A comparative study on performance of multilayer coated and uncoated carbide inserts when turning AISI D2 steel under dry environment

The present work deals with a comparative study on flank wear, surface roughness, tool life, volume of chip removal and economical feasibility in turning high carbon high chromium AISI D2 steel with multilayer MTCVD coated [TiN/TiCN/Al₂O₃/TiN] and uncoated carbide inserts under dry cutting environment. Higher micro hardness of TiN coated carbide samples (1880 HV) compared to uncoated carbide (1430 HV) is observed and depicts better resistance against abrasion. The low erosion rate was observed in TiN coated insert compared to uncoated carbide. The tool life of TiN coated insert is found to be approximately 30 times higher than the uncoated carbide insert under similar cutting conditions and produced lower surface roughness compared to uncoated carbide insert. The dominant wear mechanism was found to be abrasion and progression of wear was steady using multilayer TiN coated carbide insert. The developed regression model shows high determination coefficient i.e. R² = 0.977 for flank wear and 0.94 for surface roughness and accurately explains the relationship between the responses and the independent variable. The machining cost per part for uncoated carbide insert is found to be 10.5 times higher than the multilayer TiN coated carbide inserts. This indicates 90.5% cost savings using multilayer TiN coated inserts by the adoption of a cutting speed of 200 m/min coupled with a tool feed rate of 0.21 mm/rev and depth of cut of 0.4 mm. Thus, TiN coated carbide tools are capable of reducing machining costs and performs better than uncoated carbide inserts in machining D2 steel.     

Improvement of AA5052 sheet properties by electromagnetic twin-roll casting

Although servo scanning 3D micro electro discharge machining (SS-3D MEDM) can achieve a high discharge ratio, the processing efficiency is still lower than expected because the discharge area at micro-electrode tip is much smaller than the area to machine. In particular, for 3D micro cavities, the processing efficiency and the machining accuracy inherently contradict each other. In this paper, an on-machine process of rough-and-finishing SS-3D MEDM is proposed with consideration that most cavity material cannot affect the dimensional accuracy. In the rough machining process, technological measures such as high discharge energy and large-diameter tool electrodes are applied to maximize processing efficiency. In the finishing machining process, a small amount of material is removed for dimensional accuracy, smooth surface, and clear edges-and-corners by changing multi-factors of machining parameters. The research is concentrated on two key techniques: rough-and-finishing border strategy and micro tool-electrode precision measurement for the process transformation from rough to finishing. Moreover, an online measurement method is proposed by the point electric contact between a micro electrode and a standard thin-rod, and the measurement accuracy was up to ±1 µm in our experimental system. Machining experiments of 3D micro cavities < 800 µm verified the proposed methods and the processes including 3D model design, rough-machining, micro-electrode measurement and fabrication, and finishing machining. The experimental results were successfully achieved as follows: the dimensional accuracy < 5 µm, surface roughness Sa0.38 µm, and the processing efficiency being improved to 2.4 times.     

Experimental study on micro EDM-drilling of Ti6Al4V using helical electrode

There is a growing interest in the machining of micro-holes with high aspect-ratio in difficult-to-machine alloys for the aerospace industry. Processes based on electro discharge machining (EDM) and developed for the manufacture of both micro-electrode and micro-hole are actually used, but most of them involve micro-EDM machines. In this work, the influence of EDM parameters on material removal rate, electrode wear, machining time and micro-hole quality when machining Ti6Al4V is studied. Due to an inefficient removal of debris when increasing hole depth, a new strategy based on the use of helical-shaped electrodes has been proposed. The influence of helix angle and flute depth with respect to process performance has been addressed. Main results include 37% reduction in machining times (hole diameter 800 μm) when using electrode helix angle of 45° and flute-depth of 50 μm, and an additional 19% with flute-depth of 150 μm. Holes of 661 μm diameter and as much as 6.81 mm depth, which yields in aspect ratio of 10:1, have successfully been machined in Ti6Al4V.     

Experimental study on fabrication and evaluation of micro pyramid-structured silicon surface using a V-tip of diamond grinding wheel

A mechanical fabrication of micro pyramid-structured silicon surface is proposed using crossed grooving with a 60° V-tip of diamond grinding wheel. It can obtain high form-accuracy, good surface quality and efficient productivity in contrast to laser machining and etching, and also assure a high aspect ratio in contrast to other mechanical processes. In order to describe its micro-structured topography, a white-light interferometer was employed, and its measured point cloud was matched using an Iterative Closest Point (ICP) algorithm. In micro grinding, a novel CNC mutual-wear truing was first developed to sharpen the wheel V-tip; then, the effects of microscopic wheel topography, silicon crystal-orientation and grinding parameter were investigated on ground micro-topography, truing ratio and material removal ratio; finally, its form-accuracy, pyramid top radius, groove tip radius, surface roughness and aspect ratio were evaluated. It is shown that better microscopic grain protrusion topography on wheel V-tip produces much larger material removal ratio and much better micro-structured topography in micro grinding, but it leads to much less truing ratio in finer GC truing. In micro grinding, silicon crystal-orientation has little effect on micro-structured topography due to diamond crystal-orientations that are randomly distributed on wheel V-tip. Although the micro pyramid-structured form error is only about 3.4 μm, its V-groove bottom and pyramidal top have very large form errors (23.1-47.9 μm) due to the sharpness of wheel V-tip and the frangibility of micro pyramid top. On increasing feed speed, its pyramid top radius decreases and its groove tip radius slightly increases, ultimately leading to an increase in aspect ratio, whereas its surface quality descends. It is concluded that the micro-pyramid arrays may be precisely patterned on silicon surface using a SD600 wheel with crossed tool paths, on-machine V-tip truing and the depth of cut in 1 μm.     

Accuracy evaluation for sub-aperture interferometry measurements of a synchrotron mirror using virtual experiments

We present a virtual experiment for the accuracy assessment of the sub-aperture interferometric measurement of a synchrotron mirror involving several thousand sub-aperture topographies. The virtual experiment simulates the measurement process and accounts for the influence of positioning device errors, interferometer errors, non-perfect calibration of machine geometry as well as errors in the interferometer reference. Two principles are considered for reconstructing the form of a test specimen from the conducted sub-aperture topographies, a stitching procedure and a direct measurement method. The virtual experiments are applied to the task of absolute form measurement (including its radius of curvature) of a synchrotron mirror with a length of 30 cm, a width of 4 cm, a maximum curvature of about 44 mm⁻¹ and a peak-to-valley of 5 mm. As a result, reconstruction accuracies can be expected to be in the range of 100 nm when the stitching method is applied, which outperforms the direct measurement method by a factor of about 3.     

Study on carrier mobility measurement using electroluminescence in frequency domain and electrochemical impedance spectroscopy

In this paper, the two methods, electroluminescence in frequency domain and electrochemical impedance spectroscopy, have been applied to investigate the carrier mobility in single layer polymer light-emitting diode employing the polymer MEH-PPV (Poly[2-methoxy-5-(2-ethylhexyloxy)-1,4-phenylenevinylene]) as the light-emitting layer. The carrier mobility μ is 1.64 × 10⁻⁶ cm²/V s under the electric field 8.3 × 10⁵ V/cm measured by the method of electroluminescence in frequency domain. The electrochemical impedance spectroscopy results indicate that the carrier mobility μ is 1.08 × 10⁻⁶ cm²/V s under the electric field 7.5 × 10⁵ V/cm. A significant advantage of the two methods is that both of them can be applied to measure the carrier mobility in the thin film.     

Detection of gas leakage using microcolor schlieren technique

This article presents microcolor schlieren technique for gas leakage detection with medium of liquefied petroleum gas (LPG, 50% C₃H₈ and 50% C₄H₁₀), which can be further applied in pipe gas leakage inspection, e.g. checking gas leakage of condenser and evaporator pipes of air conditioning in the automatic production line. In this work, experiments used microcolor schlieren to observe leaking LPG from microholes with pipes and determined the technical sensitivity, where the microholes were made by using electric discharge machining (E.D.M.). The experimental run conditions are different LPG leaking flow rates integrated with different microhole diameters of 1130, 176, 75, 45.6, 35.32, and 27.5 μm. The results show that present microcolor schlieren can clearly visualize microhole with ?27.5 μm under leaking pressure difference of 5 torr and ?35.32 μm with leaking pressure difference under 1 torr.     

Fabrication and characterization of a new MEMS fluxgate sensor with nanocrystalline magnetic core

This paper presents a new MEMS fluxgate sensor with a Fe-based nanocrystalline ribbon magnetic core and 3D micro-solenoid coils. The excitation coils were placed vertically to the sensing coil on the chip plane. Second harmonic operation principle was adopted in this fluxgate sensor. The total size of the fluxgate sensor was 6.25 mm × 4.85 mm × 120 μm. A simple testing system was established to characterize the fabricated devices. A band pass filter was used to pick up the second harmonic signals in the sensing coils. When excitation rms current of 120 mA and the operational frequency of 200 kHz were selected for the testing of the fabricated devices, the sensitivity of the developed fluxgate sensor was 1005 V/T in the linear range of −500 μT to +500 μT. Due to the combination of the 3D structure coils with the nanocrystalline core, relatively low sensor noise was achieved. The noise power density was 544 pT/Hz^0.5@1 Hz and the noise rms level was 9.68 nT in the frequency range of 25 mHz-10 Hz.     

Research on ECM process of micro holes with internal features

Micro holes with internal features are widely used as spray holes and cooling holes nowadays, which are usually required to be with high aspect ratio and shape accuracy, as well as good surface quality. An electrochemical machining (ECM) process is presented to machine these micro holes with diameter <200 μm. A quantitative relation between micro-hole diameter and machining parameters including voltage, duty ratio and feedrate is obtained through orthogonal experiments. According to the designed shape of internal features, change rules of machining parameters for varied diameters in different depth are obtained, and then micro holes with internal features are shaped precisely. Taking reverse tapered hole as an example, ECM experiments by varying parameters of voltage, duty ratio and feedrate (called varying voltage machining, varying duty ratio machining and varying feedrate machining, respectively) are carried out. Micro holes with inlet diameter of 178 μm and taper angle of 1.05° are shaped on a 1.0 mm-thick workpiece of 18CrNi8. The deviation of inlet is <3 μm and the taper-angle error is <0.1° in varying voltage machining. The corresponding dimensional accuracy of taper angle is improved by 51% than that of varying duty ratio machining under the same efficiency. The machining efficiency of varying voltage machining is increased by 36% compared to the efficiency in varying feedrate machining. In addition, the micro holes with complex features of funnel shape and bamboo shape are machined.     

A novel surface analytical model for cutting linearization error in fast tool/slow slide servo diamond turning

Fast tool/slow slide servo (FTS/SSS) technology plays an important role in machining freeform surfaces for the modern optics industry. The surface accuracy is a sticking factor that demands the need for a long-standing solution to fabricate ultraprecise freeform surfaces accurately and efficiently. However, the analysis of cutting linearization errors in the cutting direction of surface generation has received little attention. Hence, a novel surface analytical model is developed to evaluate the cutting linearization error of all cutting strategies for surface generation. It also optimizes the number of cutting points to meet accuracy requirements. To validate the theoretical cutting linearization errors, a series of machining experiments on sinusoidal wave grid and micro-lens array surfaces has been conducted. The experimental results demonstrate that these surfaces have successfully achieved the surface accuracy requirement of 1 μm with the implementation of the proposed model. These further credit the capability of the surface analytical model as an effective and accurate tool in improving profile accuracies and meeting accuracy requirements.     

微槽激光电解组合微加工研究

微槽结构作为微型结构的基本单元,具有增加散热面积、存储润滑剂和减少阻力等功能,多用于大热流密度器件的散热或表面润滑,但其存在加工尺寸小、精度要求高以及加工难度大等问题。为了实现微槽的高效高精度加工,提出了一种激光电解组合微加工方法,并搭建了纳秒激光加工装置和数控微细电解加工装置;利用激光烧蚀快速加工出微槽结构的基本形貌,再通过微细电解的方式去除其表面再铸层及飞溅颗粒,提高其表面精度和表面性能。通过理论研究以及优化加工参数试验,加工出长度为400μm,宽度为220μm,深度为120μm的微槽结构。激光电解组合微加工微槽的表面粗糙度由激光加工后的Ra 5.36μm降低至Ra 1.23μm;激光电解组合微加工的加工效率是微细电解加工的4.26倍。     

Photo-enhanced field emission study of TiO2 nanotubes array

Aligned TiO₂ nanotubes were synthesized by simple anodization of the Ti foil surface. The as-anodized product is further characterized by SEM, XRD, and PL. The tube inner diameter is found to be ≈60-80 nm with the average wall thickness ≈30 nm and areal density ≈15×10⁶/ cm². FE studies of the aligned TiO₂ nanotubes are carried out at base pressure of ≈1×10⁻⁸ mbar. The turn-on field observed for an emission current density of ≈10 μA/cm² is found to be ≈1.7 V/μm and current density of ≈44 μA/cm² is obtained at an applied field of ≈2.3 V/μm. Photo-enhanced FE study is carried out by shining visible and UV light on the cathode. The aligned TiO₂ nanotubes show sensitivity to both the light sources. The FE current shows fast switching response to the visible light. The increment in the preset current upon UV illumination can be attributed to the band edge excitation of the electrons. The free excitons associated with band gap of the TiO₂ nanotubes array may be responsible for the visible light sensitivity. TiO₂ nanotubes are also grown on the Ti wire and exhibit similar photo-enhanced behavior. The FE and photo-enhanced FE properties demonstrate the applicability of the aligned TiO₂ nanotubes in the FE based micro/nanoelectronic devices.     

The beam divergence of an indium LMIS at a distance of 50 μm as determined by plasma diagnostic measurements

The current-dependent beam divergence at a distance of 50 μm from an indium-liquid metal ion source is derived from experimental data obtained by measuring the beam spread with a 3D Plasma diagnostic system at a distance of 10 cm from the needle tip. The observed relationship between emission current and beam divergence in vicinity of the emitting needle is used to design a focusing electrode for a field-emission electric propulsion thruster operating at currents up to 150 μA. Another application involves focused ion beam columns which may choose to forego a beam-limiting aperture, such as LMIS-based rapid machining tools with large beam currents.     

Accurate conductance measurements of a pinhole orifice using a constant-pressure flowmeter

A pinhole orifice with a known conductance can be used as a secondary flow standard. Commercially available laser-drilled pinhole orifices with diameters ranging from 1.0 μm to 50 μm can have molecular-flow conductances ranging from about 0.1 μL/s to 200 μL/s for N₂ at 23 °C. Gas flows of 10⁻¹¹–10⁻⁶ mol/s can easily be produced by applying an upstream pressure in the range of 1–10⁵ Pa. Accurate measurements of the orifice conductance as a function of pressure are required to use the pinhole orifice as a basis of a flowmeter. We use a constant-pressure flowmeter to make accurate measurements of the conductance of a 20 μm orifice as a function of pressure for gas flows of Ar and N₂ into vacuum. We present results of these conductance measurements for an orifice with a nominal diameter of 20 μm. The N₂ conductance of this orifice ranged from 30 μL/s to 60 μL/s over the range of pressures investigated, and was measured with an uncertainty of better than 0.2% (k = 2) for upstream pressures greater than 10 Pa.     

Application of highly silicon-doped marker layers in the investigation of unintentional doping in GaN on sapphire

To provide a route to the assessment of the impact of inclined facets on unintentional n-type doping during the growth of c-plane GaN on sapphire, thin (100 nm), highly Si-doped (at 10¹⁹ cm⁻³) marker layers have been incorporated into a GaN epitaxial layer grown by a method involving a transition from initial three-dimensional island growth to later, two-dimensional, planar growth. Imaging of the completed epitaxial layer in cross-section by scanning capacitance microscopy reveals the shapes of the islands, which were present during the early stages of growth and the relationship between the facets present and the incorporation of unintentional dopants. The results show that unintentional dopants are mostly incorporated on facets inclined to the [0 0 0 1] direction, and suggest that gaseous impurities present in the MOVPE reactor are one source of dopant species.     

Application of response surface method on machining of Al–SiC nano-composites

The newly fabricated metal matrix nano-composite (MMNC) of Al 7075 reinforced with 1.5 wt% SiC nano-particles was prepared by a novel ultrasonic cavitation method. The high resolution scanning electron micrograph (SEM) and field emission scanning electron micrograph (FESEM) shows uniform distribution and good dispersion of the SiC nanoparticles within the aluminum metal matrix. Electrical discharge machining (EDM) was employed to machine MMNC with copper electrode by adopting face centered central composite design of response surface methodology. Analysis of variance was applied to investigate the influence of process parameters and their interactions. Further a mathematical model has been formulated in order to estimate the machining characteristics. It has been observed that pulse current was found to be the most important factor affecting all the three output parameters such as material removal rate (MRR), electrode wear rate (EWR) and surface roughness (SR). The optimum parameter of combination setting has been identified for the MMNC are voltage 50.00 V, pulse current 8.00 A, Pulse on time 8.00 μs and pulse off time 9.00 μs. Finally the parameters were optimized for maximizing MRR, minimizing EWR and SR using desirability function approach.     

Three-dimensional atom mapping of boron in implanted silicon

The redistribution of boron in highly implanted 〈1 0 0〉 silicon (10 keV; 5×10¹⁵ at/cm²) annealed at 600 °C for 1 h was studied using both laser-assisted wide-angle atom probe (LaWaTAP) and secondary ion mass spectrometry (SIMS). As expected, the concentration was found to increase steeply to 10²¹ boron atoms/cm³ at a distance close to 35 nm and to decrease slowly to 10¹⁹/cm³, a value close to the boron level of the silicon substrate. For depth under 75 nm, the implantation profile of boron as given by LaWaTAP was found very close to that given by SIMS investigations without any calibration of the LaWaTAP data. For larger depth, the LaWaTAP profile is observed above that of SIMS. Detection limits of LaWaTAP for low dopant concentrations are discussed. The contribution of the background noise in the spectrum and sampling errors are considered. Fine-scale fluctuations not detected in SIMS profile and related to clustering were evidenced in LaWaTAP maps and profiles. Numerous boron clusters lying on {0 0 1} planes parallel to the implanted surface, a few nanometer in size, were identified and interpreted as boron interstitial clusters (BICs), in agreement with Cristiano et al. observations. They contained between 50 and 300 atoms (Si and B). This is much higher than that generally assumed in particular in ab-initio modelling where a few atoms BICs are considered. These clusters contained 7 at% of boron in average.     

Process investigation on meso-scale hard milling of ZrO2 by diamond coated tools

This paper investigates the feasible machining of zirconium oxide (ZrO₂) ceramics, in the hard state, via milling by diamond coated miniature tools (from here on briefly indicated as meso-scale hard milling). The workpiece material is a fully sintered yttria stabilized tetragonal zirconia polycrystalline ceramic (Y-TZP). Diamond coated WC mills, 2 mm in diameter, four flutes and large corner radius (0.5 mm) are chosen as cutting tools, and experiments are conducted on a state-of-the-art micro milling machine centre. The influence of cutting parameters, including axial depth of cut (a_p) and feed per tooth (f_z), on the achievable surface quality is studied by means of a one-factor variation experimental design. Further tests are also conducted to monitor the process performance, including surface roughness, tool wear and machining accuracy, over the machining time. Mirror quality surfaces, with average surface roughness Ra below 80 nm, are obtained on the machined samples; the SEM observations of the surface topography reveal a prevailing ductile cutting appearance. Tool wear initiates with delamination of the diamond coating and progresses with the wear of the WC substrate, with significant effect on the cutting process and its performance. Main applications of this research include three dimensional surface micro structuring and superior surface finishing.     

Laminated fabrication of 3D queue micro-electrode and its application in micro-EDM

3D micro-electrode used in micro electrical discharge machining (micro-EDM) is difficult to be fabricated. Based on laminated object manufacturing (LOM) process, this paper superimposed multilayer 2D micro-structures together to fit out 3D micro-electrode and applied it in micro-EDM to process 3D micro-cavity mold. Firstly, 100-μm-thick Cu foils were cut by wire-electrical discharge machining (WEDM) to obtain multilayer 2D micro-structures, and then these 2D micro-structures were connected together to fit out 3D micro-electrode through vacuum pressure thermal diffusion welding. Secondly, under the effect of 80-V voltage, 0.2-MHz pulse frequency, 800-ns pulse width, and 4200-ns pulse interval, the 3D micro-electrode was applied in micro-EDM and 3D micro-cavity mold with high surface quality was obtained. Thirdly, in order to reduce the adverse impact of electrode wear on machining precision of 3D micro-cavity mold, 3D queue micro-electrode was used to process the same 3D micro-cavity mold, in which the first electrode is for rough machining and the others for fine machining. Finally, based on the above studies, two kinds of 3D queue micro-electrodes were fabricated, and the 3D micro-cavity molds with surface roughness Ra?=?0.48 μm were obtained through micro-EDM. Compared with the scanning 3D micro-EDM process, the 3D micro-cavity mold can be obtained through up and down reciprocating method of the 3D queue micro-electrode, featuring simple machining process and high efficiency.     

Precision machining of micro tool electrodes in micro EDM for drilling array micro holes

Micro electro discharge machining (micro EDM) is suitable for machining micro holes on metal alloy materials, and the micro holes can be machined even to several microns by use of wire electro discharge grinding (WEDG) of micro electrodes. However, considering practicability of micro holes <Φ100 μm in batch processing, the controllable accuracy of holes’ diameter, the consistency accuracy of repeated machining and the processing efficiency are required to be systematically improved. On the basis of conventional WEDG method, a tangential feed WEDG (TF-WEDG) method combined with on-line measurement using a charge coupled device (CCD) was proposed for improving on-line machining accuracy of micro electrodes. In TF-WEDG, removal resolution of micro-electrode diameter (the minimum thickness to be removed from micro electrode) is greatly improved by feeding the electrode along the tangential direction of wire-guide arc, and the resolution is further improved by employing negative polarity machining. Taking advantage of the high removal resolution, the precise diameter of micro-electrode can be achieved by the tangential feed of electrode to a certain position after diameter feedback of on-line measurement. Furthermore, a hybrid process was presented by combining the TF-WEDG method and a self-drilled holes method to improve the machining efficiency of micro electrodes. A cyclic alternating process of micro-electrode repeated machining and micro holes’ drilling was implemented for array micro holes with high consistency accuracy. Micro-EDM experiments were carried out for verifying the proposed methods and processes, and the experimental results show that the repeated machining accuracy of micro electrodes was less than 2 μm and the consistency accuracy of array micro holes was ±1.1 μm.