Growth,Characterization and Micro-pattern Fabrication of Iridium/Si3N4/Si（100） Thin Films

Iridium thin films have been deposited on Si3N4（100 nm）/Si（100） substrates by magnetron sputtering. And then iridium film micro-patterns were fabricated by ion milling technique. The atomic force microscopy （AFM） measurements reveal that there is a very fiat and smooth surface with an average roughness of 0.64 nm for the iridium films. The X-ray diffraction also reveals that the deposited iridium films have a polycrystalline microstructure with （111） plane preferential orientation. The electrical resistivity of the iridium films was also measured and discussed.     

Fabrication of GaN films through reactive reconstruction of magnetron sputtered ZnO／Ga2O3

A simple and easily operated technique was developed to fabricate GaN films. GaN films possessing hexagonal wurtzite structure were fabricated on Si(111) substrates with ZnO buffer layers through nitriding Ga2O3 films in the tube quartz furnace. ZnO buffer layers and Ga3O3 films were deposited on Si substrates in turn by using radio frequncy magnetron sputtering system before the nitriding process. The structure and composition of GaN films were studied by X-ray diffraction, selected area electron diffraction and Fourier transform infrared spectrophotometer. The morphologies of GaN films were studied by scanning electron microscopy. The results show that ZnO buffer layer improves the crystalline quality and the surface morphology of the films relative to the films grown directly on silicon substrates. The measurement result of room-temperature photoluminescence spectrum indicates that the photoluminescence peaks locate at 365 nm and 422 nm.     

Effects of Annealing Processes on Cu_xSi_(1-x) Thin Films

The Cu_xSi_(1-x) thin films have been grown by pulsed laser deposition(PLD) with in situ annealing on Si(001) and Si(111),respectively.The transformation of phase was detected by X-ray diffraction(XRD).The results showed that the as-deposited films were composed of Cu on both Si(001) and Si(111).The annealed thin films consisted of Cu +η "-Cu_3Si on Si(001) while Cu +η'-Cu_3Si on Si(111),respectively,at annealed temperature(T_a)= 300-600℃.With the further increasing of T_a,at T_a= 700℃,there was only one main phase,η"-Cu_3Si on Si(001) while η'-Cu_3Si on Si(111),respectively.The annealed thin films transformed from continuous dense structure to scattered-grain morphology with increasing T_a detected by field emission scanning electron microscope(FESEM).It was also showed that the grain size would enlarge with increasing annealing time(t_a).     

Structure and internal stress of Au films deposited on SiO2／Si（100） andmica by dc sputtering

Au films with a thickness of about 300 nm were deposited on SiO2/Si(100) and mica substrates by dc sputtering. X-ray diffraction spectroscopy and field emission scanning electron microscopy were used to analyze the structure and internal stress of the Au films. The films grown on SiO2/Si(100) show a preferential orientation of [111] in the growth direction. However the films grown on mica have mixture crystalline orientations of [111], [200], [220] and [311] in the growth direction and the orientations of [200] and [311] are slightly more than those of [111] and [220]. An internal stress in the films grown on SiO2/Si(100) is tensile. For Au films grown on mica the internal stresses in the [111]-and [311]-orientation grains are compressive while those in the [200]- and [220]-orientation grains are tensile. Au films grown SiOJSi(100) have some very large grains with a size of about 400 nm and have a wider grain size distribution compared with those grown on mica.     

Oxygen vacancy and Mn~(2+)induced ferromagnetism in Mn-doped ZnO thin films

With the purpose of investigating the origin of ferromagnetism(FM), Mn-doped Zn O thin films had been fabricated by radio frequency(rf) magnetron sputtering and subsequent anneal process. The characterization of the Mn-doped Zn O thin films was conducted by X-ray diffraction(XRD), X-ray photoelectron spectroscopy(XPS), and superconducting quantum interference device(SQUID). With increasing the anneal temperature from 300°C to 700°C for 3 min, the influence on magnetism of the Mndoped ZnO thin films is slight. While extending the anneal time from 3 to 50 min at 300°C, the influence on magnetism is obvious and the Mn-doped ZnO thin films with 30 min clearly demonstrate FM. Compared with the effect of oxygen vacancy and substitutional Mn~(2+)on the ferromagnetic behavior, OVplays the main role in inducing FM of the Mn-doped ZnO thin films with good crystal structure.     

Structural and physical properties of permalloy thin films prepared by DC magnetron sputtering at different substrate temperature

Permalloy Ni80Fe20 films have been grown on thermal oxidized Si (111) wafers by magnetron sputtering at well-controlled substrate temperatures of 300, 500, 640 and 780 K in 0.65 Pa argon pressure. The base pressure was about 1×10-4 Pa. The deposition rate was about 5 nm/min for all the films. The structure of the films was studied using X-ray diffraction, scanning electron microscopy and atomic force microscopy. The composition of the films was analyzed using scanning Auger microprobe. The resistance and magnetoresistance of the films were measured using four-point probe technique. The results show that the content of oxygen in the films decreases gradually with raising substrate temperature. In addition, the surface morphology of the films presents notable change with the increasing of the substrate temperature; the residual gases and defects decrease and the grains have coalesced evidently, and then the grains have grown up obviously and the texture of (111) orientation develops gradually in the grow     

Effect of TiO₂ Seed Layer on 0.7Pb(Mg_0.33Nb_0.67)O₃-0.3PbTiO₃ Thin Films Deposited by Radio Frequency Magnetron Sputtering

We have grown PbMg1/3Nb2/3O3-PbTiO3(PMN-PT) thin films by radio frequency(RF) sputtering deposition at 550 ℃-650 ℃ on Pt/Ti/SiO2/Si and TiO2/Pt/Ti/SiO2/Si substrates.The phase compositions and microstructure of thin films were characterized by X-ray diffraction(XRD) and scanning electric microstructure(SEM).The effect of the TiO2 seed layer on PMN-PT films was studied.     

Preparation and characterization of transparent conductive zinc doped tin oxide thin films prepared by radio-frequency magnetron sputtering

High transparent and conductive thin films of zinc doped tin oxide (ZTO) were deposited on quartz substrates by the radio-frequency (RF) magnetron sputtering using a 12 wt% ZnO doped with 88 wt% SnO2 ceramic target.The effect of substrate temperature on the structural,electrical and optical performances of ZTO films has been studied.X-ray diffraction (XRD) results show that ZTO films possess tetragonal rutile structure with the preferred orientation of (101).The surface morphology and roughness of the films was investigated by the atomic force microscope (AFM).The electrical characteristic (including carrier concentration,Hall mobility and resistivity) and optical transmittance were studied by the Hall tester and UV- VIS,respectively.The highest carrier concentration of -1.144×1020 cm-3 and the Hall mobility of 7.018 cm2(V ·sec)-1 for the film with an average transmittance of about 80.0% in the visible region and the lowest resistivity of 1.116×10-2 Ω·cm were obtained when the ZTO films deposited at 250 oC.     

Dynamic dam-reservoir interaction analysis including effect of reservoir boundary absorption

The Bi3.25La0.75Ti3O12 thin films were fabricated on the Pt/Ti/SiO2/Si substrates using sol-gel method. The structure and morphology of the films were characterized using X-ray diffraction and atomic force microscopy. The thin films showed a perov- skite phase and dense microstructure. The 2Pr and 2Vc of the Bi3.25La0.75Ti3O12 thin films annealed at 700℃ were 18.6 μC/cm2 and 4.1 V, respectively, under an applied voltage 10 V. After the switching of 1×1010 cycles, the Pr value decreased to 90% of its pre-fatigue values. The films showed good insulating behavior according to the test of leakage current. The dielectric constant and the dissipation factor of the Bi3.25La0.75Ti3O12 thin films were about 176 and 0.046 at 1 kHz, respectively.     

Structure, optical, and magnetic properties of Mn-doped ZnO films prepared by sputtering

The microstructural,optical,and magnetic properties and room-temperature photoluminescence(PL) of Mn-doped ZnO thin films were studied.The chemical compositions were examined by energy dispersive X-ray spectroscopy(EDS) and the charge state of Mn ions in the ZnO:Mn films was characterized by X-ray photoelectronic spectrometry(XPS).From the X-ray diffraction(XRD) data of the samples,it can be found that Mn doping does not change the orientation of ZnO thin films.All the films prepared have a wurtzite stru...     

磁控溅射法生长ZnO薄膜的结构和表面形貌特性

采用射频磁控溅射方法,在Si（111）和玻璃基片上制备ZnO薄膜。研究衬底温度和基片类型对薄膜结构、表面形貌的影响。结果显示,所有ZnO薄膜沿c轴择优生长,同种基片类型上生长的薄膜,随着衬底温度升高,（002）衍射峰强度和表面粗糙度增高;相同衬底温度下生长的ZnO薄膜,Si基片上制备的薄膜（002）衍射峰强度和表面粗糙度小于玻璃片上的。基片类型影响薄膜应力状态,玻璃片上制备的ZnO薄膜处于张应变状态,Si基片上的薄膜处于压应变状态;对于同种基片类型上生长的ZnO薄膜,衬底温度升高,应力减小。Si衬底上、300℃下沉积的薄膜颗粒尺寸分布呈正态。     

基片表面朝向对ZnO纳米线生长机理的影响

采用热蒸发ZnO粉末法,以金膜为催化剂,在两片表面分别朝上和朝下的Si(100)基片上生长ZnO纳米线(样品分别标为1#和2#)。X射线衍射(XRD)图谱上只存在ZnO的(002)衍射峰,说明ZnO纳米线沿(001)择优取向。通过扫描电子显微镜(SEM)表征发现,ZnO纳米线整齐排列在Si基片上,直径在100nm左右,平均长度为4mm。通过分析得出,两种基片上生长的ZnO纳米线的生长机理是不相同的:1#样品,在基片表面上先生长ZnO薄膜,再在薄膜上生长ZnO纳米线;2#样品,ZnO纳米线直接外延生长在基片表面。结果显示基片表面的朝向影响ZnO纳米线的生长机理。     

Structure and internal stress of Au films deposited on Si02/Si(100) and mica by dc sputtering

Au films with a thickness of about 300 nm were deposited on SiO2/Si(100) and mica substrates by dc sputtering. X-ray diffraction spectroscopy and field emission scanning electron microscopy were used to analyze the structure and internal stress of the Au films. The films grown on SiO2/Si(100) show a preferential orientation of [111] in the growth direction. However the films grown on mica have mixture crystalline orientations of [111], [200], [220] and [311] in the growth direction and the orientations of [200]and [311] are slightly more than those of [111] and [2201. An intemal stress in the films grown on SiO2/Si(100) is tensile. For Au films grown on mica the internal stresses in the [111]- and [311]-orientation grains are compressive while those in the [200]- and [220]-orientation grains are tensile. Au films grown SiO2/Si(100) have some very large grains with a size of about 400 nm and have a wider grain size distribution compared with those grown on mica.     

在LaNiO3衬底上（Pb,La）TiO3铁电薄膜的制备和研究

首先通过金属有机化合物热分解(MOD)法在Si(100)基片上制备出LaNiO3(LNO)薄膜,再通过溶胶-凝胶(sol-gel)法,在LNO/Si(100)衬底上制备出(PbxLa1-x)TiO3(PLT)铁电薄膜。经XRD分析表明,LNO薄膜具有(100)择优取向的类钙钛矿结构,PLT/LNO/Si薄膜具有四方相钙钛矿结构,同时以(100)择优取向。最后对薄膜的介电性和铁电性进行了测试,发现薄膜介电常数适中,铁电性良好。     

衬底效应对LiTaO3薄膜制备的影响

用溶胶凝胶法在N型硅、P型硅、石英、铂、镍衬底上制备了钽酸锂(LiTaO3)薄膜,用XRD和SEM对钽酸锂薄膜性能参数进行了表征;发现掺杂少量环氧树脂能提高钽酸锂薄膜的均匀性,改善薄膜与衬底的粘附性;研究了衬底效应与薄膜厚度的关系,薄膜厚度超过0.2 μm,Ni衬底的XRD峰值强度几乎不再出现,说明衬底对薄膜初始结晶取向有重要影响;利用不同衬底上生长钽酸锂薄膜,XRD研究结果表明:N型硅、P型硅、石英衬底上只能制备多晶钽酸锂薄膜,铂衬底上制备的钽酸锂薄膜在(012)晶向有强大的择优取向性,镍衬底上制备的钽酸锂薄膜有更好的C轴择优取向性,C轴择优取向系数可达0.082。     

Fabrication of GaN films through reactive reconstruction of magnetron sputtered ZnO/Ga_2O_3

1　INTRODUCTIONGallium nitride (GaN) is one of the most po tential semiconductors. GaN has a direct energyband gap of 3.4 eV at room temperature and highexternal photoluminescence quantum efficiency, aswell as a high excitonic binding energy of20 meV[1]. It is an ideal material for fabrication ofultraviolet(UV)/blue/green light emitting diodes(LEDs), laser diodes(LDs), UV detectors and de vices operating in high temperature, high frequen cy and high power co…     

在LaNiO_3衬底上（Pb,La）TiO_3铁电薄膜的制备和研究

首先通过金属有机化合物热分解（MOD）法在Si（100）基片上制备出LaNiO3（LNO）薄膜,再通过溶胶-凝胶（sol-gel）法,在LNO/Si（100）衬底上制备出（PbxLa1-x）TiO3（PLT）铁电薄膜。经XRD分析表明,LNO薄膜具有（100）择优取向的类钙钛矿结构,PLT/LNO/Si薄膜具有四方相钙钛矿结构,同时以（100）择优取向。最后对薄膜的介电性和铁电性进行了测试,发现薄膜介电常数适中,铁电性良好。     

Si(111)和Si(100)衬底上磁控反应溅射制备AlN薄膜

采用射频磁控反应溅射法在Si(111)和Si(100)两种衬底上制备了AlN薄膜,用X射线衍射(XRD)对AlN薄膜进行了表征,研究了衬底Si(111)、Si(100)取向以及N2百分比对AlN(002)薄膜c-轴择优取向的影响。实验结果表明,Si(100)较适合生长c-轴择优取向AlN薄膜,而且N2百分比为40%时,AlN薄膜的c-轴取向最好,具有尖锐的XRD峰,此时对应于AlN(002)晶向。计算了(002)取向AlN和两种Si衬底的失配度,Si(111)面与AlN(002)面可归结为正三角形晶系之间的匹配,失配度为23.5%;而Si(100)面与AlN(002)面可归结为正方形晶系与正三角形晶系之间的匹配,失配度为0.8%,可以认为完全共格。理论分析和实验结果相符。