浅谈碳纳米复合材料的应用与发展

本文介绍一些碳纳米纤维管的应用与发展,综述了碳纳米纤维管/聚合物复合材料的制备方法及其聚合物结构复合材料和聚合物功能复合材料中的应用研究情况,在此基础上,分析了碳纳米纤维管在复合材料制备过程中的纯化、分散、损伤和界面等问题,并展望了今后碳纳米及复合材料的发展前景。     

基于碳纳米材料构建传感器用于抗坏血酸、尿酸和多巴胺检测的研究进展

对应用于抗坏血酸、尿酸和多巴胺同时检测的碳纳米材料和电化学方法进行了简单阐述,重点从不同碳纳米材料的物理化学特性介绍了其在电化学传感器构建中发挥材料自身优势促进生物分子在传感器表面被灵敏准确识别的传感方法。总结了近年来基于石墨烯、碳纳米管、碳纳米纤维、纳米多孔碳和氮掺杂碳纳米材料等碳纳米材料构建传感器应用于三种生物分子同时检测的研究进展;分析了当前电化学传感器构建的不足及面临的挑战,并对今后电化学领域应用于生物活性分子快速检测的研究方向进行了展望。     

Carbon Nanostructure Enhanced Reinforcements in Electromagnetic Compatibility Applications

研究了将碳纳米结构材料合成到以PC/ABS、PA-6,6、PC、PP等热塑性聚合物为基底母料的碳增强复合材料中的电气性能、热导特性及机械性能.     

石墨烯/聚合物功能化复合材料的研究进展

石墨烯是一种具有二维结构的纳米碳材料,具有独特的物理性能,如比表面积大、导电导热性好、机械强度高等,因此在材料的轻质高强、导热、导电、电磁屏蔽等领域均备受关注。本文主要侧重介绍石墨烯/聚合物功能化复合材料的代表性研究成果,并对目前石墨烯复合材料的规模化应用进行评述,综合分析石墨烯/聚合物复合材料存在的关键问题及未来发展趋势。     

CoPt磁性纳米材料的研究进展

目前对CoPt磁性纳米材料的研究主要集中在CoPt磁性纳米颗粒、纳米线以及纳米薄膜三个方面,从这三个方面对CoPt磁性材料的研究进展进行详细地介绍。主要阐述了CoPt磁性纳米材料制备方法以及性能特征,同时系统地分析了影响CoPt磁性纳米材料的磁学性能的关键因素。     

电子行业中复合材料导热模型及机理研究进展

随着电子信息产业的快速发展,电子器件和封装材料的散热及综合性能要求越来越高,因此寻求高导热、高性能的复合材料成为电子行业中一个研究趋势。从导热模型、导热机理、如何提高热导率三个方面对电子工业领域中所用高分子复合材料进行了总结。     

纳米复合材料及其在隐身技术中的应用

介绍了纳米材料和纳米效应,说明了高分子纳米复合材料的类型、制备方法及其光学性质。简要分析了纳米复合材料的技术特征,叙述了纳米复合材料在隐身技术中的应用和国外纳米隐身材料的研究进展情况。     

磁性碳纳米复合吸波材料的研究进展

碳纳米材料具有独特的微观结构和介电性能,将这类材料与磁损耗材料复合可以有效提高吸波性能。从制备方法、吸波性能和吸波机理等方面,综述了石墨烯、碳纳米管、碳纳米纤维等碳纳米材料与磁性材料复合的吸波特性的最新研究成果,并对其发展前景进行了展望。     

聚合物基复合封装材料导热性能的参数仿真

鉴于聚合物基复合封装材料导热性能传统研究方法的不足(效率低、预测模型不合理等),提出了一种基于VC++结合ANSYS和MATLAB联合编程的方法,对聚合物基复合材料的导热性能进行参数化有限元分析。用户只需要在由VC++开发出来的人机交互界面上输入复合材料的相关导热参数,即可由ANSYS与MATLAB相互协作完成导热模型的构建、模型导热率的数值仿真、结果输出的可视化处理等一系列工作。通过分析氮化铝填充环氧树脂复合材料的导热性能,检验了该方法的可靠性。研究结果表明,该方法不仅能够有效地预测实验结果,而且还方便易用。     

碳基无源器件研究进展综述

碳纳米材料具有诸多独特的物理特性,如极大的热导率和载流容量.根据国际半导体技术发展路线图给出的预测,碳纳米材料可望取代传统硅和铜材料成为下一代集成电路的基础材料.本文针对碳纳米材料在无源电子器件方面的发展现状和应用前景,详细讨论了碳纳米管、石墨烯纳米带等碳基纳米互连结构的电学特性.进而,简要评述了片上电感、电容器等碳基高频无源器件,并介绍了碳纳米材料在集成电路热管理方面的应用.     

In-situ analysis of thermal properties of polymer composites by embedded LED temperature sensor

Real time and accurate measurement of thermal conductivity of polymer composites with thermal conductive fillers challenges researchers in industrial application. Here, we present an in-situ measurement approach by embedding a LED or diode as a combined heat source and temperature sensor into the filled polymer and using the well-established transient measuring method based on forward voltage variation to determine the temperature response of the sensor in polymer. Numerical model fitting is applied to estimate the thermal conductivity of the polymer composites with different filler/polymer ratios. These findings are compared with other thermal conductivity test methods such as the laser flash method and the Modular Differential Scanning Calorimeter (MDSC). The proposed approach provides a quick way of measuring the thermal conductivity in relatively thin polymer composites and agrees well with the MDSC method. Another advantage is that it can work with the real samples made for the application in mind, so its results can be used directly.     

Thermal Transport in 3D Nanostructures

This work summarizes the recent progress on the thermal transport properties of 3D nanostructures, with an emphasis on experimental results. Depending on the applications, different 3D nanostructures can be prepared or designed to either achieve a low thermal conductivity for thermal insulation or thermoelectric devices or a high thermal conductivity for thermal interface materials used in the continuing miniaturization of electronics. A broad range of 3D nanostructures are discussed, ranging from colloidal crystals/assemblies, array structures, holey structures, hierarchical structures, to 3D nanostructured fillers for metal matrix composites and polymer composites. Different factors that impact the thermal conductivity of these 3D structures are compared and analyzed. This work provides an overall understanding of the thermal transport properties of various 3D nanostructures, which will shed light on the thermal management at nanoscale.     

Thermal Transport in Conductive Polymer–Based Materials

The demand for flexible conductive materials has motivated many recent studies on conductive polymer–based materials. However, the thermal conductivity of conductive polymers is relatively low, which may lead to serious heat dissipation problems for device applications. This review provides a summary of the fundamental principles for thermal transport in conductive polymers and their composites, and recent advancements in regulating their thermal conductivity. The thermal transport mechanisms in conductive polymer–based materials and up‐to‐date experimental approaches for measuring thermal conductivity are first summarized. Effective approaches for the regulation of thermal conductivity are then discussed. Finally, thermal‐related applications and future perspectives are given for conductive polymers and their composites.     

碳基纳米吸波材料制备的研究进展

为探索民用电磁屏蔽和军用隐形碳基高性能吸波材料的制备,研究了碳纳米管和磁性金属复合,碳纳〖JP2〗米管和铁氧体复合,碳纳米管/聚合物复合,碳、石墨基复合等碳基吸波材料的不同复合和制备方法,比较了其反射损耗等不同的特点、影响因素和性能特点及其相关应用。结果表明,多元复合、低维化、工艺优化是其制备的有效途径。     

高频高速印制板材料导热性能的研究进展

随着电子技术的发展,对高频高速印制板导热性越来越高的要求。除了开发高成本的高导热性聚合物材料外,在聚合物中填充高导热性的无机材料也是提高高频高速印制板基材导热性能的有效方法,而且填充型复合材料可以用理论模型预测其导热系数。主要综述了填料的形貌、分布与表面改性对填充型复合材料导热系数的影响等方面的研究进展。     

Flexible Thermoelectric Polymer Composites Based on a Carbon Nanotubes Forest

Polymer‐based composites are of high interest in the field of thermoelectric (TE) materials because of their properties: abundance, low thermal conductivity, and nontoxicity. In applications, like TE for wearable energy harvesting, where low operating temperatures are required, polymer composites demonstrate compatible with the targeted specifications. The main challenge is reaching high TE efficiency. Fillers and chemical treatments can be used to enhance TE performance of the polymer matrix. The combined application of vertically aligned carbon nanotubes forest (VA‐CNTF) is demonstrated as fillers and chemical post‐treatment to obtain high‐efficiency TE composites, by dispersing VA‐CNTF into a poly (3,4‐ethylenedioxythiophene) polystyrene sulfonate matrix. The VA‐CNTF keeps the functional properties even in flexible substrates. The morphology, structure, composition, and functional features of the composites are thoroughly investigated. A dramatic increase of power factor is observed at the lowest operating temperature difference ever reported. The highest Seebeck coefficient and electrical conductivity are 58.7 µV K^?1 and 1131 S cm^?1, respectively. The highest power factor after treatment is twice as high in untreated samples. The results demonstrate the potential for the combined application of VA‐CNTF and chemical post‐treatment, in boosting the TE properties of composite polymers toward the development of high efficiency, low‐temperature, flexible TEs.     

Improving thermal conductivity of polymer composites in embedded LEDs systems

Polymer embedding of LEDs increases safety and waterproof levels in LED based lighting systems. The embedding allows for mechanical flexibility of these systems. The increase of polymer thermal conductivity has been a research challenge for decades. Here, we suggest materials for enhancing thermal conductivity in polymer embedded LED systems. We demonstrate that thermally conductive fillers into the polymer matrix to form a composite improved heat transfer from the LEDs to the environment. Non metallic boron nitride with a high intrinsic thermal conductivity is a good candidate. Thermal conductivity of basic polymer PDMS with various filler size and polymer ratios is reported here. Here, an in situ measurement tool to fast evaluate the quality of the composites in LED applications is demonstrated. Future work will focus on further increasing the thermal conductivity of the composites by using different mixtures.     

高导热聚合物基复合封装材料及其应用

微电子封装密度的提高对传统环氧塑封料的导热性能提出了更高的要求,将高导热的陶瓷颗粒/纤维材料添加到聚合物塑封材料中可获得导热性能好的复合型电子封装材料。文章结合高导热环氧塑封材料的研究工作,评述了高热导聚合物基复合封装材料的材料体系、性能特点和在微电子封装中的应用情况。分析讨论了影响聚合物基复合电子封装材料导热性能和介电性能的因素,提出了进一步提高聚合物基复合电子封装材料导热性能的途径。