Surface-Photovoltage Measurement of Volume Electron Lifetime in p-Si Wafers

The problem of estimating the volume lifetime _v of minority carriers in p-type Si wafers by surface-photovoltage measurements is addressed. An experiment is conducted in order to ascertain the relationship between measured and actual values of _v. The measurements are carried out on circular specimens whose thickness is reduced from about 2000 to 450 m by stepwise etching. The specimens are cut from a Czochralski-grown rod, their actual values of _v ranging from 10 to 300 s. The surface recombination rate of minority carriers is determined on both sides of the specimens covered with native oxide, the sides differing in surface finish. The results of the experiment allow one to determine _v up to about 400 s.     

A 70-MHz Continuous-Time CMOS Band-Pass ΣΔ Modulator for GSM Receivers

A 70-MHz continuous-time CMOS band-pass modulator for GSM receivers is presented. Impulse-invariant-transformation is used to transform a discrete-time loop-filter transfer function into continuous-time. The continuous-time loop-filter is implemented using a transconductor-capacitor (G _m -C) filter. A latched-type comparator and a true-single-phase-clock (TSPC) D flip-flop are used as the quantizer of the modulator. Implemented in a MOSIS HP 0.5-m CMOS technology, the chip area is 857 m × 420 m, and the total power consumption is 39 mW. At a supply voltage of 2.5 V, the maximum SNDR is measured to be 42 dB, which corresponds to a resolution of 7 bits.     

Current Testing Procedure for Deep Submicron Devices

This paper presents a test technique that employs two different supply voltages for the same IDDQ pattern. The results of the two measurements are subtracted in order to eliminate the inherent sub-threshold leakage. Summary of the experiment carried out on System on a Chip (SOC) device build in 0.35 technology is also shown. These experiments proved that the method is effective in detecting failures not detectable with the single limit IDDQ.     

A Very Low Power Consumption, Low Noise Analog Readout Chip for Capacitive Detectors with a Power Supply of 3.3 V

An analog frontend block of a VLSI readout chip, dedicated to high spatial resolution X or beta ray imaging, using capacitive silicon detectors, is described. In the present prototype, an ENC noise of 343 electrons at 0 pF with a noise slope of 28 electrons/pF has been obtained for a peaking time of 10 s, a 37 mV/fC conversion gain, a 3.5 V power supply and a 150 W/channel power consumption.     

A nonvolatile analog neural memory using floating-gate MOS transistors

Simple floating-gate transistors fabricated by a conventional double-polysilicon process show excellent programming and charge-retention characteristics. A five-transistor synapse cell achieves 8-bit resolution and at least 6-bit accuracy for analog neural computation. It occupies 67 m×73 m in a 2-m CMOS process and can retain charge accuracy for over 25 years.This research was partially supported by DARPA under Contracts MDA972-90-C-0037 and MDA972-88-C-0048 and by TRW, Inc.     

A CMOS Offset Phase Locked Loop for a GSM Transmitter

This paper describes a CMOS offset phase locked loop (OPLL) for a global system for mobile communications (GSM) transmitter. The OPLL is a PLL with a down-conversion mixer in the feedback path and is used in the transmit (Tx) path as a frequency converter. It has a tracking bandpass filter characteristic in such a way that the OPLL can suppress the noise in the GSM receiving band (Tx noise) without a duplexer. When the loop bandwidth of the OPLL was 1.0 MHz, the Tx noise level of –163.5 dBc/Hz, the phase error of 0.66° rms, and the settling time of 40 s were achieved. The IC was implemented by using 0.35-m CMOS process. It takes 860 m×620 m of total chip area and consumes 17.6 mA with a 3.0 V power supply.     

High-Speed High-Precision CMOS Current Conveyor

In this paper a new class-AB CMOS second generation current conveyor (CCII) based on a novel high-performance voltage follower topology is proposed. Post-layout simulation results from a 0.8 m design supplied at 3.3 V show very low resistance at node X (<50 ), high frequency operation (100 MHz), high precision in the voltage and current transference and reduced offset. As application examples, a V-I converter and a current feedback operational amplifier (CFOA) have been implemented. The latter presents slew-rate levels higher than ±100 V/s.     

Multi-Value Voltage-to-Voltage Converter Using a Multi-Stage Symmetrical Charge Pump for On-Chip EEPROM Programming

A fully integrated multi-stage symmetrical structure chargepump and its application to a multi-value voltage-to-voltage converterfor on-chip EEPROM programming are presented. The multi-valuevoltage-to-voltage converter is designed to offer two output voltages,power supply and triple power supply alternatively, which is neededfor a memory array. A dynamic analysis of the multi-stage symmetricalstructure charge pump and an optimization design in terms of circuitarea are also given. The circuit is implemented in a 1.2 CMOSprocess and the measurement results show that a voltage pulse as shortas 5 s with a rise time of 3 s is obtained. For a 5 V powersupply and with a resistive charge of 100 k, the programmingoutput voltage can reach as high as 11 V and output current forprogramming is over 110 A, which are high enough to program thememory cell.     

0.35 μm CMOS T/R Switch for 2.4 GHz Short Range Wireless Applications

This paper describes the design and implementation of a transmit/receive switch for 2.4 GHz ISM band applications. The T/R switch is implemented in a 0.35 m bulk CMOS process and it occupies 150 m · 170 m of die area. A parasitic MOSFET model including bulk resistance is used to optimize the physical dimensions of the transistors with regard to insertion loss and isolation. The measured insertion loss is 1.3 dB without port matching. Simulations using measured s-parameters indicate that an insertion loss of 0.8 dB can be obtained with a conjugate match. The measured isolation is 42 dB and the maximum transmit power is 16 dBm.     

A 640 by 480 Pixels Readout Circuit for IR Imaging

A readout circuit for a 640 × 480 pixels FPA (focal plane array) has been successfully designed, fabricated and tested. The circuit solution is based on a per pixel source-follower direct injection (SFDI) pre-amplifier. Signal multiplexing is performed in both X and Y direction. The pixel size is 25 m × 25m. The chip is optimized for a QWIP (quantum well infrared photodetector) operating at a temperature of 70 K. The circuit has been realized in a standard 0.8 m CMOS process.