(K_(0.5)Na_(0.5))_(0.94-2x)Li_(0.06)Sr_xNb_(0.98)Sb_(0.02)O_3无铅压电陶瓷的制备及性能研究

采用传统陶瓷烧结工艺制备了(K0.5Na0.5)0.94-2xLi0.06SrxNb0.98Sb0.02O3无铅压电陶瓷,研究了陶瓷的结构、烧结特性及电性能特征.研究结果表明:制备的KNLSN-Srx陶瓷为单一的具有四方相的钙钛矿结构,SEM照片中可以看出材料的平均晶粒尺寸随着Sr掺入量的增加逐渐变大,陶瓷的烧结温度随Sr掺入量的增加而升高,Li,Sr和Sb掺杂(K0.5Na0.5)NbO3后,材料的压电系数d33、平面机电耦合系数kp得到提高,同时介电损耗tanδ和机械品质因子Qm降低,Sr掺入量在2mol%时各项性能最佳(d33=130pC/N,kp=34.5%,tanδ=4.2%).     

Y2O3掺杂(Bi0.5 Na0.5)0.94 Ba0.06 TiO3无铅压电陶瓷的研究

采用固相合成法制备了Y2O3掺杂(Bi0.5 Na0.5)0.94 Ba0.06 TiO3无铅压电陶瓷.研究了Y2O3掺杂对(Bi0.5 Na0.5)0.94Ba0.06 TiO3陶瓷晶体结构、介电与压电性能的影响.XRD分析表明,在所研究的组成范围内陶瓷均能够形成纯钙钛矿固溶体.介电常数-温度曲线显示陶瓷具有弛豫铁电体特征,陶瓷的弛豫特征随掺杂的增加更为明显.在Y2O3掺杂量为0.5%时陶瓷的压电常数d33分别为137 pC/N,为所研究组成中的最大值,掺杂量为0.1%时,机电耦合系数kp与kt最大值为0.30,0.47.     

(K0.5Na0.5)NbO3-LiNbO3无铅压电陶瓷的烧结特性和压电性能研究

采用传统陶瓷烧结工艺制备了(1-x)(K0.5Na0.5)NbO3-xLiNbO3无铅压电陶瓷,研究了陶瓷的结构、烧结特性及电性能特征.制备的(K0.5Na0.5)NbO3-LiNbO3陶瓷为单一的钙钛矿结构,室温下其相结构随LiNbO3含量增加逐渐由正交相向四方相转变,显微结构也由于LiNbO3含量的不同而表现出很大差异.与(K0.5Na0.5)NbO3陶瓷相比,(K0.5Na0.5)NbO3-LiNbO3陶瓷的烧结温度降低,烧结特性得到改善. (K0.5Na0.5)NbO3-LiNbO3陶瓷表现出优越的压电性能,其中0.94(K0.5Na0.5)NbO3-0.06LiNbO3(x=0.06)陶瓷的压电常数d33达到205pC/N,机电耦合系数kp为40.3%,kt达到49.8%.     

0.94[(Na0.96-xKxLi0.04)0.5Bi0.5]TiO3-0.06Ba(Zr0.055Ti0.945)O3无铅压电陶瓷的压电介电特性

对无铅压电陶瓷0.94[(Na0.96-xKxLi0.04)0.5Bi0.5]TiO3-0.06Ba(Zr0.055Ti0.945)O3的性质随K含量的变化进行了系统研究,获得压电应变常数d33高达185pC/N的0.94[(Na0.80K0.16Li0.04)0.5-Bi0.5]TiO3-0.06Ba(Zr0.055Ti0.945)O3压电陶瓷.随着K掺杂量的增加,该陶瓷材料的介电温谱峰值向右明显移动,其介电峰温度明显升高.     

CuO掺杂的(Na_(0.66)K_(0.34))NbO_3无铅压电陶瓷性能研究

采用传统工艺制备了CuO掺杂的无铅压电陶瓷(Na0.66K0.34)NbO3,研究了CuO掺杂对其压电、介电、铁电等性质的影响。实验结果显示,CuO掺杂促进了晶粒生长,降低了样品的烧结温度,适量掺杂能够显著提高陶瓷样品的密度。当掺杂量为0.5%(摩尔分数)时,样品的密度为4.26g/cm3,品质因子Qm提高到400,介电损耗tanδ降低至0.8%。实验结果还显示,CuO掺杂使得陶瓷变硬,起到硬性添加剂的作用。随着CuO掺杂量的增加,样品的居里点(TC)、正交-四方相变温度(TT-O)、压电常数d33以及机电耦合系数kp均明显降低,而矫顽场显著增加。对于不掺杂的(Na0.66K0.34)NbO3陶瓷,其d33高达107pC/N,该陶瓷优异的压电性能表明,除了具有准同型相界结构的(Na0.5K0.5)NbO3外,(Na0.66K0.34)NbO3也是一种具有研究潜力的无铅压电陶瓷组分。     

一种改性铌酸盐系无铅压电陶瓷的合成与特性研究

K0.5Na0.5NbO3(KNN)系铌酸盐是一类可能替代铅基压电陶瓷的无铅压电陶瓷.利用Ta和Sb掺杂或者取代KNN中的相关离子,在陶瓷的准同型相界(MPB)处显现出高的压电和介电性能.利用传统技术制作出一种新的致密度较高的无铅压电陶瓷(1-x)(K0.5Na0.5)(Nb0.96Sb0.04)O3-xLiTaO3(简记为KNNS-LT).所有的组分在MPB处都存在纯的钙钛矿结构,主要压电性能在MPB处达极大值,其机电耦合系数kp为40%,压电常数d33为225pC/N,居里温度Tc为355℃.     

溶胶-凝胶法制备锰掺杂 (Bi0.5Na0.5)0.94Ba0.06TiO3无铅陶瓷的压电特性

用溶胶-凝胶工艺制备了 (Bi0.5Na0.5)0.94Ba0.06TiO3 + x wt% Mn (x=0- 0.4)系列无铅压电陶 瓷.研究发现适量锰的掺杂可以有效地降低材料的介电常数和介电损耗,同时提高材料的退极化 温度,但过量锰的掺杂使得材料的压电特性变差.当锰的掺杂量为 0.1wt%时,陶瓷具有该系列最 大的压电常数( d33=175× 10- 12C/N)、最大的机电耦合系数 kt=56%, kp=26%)、较小的介电损耗 tgδ =2.7%,较高的退极化温度( Td=82℃).     

高性能无铅压电陶瓷(Bi0.5Na0.5)0.94Ba0.06TiO3的制备与性能

采用企业的电子陶瓷工艺制备了(Bi0.5Na0.5)0.94Ba0.06TiO3(BNTBT-6)无铅压电陶瓷,研究了制备工艺对BNTBT-6陶瓷的晶相、微观结构与介电压电性能的影响.研究结果表明,烧结方式会对BNTBT-6陶瓷的晶相和性能产生一定的影响.电学性能研究结果表明,湿磨盖烧BNTBT-6陶瓷样品的压电性能优良,室温下陶瓷样品的压电常数d33达到195pC/N,机电耦合系数kp为35%,机械质量因子Qm达到130,介电损耗tgδ为0.025.     

溶胶-凝胶法制备(Bi0.5Na0.5)1-xBaxTiO3陶瓷的性能

测量了使用溶胶-凝胶工艺制备的 (Bi0.5Na0.5)1- xBaxTiO3(x=0,0.02,0.04,0.06)系无铅 压电陶瓷的介电、压电和弹性参数.研究发现,该工艺制备的 (Bi0.5Na0.5)0.94Ba0.06TiO3陶瓷具有 此系列最强的压电性能, 与传统工艺制备的该类压电陶瓷相比, 溶胶-凝胶工艺制备的 (Bi0.5Na0.5)0.94Ba0.06TiO3陶瓷具有压电常数( d33=173× 10- 12C/N)、机电耦合系数( kt=56%, kp= 26%)、泊松比(ν =0.3)提高; 频率常数( Nt=2250Hz· m, Np=2810Hz· m)、退极化温度( Td= 75℃)降低以及介电常数(εTr33=820)、介电损耗( tgδ=3.9%)稍大的特点.     

LiTaO3掺杂对K0.5Na0.5NbO3基无铅压电陶瓷性能的影响

采用传统陶瓷工艺制备了LiTaO3掺杂的K0.5Na0.5NbO3基无铅压电陶瓷(记为KNN xLT,x=0～8%(摩尔分数)),并研究了陶瓷的晶相、显微结构和压电、铁电等性能.研究结果表明,KNN xLT陶瓷的正交相-四方相准同型相界(MPB)位于4%＜x＜6%处.随着LiTaO3含量的增加,陶瓷的正交→四方结构相变温度(TO-T)向低温方向移动,而四方→立方结构相变温度(Tc)向高温方向移动.陶瓷的压电常数d33和机电耦合系数kp随LiTaO3含量的增加均先增大后减小,而剩余极化强度Pr则随之逐渐减小,矫顽场Ec逐渐增大.当x=6%时,陶瓷具有较好的压电和铁电性能:d33=190pC/N,kp=40.0%,Pr=22.0μC/cm2,Ec=1.78kV/mm,Tc=440℃.该体系陶瓷具有较高的压电常数和比较大的平面机电耦合系数,是一种应用前景良好的压电铁电材料.     

In0.53Ga0.47As PIN光电探测器的温度特性分析

从理论和实验上分析了双异质结In0.53Ga0.47As PIN光电探测器在不同的反向偏置电压下暗电流在甚宽温度范围内的温度特性。结果表明：在反向偏置低压与高压段,产生一复合电流与隧道电流(缺陷隧道电流与带带间隧道电流)分别占主导地位,并呈现出相应的温度特性。还从理论与实验两方面探讨了噪声对探测器R0A的影响,结果表明：在低温段,产生一复合噪声起主要作用,在高温段,俄歇复合噪声起主要作用。     

高性能In0.53Ga0.47AsPIN光电探测器的研制

报道了采用GSMBE方法研制的In0.53Ga0.47As PIN光电探测器，器件结构中引入了宽禁带InP窗口层和聚酰亚胺钝化工艺，减小了暗电流，提高了器件性能。在反向偏压为5V时器件的暗电流为640pA，反向偏压为10V时测得器件的上升时间为37.2ps，下降时间为30.45ps，半高宽为43.9ps。对影响探测器暗电流的因素和提高响应速度的途径进行了讨论。     

Densification and phase formation in seeded, reactively sintered Sr0.53Ba0.47Nb2O6 ceramics

Sr_0.53Ba_0.47Nb₂O₆ (SBN53) ceramics were reactively sintered from SrNb₂O₆ and BaNb₂O₆ powders. The formation temperature decreased from 1260°C for unseeded samples to 1130°C for the samples with 15.4 wt% seeds plus 0.85 mol% V₂O₅ at a heating rate of 4°C/min. For the V₂O₅-free samples, the activation energy was lowered from 554 ± 15 kJ/mol for unseeded samples to 241 ± 17 kJ/mol for the samples with 15.4 wt% seeds. In the V₂O₅-containing samples, densification and phase formation occurred simultaneously. In the V₂O₅-free samples, however, phase formation was completed before densification. In both cases, ceramics with 95% relative density were obtained. In all cases, SBN53 formed directly, rather than via a variety of intermediate SBN solid solutions. The microstructure evolution was also studied.     

Robust Bi7.53Co0.47O11.92 nanoflowers for high-performance supercapacitor

The robust Bi_7.53Co_0.47O_11.92 nanoflowers on the nickel foam are first designed by a simple solvent thermal reaction followed by calcining. For its unique structural stability and good electrical conductivity, the Bi_7.53Co_0.47O_11.92 nanoflowers exhibit high specific capacitance of 1046 F g^?1 at 1 A g^?1 and outstanding rate capability (81.7% capacitance retention at 10 A g^?1) along with good cycling stability (80.5% capacitance retention after 3000 cycles). The asymmetric supercapacitor assembled with Bi_7.53Co_0.47O_11.92 and activated carbon delivers a high energy density of 41.1 Wh kg^?1. This research provides a guiding strategy for the synthesis of high-performance supercapacitor electrode material based on the bismuth.

Graphical abstract

Robust Bi_7.53Co_0.47O_11.92 nanoflowers were first designed by a feasible method and exhibited high specific capacitance and outstanding rate capability.

     

Anisotropic upper critical fields of disordered Nb0.53Ti0.47-Ge multilayers

Studies are reported of the upper critical fields of Nb_0.53Ti_0.47-Ge multilayers consisting of thick Ge layers and varying-thickness Nb_0.53Ti_0.47 layers. Both the angular dependence and the temperature dependence of the upper critical fields indicate a dimensional crossover at a Nb_0.53Ti_0.47 layer thickness near 200 Å. All the 2D samples display a cusplike upper critical field angular dependence with a sharper cusp for thinner Nb_0.53Ti_0.47 layers. The parallel upper critical fields are tentatively fitted with an expression combining the 2D field dependence of Rickayzen, the paramagnetic limiting behavior of Maki, and the disorder-related Coulomb interaction effects of Maekawa and Fukuyama. The perpendicular fields are fitted with the Maekawa, Ebisawa, and Fukuyama theory; better agreement is obtained for thinner Nb_0.53Ti_0.47 sublayers when the paramagnetic limiting effect is included.     

Radiation damage of In0.53Ga0.47As photodiodes by high energy particles

The performance degradation of In_0.53Ga_0.47As p-i-n photodiodes, subjected to a 220-MeV carbon particle irradiation in the fluence range 10¹⁰ to 10¹³ cm^–2, is reported. It is shown that the increase of the dark current scales roughly with the displacement damage created in the n-type InGaAs region. The degradation of the photo-current, on the other hand, does not scale with the displacement damage, for all irradiations studied. Therefore, it is believed that the photo-current suffers from increased surface recombination, which is related to the ionization damage created in the passivation layer.     

High field transport characteristics of minority electrons in p-In0.53Ga0.47As

Measurements of the static current-voltage characteristics of photoexcited minority electrons in p-In_0.53Ga_0.47As are reported. Photoluminescence measurements are also presented. These results are discussed in terms of the theory for high field photoconductivity and the recently reported velocity-field characteristics for minority electrons in In_0.53Ga_0.47As.     

In0.53Ga0.47As/InP(001)薄膜表面重构的研究

通过扫描隧道显微镜(STM)以及反射式高能电子衍射(RHEED)对在不同As4等效束流压强(As4BEP)下生长的In0.53 Ga0.47 As薄膜表面重构进行研究.研究发现在两种As4 BEP条件下,样品表面重构都以(4×3)/(n×3)为主,并存在c(6×4)、β2(2×4)以及α2(2×4)三种重构类型.和低As4 BEP条件相比,高As4 BEP条件下反射式高能电子衍射仪图像更加清晰,高分辨率的STM扫描图片也能够分辨出各种重构类型.对高分辨率的STM扫描图像进行进一步分析得到,随着As4 BEP的升高,β2(2×4)重构类型明显减少,这是由于高As4 BEP减少In偏析,从而抑制β2(2×4)重构的产生.