Transient liquid phase bonding process using liquid phase sintered alloy as an interlayer material

An attempt was made of using a liquid phase sintered alloy, which will be a liquid phase coexisting with solid particles at the bonding temperature, as an interlayer for bonding metals. With an aim of revealing the fundamental features of this modified TLP bonding, investigated were the kinetics concerned with the isothermal solidification process and the growth of solid particles in Fe-4.5wt%P and Fe-1.16wt%B interlayers for bonding pure iron. The movement of the bond interface was linearly dependent on t ^1/2 with higher slope than expected in the normal TLP bonding. The higher slope is attributed to the contribution of the solid particles distributed in the interlayer. The solid particles have shown no growth. However, when pure Fe particles are allowed to coexist with the liquid of equilibrium composition, they grows very rapidly. Discussion was made on the growth kinetics of the pure Fe particles.     

Transient liquid phase bonding of steel using an Fe–B interlayer

Transient liquid phase bonding processes have been performed to join two carbon steel tubes using Fe_96.2B_3.8 wt% amorphous ribbons as interlayers. Welding experiments were performed at the temperature T ≈ 1,250 °C for different durations and under pressures of 2, 3 and 4 MPa. From metallographic inspection it is concluded that the bonding process ends in 7.0 min if a pressure of 4 MPa is applied whereas the process results incomplete if less pressure is applied. A 1D model using a finite element method has been developed for the simulation of a transient liquid phase bonding process. This model was applied to the bonding of steel/Fe–B glassy metals/steel. The computed results allow us to understand the role played by the variables involved in the bonding process.     

Transient liquid phase bonding of steel using an Fe–B interlayer: microstructural analysis

Transient liquid phase bonding processes have been performed to join two carbon steel tubes using Fe_96.2B_3.8 wt% amorphous ribbons as interlayer. Welding experiments were performed at the temperature T ≈ 1,250 °C for different durations and under pressures of 0.8, 2, 3, and 4 MPa. From metallographic inspection, it is concluded that the bonding process ends in 7.0 min if a pressure of 4 MPa is applied, whereas the process results incomplete if less pressure is applied. The metallurgical aspects of these joints are analyzed. Plastic deformation at the joint is observed. Micrographs show that if pressure increases, the amount of pro-eutectoid ferrite decreases, therefore, an increase in the hardenability of the steel occurs. This fact could be due to the effect of the compression plastic deformation that prevails at the joint zone.     

Transient liquid phase diffusion bonding of Al/Mg2Si metal matrix composite

As-cast Al/Mg₂Si metal matrix composite was joined by transient liquid phase diffusion bonding using Cu interlayer at various bonding temperatures and durations. This metal matrix composite contained 15% Mg₂Si and was produced through in situ technique by gravity casting. Specific diffusion bonding process was applied as a low vacuum technique. The microstructure of joints consisted of Al-α, CuAl₂ and Mg₂Si or Al-α and Mg₂Si depending on bonding temperature and duration. The maximum shear strength was achieved when samples were bonded at 580 °C for 120 min. Micro-hardness and compositional homogeneity of joints across the bonded interface were improved with increasing the bonding duration at 560 °C and had no significant changes at 580 °C.     

Transient liquid phase bonding of 2124 aluminium metal matrix composite

Abstract

The transient liquid phase (TLP) bonding of particle reinforced aluminium metal matrix composites (MMCs) using copper interlayers often results in the segregation of SiC particles to the bond region, and this has the effect of producing bonds with poor mechanical strengths. In this preliminary study, the TLP bonding of a 2124 aluminium alloy MMC is investigated using nickel interlayers, and the initial results show that good bonds are produced with no effect on the SiC dispersion in the matrix. The absence of segregation is attributed to the high diffusivity of the nickel in the aluminium MMC, which produces rapid isothermal solidification at the bonding temperature. Bond shear tests show that near parent metal strengths are possible when thin nickel interlayers are used, and failure occurs at the MMC/bond interface. When thick interlayers are used, failure is predominately through the centre of the bondline.     

Transient liquid phase diffusion bonding of oxide dispersion strengthened nickel alloy MA758

Abstract

Transient liquid phase diffusion bonding has been used to join an oxide dispersion strengthened (ODS) nickel alloy (MA758) using an amorphous metal interlayer with a Ni–Cr–B–Si composition. A microstructural study was undertaken to investigate the effect of parent metal grain size on the joint microstructure after isothermal solidification. The ODS alloy was bonded both in fine grain and recrystallised conditions at 1100°C for various hold times. The work shows that the final joint grain size is independent of the parent alloy grain structure and the bonding time. However, when the alloy is bonded in the recrystallised condition and given a post-bond heat treatment at 1360°C, the joint grain size increases and a continuous parent alloy microstructure across the joint region is achieved. If MA758 is bonded in the fine grain condition and then subjected to a recrystallising heat treatment at 1360°C, the grains at the joint appear to increase in size with increasing bonding time. The joint grains are generally larger than those produced when the alloy is bonded in the recrystallised condition. The differences in microstructural developments across the joint are discussed in terms of stored strain energy of the parent metal grains.     

Transient liquid phase bonding of Sn–Bi solder with added Cu particles

The aim of this study was to apply the transient liquid phase (TLP) bonding technique to low-temperature Sn–Bi-based solders to enable their use in high-temperature applications. The microstructure of the eutectic Sn–Bi solders with and without added Cu particles was investigated with the solders sandwiched between two Cu substrates. The flux of the Cu atoms successfully consumed the Sn phase and resulted in the formation of Sn–Cu intermetallic compounds and a Bi-rich phase in the solder joint. This caused the melting point of the solder joint to increase from 139 to 201 °C. The results of this study show the potential of using low-temperature solders in high-temperature applications. This study also provides new insight into the advantages of using particles in the TLP bonding process.     

Transient liquid phase diffusion bonding and associated recrystallization phenomenon when joining ODS ferritic superalloys

Oxide dispersion strengthened (ODS) ferritic superalloys attribute their excellent intermediate and high temperature creep resistant properties to the distribution of an inert oxide, Y₂O₃ within highly directional and elongated grains. Careful selection of joining techniques is, therefore, of utmost importance so that the parent metal microstructure is not disrupted and is continuous across the bond line. Transient liquid phase (TLP) bonding is a suitable technique which has been used to join the ferritic superalloys MA957, MA956 and PM2000 using an amorphous foil based on an Fe-B-Si composition. To further minimize disruption to the parent alloy microstructure at the bond line, thin sputter coats based on the Fe-B-Si composition have also been used successfully for TLP bonding. Results have shown a boron-induced secondary recrystallized zone at the bond line in MA957 which acts as a barrier to further grain growth across the bond line on subsequent zone annealing. Differential scanning calorimetry shows that this recrystallization is triggered at 200 °C below the usual recrystallization temperature during heat treatment and occurs only when the metal filler melts and there is a free flux of boron into the base metal. Texture measurements show that the boron-induced recrystallization is of the same nature as the recrystallization produced by heat treatment but possesses a stronger directional 110 fibre texture. In contrast, grain growth across the bond line could be achieved in TLP bonds produced in MA956. However, a similar heat treatment for PM2000 produced simultaneous but independent secondary recrystallization both at the joint and in the bulk alloy. This difference in behaviour between these two similar alloys is attributed to differences in their thermomechanical processing.     

Transient liquid phase bonding of a microduplex stainless steel using amorphous interlayers

Abstract

Microduplex stainless steels are two phase alloys which show excellent corrosion resistance and toughness. In order to join these special steels, fusion welding processes are normally used and a second post-weld heat treatment is necessary to regain the original ferrite to austenite ratio. In this study, transient liquid phase diffusion bonding was used to join a 2205 duplex stainless steel with the aid of amorphous interlayers. The research compares a Ni–B–Si ternary system with that of an Fe–B–Si interlayer, and compositional, microstructural and mechanical assessment was used to determine the quality of the bonds produced. These preliminary results show that the nickel based interlayer stabilises the austenitic phase along the bond length, which hinders grain growth across the joint region. In contrast, the iron based interlayer produces diffusion bonds, which show microstructural and compositional homogeneity across the joint region. Furthermore, mechanical and pitting corrosion tests show that transient liquid phase diffusion bonds can achieve properties similar to those of the parent alloy.     

Kinetics of transient liquid phase diffusion bonding process for joining aluminium metal matrix composite

Abstract

The mechanism and kinetics of the transient liquid phase diffusion bonding process in a 6061–15 wt-%SiCp composite at 570°C, 0·2 MPa, with 200 μm thick copper foil interlayer, has been investigated by microstructural characterisation of the bond region using optical microscopy, scanning electron microscopy and electron probe microanalysis. The kinetics of isothermal solidification, representing the displacement of the solid/liquid interface y (in micrometres) as a function of time t (in seconds), followed a power law relationship y?=?157t^0·07. According to this kinetic equation, the effective diffusivity of copper in the composite system was found to be ～10⁶ times higher than the lattice diffusivity, indicating the dominance of short circuit diffusion through the defect rich particle/matrix interface.     

Interfacial structure and strength on Ti(C,N) joint using liquid phase diffusion bonding with Ti/Ni interlayer

Abstract

Partial transient liquid phase diffusion bonding (PTLP-DB) on Ti(C,N) cermet was studied in the present paper using Ti/Ni/Ti foil sandwich structure as the interlayer. The interfacial structure and element distribution at the interface were observed using SEM, electron probe microanalysis and X-ray diffraction. The joint strength was measured using four-point bending test. The results showed that metallurgical bonding between Ti(C,N) cermet was achieved using PTLP-DB. Near Ti(C,N) cermet side, a strong chemical reaction occurred to produce an interfacial multilayer containing Ti–Al and Ti–Ni intermetallics. Different bonding times during PTLP-DB were also studied, and there was an optimum time during bonding. With a shorter bonding time, voids were observed at the interface, while with a prolonged time, the bending strength on the joints also decreased due to the overgrowth on intermetallic layer and the existence of high gradient residual stress at the interface.     

Transient liquid phase bonding of Gamma Met PX: microstructure and mechanical properties

Abstract

An investigation of microstructural development and structure–property relationships of transient liquid phase (TLP) bonded current generation γ-TiAl alloy, known as Gamma Met PX, is presented. This joining technique employed a composite interlayer consisting of a non-melting constituent (TiAl alloy) and a liquid forming constituent (copper). The microstructures of the bonds, identified using light microscopy and scanning electron microscopy, are correlated with room temperature mechanical performance. These studies suggested that joints can retain properties similar (i.e. >90%) to that of the bulk material when employing a suitable composite interlayer, bonding conditions and post-bond heat treatment. Additionally, comparisons are drawn between wide gap TLP bonding of an earlier generation γ-TiAl alloy, Ti–48Al–2Cr–2Nb (at.-%), and wide gap TLP bonding of Gamma Met PX.     

Numerical modelling of transient liquid phase bonding and other diffusion controlled phase changes

Diffusion in material of inhomogeneous composition can induce phase changes, even at a constant temperature. A transient liquid phase (TLP), in which a liquid layer is formed and subsequently solidifies, is one example of such an isothermal phase change. This phenomenon is exploited industrially in TLP bonding and sintering processes. Successful processing requires an understanding of the behaviour of the transient liquid layer in terms of both diffusion-controlled phase boundary migration and capillarity-driven flow. In this paper, a numerical model is presented for the simulation of diffusion-controlled dissolution and solidification in one dimension. The width of a liquid layer and time to solidification are studied for various bonding conditions. A novel approach is proposed, which generates results of a high precision even with coarse meshes and high interface velocities. The model is validated using experimental data from a variety of systems, including solid/solid diffusion couples.     

Mg/Zn/Al瞬间液相过冷连接界面的组织与性能研究

采用瞬间液相过冷连接方法对AZ31镁合金/锌中间层/5083铝合金进行连接,利用SEM、XRD、拉伸实验机和微观硬度计对结合界面的微观组织、力学性能进行了表征。结果表明,以锌作中间层,采用瞬间液相过冷连接可以实现AZ31镁合金与5083铝合金的有效连接,接头的最高抗拉强度可以达到38.5MPa,随着低温扩散保温时间的延长,扩散层厚度随之增加,接头的抗拉强度也随之升高;接头的拉伸断口属于脆性断裂,结合界面形成了MgZn2和少量的Mg17Al12金属间化合物;结合界面的微观硬度最高达170。     

Morphology and microstructure of Alp/SiCp composite powder prepared using a stone mill

Abstract

Aluminium based metal matrix composite powder was prepared using a stone mill. Elemental powders of pure aluminium and SiC particle reinforcement were milled in a horizontal stone mill at a constant rotation. Two different mill gaps were employed to investigate the distribution of SiC particles embedded in the aluminium matrix. In each case, 1 ton h^-1 of Al_p/SiC_p composite powder was produced. The shape of the aluminium particles changed from ligamental to spherical and the angular faceted SiC particles became more spherical in form. Morphological and microstructural observations revealed that the advantages of using a stone mill to produce composite powder were that it provided well distributed SiC particles and good bonding between matrix and reinforcement. The mixing mechanism of the stone mill can be described as follows: shear deformation of aluminium particles and embedding of the SiC into the aluminium flakes, rolling and cold welding of the Al/SiC composite flakes to form rolls, and fracture of the composite rolls into spherical particles. Hot extrusion improved the distribution of the SiC particles in the matrix.     

Studies on squeeze casting of Al 2124 alloy and 2124-10% SiCp metal matrix composite

Aluminium 2124 alloy and its composite with 10% SiC particles of average particle size of 23 μm were squeeze cast at different pressures. The effect of squeeze pressure during solidification was evaluated with respect to microstructural characteristics using optical microscopy and image analysis and mechanical properties by tensile testing. The microstructural refinement, elimination of casting defects such as shrinkage and gas porosities and improved distribution of SiC particles in the case of the composite were resulted when pressure is applied during solidification. A pressure level of 100 MPa was found to be sufficient to get the microstructural refinement and very low porosity level in both the alloy and the composite. The improved mechanical properties observed in the squeeze cast alloy and the composite could be attributed to the refinement of microstructure within the material.     

Liquid phase bonding of aluminium and aluminium/Nicalon composite using copper interlayers

Abstract

The liquid phase bonding, in air, of unreinforced and fibre reinforced aluminium using copper interlayers has been investigated. Bond strengths have been measured and microstructures characterised using electron microscopy and electron probe microanalysis. The diffusion behaviour and interphase reactions, which depend on the bonding conditions, are discussed, and a mechanism for the formation of a liquid phase bond is proposed. For unreinforced aluminium a bonded area of ~100% was achieved at 550°C by applying a pressure of 10 MPa for 30 min to the joint while using a 10 μm thick copper interlayer. With the composite it was necessary to use a higher bonding pressure (20 MPa) in order to limit oxidation of the copper and maximise the bonded area (to ~80%).

MST/1730     

Microstructure and mechanical properties of diffusion bonded W/steel joint using V/Ni composite interlayer

Diffusion bonding between W and steel using V/Ni composite interlayer was carried out in vacuum at 1050 °C and 10 MPa for 1 h. The microstructural examination and mechanical property evaluation of the joints show that the bonding of W to steel was successful. No intermetallic compound was observed at the steel/Ni and V/W interfaces for the joints bonded. The electron probe microanalysis and X-ray diffraction analysis revealed that Ni₃V, Ni₂V, Ni₂V₃ and NiV₃ were formed at the Ni/V interface. The tensile strength of about 362 MPa was obtained for as-bonded W/steel joint and the failure occurred at W near the V/W interface. The nano-indentation test across the joining interfaces demonstrated the effect of solid solution strengthening and intermetallic compound formation in the diffusion zone.