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1.
采用低压金属有机化学气相沉积(LP-MOCVD)技术,在InP衬底上外延生长In0.82Ga0.18As.研究生长温度对In0.82Ga0.18As表面形貌、结晶质量和Ⅲ族源铟镓比的影响.扫描电子显微镜观察样品的表面形貌.X射线衍射用于表征材料的组分和结晶质量.结果表明,生长温度强烈地影响In0.82Ga0.18As材料的表面形貌和结晶质量.样品的表面形貌随生长温度的增加由典型的2D生长模式过渡到3D生长模式.X射线衍射曲线半峰全宽为1224、1454、2221、2527 S,分别对应于生长温度为410、430、450、470℃四个样品.此外,Ⅲ族源铟镓比值也随生长温度的增加从0.42增大到4.62.  相似文献   

2.
In order to improve the quality of detector, InxGa1-xAs (x=0.82) buffer layer has been introduced in In0.82Ga0.18As/InP heterostructure. Dislocation behavior of the multilayer is analyzed through plane and cross section [110] by transmission electron microscopy (TEM) and high resolution transmission electron microscopy (HRTEM). The dislocations are effectively suppressed in InxGa1-xAs (x=0.82) buffer layer, and the density of dislocations in epilayer is reduced obviously. No lattice mismatch between buffer layer and epilayer results in no misfit dislocation (MD). The threading dislocations (TDs) are directly related to the multiplication of the MDs in buffer layer.  相似文献   

3.
Microstructure and misfit dislocation behavior in InxGa1-xAs/InP heteroepitaxial materials grown by low pressure metal organic chemical vapor deposition (LP-MOCVD) were analyzed by high resolution transmission electron microscopy (HRTEM), scanning electron microscopy (SEM), atomic force microscopy (AFM), Raman spectroscopy and Hall effect measurements. To optimize the structure of In0.82Ga0.18As/InP heterostructure, the InxGa1-xAs buffer layer was grown. The residual strain of the In0.82Ga0.18As epitaxial layer was calculated. Further, the periodic growth pattern of the misfit dislocation at the interface was discovered and verified. Then the effects of misfit dislocation on the surface morphology and microstructure of the material were studied. It is found that the misfit dislocation of high indium (In) content In0.82Ga0.82As epitaxial layer has significant influence on the carrier concentration.  相似文献   

4.
The observation of all-optical switching in a nonlinear AlGaAs directional coupler using the nonresonant contribution to the intensity dependent refractive index, below half the bandgap, is reported. These results represent the first demonstration of an ultrafast device using semiconductor waveguides, where the throughput is not limited by absorption processes.<>  相似文献   

5.
A novel, simplified hydride vapor phase epitaxy (VPE) method based on the utilization of Ga/In alloys as the group III source was studied for deposition of GaxIn1-xAs. The effects of a wide range of experimental variables (i.e., inlet mole fractions of HC1 and AsH3, deposition temperature, gas velocity, Ga/ln alloy composition, and reactor geometry) on the ternary composition and growth rate were investigated. The growth rate of Ga x In1− xAs was found to increase with increasing deposition temperature and exhibited a maximum with inlet HC1 mole fraction. The growth rate increases slightly with inlet AsH3 mole fraction and is independent of gas velocity. The Ga composition of the deposited film increased with increasing inlet HC1 mole fraction and gas velocity. Increased In concentrations were observed with increases in inlet AsH3 mole fraction and deposition temperatures. Layers of Ga0.47In0.53As lattice matched to InP were successfully grown from alloys containing 5 to 8 at.% Ga. These layers were used to produce state-of-the-artp- i- n photodetectors having the following characteristics: dark current,I d(- 5 V) = 10-20 nA; responsivity,R = 0.84-0.86 A/W; capacitance,C = 0.88–0.92 pF; breakdown voltage,V b > 40 V. This study demonstrated for the first time that a simplified hydride VPE process with a Ga/ln alloy source is capable of producing device quality epitaxial layers.  相似文献   

6.
Submicron p-channel (Al,Ga)As/(In,Ga)As HIGFETs have been optimized for application to high-performance complementary GaAs circuits. Major issues with submicron and deep submicron (Lg⩽0.5-μm) P-channel HIGFETs have been the severe short-channel effects, such as high subthreshold leakage currents and high output conductances. With optimization of the p-type self-aligned implant schedule, control of impurity contamination at the substrate/buffer interfaces and increase of the resistivity of the unintentionally-doped GaAs buffers, high-performance submicron devices have been realized. Typically, 0.5-μm P-HIGFETs yielded room temperature transconductances of 90 mS/mm, drain currents at Vgs =Vds=-1.5 V of 63 mA/mm, and subthreshold leakage currents near 1 nA. Subthreshold slope of 90 mV/decade and output conductances under 5 mS/mm were realized  相似文献   

7.
Transconductance as high as 676 mS/mm at 300 K was observed to 0.7×10-μm2 n-channel devices (HIGFETs) made on epilayers with Al0.3Ga0.7As insulator thickness of 200 Å and In0.15Ga0.85As channel thickness of 150 Å. An FET K value (K=Wg Uε/2aLg) as large as 10.6 mA/V 2 was also measured from another device with transconductance of 411 mS/mm. The high K values are achieved under normal FET operation without hole-injection or drain-avalanche breakdown effects. These results demonstrate the promise of pseudomorphic (Al,Ga)As/(In,Ga)As HIGFETs for high-performance circuit applications  相似文献   

8.
采用金属有机物化学气相沉积法(MOCVD)生长GaAs/Al0.3Ga0.7As量子阱材料,制备300 m300 m台面,内电极压焊点面积为20 m20 m,外电极压焊点面积为80 m80 m单元量子阱器件两种。利用傅里叶光谱仪对1#,2#样品进行77K液氮温度光谱响应测试。实验结果显示1#,2#样品峰值响应波长分别为8.43 m,8.32 m,与根据薛定谔方程得到器件理论峰值波长8.5 m间误差分别为1.0%,2.1%。实验结果说明MOCVD技术可以满足QWIP生长制备工艺要求,且器件电极压焊点位置与面积大小对器件峰值波长影响不大,而对峰值电流有一定影响。  相似文献   

9.
Transferred-electron oscillations were observed and investigated in planar devices of In0.53Ga0.47As. The peak-to-peak magnitude of oscillations with respect to the device current at threshold field was as high as 70%, indicating the peak-to-valley velocity ratio of 3.3:1 for this material. The domain velocity was estimated from the oscillation frequency (2 GHz) and the corresponding device length (40 ?m) to be 8×106 cms?1. The results presented in the letter show a promising prospect for TED applications of this ternary alloy.  相似文献   

10.
采用n-(AI,Ga)As/GaAs异质结构材料制作的高电子迁移率晶体管(HEMT)在微波与超高速器件中已逐步成熟,并已开始出现实用化产品。 本简讯首次报导采用汽相外延方法在半绝缘GaAs衬底上生长N-GaAs/(I,Ga八s异质结构材料制作的HEMT,并已证实器件在低温下未出现陷附中心造成的异常。(国外均采用MBE生长的材料)。 所用材料结构为半绝缘GaAs衬底上汽相外延约1卜m In人a1.仲s层(X=0.15)及o.2~0.3urn N-GaAs层,(In,Ga八s层不掺杂,而GaAs层掺杂浓度约 5 x 10‘”cm-‘。为研制HEMT,采用厚度监控技术使顶部N-GaAs层减薄至1000A以内。…  相似文献   

11.
讨论了量子点红外探测器的工作原理、性能参数、暗电流形成机理及其优势,介绍了In(Ga)As量子点红外探测器的主要结构、性能和取得的最新结果,最后探讨了如何进一步提高量子点红外探测器的性能。指出要实现量子点红外探测器的优势,必须优化量子点生长条件,让量子点更小、更均匀和密度更大;必须提高量子点的掺杂控制和掺杂水平,实现每个量子点中有1~2个电子;必须降低量子点生长中引入的应力,增加量子点有源区的层数;此外,还必须寻求新的量子点红外探测器结构。  相似文献   

12.
The transferred-electron effect in In0.53Ga0.47As is demonstrated by observation for the first time in the travelling-domain mode. Current pulses of more than 70% are found. From velocity/field characteristics the peak velocity is determined as (2.2 ± 0.3) × 107 cm/s. The temperature dependence of the peak current is measured.  相似文献   

13.
The MBE growth of In/sub 0.52/Ga/sub 0.18/Al/sub 0.30/As ( lambda /sub g/=1.06 mu m) layers in the temperature range of 400-450 degrees C was demonstrated to give high-quality optical waveguides which not only exhibit low propagation losses as low as 0.5 dB/cm at lambda =1.55 mu m but concomitantly high resistivity of >10/sup 4/ Omega cm. The refractive index of In/sub 0.52/Ga/sub 0.18/Al/sub 0.30/As was estimated to be 3.207+or-0.03 at lambda =1.55 mu m.<>  相似文献   

14.
通过采用经过优化的新型大光腔结构,脊形波导980nm单模InGaAs/GaAs/AlGaAs多量子阱半导体激光器在保持大功率光输出的同时获得了较小的垂直发散角.结果表明波导中的光功率密度可以降低,获得了大于400mW、斜率效率0.89W/A的输出光功率,垂直方向远场发散角也降低到23°.  相似文献   

15.
120 nm gate-length In_(0.7)Ga_(0.3)As/In_(0.52)Al_(0.48) As InP-based high electron mobility transitions(HEMTs) are fabricated by a new T-shaped gate electron beam lithograph(EBL) technology,which is achieved by the use of a PMMA/PMGI/ZEP520/PMGI four-layer photoresistor stack.These devices also demonstrate excellent DC and RF characteristics:the transconductance,maximum saturation drain-to-source current,threshold voltage,maximum current gain frequency,and maximum power-gain cutoff frequency of InGaAs/I...  相似文献   

16.
通过合理的外延层材料结构设计和改进的器件制备工艺,制备出功率增益截止频率(fmax)为183GHz的晶格匹配InP基In0.53Ga0.47As-In0.52Al0.48As HEMT。该fmax为国内HEMT器件最高值,还报道了器件的结构、制备工艺以及器件的直流和高频特性。  相似文献   

17.
The first room-temperature operation of Ga0.47In0.53As/Al0.48In0.52As resonant tunnelling (RT) diodes is reported. The peak/valley ratio of the current is as high as 4:1 at room temperature and is 15:1 at 80 K. These are the highest values of peak/valley ratio at the respective temperatures, reported so far, in this material system. The position of the peak in the current/voltage characteristic also showed good agreement with that obtained from an electron tunnelling transmission calculation.  相似文献   

18.
通过合理的外延层材料结构设计和改进的器件制备工艺,制备出功率增益截止频率(fmax)为183GHz的晶格匹配InP基In0.53Ga0.47As-In0.52Al0.48As HEMT.该fmax为国内HEMT器件最高值.还报道了器件的结构、制备工艺以及器件的直流和高频特性.  相似文献   

19.
We have studied the dark noise of planar, interdigitated Ga0.47In0.53As photoconductive detectors by measuring the statistical distribution of the dark current under DC bias. The measurements reveal two interesting results: (i) the probability distribution of the dark current around its DC level is Gaussian and (ii) the standard deviation of the probability distribution grows exponentially with increasing bias voltage. Utilising these data an optimum bias level was calculated to maximise the receiver sensitivity of the detector.  相似文献   

20.
提出了利用分子束外延方法生长In0.5Ga0.5As/In0.5Al0.5As应变耦合量子点,并分析量子点的形貌和光学性质随GaAs隔离层厚度变化的特点.实验结果表明,随着耦合量子点中的GaAs隔离层厚度从2 nm增加到10 nm,In0.5Ga0.5As量子点的密度增大、均匀性提高,Al原子扩散和浸润层对量子点PL谱的影响被消除,而且InAlAs材料的宽禁带特征使其成为InGaAs量子点红外探测器中的暗电流阻挡层.由此可见,选择合适的GaAs隔离层厚度形成InGaAs/InAlAs应变耦合量子点将有益于InGaAs量子点红外探测器的研究.  相似文献   

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