分子束外延碲镉汞探测器的变结面积I-V测试研究

碲镉汞红外探测器的表面钝化处理对器件暗电流有较大影响,决定了器件的探测性能。为了研究表面钝化层不同生长方式对暗电流的抑制效果,使用分子束外延(Molecular Beam Epitaxy, MBE)系统在Si基衬底上生长碲镉汞材料,分别通过磁控溅射和原位钝化方法生长CdTe/ZnS钝化膜层。采用半导体工艺在碲镉汞材料上制备了变面积光伏探测器。通过测试不同钝化膜层器件的暗电流,分析零偏电阻和面积乘积(R₀A)与周长面积之比(p/A)的关系。结果表明,磁控溅射生长钝化层的Si基碲镉汞器件存在较大的隧穿电流,而原位钝化生长钝化层的Si基碲镉汞器件能更有效地抑制表面漏电流。拟合器件R₀A因子随PN结面积的变化,得出原位生长钝化层的器件具有更好的钝化效果。变面积器件的制备和测试能够有效且直观地反映器件性能。     

SiO_2钝化层对GaN基PIN结构核探测器漏电流的影响

成功地制备了有SiO2钝化层和无SiO2钝化层的GaN基PIN结构核辐射探测器,并对二者的I-V特性进行了测试。实验结果表明,SiO2钝化层的存在显著地降低了GaN基PIN结构核辐射探测器的反向漏电流,在-40V的反向偏压情况下,漏电流约有2个数量级的降低。实验过程中观测到随着反向偏压的增大,SiO2钝化层对器件反向漏电流的抑制效应更明显。建立了一种表面沟道模型解释了SiO2钝化层对漏电流的影响。     

基于AlN膜钝化层的高功率垂直腔面发射激光器

高功率垂直腔面发射半导体激光器(VCSEL)内部的自生热是影响器件功能的重要因素,为改善器件的散热性能,采用AlN膜做钝化层研制了基于AlN膜钝化层的980 nm高功率VCSEL器件。对高功率VCSEL进行模拟仿真与理论分析表明,采用AlN膜钝化层可以改善器件内部的温度分布,降低器件的热阻,提高器件的散热能力;采用相同的外延片与工艺实验制备了出光孔径同为200μm的AlN膜钝化层和传统的SiO2膜钝化层的高功率VCSEL器件;对两种不同的钝化层的器件性能进行了实验对比测试,结果表明AlN膜钝化层的高功率VCSEL器件室温下的最大输出功率可达470 mW,比同温度下SiO2膜钝化层的高功率VCSEL器件的最大输出功率高140 mW。AlN膜钝化层的高功率VCSEL在外界温度80℃时,仍能正常激射,具有良好的温度适应性与光电性能。     

钝化膜应力对锑化铟器件性能的影响

随着InSb红外探测器关键尺寸的不断缩小,钝化膜应力的大小对器件I-V性能的影响越发明显。为了降低探测器芯片的应力,研究了一种由SiO₂ 和SiON组成的复合钝化膜体系。通过改变气体的射频时间,在InSb晶片上淀积厚度分别为300 nm、500 nm、700 nm和900 nm的钝化膜,测量并计算了不同厚度钝化膜的应力。当厚度为700 nm时,钝化膜的应力最小值为－1.78 MPa。研究了具有不同应力钝化膜的器件的I-V特性,发现厚度为700 nm时InSb芯片具有更加优异的I-V特性。通过调整复合钝化膜的厚度,降低了钝化膜的应力,有效地提升了InSb探测器的性能。     

不同钝化膜对InSb光伏探测器性能影响研究

采用3种不同钝化膜制备InSb探测器,测试不同周长/面积比二极管芯片的I-V特性曲线,通过对偏置电压为-0.1 V时的暗电流密度进行比较,分析了表面漏电流对InSb探测器性能的影响.实验结果表明SiO2+SiNx复合膜能大幅度降低器件表面暗电流,C-V测试结果也表明复合钝化膜能大幅度降低了界面固定电荷.将复合钝化膜应用到128×12815μm InSb焦平面探测器上,探测器芯片优值因子R0A≥5×104Ω·cm2,较之前(R0A≈5×103Ω·cm2)得到了极大改善.     

薄p型层GaN基p-i-n型紫外探测器的反向漏电特性

制备了薄p型层GaN基p-i-n型紫外探测器,并对其反向漏电特性进行了研究。探测器材料采用金属有机化学气相沉积(MOCVD)方法在蓝宝石衬底上外延生长获得,p-GaN的厚度为30nm。基于该材料制作了具有共面电极的探测器器件,并采用SiO2对刻蚀侧壁进行了钝化。测试结果表明,结面积为1.825×10-4cm2的器件在-1V时的反向漏电流面密度为3.0×10-9 A/cm2,优质因子达到3.7×109Ω.cm2。     

平面肖特基二极管的制作

为研究制作THz频段下工作的肖特基二极管器件,系统研究了平面肖特基二极管的制作工艺。通过分子束外延(MBE)生长了掺杂浓度分别为5×1018 cm-3的缓冲层和2×1017 cm-3的外延层,并研究温度对厚度的影响,使得膜层厚度控制良好,晶格完整。通过参数控制,减小了等离子体增强化学气相沉积(PECVD)的SiO2钝化层应力,使压指结构的翘曲情况得以改善。研究了不同退火温度下欧姆接触的情况,使接触电阻率减小到0.8×10-7 ?/cm2。用电子束光刻和干法刻蚀制作了亚微米级的阳极区域,结合GaAs湿法刻蚀的速率控制,完成了表面沟道的制作,制作出完整的平面肖特基二极管。通过I-U曲线理论计算,二极管的截止频率达到太赫兹量级,为后续工作奠定了基础。     

ICPCVD-SiN_x对GaN/AlGaN基紫外探测器的钝化效果的研究

采用ICPCVD-SiNx薄膜对GaN/A1GaN基紫外探测器进行钝化,从薄膜绝缘特性、钝化效果两方面,对ICPCVD-SiNx、磁控溅射-SiOx、PECVD-SiOx和PECVD-SiNx四种钝化膜进行对比.制作了钝化膜/GaN MIS器件,通过测试MIS器件漏电流密度和薄膜击穿电场的大小表征薄膜绝缘性能,结果表明ICPCVD-SiNx对应的MIS器件的漏电特性最好,外加偏压为100 V时,其漏电流密度保持在1×10-7 A/cm2以下,薄膜击穿电场大于3.3 MV/cm.采用不同钝化方法制作了p-i-n型AlGaN基紫外探测器,通过计算钝化前后器件暗电流的变化,表征不同钝化方法的钝化效果.结果表明ICPCVD-SiNx钝化的器件,其暗电流比其他钝化方法的器件小近两个数量级,在-5V偏压下暗电流密度为7.52 A/cm2.     

InSb光伏探测器钝化对电学性能的影响

实验以阳极氧化法在0.1MKOH溶液中钝化InSb光伏探测器,测量器件钝化前后电学性能的变化。结果表明,器件经钝化后,反向阻抗普遍提高,零偏压阻值显著增加。由于有效地减小表面漏电现象和“沟道效应”,台面下反型层对信号响应降低,改善了器件敏感面扩大问题。借助于俄歇电子能谱仪和x光能谱仪对钝化膜的主要成份进行了测定。文中列出器件钝化前后性能变化数据,並对实验中的现象及有关工艺问题进行讨论。     

硅衬底上分子束外延高性能平面GaAS/A1_(0.3)Ga_(0.7)As肖特基势垒光探测器

<正>Si衬底上生长GaAs器件一直受到人们的重视,但过去si上生长GaAs光探测器的性能并不理想。1991年12月《Electronics Letters》报道了美国佛罗里达大学和德克萨斯仪器公司研制的性能优良的平面肖特基势垒光探测器。 器件用分子束外延生长技术制造。先在P—Si(001)取向衬底上生长GaAs缓冲层,然后再     

Improved Performances of InGaN Schottky Photodetectors by Inducing a Thin Insulator Layer and Mesa Process

The performances of InGaN Schottky photodetectors with varied fabrication processes were investigated. The photoresponse and dark current of InGaN Schottky photodetectors can be obviously improved by inserting a thin $hbox{Si}_{3}hbox{N}_{4}$ passivation layer between the InGaN layer and the Schottky metal. Furthermore, a mesa process gives not only a further increase in the photoresponse but also a pronounced reduction in the reverse leakage current of about two orders of magnitude. A lateral surface leakage current mechanism associated with the 2-D variable-range hopping conduction through high-density surface states in InGaN is proposed to explain the reduction of the reverse leakage current after etching the mesa.      

Lattice mismatched InGaAs on silicon photodetectors grown by molecular beam epitaxy

In_0.5Ga_0.5As on silicon photodetectors, including three types of interdigitated-finger devices as well as linear photoconductors, were fabricated and measured. The InGaAs/Si structure was grown by molecular beam epitaxy and utilized a 100 Å GaAs intervening nucleation layer between the silicon substrate and the InGaAs layers, step-graded In_xGa_1?xAs layers, and an in-situ grown 40 Å thick GaAs surface layer, which substantially enhanced the metal-semiconductor barrier height (Φ_b = 0.67 V) for the InGaAs. Schottky diodes fabricated independently of the photodetectors had nearly ideal characteristics with an ideality factor (n) of 1.02 and a reverse breakdown voltage of 40 V. The interdigitated Schottky photodetectors showed dark currents between <3nA and 54 μA at a 3 V bias and initial photoresponse rise times in the range of 600 to 725 ps, comparable to similar InGaAs metal-semiconductor-metal photodetectors grown lattice matched on InP. The photoconductors fabricated in the same material had rise times in the range of 575 to 1300 ps, thus being slightly slower, and had dark currents of 7 to 80 mA. The responsivity of the photoconductors was typically greater than that of the diodes by a factor of five to fifteen. The results show potential for monolithic integration of InGaAs photodetectors on silicon substrates.     

Electrical Characteristics of 10-kV 4H-SiC MPS Rectifiers with High Schottky Barrier Height

This paper reports the study of the fabrication and characterization results of 10-kilo-volt (kV) 4H-SiC merged PiN/Schottky rectifiers. A metal contact process was developed to make the Schottky contact on n-type SiC and ohmic contact on p-type SiC at the same time. The diodes with different Schottky contact width were fabricated and characterized for comparison. With the improvement quality of the Schottky contact and the passivation layer, the devices show low leakage current up to 10 kV. The on-state characteristics from room temperature to elevated temperature (423 K) were demonstrated and compared between structures with different Schottky contact width.     

Lateral high-speed metal-semiconductor-metal photodiodes onhigh-resistivity InGaAs

First results are presented on the fabrication and characterization of MSIM photodetectors on high-resistivity Fe-doped InGaAs. The acronym MSIM refers to the fact that the active layer of the photodiodes consists of a semi-insulating (SI) photoabsorbing semiconductor layer. Metal-semiconductor-metal (MSM) photodetectors on high-resistivity InGaAs with a lateral planar structure have been fabricated and characterized. The detectors formed exhibit a low capacitance (<50 fF), a very fast response (>14 GHz), a dark current of about 250 nA at a bias voltage of 10 V, and an external quantum efficiency of 20% at 1.3 μm. The dark current values of the MSIM devices are only a factor of three larger than the values for MSM photodetectors based on a technologically complex AlInAs/InGaAs superlattice. This result indicates that the Fe doping of the photoactive InGaAs layer yields a significantly increased Schottky barrier. The fabrication of MSM photodetectors on high-resistivity InGaAs is demonstrated. Laterally structured photodiodes are formed with interdigitated contact fingers. The devices show a high response bandwidth and are suitable for high-speed applications     

色散效应对钝化硅太阳电池减反射膜系设计的影响

在考虑折射率色散效应基础上,以加权平均反射率作为评价函数,通过智能优化算法对空间硅太阳电池减反射膜进行优化设计,得到了最佳的膜厚参数,并与不考虑色散下设计的减反射膜进行了比较。对MgF2/TiO2,SiO2/TiO2双层减反射膜,与不考虑色散情形相比,考虑色散下优化后的最小加权平均反射率分别减小了36.6%和37.6%;对具有厚度为15 nm的SiO2钝化层的硅太阳电池的MgF2/TiO2,SiO2/TiO2减反射膜重新优化设计,与不考虑色散情形相比,考虑色散下优化后的最小加权平均反射率分别减小了43.9%和33.7%;对具有不同厚度钝化层的空间硅太阳电池,在考虑色散下进行了减反射膜的优化设计。结果发现,随着钝化层厚度的增加,所得减反射膜的最小加权平均反射率也随之增大,减反射效果越来越弱。最后,在考虑与未考虑色散情形下,将钝化层膜厚也作为反演参量后重新设计。结果表明:在色散情形下所设计的减反射膜更佳,对于MgF2/TiO2/SiO2（钝化层）膜系,最佳膜厚参量为d1（MgF2）=97.6 nm,d2（TiO2）=40.2 nm,d3（SiO2）=4.9 nm;对于SiO2/TiO2/SiO2（钝化层）,最佳膜厚参量为d1（SiO2）=85.1 nm,d2（TiO2）=43.4 nm,d3（SiO2）=1.8 nm。     

Organic thin film transistors with a SiO2/SiNx/SiO2 composite insulator layer

We have investigated a SiO₂/SiN_x/SiO₂ composite insulation layer structured gate dielectric for an organic thin film transistor（OTFT） with the purpose of improving the performance of the SiO₂ gate insulator. The SiO₂/SiN_x/SiO₂ composite insulation layer was prepared by magnetron sputtering.Compared with the same thickness of a SiO₂ insulation layer device,the SiO₂/SiN_x/SiO₂ composite insulation layer is an effective method of fabricating OTFT with improved electric characteristics and decreased leakage current.Electrical parameters such as carrier mobility by field effect measurement have been calculated.The performances of different insulating layer devices have been studied,and the results demonstrate that when the insulation layer thickness increases,the off-state current decreases.     

Si（Ge）MOSFET器件微结构的研究

采用横断面的透射电子显微术，扫描电子显微术和高分辨电子显微学方法，研究了ＧｅＳｉ沟道ｐ－ＭＯＳＦＥＴ的微结构。观察表明，器件是由Ｓｉ基片／ＳｉＯ２非晶层／ＳＯＩＳｉ层／ＧｅＳｉ沟道层／超薄ＳｉＯ２非晶层／Ｓｉ细晶层／ＳｉＯ２非晶层／Ａｌ电极层等组成的；ＳＯＩＳｉ层工作区单晶性良好，很难找到缺陷，缺陷能效地被限制在工作两侧的缺陷聚集区；在ＳＯＳＳｉ层和ＧｅＳｉ沟道层之间存在着一些瓣状衬底，它可能是在     

Schottky metal-semiconductor-metal photodetectors on GaN filmsgrown on sapphire by molecular beam epitaxy

We report high-performance back-to-back Schottky metal-semiconductor-metal photodetectors fabricated on GaN epitaxial layers grown by molecular beam epitaxy. The photodetectors exhibit very low dark current (<1 pA at 30 V) and high external quantum efficiency (>70%). Medici simulation of the depletion region width indicated an absence of photoconductive gain. The temporal response has also been characterized