3<Emphasis Type="Italic">C</Emphasis>-SiC <Emphasis Type="Italic">p-n</Emphasis> structures grown by sublimation on 6<Emphasis Type="Italic">H</Emphasis>-SiC substrates

Sublimation epitaxy in a vacuum has been employed to grow n-and p-type 3C-SiC layers on 6H-SiC substrates. Diodes have been fabricated on the basis of the p-n structure obtained, and their parameters have been studied by measuring their current-voltage and capacitance-voltage characteristics and by applying the DLTS and electroluminescence methods. It is shown that the characteristics of the diodes studied are close to those of diodes based on bulk 3C-SiC. A conclusion is made that sublimation epitaxy can be used to fabricate 3C-SiC p-n structures on substrates of other silicon carbide polytypes.     

Temperature dependence of the band structure of 3<Emphasis Type="Italic">C</Emphasis>, 2<Emphasis Type="Italic">H</Emphasis>, 4<Emphasis Type="Italic">H</Emphasis>, and 6<Emphasis Type="Italic">H</Emphasis> SiC polytypes

The temperature dependences of significant energy extrema at the high-symmetry points Γ, X, L, K, M, A, and H of the Brillouin zone in the cubic and hexagonal modifications of SiC, as well as the energies of the main interband transitions at these points, were calculated for the first time by the empirical-pseudopotential method. The effect of the temperature dependence of the electron-phonon interaction on the crystal band structure was taken into account via the Debye-Waller factors, and the contribution of the linear expansion of the lattice was accounted for via the temperature dependence of the linear-expansion coefficient. The special features of the temperature dependences of the energy levels and of energies of the interband and intraband transitions are analyzed in detail. The results of the calculations are in good agreement with the known experimental data on the characteristics of SiC-based p-n structures operating in the breakdown mode. For example, the temperature coefficient of the energy of the X_1c–X_3c transition, which is responsible for the narrow violet band in the breakdown-electroluminescence spectra of reverse-biased p-n junctions, was found to be significantly smaller than the temperature coefficients for the interband transitions (from the conduction to valence band). This fact is quite consistent with the experimental curve of the temperature coefficient of the emission spectrum, which has a minimum in the same wavelength range.     

A DLTS study of 4<Emphasis Type="Italic">H</Emphasis>-SiC-based <Emphasis Type="Italic">p</Emphasis>-<Emphasis Type="Italic">n</Emphasis> junctions fabricated by boron implantation

Deep-level transient spectroscopy (DLTS) has been used to study p-n junctions fabricated by implantation of boron into epitaxial 4H-SiC films with n-type conductivity and the donor concentration (8–9) × 10¹⁴ cm⁻³. A DLTS signal anomalous in sign is observed; this signal is related to recharging of deep compensating boron-involved centers in the n-type region near the metallurgical boundary of the p-n junction.     

Subnanosecond 4<Emphasis Type="Italic">H</Emphasis>-SiC diode current breakers

Mesa epitaxial 4H-SiC-based p ⁺-p-n ₀-n ⁺ diodes have been fabricated and their reverse recovery characteristics have been measured in modes typical of fast semiconductor current breakers, drift step recovery diodes, and SOS diodes. It has been found that, after the short (～10 ns) pulsed injection of nonequilibrium carriers by a forward current with a density of 200–400 A cm^?2 and the subsequent application of a reverse voltage pulse (with a rise time of 2 ns), diodes can break a reverse current with a density of 5–40 kA cm^?2 in a time of about (or less than) 0.3 ns. A possible mechanism for ultrafast current breaking is discussed.     

Instability of current and <Emphasis Type="Italic">N</Emphasis>-shaped current-voltage characteristic in a silicon <Emphasis Type="Italic">p-i-n</Emphasis> diode subjected to a magnetic field

Experimental results of studying the p-i-n structures based on n-Si with the resistivity ρ = 120 Ω cm are reported. The dynamic S-shaped current-voltage characteristics were studied at various values of the applied magnetic field. Initiation of the current and voltage large-amplitude oscillations was observed at a magnetic field of 2 kOe. A further increase in the magnetic field leads to an increase in the amplitude of oscillations and to the appearance of a high-frequency oscillation mode with the frequency of ～ 3 MHz; this mode modulates the low-frequency mode. A magnetic field in excess of 5 kOe reduces the amplitude of both modes of current oscillations and completely suppresses oscillations in the circuit so that the S-shaped form of the current-volt-age characteristic disappears. In accordance with the theory, experimental current-voltage characteristics were observed for the first time to feature portions with negative differential N-type conductivity in the presence of a high magnetic field and with the chosen sample configuration and relevant values of electric field.     

Thermal calculation of SiC <Emphasis Type="Italic">p-i-n</Emphasis> diodes

Thermal calculations of various design models of SiC p-i-n diodes with a structure capacity of 0.2 pF are carried out for substrate thicknesses of 360, 50, and 2 mm. Comparison with a silicon p-i-n structure on an integrated heat sink is performed.     

Cooperative effects in the case of pulsed self-heating of a <Emphasis Type="Italic">p-i-n</Emphasis> diode

A variant of the analytical model for distributed injection-related and thermal processes occurring during self-heating of a semiconductor p-i-n diode is suggested. Transient characteristics of the voltage, which reveal the stages of preliminary and enhanced self-heating and also of thermal breakdown, have been calculated. Systematic features of evolution of the concentration and temperature distributions in the base in these stages are studied, and unusual phenomenon (short-term concentration depletion of the injection channel at stages preceding both the thermal-generation increase in concentrations and onset of breakdown) is illustrated. It is established that mechanisms of this phenomenon consist in cooperative interaction of the effects of the temperature-gradient drift, thermal diffusion, and a decrease in the charge-carrier mobility due to the electric field.     

Current flow mechanism in ohmic contact to <Emphasis Type="Italic">n</Emphasis>-4<Emphasis Type="Italic">H</Emphasis>-SiC

Current flow in an In-n-4H-SiC ohmic contact (n ≈ 3 × 10¹⁷ cm⁻³) has been studied by analyzing the temperature dependence of the per-unit-area contact resistance. It was found that the thermionic emission across an ∼0.1-eV barrier is the main current flow mechanism and the effective Richardson constant is ∼2 × 10⁻² A cm⁻² K⁻¹.     

High-temperature nuclear-detector arrays based on 4 <Emphasis Type="Italic">H</Emphasis>-SiC ion-implantation-doped <Emphasis Type="Italic">p</Emphasis><Superscript>+</Superscript>-<Emphasis Type="Italic">n</Emphasis> junctions

Results obtained in a study of spectrometric characteristics of arrays of four detectors based on 4H-SiC ion-implantation-doped p ⁺-n junctions in the temperature range 25–140 °C are reported for the first time. The junctions were fabricated by ion implantation of aluminum into epitaxial 4H-SiC layers of thickness ≤45 μm, grown by chemical vapor deposition with uncompensated donor concentration N _d ? N _a = (4–6) × 10¹⁴ cm^?3. The structural features of the ion-implantation-doped p ⁺-layers were studied by secondary-ion mass spectrometry, transmission electron microscopy, and Rutherford backscattering spectroscopy in the channeling mode. Parameters of the diode arrays were determined by testing in air with natural-decay alpha particles with an energy of 3.76 MeV. The previously obtained data for similar single detectors were experimentally confirmed: the basic characteristics of the detector arrays, the charge collection efficiency and energy resolution, are improved as the working temperature increases.     

Sectoral transition between modes <Emphasis Type="Italic">H</Emphasis><Subscript>10</Subscript> and <Emphasis Type="Italic">H</Emphasis><Subscript>01</Subscript>

The excitation of main parasitic modes E ₁₁, H ₁₁, and H ₂₁, which have cutoff sections in a sectoral transition between modes H ₁₀ and H ₀₁, is investigated. It is shown that, for magnetic modes, including modes H ₁₁ and H ₂₁, it is unnecessary to use the Airy equation and that this circumstance simplifies the design relationships. The energies of these modes are calculated as functions of the transition parameters.     

Low-temperature (77 K) impurity breakdown in <Emphasis Type="Italic">p</Emphasis>-type 4<Emphasis Type="Italic">H</Emphasis>-SiC

The impact ionization of acceptors in aluminum-doped 4H-SiC epitaxial films (Al concentration 2 × 10¹⁵ cm^?3) at a temperature of 77 K is studied. It is found that the impact-ionization coefficient exponentially depends on the reverse electric field: α _p = α*_pexp(?F*/F). The largest ionization coefficient is α* _p = 7.1 × 10⁶ cm^?3 s^?1, and the threshold field is F* = 2.9 × 10⁴ V/cm.     

Effect of the energy of bombarding electrons on the conductivity of <Emphasis Type="Italic">n</Emphasis>-4<Emphasis Type="Italic">H</Emphasis>-SiC (CVD) epitaxial layers

The electrical characteristics of epitaxial layers of n-4H-SiC (CVD) irradiated with 0.9 and 3.5MeV electrons are studied. It is shown that the donor removal rate becomes nearly four times higher as the energy of impinging electrons increases by a factor of 4, although the formation cross section of primary radiation defects (Frenkel pairs in the carbon sublattice) responsible for conductivity compensation of the material is almost energy independent in this range. It is assumed that the reason for the observed differences is the influence exerted by primary knocked-out atoms. First, cascade processes start to manifest themselves with increasing energy of primary knocked-out atoms. Second, the average distance between genetically related Frenkel pairs grows, and, as a consequence, the fraction of defects that do not recombine under irradiation becomes larger. The recombination radius of Frenkel pairs in the carbon sublattice is estimated and the possible charge state of the recombining components is assessed.     

Recombination of charge carriers in the GaAs-based <Emphasis Type="Italic">p</Emphasis>-<Emphasis Type="Italic">i</Emphasis>-<Emphasis Type="Italic">n</Emphasis> diode

It is established that the radiative recombination of charge carriers plays a substantial role in the GaAs-based p-i-n diodes at high densities of the forward current. It is shown experimentally that the diodes operating in microwave integrated circuits intensely emit light in the IR range with wavelengths from 890 to 910 nm. The obtained results indicate the necessity of taking into account the features of recombination processes in the GaAs-based microwave p-i-n diodes.     

High-voltage (900 V) 4 <Emphasis Type="Italic">H</Emphasis>-SiC Schottky diodes with a boron-implanted guard <Emphasis Type="Italic">p-n</Emphasis> junction

High-voltage (900 V) 4H-SiC Schottky diodes terminated with a guard p-n junction were fabricated and studied. The guard p-n junction was formed by room-temperature boron implantation with subsequent high-temperature annealing. Due to transient enhanced boron diffusion during annealing, the depth of the guard p-n junction was equal to about 1.7 μm, which is larger by approximately 1 μm than the projected range of 11 B ions in 4H-SiC. The maximum reverse voltage of fabricated 4H-SiC Schottky diodes is found to be limited by avalanche breakdown of the planar p-n junction; the value of the breakdown voltage (910 V) is close to theoretical estimate in the case of the impurity concentration N = 2.5 × 10¹⁵ cm^?3 in the n-type layer, thickness of the n-type layer d = 12.5 μm, and depth of the p-n junction r _j = 1.7 μm. The on-state diode resistance (3.7 mΩ cm²) is controlled by the resistance of the epitaxial n-type layer. The recovery charge of about 1.3 nC is equal to the charge of majority charge carriers that are swept out of an epitaxial n-type layer under the effect of a reverse voltage.     

Bistable low temperature (77 K) impurity breakdown in <Emphasis Type="Italic">p</Emphasis>-type 4<Emphasis Type="Italic">H</Emphasis>-SiC

Low-temperature (77 K) forward current-voltage characteristics of 4H-SiC p ⁺-p-n ⁺-n (substrate) mesa epitaxial diode structures have been measured. The characteristics are S-shaped, which is accounted for by the bistable nature of the impact ionization of frozen-out acceptor atoms of aluminum.     

High-voltage (1800 V) planar 4<Emphasis Type="Italic">H</Emphasis>-SiC <Emphasis Type="Italic">p-n</Emphasis> junctions with floating guard rings

Planar 4H-SiC p-n junctions with floating guard rings have been fabricated. The main junction and the rings were formed by room temperature boron implantation followed by high temperature annealing. The breakdown voltage of the p-n junctions is 1800 V, which twice exceeds that of similar junctions without guard rings and reaches 72% of the calculated breakdown voltage of a plane-parallel p-n junction with the same epitaxial layer parameters     

High-efficiency LEDs based on <Emphasis Type="Italic">n</Emphasis>-GaSb/<Emphasis Type="Italic">p</Emphasis>-GaSb/<Emphasis Type="Italic">n</Emphasis>-GaInAsSb/<Emphasis Type="Italic">P</Emphasis>-AlGaAsSb type-II thyristor heterostructures

A new type of light-emitting diodes (LEDs), a high-efficiency device based on an n-GaSb/p-GaSb/n-GaInAsSb/P-AlGaAsSb thyristor heterostructure, with the maximum emission intensity at wavelength λ = 1.95 μm, has been suggested and its electrical and luminescent characteristics have been studied. It is shown that the effective radiative recombination in the thyristor structure in the n-type GaInAsSb active region is provided by double-sided injection of holes from the neighboring p-type regions. The maximum internal quantum efficiency of 77% was achieved in the structure under study in the pulsed mode. The average optical power was as high as 2.5 mW, and the peak power in the pulsed mode was 71 mW, which exceeded by a factor of 2.9 the power obtained with a standard n-GaSb/n-GaInAsSb/P-AlGaAsSb LED operating in the same spectral range. The approach suggested will make it possible to improve LED parameters in the entire mid-IR spectral range (2–5 μm).     

Giant burst of impact ionization in a <Emphasis Type="Italic">p-n</Emphasis> junction of the 6<Emphasis Type="Italic">H</Emphasis>-SiC polytype

A study of the electron component of impact ionization in the p ⁺-n ^?-n ⁺ junction in the 6HSiC polytype made it possible to detect a giant burst of impact ionization and origination of an extra early avalanche breakdown. The electric field of this breakdown is lower by ～20% than the electric field of the breakdown arising as a result of a steady development of the impact ionization. It is of interest that this phenomenon occurs abruptly, without any apparent causes, in particular, without an increase in the dark current characteristic of a prebreakdown state of the p-n junction. Conditions for origination of an unusual breakdown and its properties made it possible to assume that there are nonlinear processes that give rise to a streamer. In the p-n junction plane, the anomalous breakdown is seen as a narrow glowing track with a width of ≈10 μm. This effect takes place in the conditions of the Wannier-Stark ladder of states. The latter can stimulate a local accumulation of charge and formation of a streamer structure.     

On the Spatial Localization of Free Electrons in 4<Emphasis Type="Italic">H</Emphasis>-SiC MOSFETS with an <Emphasis Type="Italic">n</Emphasis> Channel

The problem of the spatial localization of free electrons in 4H-SiC metal—oxide—semiconductor field effect transistors (MOSFETS) with an accumulation- and inversion-type n channel is theoretically analyzed. The analysis demonstrates that, in optimally designed accumulation transistors (ACCUFETs), the average distance from the surface, at which free electrons are localized, may be an order of magnitude larger than that in inversion MOSFETs. This can make 4H-SiC ACCUFETs advantageous as regards the effective carrier mobility in a conducting channel.