Improvement of deposition uniformity in alloy electroforming for revolving parts

The ability to control the nonuniformity of electrodeposition is a key to successful application of electroforming technology. In this paper, an experimental system is developed to electroform the thin-walled revolving parts. Some measures are employed to improve the uniformity of deposition distribution, such as conformal anode, cathode shield and high-frequency pulse current. The profile of the conformal anode is precisely designed by using the function of electric field analysis of ANSYS software, so as to reduce the experimental works and increase the application effect of conformal anode. The deposition thickness, alloy composition and microhardness of the electroforms are measured to reveal the actual deposition distribution. The results show that the electroforms have a satisfactory deposition distribution, the patterns of which are similar to the current density distribution on cathode.     

Fabrication of microprism mould by electroforming with high electrolyte flowrate

Abstract

Electroforming is applied to fabricate microprism moulds, however only low working current density is employed because the higher current density at the edge limits the usable value of the working current density. Reduction of current density at the edge is a key in the enhancement of the working current density. In this paper, a secondary cathode was introduced to lower the edge current density. By this technique, the edge current density of the primary cathode surface is not only weakened obviously but can be even lower than that of the others. In addition, a high electrolyte flow rate has been introduced to improve working current density. Experimental results show that both the microhardness and tensile strength of the electroformed layer increase with electrolyte flowrate. By using both secondary cathode and high speed electrolyte flow, the electroforming time could be reduced significantly and mechanical properties of the electroformed layer are not adversely affected in electroforming of microprism moulds.     

Effects of pulse reverse electroforming parameters on the thickness uniformity of electroformed copper foil

The non-uniformity of electroformed layers directly affects the mechanical properties and application requirements of micro devices. Therefore, uniformity of electroformed copper foil is significant in ensuring or improving the mechanical properties of micro devices. The influences of duty cycle, current density, power source, and electroforming time on the thickness uniformity of electroformed copper layers were studied, and these parameters were optimised by using the orthogonal experiment method. The thickness distribution rule of electroformed copper foil was also determined. Duty cycle had the largest influence on the uniformity; the uniformity of electroformed layers prepared with pulse reverse current power source was superior to those prepared with direct current power source and pulse current power source. Increasing current density enhanced uniformity. The optimal technical process suggested by this orthogonal experiment adopts pulse reverse current power, 30% of positive duty cycle, 10% of negative duty cycle, 2?A?dm^?2 of current density, and 92?minutes of electroforming time. The minimum coefficient of variation reached 1.54%. The thickness of electroformed copper foil varied directionally.     

Generation of discontinuous microstructures by Diamond Micro Chiseling

Diamond Micro Chiseling (DMC) is a new machining process to generate discontinuous microstructures, such as miniaturized cube corner retroreflectors or V-shaped grooves with defined endings. After a brief introduction to the process itself, this paper presents an in-depth analysis of factors that determine the achievable size and performance of such microstructures. The capability for generating discontinuous microstructures is assessed theoretically by considering the process kinematics and the diamond tool design by geometrical calculations. Thereafter, an experimental evaluation of the process is presented by showing measured data for cutting forces, achievable shape accuracy and surface finish for different structure sizes.     

Fabrication of biomimetic wet adhesive pads with surface microstructures by combining electroforming with soft lithography

Biomimetic adhesive pads, which include seta adhesive pads and wet adhesive pads, are compel-ling to be applied for a climbing robot. A novel approach for fabricating biomimetic wet adhesive pads with surface microstructures by combining electroforming process with soft lithography is proposed in this paper. According to the principle of wet adhesive of insects?? pads, the mechanism of wet adhesion is analyzed. Polydimethylsiloxane wet adhesive pads with surface microstructures with the width of 100 ??m and height of 25 ??m have been obtained experimentally. A series of testing experiments have been carried out to prove that microstructures on the surface of pads fabricated by the proposed technique can effectively improve the wet adhesive ability.     

喷射沉积Al-Si-Ni-Cu-Mg合金的显微组织和相组成

利用喷射沉积技术制备了Ａ１Ｓｉ２０Ｎｉ４Ｃｕ３Ｍｇ合金,分析了合金沉积态、挤压态和Ｔ６热处理态的微观组织,结果表明,组织中存在三种含Ｎｉ的金属间化合物,在挤压和Ｔ６热处理时,它们能够有效地阻碍Ｓｉ原子的扩散,抑制初晶Ｓｉ的长大。此外,起常常强化作用的Ｃｕ与Ａｌ,Ｓｉ一起形成的金属间体例物,影响了合金在Ｔ６热处理时的沉淀强化作用。     

AgMgAl metallic glassy and intermetallic thin films for electric contact applications

The AgMgAl thin films, in an attempt in replacing the expensive pure Au contact films, are prepared by co-sputtering. The surface morphology, roughness, amorphous or crystalline atomic structure, grain size, and electric resistivity are systematically examined. Depending on the film compositions, the films can be fully amorphous or fully nanocrystalline, or a composite with the mixture of nanocrystalline phases dispersed in the amorphous matrix. Under the as-sputtered condition, the crystalline group has the lowest resistivity, ranging from 27 to 37 μΩ·cm, the composite group lies in the middle, 31–70 μΩ·cm, and the fully amorphous group possesses the highest resistivity, 87–122 μΩ·cm. Appropriate short thermal annealing for the amorphous films can drastically lower the resistivity down to as low as 9 μΩ·cm, already compatible to pure Au (3–7 μΩ·cm). This study demonstrates the feasibility of the AgMgAl films in replacing the pure Au.     

Ultraprecision cutting of photoresist/gold composite microstructures

Ultraprecision cutting tests were performed on a photoresist/gold bump composite and cutting characteristics were investigated by examining the surface topography, chip formation, cutting force, and temperature. The cutting mechanisms depended significantly on the cutting speed, undeformed chip thickness, and tool geometry. At a high cutting speed, photoresist softening occurred, leading to chip adhesion on tool faces and burr formation on gold bumps. Two kinds of microfractures were identified in the photoresist cutting, and critical cutting conditions for each were obtained. The findings in this study provide process criteria for ultraprecise planarization of LSI substrates for three-dimensional chip implementing technology.     

氧化铈在电铸吸塑铜模具中的应用研究

研究了在电铸吸塑铜模具的硫酸盐电铸液中,加入稀土氧化铈,模具组织和性能的影响。研究结果表明,电铸液中加入稀土氧化铈,在降低沉积速率的同时,使晶粒得到了细化,组织也变得更加致密,电铸层显微硬度和耐磨损性能得到了提高。     

Preparation of metallic coatings on polymer matrix composites by cold spray

In the present work, an Al metallic coating and an Al/Cu bimetallic coating were prepared on the surface of a carbon fiber-reinforced polymer matrix composite (PMC) using a cold spray system with nitrogen as process and powder carrier gas. The microstructure, microhardness, and bond strength of the resultant coatings are analyzed. The bonding mechanism of the coatings, especially the deposition behavior of the Al particles on the PMC surface is discussed. Results had shown that cold spraying enables the deposition of the metallic and bimetallic coatings directly onto the PMC surface with precise process control and reasonable bonding of feedstock and substrate material. The surface metallization of PMC via cold spraying process presents promising application prospects.     

Microstructure and mechanical properties of a spray-formed Ti-based metallic glass former alloy

A Ti_45.8Zr_6.2Cu_39.9Ni_5.1Sn₂Si₁ composite plate was spray deposited on a copper substrate. From the bottom substrate-contact surface to the upper free surface of the deposit, a layered microstructure evolution in the order of fully amorphous (for the region 1-2 mm perpendicularly away from the substrate), amorphous/nanocrystalline (3-4 mm from the substrate), ultrafine-grained crystalline (5-6 mm from the substrate) and micron-sized crystalline phases (7-8 mm from the substrate) was observed. The oversprayed powders bellow 50 μm exhibit fully amorphous structure, while the ones above 50 μm show certain crystallization behavior. The fracture strength of 1.58-1.85 GPa with obvious plastic strain can be achieved under compressive tests for the spray-formed deposit. Spray forming can therefore produce bulk-sized high strength Ti-based alloy which evolves gradually from certain non-equilibrium towards equilibrium during deposition, which were considered to be attributable to the chill effect at the bottom substrate-contact surface and the following heat entrapment from the successively deposited droplets or powders.     

Formation and corrosion behavior of Fe-based amorphous metallic coatings by HVOF thermal spraying

Amorphous coatings with a composition of Fe₄₈Cr₁₅Mo₁₄C₁₅B₆Y₂ were prepared by means of high velocity oxygen fuel (HVOF) thermal spraying under different conditions. Microstructural studies show that the coatings present dense layered structure and low porosity with a fraction of nanocrystals precipitated. The porosity and amorphous fraction of the coatings decrease as the kerosene and oxygen flow increase within the parameter range examined. Corrosion behavior of the amorphous coatings was investigated by electrochemical measurement. The results show that the coatings are spontaneously passivated with wide passive region and low passive current density in 3.5% NaCl, 1 N HCl and 1 N H₂SO₄ solutions, and exhibit an excellent ability to resist localized corrosion. However, the corrosion resistance of the coatings decreases in 1 N NaOH solution with lower transpassive potential and passive region. In addition, the optimal spraying parameter improves the corrosion resistance of the amorphous coatings obviously due to the proper proportion of porosity and amorphous fraction.     

Electrochemical micromachining of microstructures of micro hole and dimple array

This paper proposes a method of electrochemical micromachining of micro hole or dimple array, in which a patterned insulation plate coated with metal film as cathode is closely attached to workpiece plate. When voltage is applied across the workpiece and cathode film over which the electrolyte flows at high speed, hole or dimple array will be produced. The proposed technology offers unique advantages such as short lead time and low cost. The effect of process parameters on the microstructure shape was demonstrated numerically and experimentally. Arrays of holes or dimples of several hundred micrometers diameter have been produced.     

Micropatterning of Ni-based metallic glass by pulsed wire electrochemical micro machining

The technique of wire electrochemical micro machining (WECMM) is proposed firstly for the micropatterning of Ni-based metallic glass in this paper. Metallic glass (MG) exhibits many outstanding properties such as high hardness and strength, which enable it to be used as functional and structural materials in micro electromechanical systems (MEMS). A significant limitation to the application of MGs is the challenge of shaping them on micro scale. WECMM is a non-traditional machining technique to fabricate microstructures that has some unique advantages over other methods, which will be a promising technique for micro shaping of metallic glass structures. Taking the example of a Ni-based glassy alloy, Ni₇₂Cr₁₉Si₇B₂, the polarization and fabrication characteristic in dilute hydrochloric acid electrolyte were investigated. Changes in the machined slit width in terms of several experimental parameters were investigated to find the optimal ones. Finally, the optimal machining parameters: HCl electrolyte concentration of 0.1 M, applied voltage of 4.5 V, pulse duration of 80 ns, pulse period of 3 μs and feed rate of 0.3 μm s⁻¹ were employed for the fabrication of microstructures. Such as a micro square helix with a slit width of 14.0 μm, standard deviation of 0.2 μm and total length up to 2000 μm, along with a micro pentagram structure with side length of 90 μm and sharp corner of 36°, were machined with a high level of stability and accuracy.     

Analysis of the SiO_x Film Microstructure on Al Substrate by APC VD Process

THE chemical vapor deposition(CVD)technology haslots of advantages,such as high deposition velocity,well distribution,well adhesion,simple equipments andso on,and is widely used in different areas.Thetechnology has recently been made a great evolution inthe research and application of material surfacemodification,imparting the specific properties to thematerial surface layer without changing thecomposition and microstructure of the bulk materials.The CVD technology can be employed to deposi…     

Development of a reversible machining method for fabrication of microstructures by using micro-EDM

A new micromachining method for the fabrication of micro-metal structures by using micro-reversible electrical discharge machining (EDM) was investigated. The reversible machining combines the micro-EDM deposition process with the selective removal process, which provides the ability of depositing or removing metal material using the same micro-EDM machining system. From the discharge mechanism of micro-EDM, the process conditions of micro-EDM deposition were analyzed firstly. Using the brass and steel materials as a tool electrode, the micro-cylinders with 200 μm in diameter and height-to-diameter ratio of more than 5 were deposited on a high-speed steel surface. Then the machining procedure was transformed easily from deposition to selective removal process by switching the process conditions. Different removal strategies including micro-EDM drilling and micro-EDM milling were used in the machining. Micro-holes with 80 μm in diameter are drilled successfully in the radial direction of the deposited micro-steel cylinder. Also, a brass square column with 70 μm in side length and 750 μm in height, and a micro-cylinder with 135 μm in diameter and 1445 μm in height are obtained by using micro-EDM milling. Finally, the characteristics of the deposited material were analyzed. The results show that the material components of a deposited micro-cylinder are almost the same as those of the tool electrode, and the metallurgical bonding has been formed on the interface. In addition, the Vickers-hardness of 454Hv of the steel deposited material is higher when compared to the hardness of 200Hv of the raw steel electrode.     

固溶温度对电子束熔丝成形TC17合金组织与力学性能影响

研究了固溶温度对电子束熔丝成形TC17钛合金组织及力学性能的影响。结果表明：电子束熔丝成形TC17钛合金为柱状晶组织,柱状晶沿堆积高度方向生长,在柱状晶内部为细小的（α+β）板条构成的网篮状组织。随固溶温度升高,（α+β）→β转变更加充分,初生α相含量减少,初生α相含量和形态对材料的塑性有较大影响,因此塑性降低,强度上升。     

Advances in micro ultrasonic assisted lapping of microstructures in hard–brittle materials: a brief review and outlook

Micro ultrasonic assisted lapping was first proposed as an effective micromachining technique for hard–brittle materials by Masuzawa's group. Through applying innovative machine tool design concepts, holes as small as 5 μm in diameter and aspect ratios larger than five were machined in quartz glass and silicon. Further applications of the micro ultrasonic assisted lapping to generating microstructures in hard–brittle materials were extended by Brinksmeier's group, and path-controlled micro ultrasonic assisted lapping was implemented in LFM, University of Bremen. These excellent results have demonstrated a promising potential for practical, but the knowledge of micro ultrasonic assisted lapping is far from sufficient to provide a complete understanding and instructive rules for industrial users. The paper briefly reviews some new advances in micro ultrasonic assisted lapping, and then introduces some necessary research topics involved in the process in order to put it into practical microfabrication.     

Characterization of quasi-nano-sized TiCx-Ni-Fe thin composite sheet prepared by using self-propagating high-temperature synthesis reaction and electroforming

Thin TiC_x-Ni-Fe composites sheet was prepared by self-propagating high-temperature synthesis (SHS) and electroforming. The quasi-nano-sized titanium carbide particles were prepared by self-propagating high temperature synthesis (SHS) followed by mechanical milling and ultrasonic floating agitation for classifying particles. The composite sheet was fabricated by co-deposition of the classified titanium carbide particles in a modified Watts nickel bath containing iron chloride during nickel-iron electro-forming. Neutron diffraction showed that the non-stoichiometric number of titanium carbides formed by the SHS reaction were in the range of 0.68 to 0.97, which depended on the initial carbon sources. X-ray diffraction and electron probe micro-analysis revealed that co-deposition of the carbides in Ni-Fe bath during the electroforming process produced a thin TiC_x-Ni-Fe composite sheet, in which quasi-nano-sized titanium carbides were embedded about 7 at.%. The average surface resistance of the thin composite sheet was 1.053 ohm/sq. The corrosion potential and rate of the composites in a 50% NaOH solution were ?920.6 mV_SHE and 8.4×10^?6 Acm^?2, respectively.