samples was studied by scanning electron microscopy （SEM）. Measured results show that ZnO films with hexagonal wurtzite structure were grown on Si（111） substrates when annealed in the two ambiences. The volatilization process of ZnO in the ammonia ambience at high temperature was discussed and the mechanism of the reaction was analyzed.     

Effect of Ru addition on the properties of Al-doped ZnO thin films prepared by radio frequency magnetron sputtering on polyethylene terephthalate substrate

The addition of ruthenium in aluminum-doped zinc oxide transparent conducting thin films was deposited on polyethylene terephthalate at 20 °C by radio frequency magnetron sputtering technique. The structure and electrical properties of the films were investigated with respect to variation of Ru concentration. The XRD and FESEM results show that the film with 0.5 wt% Ru doping has the best crystallinity and larger pyramid-like grains, therefore the resistivity reached to a lowest value of 9.1 × 10⁻⁴ Ωcm. The low carrier mobilities of the films (3–7.2 cm² V⁻¹ s⁻¹), however, were limited by ionized impurity scattering and grain boundary scattering mechanisms since the carrier concentrations were ranged from 2.2 × 10²⁰ to 9.5 × 10²⁰ cm⁻³. The transmittance in the visible is greater than 80% with the optical band gap in the order of 3.352–3.391 eV.     

溅射气压对ZnO透明导电薄膜光电性能的影响

采用射频磁控溅射方法,在普通玻璃上制备了具有高度c轴取向的ZnO薄膜,研究了溅射气压(0.2～1.5 Pa)对ZnO薄膜的微观结构和光电性能的影响.AFM、XRD、UV-Vis分光光度计及四探针法研究表明:随着溅射气压的增大,ZnO薄膜沿c轴方向的结晶质量提高,晶粒细化,薄膜表面更加致密,晶粒大小更加均匀;ZnO薄膜在400～900nm范围内的平均透过率均高于85%,其中在0.5～1.5 Pa范围内其透过率高于90%;样品在高纯氮气气氛中经350 ℃,300 s退火后,电阻率最低达到10-2 Ω-cm量级.     

磁控溅射和退火制备ZnO/SiO2复合薄膜

采用射频磁控溅射和退火处理的方法在单晶硅衬底上制备了ZnO/SiO2复合薄膜,利用X射线衍射(XRD)、扫描电镜(SEM)、能谱分析(EDS)和接触角测量等测试手段研究溅射气压、溅射功率、氧氩比和退火温度等对复合薄膜成分组成、组织结构及润湿性能的影响。研究表明,复合薄膜中主要有ZnO、SiO2、Zn2SiO4 3种物相,且分别以六方纤锌矿结构、无定形态和硅锌矿型等形式存在。随着溅射和退火工艺的改变,复合薄膜的接触角在41°～146°间变化,组织形态由颗粒状向纳米竹叶状变化。溅射气压0.5 Pa,溅射功率120 W,氧氩比(O2∶Ar)为0∶30,退火温度为700℃的条件下获得具有六方纤锌矿结构的ZnO纳米组织,该组织呈现出竹叶状,在薄膜表面交错排列形成了无序多空隙的微观形貌,使复合薄膜具有超疏水性,接触角为146°。     

Yttria-stabilized zirconia thin films deposited by pulsed-laser deposition and magnetron sputtering

Yttria-stabilized zirconia (YSZ, ZrO₂:Y₂O₃) was deposited on (100) silicon by two physical vapor deposition techniques: pulsed laser deposition (PLD) and reactive magnetron sputtering (RMS). PLD thin films were grown on silicon substrates at 500 °C from the ablation of a 8YSZ ceramic target by a KrF excimer laser. RMS thin films were obtained by direct current magnetron sputtering of a Zr/Y metallic target in an oxygen/argon atmosphere. The deposition rate of the PLD technique using an UV excimer laser delivering pulses at a repetition rate of 40 Hz was found two orders of magnitude lower than the RMS method one. Both techniques led to the growth of crystalline films with a (111) preferential orientation. PLD films were dense and featureless whereas RMS ones exhibited well defined but compact columnar structure. Growth of a YSZ film of about 1 μm covering a rough and porous commercial anode support (NiO-YSZ cermet) was successfully carried out with both methods.     

Effect of the PbOx thickness on the microstructure and electrical properties of PLT thin films prepared by RF magnetron sputtering

The (Pb_0.90La_0.10)Ti_0.975O₃ (PLT) thin films with different thicknesses of PbO_x buffer layers were deposited on the Pt(111)/Ti/SiO₂/Si(100) substrates by RF magnetron sputtering technique. The PbO_x buffer layer leads to the (100) orientation of the PLT thin films. Effects of the PbO_x thickness on the microstructure and electrical properties of the PLT thin films were investigated. The experimental results show that the PbO_x thickness plays an important role on the orientation, phase purity, domain structure, and electrical properties of the PLT thin films. The PLT thin films with proper PbO_x thickness possess highly (100) orientation, high phase purity, strong intensity of out of plane polarization, and good electrical properties. It is concluded that the PbO_x thickness between PLT thin films and Pt coated Si substrate is very critical to obtain good electrical properties.     

磁控溅射氧化钒薄膜的相组成及性能

采用反应磁控溅射法在玻璃基底上沉积氧化钒薄膜,分别利用X射线衍射(XRD)、原子力显微镜(AFM)和红外光谱仪分析样品的物相、表面形貌和红外光透过率。结果表明:氧气体积分数低于15%时,薄膜为低价钒氧化物,高于20%时薄膜为V2O5;氧气体积分数等于15%时,溅射功率由150W增加到200W,薄膜中钒的价态变低;当溅射功率为250W时,薄膜物相变成VO2。随着沉积时间从30min增加到60min,原子力显微分析显示VO2颗粒尺寸从约200nm增加到400nm;红外光透过率范围从55%～65%减小到45%～55%。     

沉积和退火温度对多晶ZnO薄膜结构特性的影响

采用RF反应溅射法在Si（111）衬底上制备出了沿C轴高度取向的多晶ZnO薄膜。通过对ZnO薄膜的X射线衍射（XRD）分析,研究了沉积温度及退火对多晶ZnO薄膜取向性、晶粒大小和应力的影响。结果表明,衬底温度和退火温度对多晶ZnO薄膜的晶体结构影响显著。适当的提高衬底温度或适当的增加退火温度都能有效地改善ZnO薄膜的结构特性,但增加退火温度更有优势。同时原子力显微镜观察表明,退火能有效地降低ZnO薄膜的表面粗糙程度。     

Influence of boron contents on properties of AlMgB films prepared by RF magnetron sputtering

Ternary AlMgB thin films were synthesized on silicon (100) substrate at 573 K by radio frequency (RF) magnetron sputtering method using one Al/Mg co-target and one boron target. The thickness of the as-deposited thin film was controlled to 500 nm by adjusting deposition time. The influences of sputtering powers on the elemental contents and structural and mechanical properties were investigated by electron probe microanalysis (EPMA), X-ray diffraction (XRD), high-resolution transmission electron microscopy (HR-TEM), and nanoindentation system. At the same time, the ball-on-disk tribometer was used to measure the friction behavior of the films. Experimental results indicate that the as-deposited boron-rich films are primarily amorphous structure and possess a dramatic high hardness up to 39 GPa with 99. 03 at. ％ boron. Obviously, it has exceeded the hardness value of 32 GPa of pure AlMgB14 bulk material prepared by sintering method. Furthermore, the friction coefficients of the thin films exhibit an average value as low as 0. 3, which is considered as the effect of self-lubricating.     

溅射功率对射频磁控溅射Al掺杂ZnO(ZAO)薄膜性能的影响

用射频磁控溅射技术,在纯氩气氛中不同溅射功率（120 W~210 W）下于玻璃衬底上制备了Al掺杂ZnO（ZAO）薄膜。利用X射线衍射仪（XRD）、扫描电子显微镜（SEM）、光谱仪和四探针测试仪等对所制备的薄膜进行了晶体结构、光学和电学性能分析。结果表明,纯氩气氛中不同溅射功率下玻璃衬底上原位沉积的ZAO薄膜具有明显的c轴择优取向性,它没有改变ZnO的六角纤锌矿结构;ZAO薄膜的可见光区平均透光率不强烈依赖于溅射功率,为75%左右;原位沉积ZAO薄膜的电阻率达到102Ω.cm数量级范围,随溅射功率由120 W增大到210 W时,薄膜电阻率从132.67Ω.cm降低到21.08Ω.cm。     

磁控溅射法制备SnS薄膜的结构和光学性能

利用磁控溅射法在FTO玻璃上制备了Sn S薄膜。采用X射线衍射仪、扫描电子显微镜和紫外可见分光光度计对不同溅射参数下制备的Sn S薄膜的晶体结构、表面形貌和光学性能进行研究,确定出制备Sn S薄膜的最优溅射参数。结果表明:溅射功率为28 W,沉积气压在2.5 Pa时,制备出的Sn S薄膜在(111)晶面具有最好的择优取向,薄膜微观形貌呈单片树叶状,晶粒粒径约370 nm,晶粒分布均匀,薄膜表面光滑致密;最优溅射参数下制备的Sn S薄膜的吸收系数可达到105cm-1,比其他方法制备的Sn S薄膜的吸收系数值高,禁带宽度为1.48 e V,与半导体太阳能电池所要求的最佳禁带宽度(1.5 e V)十分接近。     

Nd-Fe-B薄膜的磁控溅射法制备与组织结构

对直流磁控溅射法制备Nd-Fe-B薄膜工艺进行了研究.在不同的溅射功率、溅射气压、溅射时间等条件下制备薄膜,并对薄膜进行了AFM、XRD分析.结果表明,Nd-Fe-B薄膜的沉积速率、表面形貌及相结构与溅射功率、溅射气压、溅射时间密切相关.薄膜的沉积速率随磁控溅射功率的增加而增加,薄膜表面晶粒尺寸和表面粗糙度随溅射功率增加而增大.沉积速率随溅射气压的升高先增大后减小.低功率溅射时,薄膜中出现α-Fe、Nd2Fe14B相相对较少,随溅射功率增加,α-Fe相消失,Nd2Fe14B相增多.综合考虑各种因素,最佳溅射功率为100～130 W.