共查询到17条相似文献,搜索用时 296 毫秒
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聚噻吩/WO_3复合纳米材料的制备及气敏性能 总被引:1,自引:1,他引:0
采用水合肼法制备WO3粉体,再以无水FeCl3作氧化剂,通过原位化学氧化聚合制备了不同聚噻吩(PTh)掺杂量的PTh/WO3复合纳米材料。并研究了用其制备的气敏元件的气敏性能。结果表明:气敏元件对H2S和NOx有较高的灵敏度和较好的选择性。用质量分数w(PTh)为5%的PTh/WO3复合纳米材料制备的气敏元件,在加热电压为2.25V时,对体积分数φ(NOx)为5×10–6的灵敏度可达77.14;用w(PTh)为20%的PTh/WO3复合纳米材料所制之气敏元件,在加热电压为2.43V时,对φ(H2S)为20×10–6的灵敏度达63.27。 相似文献
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用纳米SnO2制作了旁热式气敏元件。用掺杂方法提高SnO2甲醛气敏元件的灵敏度,掺杂剂包括Pd,Sb,Ti,Zr,Cu,Ag,Mn等。在SnO2气敏元件中分别掺杂质量分数2%Pd和2%Zr对提高元件灵敏度有显著效果。未掺杂SnO2、掺杂质量分数2%Pd和2%Zr的气敏元件对体积分数为5×10-5甲醛的灵敏度分别为1.33,2.38,2.08,但是掺杂在改善元件对乙醇的选择性方面作用不大。分析了掺杂改善SnO2气敏元件灵敏度的原理,当SnO2表面吸附还原性气体时,吸附气体提供电子,使半导体表层的导电电子数增加,引起电导率增加、电阻下降。吸附气体浓度越高,电阻率变化越大,元件灵敏度越大。 相似文献
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SrTiO3压敏电阻耐浪涌电流特性的研究 总被引:4,自引:0,他引:4
本文研究了用一次烧成法制备的Mn^2+和Cu^+为受主掺杂的SrTiO3低压压敏电阻,在浪涌电流冲击后,其压敏和介电特性的变化规律及影响因此。证Cu^+掺杂的试样具有较高的耐浪涌电流能力。 相似文献
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In this work, the effect of terbium (Tb3+) as dopant on the structural, optical, electrical and gas sensing properties of In2O3 (indium oxide) nanoparticles has been discussed. In2O3 and Tb3+-doped In2O3 nanoparticles were synthesized by a facile and cost effective co-precipitation method. XRD analysis revealed the formation of bixbyite-type cubic phase for In2O3 and Tb3+-doped In2O3 nanoparticles which was further supported by Raman studies. It was observed that the crystallite size of In2O3 nanoparticles decreased, while structural disorder increased with increase in Tb3+ concentration. SEM micrographs showed that particles were spherical in shape and EDS corroborated the presence of Tb3+ in doped In2O3 nanoparticles. A broadening and shifting of Raman peaks with increase in Tb3+ content was also observed. For gas sensing characteristics, the nanoparticles were applied as thick film onto the alumina substrate and tested at different operating temperatures for various volatile organic compounds (such as methanol, ethanol, acetone) and ammonia. The results indicated that the sensor based on 5%Tb3+-doped In2O3 nanoparticles presented much higher sensor response to 50ppm ethanol at 300 °C temperature than the pure In2O3 sensor. The enhancement of the response may be attributed to high surface basicity, small size and large lattice distortion of doped In2O3 sensor. 相似文献
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TiO2纳米材料良好的光电性能,为其作为制备染料敏化太阳电池等新型太阳电池的光阳极材料提供了很好的应用基础。采用溶胶-凝胶法成功制备了Cu掺杂的TiO2纳米晶粉体,并利用XRD、EDS、TEM以及荧光分光光度计对样品进行了表征,研究了Cu掺杂对TiO2的物相类型、微观结构、晶粒尺寸以及光致发光性能的影响。结果表明,Cu掺杂使Cu2+取代Ti 4+进入TiO2的晶格中,在抑制TiO2晶粒生长的同时促进了TiO2的晶型转变,但这种抑制和促进作用会随着Cu掺杂量的增加而减弱。3%(原子分数)的Cu掺杂能够有效增强TiO2对光生电子的捕获能力,降低光生电子的复合速率,优化其光电性能。 相似文献
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以BaCO3、Bi2O3为原料,Na2C2O4为掺杂剂,用传统固相法制备了具有NTC特性的BaBi1–xNaxO3陶瓷。用XRD,SEM和ρ-t特性测量仪,研究了Na+掺杂量对该陶瓷的物相、显微结构及电性能的影响。结果表明:BaBi1–xNaxO3陶瓷的B25/85值和室温电阻率ρ25均随着x(Na2C2O4)的增加呈现先减小后变大的趋势;当x(Na2C2O4)为0.050时,获得了具有较好NTC特性的试样,其ρ25为2200?·cm,B25/85值为3365K。 相似文献
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新型掺铒离子氧氟碲酸盐玻璃的光谱性质 总被引:1,自引:1,他引:1
探求新的具有优良的热学和光学性能的基质玻璃系统,是获得具有宽带宽和增益平坦的掺Er^3+光纤放大器(EDFA)的一种有效途径。制备了一种新型氧氟碲酸盐玻璃TeO2-BaF2-LaF3,并对其热学性能和光学性质进行了测试。应用乍得-奥菲尔特(Judd-Ofelt)理论计算了Er^3+离子的J-O理论参量和荧光寿命r。探讨了氟化物的引入对碲酸盐玻璃结构的改变的影响,并分析了其对玻璃的热学性质和光学性质的影响。实验发现,获得的氧氟碲酸盐玻璃具有优良的热学稳定性(△T=156.6C),宽的荧光半峰全宽(72nm),长的荧光寿命(r=4.9ms)以及良好的平坦增益特性。该玻璃系统有望成为新的宽带光纤放大器用基质玻璃材料。 相似文献
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The mechanical alloying (MA) process was employed as an alternative method to produce the lead-free solder pastes of Sn-3.5Ag-xNi
(x=0.1, 0.5, 1.0, 1.5, and 2.0) in this study. When the Ni concentration was low (x=0.1, 0.5), MA particles agglomerated to
a flat ingot with particle sizes >100 μm. For higher Ni concentration (x=1.0, 1.5, and 2.0), MA particles turned into fragments
with particle sizes <100 μm. The particle size of the solders appeared to be dependent on the Ni concentration. To reduce
the particle size of SnAgNi alloys with low Ni concentration, Ni3Sn4 nanoparticles were doped into Sn and Ag powders to derive a Ni3Sn4-doped solder. For the Ni3Sn4-doped solder, the particle size was smaller than that doped by the pure Ni. The distinction of milling mechanism between
Ni3Sn4-doped solder and the pure Ni-doped solder by MA process was probed and discussed. In addition, differential scanning calorimetry
(DSC) results ensured its feasibility in applying the solder material in the reflow process. Wettability tests between solders
and Cu substrate also revealed that the wetting angles for Ni3Sn4-doped solder with low Ni concentration (0.1 and 0.5 wt.%) were smaller than those for pure Ni-doped solder. The wetting angles
on both Cu substrate and electroplated Ni metallization for SnAgNi solders were also comparable with commercial Sn-3.5Ag and
Sn-3.0Ag-0.5Cu solders. Favorable wettability of the as-derived solder in this study was clearly demonstrated. 相似文献