自动化技术在机械制造控制中的应用价值

电子计算机网络广泛应用,机械制造行业中开始大量使用自动化技术,就是利用自动化的机械设备,人工智能化的对机械制造的相关环节进行处理.利用自动化技术进行机械制造能够减少人的劳动强度,因此自动化技术在机械制造控制中有着极好的应用价值.本文就自动化技术在机械制造控制中的应用价值情况进行探讨.     

机械制造自动化技术特点与发展趋向

随着我国机械制造技术的发展,机械制造自动化逐渐成为机械制造业的重点应用技术。机械制造自动化技术的应用有效减短了机械产品的生产周期,节约了相关的生产成本,最终提高了企业的经济效益和社会效益,推动了我国机械制造业的健康发展。本文初步阐述了我国机械制造自动化技术的发展现状,探讨了机械制造自动化技术的主要特点,最后进一步总结分析了我国机械制造自动化技术的发展趋向,以期推动我国机械制造业的发展。     

机械自动化技术在机械制造业中的应用

近年来,智能化信息技术在机械制造产业中获得了普遍的运用。目前中国正处在发展的转型期,所以机械制造产业发展趋势对中国经济社会发展起到了关键的影响。在机械工业中,引入自动化技术能够更有效的提升机械制造效率,而当前,自动化技术已经在中国机械工业的各个方面都进行了广泛应用,比如在虚拟化技术方面,集成化技术方面等等,为自动化科技的迅速发展以及我国机械制造产业的发展壮大,提供了重要科技基础。     

日常生产中机械自动化的应用剖析

目前我国主流的机械制造中,机械自动化占据的地位更加主要,机械制造水平的发展方式与进步趋势均基于机械自动化的使用模式,此外,诸多机构的制造均与机械自动化技术的应用密切相关。本文简要剖析了日常生产中机械自动化技术的应用,并为今后的相关工作提供借鉴。     

人工智能在机械制造及其自动化中的应用

随着我国科学技术的飞速发展,机械制造及其自动化也得到了飞速的发展。机械制造及其自动化能够节约人力与物力,大幅提升了我国工业的生产效率,在各行各业都有着较为广泛的应用。随着人工智能技术的发展,越来越多人开始探究如何将人工智能技术应用于机械制造及其自动化当中。本文主要探究了人工智能在机械制造及其自动化中的应用。     

机械自动化在机械制造中的应用价值

科学技术是第一生产力,这个结论已经越来越为人们所承认。而自改革开放以来,我国的经济得到了迅速的发展,在科学技术越来越为人们所重视的时代,我国机械制造业的前景可谓是非常光明。而机械自动化技术在机械制造中的应用更是进一步满足了对于各种精细部件的大批量加工的需要。作为一种新型的生产力,机械自动化技术已经推动机械制造产业迈向了新的台阶,如何将机械制造与机械自动化有机地结合到一起,是相关工作者思考的问题。本文将浅析自动化技术的内涵以及自动化技术在机械制造中的应用,并简要探讨自动化技术的在机械制造中的发展趋势。     

机械工程及自动化在制造中的应用及发展趋势

在中国机械生产行业的持续蓬勃发展下,自动化的科技在机械的使用中也获得了全新发展。由于机械制造产业对人类生产生活具有直接影响,因此机械工程自动化技术在机械制造产业中的有效运用将有助于提高机械工业的生产效益,也是机械制造产业未来发展的大趋势。本篇重点对机械及自动化技术在制造业中的运用情况加以了分析,并同时论述了其发展。     

机械自动化在机械制造中的应用探讨

随着改革开放的深入发展各行各业都呈现出繁荣发展的景象,在机械化发展的时代,我国机械制造业的前景越来越广阔。机械自动化在机械制造中的应用更是提高了机械制造的生产效率进一步满足了机械生产加工中的要求。机械自动化是指在机械制造业中利用自动化技术使机械生产实现连续自动运行刑用机械自动化能够优化生产过程,提高机械制造业的生产水平。本文主要针对机械自动化在机械制造中应用的相关问题进行探讨。     

论机械制造工艺发展现状与未来发展趋势

随着工业革命的掀起,工业在社会经济发展中占据着越来越重的地位,机械制造业作为为整个国民经济发展提供技术装备的一个行业,其发展水平是衡量一个国家工业化程度高低的重要指标。本文针对机械制造工艺的发展现状进行研究,并分别从激光技术和自动化控制技术两方面对高科技技术在机械制造工艺中的应用进行详细的介绍,通过分析机械制造工艺的应用现状来阐述机械制造工艺在未来集成化、微纳化、自动化和数字化的发展趋势。     

浅谈电气自动化技术在机械制造中的运用

近几年电气自动化技术不断发展,在各个领域大放光彩,在机械制造业中也得到越来越广泛地应用,使得机械制造业更加高效,这对我国国民经济发展有所助益.本文首先介绍电气自动化技术在机械制造也中目前应用的现状以及特点,然后介绍电气自动化技术在机械制造业中的具体应用,最后提出改进的措施,希望能为电子自动化在机械制造中的运用提供发展思路和方向.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks