TSV垂直传输结构的射频特性研究北大核心CSCD

作为微波、低频信号垂直传输通路,硅过孔(Through silicon via,TSV)技术是实现射频微系统三维集成的核心技术之一。本文设计并加工了背靠背形式的TSV测试芯片,并使用探针台测试其射频性能。为了提取单个TSV垂直过渡结构的参数,对测试结果进行剥离。首先分析建立带冗余结构的等效电路模型;然后用多线TRL(Through-reflect-line)方法求得冗余结构的参数,代入等效电路模型中求解单个TSV垂直传输结构的传输特性;最后得到的TSV传输特性与仿真结果吻合,验证了剥离结果的合理性。     

TSV垂直传输结构的射频特性研究

作为微波、低频信号垂直传输通路,硅过孔(Through silicon via,TSV)技术是实现射频微系统三维集成的核心技术之一。本文设计并加工了背靠背形式的TSV测试芯片,并使用探针台测试其射频性能。为了提取单个TSV垂直过渡结构的参数,对测试结果进行剥离。首先分析建立带冗余结构的等效电路模型;然后用多线TRL(Through-reflect-line)方法求得冗余结构的参数,代入等效电路模型中求解单个TSV垂直传输结构的传输特性;最后得到的TSV传输特性与仿真结果吻合,验证了剥离结果的合理性。     

SiGe HBT小信号和大信号建模与分析北大核心CSCD

基于异质结双极晶体管(HBT)优良的微波特性,精确建模对使用该类器件进行电路设计具有重要的意义。介绍了HBT所具有的独特优越性,采用Gummel-Poon等效电路模型对常用HBT进行了小信号和大信号模型的建立,加入了寄生电感等效衬底寄生参数,测试了SiGe HBT在不同偏置下的S参数及I-V特性曲线,利用半解析方法分析了非线性模型的参数提取,讨论了本征参数和寄生参数的拟合优化。给出了关于HBT大信号和小信号等效电路模型,对比实测参数进行验证,建立模型在测试频率范围内拟合结果和测试结果吻合良好。     

肖特基二极管毫米波等效电路模型参数提取方法

提出了一种肖特基二极管的毫米波等效电路模型参数提取方法。该方法利用开路测试结构确定焊盘电容,并结合短路测试结构确定馈线电感;基于直流I-V特性曲线和小信号S参数分别提取了寄生电阻并进行了对比分析;给出了本征元件随偏置电压的变化曲线。在频率高达40 GHz的范围内,截止和导通状态下S参数的模拟与测试数据吻合良好,验证了提取方法的有效性。     

基于分段拟合的SiC MOSFET模型优化方法

提出了一种基于分段拟合的SiC MOSFET模型优化方法.将表征静态特性的核心单元模型优化为分段模型,以使其能同时准确表征高、低栅压下器件的静态特性.同时,在模型分段处进行线性插值以保证模型函数的连续性,基于器件漏源支路元器件参数对拟合数据进行修正以提高模型表征参数的提取准确度.此外,为提高器件的动态模型准确度,增加了栅漏结电容模型函数的分段点,并给出了分段点选择方法.将优化前后栅漏结电容模型函数和静态仿真结果与测试获得的电容曲线、转移曲线和输出曲线进行对比,曲线匹配度较高,表明提出的优化方法显著提高了动态和静态模型的准确性.最后,搭建了SiC MOSFET开关特性测试平台,通过动态开关实验验证了模型优化方法的准确性.     

一种精确的有机薄膜晶体管模型参数提取方法研究

提出了一种可以精确获得有机薄膜晶体管(OTFT)的直流电流-电压模型中的参数提取方法。该方法通过对实验获得的输出特性曲线和转移特性曲线进行计算和处理,精确获得OTFT器件模型中的7个参数。实验制备了两种采用不同绝缘栅的基于并五苯的底栅顶接触的OTFT,并对其进行了参数提取。利用提取的参数及直流电流-电压模型对OTFT进行模拟,将模拟结果与实验测试结果相比较发现,模拟得到的输出特性及转移特性与测试结果拟合得很好,验证了本文中参数提取方法的正确性。应用建立的模型及本文中的参数提取方法可以用于OTFT器件的设计与模拟。     

ESD保护器件GGNMOS二次击穿前的建模

基于ESD应力下GGNMOS的工作特性,从GGNMOS的内部物理过程,推导建立了二次击穿前GGNMOS的器件级模型,并给出了相应的参数提取方法;实现了输入工艺参数等到模型中,即可仿真GGNMOS二次击穿前的I-V特性.通过与TLP实际测试结果的比较,证实了所推导模型的可行性.     

一种基于BSIM-CMG的FinFET变容管模型

提出了一种适用于FinFET变容管的建模方法.在BSIM-CMG的基础上,模型采用衬底模型和外围寄生模型来表征变容管的射频寄生效应.提出了具体的参数提取方法,将测试的S参数导入到安捷伦IC-CAP建模软件提取参数,测试结构引入高频寄生采用(open+ short)去嵌方法进行去嵌.通过调节模型参数拟合测试曲线得到FinFET变容管模型.该模型可精确表述FinFET变容管全工作区域特性,解决传统MOS变容管模型无法准确描述三维FinFET器件变容特性的问题.模型和模型参数提取方法采用20个硅鳍、16个栅指、158 nm栅长、578 nm栅宽的FinFET变容管进行建模验证,模型仿真和测试所得C-V,R-V和S参数特性吻合良好.     

太赫兹平面肖特基二极管参数模型

根据太赫兹平面肖特基二极管物理结构,在理想二极管SPICE参数模型的基础上建立了二极管小信号等效电路模型。依据该二极管等效电路模型设计了基于共面波导（CPW）去嵌方法的二极管S参数在片测试结构,并对其在0.1~50 GHz、75~110 GHz频率范围内进行了高频小信号测试,利用测试结果提取了高频下二极管电路模型中各部分电容、电阻以及电感参数。将相应的高频下电容与电阻参数分别与低频经验公式电容值和直流I-V测试提取的电阻值进行了对比,并利用仿真手段对高频参数模型进行了验证。完整的参数模型以及测试手段相较于理想二极管SPICE模型和传统的参数提取方法可以更为准确地表征器件在高频下的工作状态。该建模思路可用于太赫兹频段非线性电路的优化设计。     

一种基于总剂量效应的SOI器件模型快速提取方法

从工程应用的角度介绍了一种基于总剂量效应的SOI器件模型参数的快速提取方法。首先,提取0 krad(Si)时器件的模型参数,然后针对总剂量敏感参数,对100 krad(Si)总辐射试验后的同种器件进行模型参数优化,并对得到的模型参数进行验证。结果表明,该方法所提取的模型参数准确有效,解决了国内目前在抗辐照SOI工艺中因采用标准SOI工艺SPICE模型(如BSIMSOI等)导致不能反映辐照效应对器件特性的影响且无法给出经过不同辐照剂量之后的器件特性的缺点,可用于评估辐射对SOI电路的影响。     

Cavity models of planar components grounded by via-holes and their experimental verification

Semianalytical electromagnetic models of grounding via-holes and shorted resonators of different shapes are proposed and experimentally verified. Our models are based on the cavity approach previously used for circular-pad via-holes. For the first time, a model of a square-pad via-hole is developed. By a perturbation approach, an approximate model for slightly rectangular shorted patches is also derived. All our via-hole models are verified experimentally. The influence of the technologically caused eccentricity of the via-hole shape is also modeled and studied by measurements. Additional verification is done by full-wave simulations with Agilent Momentum (2002) and IE3D-10.1. Our models compute the modal resonant frequencies, fields, and equivalent-circuit components of the via-holes. They allow for the study of the frequency limitations of grounding via-holes for high-speed applications, as well as the modes of shorted resonators for printed antennas and filters. The developed models are fast and accurate.     

Microwave Characterization and Modeling of High Aspect Ratio Through-Wafer Interconnect Vias in Silicon Substrates

In this paper, we present the detailed fabrication process, high-frequency characterization, and modeling of through-wafer copper-filled vias ranging from 50- to 70-$mu$m-in diameter on 400-$mu$m-thick silicon substrates. The high aspect ratio via-holes were fabricated by carefully optimizing the inductively coupled plasma deep reactive ion etching process. The high aspect ratio via-holes are completely filled with copper using a bottom-up electroplating approach. The fabricated vias were characterized using different resonating structures based on which the inductance and resistance of the filled via-holes are extracted. For a single 70-$mu$m via, the inductance and resistance are measured to be 254 pH and 0.1$Omega$, respectively. In addition, the effect of the physical arrangement and distribution in multiple-via configurations on the resulting inductance is also evaluated with double straightly aligned quadruple and diagonally aligned quadruple vias. Physical mechanisms of the dependence was depicted by electromagnetic simulation. An equivalent-circuit model is proposed and model parameters are extracted to provide good agreement.     

基于热电制冷器温控系统数学建模和参量辨识

为了实现对半导体激光器温度的高精度控制,利用热电制冷器、温度传感器与相应的散热装置,设计了一套半导体激光器温度控制的实验系统.首先采用热力学分析方法,对实验系统进行了理论分析,建立了该温控实验系统数学模型与相应的传递函数;其次,在取得了半导体激光器温度数据的条件下,根据模型参量的特点,提出了一种结合阶跃响应的实验曲线,应用非线性曲线最小二乘拟合进行模型参量的辨识;最后利用该模型参量进行了系统仿真和实验验证.结果表明,仿真曲线、拟合曲线与实验曲线结果一致,拟合的模型参量具有较高的预测精度.这些结果对优化调整温度控制实验是有帮助的.     

基于SystemC和Verilog软硬件协同验证

针对当前专用数字集成电路设计中的验证瓶颈,为了在更高的抽象级别对设计对象进行描述和验证,提出一种软硬件协同验证方法.该方法基于SystemC的交易级处理器内核模型和基于Verilog的内核之外的硬件模型.该方法被应用到东南大学研发的微处理器芯片GIV的具体验证中.实验数据表明,由于采用软硬件协同验证模型在芯片生产之前对系统功能、结构设计等进行验证,缩短了开发周期,降低了开发成本,提高了验证可靠性.     

Numerical design strategy for lumped element circulators

A design strategy is presented for a symmetrical 3-port lumped element circulator. By applying a numerical time domain method metallisations that are several μm high, and via-holes can be modelled with high accuracy. Furthermore, parasitic elements are implicitly included, and the numerical analysis provides valuable information about important device performances.Therefore, the application of the presented strategy allows the numerical analysis of very compact devices built by using thin film technology.For comparison with measured scattering parameters the device performance of an optimised circulator is numerically calculated. Measured scattering parameters agree very well with the calculation results.     

Gaussian process modeling and multi-step prediction for time series data in wireless sensor network environmental monitoring

For time series data collected from WSN environmental monitoring applications,a novel multi-step prediction method based on Gaussian process model was proposed.The method could make prediction for future environmental monitoring data.Kernel functions were used to describe data properties in the Gaussian process model.Kernel functions for environmental monitoring data were constructed through the EMD(empirical mode decomposition)technique and analysis of data inherent physical properties.And the constructed kernel functions were capable of describing the data change mode.Extensive experiments for multi-step prediction performance comparison test were performed on three kinds of data sets using over 20 000 environmental monitoring data records.Experimental results show that the average prediction accuracy of the Gaussian process multi-step prediction method can be increased by 20% than compared prediction methods.The prediction method can be applied to future environmental parameters trend analysis,early warning for abnormal environmental events and other scenes.     

几类非确定型量子程序的终止验证

程序验证是保证程序正确性的关键技术.由于经典世界和量子世界的本质不同,经典程序验证的技术和工具不能直接应用到量子系统.而量子程序设计语言是描述量子系统的一种新的形式化模型,量子程序的验证问题就显得更为迫切和必要.本文首先讨论了量子通讯中常用的比特翻转、相位翻转、去极化、幅值阻尼、相位阻尼等信道作为特殊的非确定型量子程序从计算基态开始运行时的可达集合和终止集合等程序验证问题.其次,把上述五种量子程序两两组合组成非确定型量子程序,根据这五种量子程序的可达集合之相似点,最终合并成三种非确定型量子程序,重点讨论了这三种非确定型量子程序从计算基态开始运行时的终止和发散等程序验证问题.研究表明：这三种非确定型量子程序从计算基态0开始运行时都是终止的;而从计算基态1开始运行时：比特翻转信道和去极化信道组成的非确定型量子程序的终止和发散与分别刻画它们的两个参数有关;比特翻转信道和相位翻转信道组成的非确定型量子程序的终止和发散只与刻画比特翻转信道的参数有关;幅值阻尼信道和相位阻尼信道组成的非确定型量子程序是发散的,其发散条件与刻画量子信道的两个参数都没有关系.本文的结果可以为量子信息安全中量子通讯协议的验证提供理论和技术支持.     

A multipath model for the powerline channel

The development of powerline communication (PLC) systems for Internet, voice, and data services requires measurement-based models of the transfer characteristics of the mains network suitable for performance analysis by simulation. This paper presents an analytic model describing complex transfer functions of typical powerline networks using only a small set of parameters. The model is based on physical signal propagation effects in mains networks including numerous branches and impedance mismatching. Besides multipath propagation accompanied by frequency-selective fading, signal attenuation of typical power cables increasing with length and frequency is considered. A verification of the model at a test network, as well as its use for definition of attenuation profiles and reference channels, demonstrate the practical value of the proposed model     

Effets d’un trou métallisé sur les caractéristiques de rayonnement d’une antenne plaque microruban alimentée par une ligne coaxiale à travers le plan de masse

Effects of the via-hole implementation on radiation characteristics of a microstrip patch antenna are computed on an EM resolver based upon integral equations and numerically solved by moment method. Coaxial feed and via-holes are considered as integral parts of the antenna so that after an accurate modeling of the incident field, induced effects of the holes are naturally accounted for. Results show that for some locations, the via-hole effects on the radiation characteristics are negligeable. Such predictions suggest solutions for various problems of practical interest in industrial applications of this new technology.     

Analysis of video transmission over lossy channels

A theoretical analysis of the overall mean squared error (MSE) in hybrid video coding is presented for the case of error prone transmission. Our model covers the complete transmission system including the rate-distortion performance of the video encoder, forward error correction, interleaving, and the effect of error concealment and interframe error propagation at the video decoder. The channel model used is a 2-state Markov model describing burst errors on the symbol level. Reed-Solomon codes are used for forward error correction. Extensive simulation results using an H.263 video codec are provided for verification. Using the model, the optimal tradeoff between INTRA and INTER coding as well as the optimal channel code rate can be determined for given channel parameters by minimizing the expected MSE at the decoder. The main focus of this paper is to show the accuracy of the derived analytical model and its applicability to the analysis and optimization of an entire video transmission system