Liquid phase epitaxial growth of GaxIn1−xP

Single crystal epitaxial layers of Ga_xln_1−xP alloys have been grown by the steady-state liquid phase epitaxial growth technique on (111)B GaAs substrates. The crystal growth process has been studied in detail and the resultant epitaxial layers have been characterized with respect to their structural, electrical and optical properties. Epitaxial layers of good structural quality could be grown only in the composition range x = 0.48 to 0.53, where the lattice parameter is close to that of the GaAs substrate. The band gap of these crystals was in the range 1.86 – 1.92 eV as determined by optical absorption and photoluminescence measurements.     

Origin of void defects in Hg1−xCdxTe grown by molecular beam epitaxy

Characterization of defects in Hg_1−xCd_xTe compound semiconductor is essential to reduce intrinsic and the growth-induced extended defects which adversely affect the performance of devices fabricated in this material system. It is shown here that particulates at the substrate surface act as sites where void defects nucleate during Hg_1−xCd_xTe epitaxial growth by molecular beam epitaxy. In this study, we have investigated the effect of substrate surface preparation on formation of void defects and established a one-to-one correlation. A wafer cleaning procedure was developed to reduce the density of such defects to values below 200 cm⁻². Focal plane arrays fabricated on low void density materials grown using this new substrate etching and cleaning procedure were found to have pixel operability above 98.0%.     

Growth and characterization of InAsSb layers on GaSb substrates by liquid phase epitaxy

High quality InAs_1−xSb_x semiconductor films were successfully grown on (100) GaSb single crystal substrates using liquid phase epitaxy technique (LPE). The crystalline structure and lattice mismatch between film and substrate were investigated by high-resolution X-ray diffraction (HRXRD). The surface roughness and the interface morphology of the epitaxial film-on-substrate were characterized by atomic force microscopy (AFM), scanning electron microscopy (SEM) and optical microscopy. These results show the high-purity InAs_1−xSb_x epitaxial layers with mirror-like surface and rms ranges from 0.5 to 2 nm, and a sharp interface between substrate and ternary film. The optical properties of the layers were studied by low temperature photoluminescence (PL) spectroscopy. PL spectrum of the ternary film shows one radiative emission peak with narrow full width at half-maximum, which is an evidence of the good crystalline quality of the epilayer. It is worth to mention that the InAsSb films were grown on GaSb substrates for compositions of Sb with x=0.16 without introducing any intermediate composition buffer layer between the GaSb substrate and the film as reported in previous works.     

X-ray Diffraction Imaging of Improved Bulk-Grown CdZnTe(211) and Its Comparison with Epitaxially Grown CdTe Buffer Layers on Si and Ge Substrates

Large-area high-quality Hg_1–x Cd _x Te sensing layers for infrared imaging in the 8 μm to 12 μm spectral region are typically grown on bulk Cd_1–x Zn _x Te substrates. Alternatively, epitaxial CdTe grown on Si or Ge has been used as a buffer layer for high-quality epitaxial HgCdTe growth. In this paper, x-ray topographs and rocking-curve full-width at half-maximum (FWHM) data will be presented for recent high-quality bulk CdZnTe grown by the vertical gradient freeze (VGF) method, previous bulk CdZnTe grown by the vertical Bridgman technique, epitaxial CdTe buffer layers on Si and Ge, and a HgCdTe layer epitaxially grown on bulk VGF CdZnTe.     

Lpe growth of Hgl−xCdxTe using conventional slider boat and effects of annealing on properties of the epilayers

The epitaxial layers of Hg_1−xCd_xTe (0.17≦×≦0.3) were grown by liquid phase epitaxy on CdTe (111)A substrates using a conventional slider boat in the open tube H₂ flow system. The as-grown layers have hole concentrations in the 10¹⁷− 10¹⁸ cm⁻³ range and Hall mobilities in the 100−500 cm²/Vs range for the x=0.2 layers. The surfaces of the layers are mirror-like and EMPA data of the layers show sharp compositional transition at the interface between the epitaxial layer and the substrate. The effects of annealing in Hg over-pressure on the properties of the as-grown layers were also investigated in the temperature range of 250−400 °C. By annealing at the temperature of 400 °C, a compositional change near the interface is observed. Contrary to this, without apparent compositional change, well-behaved n-type layers are obtained by annealing in the 250−300 °C temperature range. Sequential growth of double heterostructure, Hg_l−xCd_xTe/Hg_l−yCd_yTe on a CdTe (111)A substrate was also demonstrated.     

Photoelectric converters with graded-gap layers based on ZnSe

Oriented polycrystalline CdSe layers are used as substrates for the epitaxial growth of ZnSe. In order to exclude the formation of defects due to mismatch between lattice constants of the active epitaxial layer and the substrate material, a graded-gap Cd _x Zn_{1 ? x} Se interlayer is grown. In this structure, the growth of donor-type point defects from the substrate through the growing layers leads to the appearance of a low-resistivity ZnSe layer. A barrier-forming p-Cu_1.8S layer is deposited onto the ZnSe. In order to reduce the recombination losses of photocarriers at the p-Cu_1.8S-n-ZnSe interface of the surface-barrier converter, an additional thin graded-gap layer incorporated into the space-charge region of the photoelectric converter is suggested and implemented.     

Ultra-Thin Si<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>Ge<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript> Dislocation Blocking Layers for Ge/Strained Si CMOS Devices

We demonstrate ultra-thin (<150 nm) Si_1−x Ge _x dislocation blocking layers on Si substrates used for the fabrication of tensile-strained Si N channel metal oxide semiconductor (NMOS) and Ge P channel metal oxide semiconductor (PMOS) devices. These layers were grown using ultra high vacuum chemical vapor deposition (UHVCVD). The Ge mole fraction was varied in rapid, but distinct steps during the epitaxial layer growth. This results in several Si_1−x Ge _x interfaces in the epitaxially grown material with significant strain fields at these interfaces. The strain fields enable a dislocation blocking mechanism at the Si_1−x Ge _x interfaces on which we were able to deposit very smooth, atomically flat, tensile-strained Si and relaxed Ge layers for the fabrication of high mobility N and P channel metal oxide semiconductor (MOS) devices, respectively. Both N and P channel metal oxide semiconductor field effect transister (MOSFETs) were successfully fabricated using high-k dielectric and metal gates on these layers, demonstrating that this technique of using ultra-thin dislocation blocking layers might be ideal for incorporating high mobility channel materials in a conventional CMOS process.     

Lattice-mismatched InGaAs layers grown by OMVPE on GaAs based compliant substrates

Thin GaAs compliant substrates have been developed in order to reduce the strain in lattice-mismatched layers during epitaxial overgrowth. Using OMVPE a variety of (30–80Å) thin GaAs layers were grown and successfully fused at 660°C on a host GaAs substrate with twist-angles between 10° and 45°. The resulting compliant substrates were overgrown with up to 3.6% lattice-mismatched and 1200 nm thick InGaAs layers. Nomarski phase contrast microscopy, photoluminescence and x-ray diffraction (XRD) were used to characterize the heteroepitaxial layers. The smooth and cross-hatch free morphology and the reduced DXRD peakwidth of the heteroepitaxial layers indicate a substantial improvement of the quality of heteroepitaxial material using compliant substrates.     

Effect of Se-doping on deep impurities in AlxGa1−xAs grown by metalorganic chemical vapor deposition

We have studied the effect of Se-doping on deep impurities in Al_xGa_1−xAs (x = 0.2∼0.3) grown by metalorganic chemical vapor deposition (MOCVD). Deep impurities in various Se-doped Al_xGa_1−xAs layers grown on GaAs substrates were measured by deep level transient spectroscopy and secondary ion mass spectroscopy. We have found that the commonly observed oxygen contamination-related deep levels at E_c-0.53 and 0.70 eV and germanium-related level at E_c-0.30 eV in MOCVD grown Al_xGa_1−xAs can be effectively eliminated by Se-doping. In addition, a deep hole level located at E_y + 0.65 eV was found for the first time in Se-doped Al_xGa_1-xAs when Se ≥2 × 10¹⁷ cm⁻³ or x ≥ 0.25. The concentration of this hole trap increases with increasing Se doping level and Al composition. Under optimized Se-doping conditions, an extremely low deep level density (N_t less than 5 × 10¹² cm⁻³, detection limit) Al_0.22Ga_0.78As layer was achieved. A p-type Al_0.2Ga_0.8As layer with a low deep level density was also obtained by a (Zn, Se) codoping technique.     

Growth by CVT and characterization of Hg1-xCdxTe epitaxial layers

Single crystal epitaxial layers of Hg_1-x Cd _x Te were grown on CdTe substrates employing the chemical vapor transport technique. Different growth temperatures, substrate orientations, and various pressures of Hgl₂ as a transport agent were used while the source materials had a fixed composition ofx = 0.2. The epilayers are of nearly uniform composition to a depth of about one-half of the layer thickness. Chemical etching of the as-grown epilayers revealed low etch pit densities in the range of 10³–10⁴ cm⁻². Rectangle-shaped etch pits are observed for the first time on the (100) oriented epilayers of this material. The growth temperature and Hgl₂ pressure used for the growth experiments have significant effects on the layer morphology and composition.     

Higher Dislocation Density of Arsenic-Doped HgCdTe Material

There is a well-known direct negative correlation between dislocation density and optoelectronic device performance. Reduction in detector noise associated with dislocations is an important target for improvement of mercury cadmium telluride (Hg_1?x Cd _x Te)-based material in order to broaden its use in the very long-wavelength infrared (VLWIR) regime. The lattice mismatch and differences in physical properties between substrates and the epitaxial Hg_1?x Cd _x Te layers cause an increased threading dislocation density. As demonstrated in this work, the presence of arsenic impurities via p-type doping in molecular beam epitaxy (MBE)-grown epitaxial crystal structure increases the etch pit density (EPD) of Hg_1?x Cd _x Te grown on Si substrates but not on CdZnTe substrates. This EPD increase is not observed in indium n-type-doped Hg_1?x Cd _x Te grown on either Si or CdZnTe substrates. This trend is also seen in layers with different cadmium compositions. All of the EPD variations of the structures studied here are shown to be independent of the MBE machine used to grow the structure. The fundamentals of this higher EPD are not yet completely understood.     

Crystal defects and interdiffusion behavior of Hg1−xCdxTe/(100)CdTe epitaxial layers grown by chemical vapor transport

Crystal defects of chemical vapor transport grown Hg_1−xCd_xTe on (100) CdTe structures have been investigated using chemical etching, wavelength-dispersive spectroscopy, x-ray rocking curve, and scanning electron microscopy methods The results indicate that the origin and spatial distribution of the misfit dislocations can be attributed to both the lattice parameter misfit and the inevitable interdiffusion occurring between the substrate and the epitaxial layer. It is proposed that the interdiffusion of Hg along the [100] direction is enhanced by dislocation channels and other defect cores along or near this direction owing to defects on the initial surface of the CdTe substrate. The results indicate that the subgrain boundaries in Hg_1−xCd_xTe are caused by slight misorientation of the lattices and polygonization of the defects during epitaxial layer growth, and by the propagation of the subgrain boundaries existing in the CdTe substrate.     

Structure investigation on Hg1−xCdxTe liquid phase epitaxial films grown by the meltetch technique

Hg_1−xCd_xTe films were grown by a modified meltetch liquid phase epitaxial (LPE) technique which includes both substrate and epilayer etchback steps. The crystal quality of epilayer has been investigated by means of transmission electron microscopy, scanning electron microscopy, and double crystal x-ray diffraction. It has been found that adequate meltetch of the substrate at the beginning of LPE provides a fresh and flat surface for epitaxial growth, while epilayer meltetch at the end of LPE may prevent spurious melt sticking.     

Growth and properties of Hg1-x Cdx Te epitaxial layers

The growth of epitaxial layers of mercury-cadmium-telluride (Hg_1-xCd_xTe) with relatively low x (0.2-0.3) from Te-rich solutions in an open tube sliding system is studied. The development of a semiclosed slider system with unique features permits the growth of low x material at atmospheric pressure. The quality of the films is improved by the use of Cd_1-yZ_yTe and Hg_1-xCd_xTe substrates instead of CdTe. The substrate effects and the growth procedure are discussed and a solidus line at a relatively low temperature is reported. The asgrown epitaxial layers are p-type with hole concentration of the order of 1·10¹⁷ cm⁻³, hole mobility of about 300 cm²·V⁻¹ sec⁻¹ and excess minority carrier life-time of 3 nsec, at 77 K.     

Defect reduction in Hg1−xCdxTe grown by molecular beam epitaxy on Cd0.96Zn0.04Te(211)B

A study on preparation of Cd_0.96Zn_0.04Te(211)B substrates for growth of Hg_1−xCd_xTe epitaxial layers by molecular beam epitaxy (MBE) was investigated. The objective was to investigate the impact of starting substrate surface quality on surface defects such as voids and hillocks commonly observed on MBE Hg_1−xCd_xTe layers. The results of this study indicate that, when the Cd_0.96Zn_0.04Te(211)B substrates are properly prepared, surface defects on the resulting MBE Hg_1−xCd_xTe films are reduced to minimum (size, ∼0.1 m and density ∼500/cm²) so that these MBE Hg_1−xCd_x Te films have surface quality as good as that of liquid phase epitaxial (LPE) Hg_1−xCd_xTe films currently in production in this laboratory.     

Electrical characterisation of Cu-Diffusedn-GaAs epitaxial layers using optical deep level transient spectroscopy

Undopedn ^--GaAs epitaxial layers were grown by OMVPE onn ⁺ (1 × 10¹⁸ cm³) and semi-insulating (SI) GaAs substrates. The as-grown epitaxial layers grown onn ⁺ substrates contained several deep level defects whereas those grown on SI substrates were, apart from the EL2, virtually “defect free”. Upon Cu diffusion, deep levels which may reduce hole and electron diffusion lengths and lifetimes, were formed. Optical deep level transient spectrocopy (ODLTS) has been used to identify such levels atE _v + 0,41 eV andE _c-0,31 eV respectively. The EO1 (EL2) trap concentration reduced after Cu had been diffused into the epitaxial layers. The magnitude of this reduction was approximately equal to the concentration of the trap found atE _c - 0,31 eV which suggests that the two may be related. Activation energies and capture cross-section values are presented for the deep levels detected in these epitaxial layers.     

Supercooling studies and LPE growth of Hg1−xCdxTe from Te-Rich solutions

Hg_1-xCd_xTe liquid phase epitaxial (LPE) layers were grown from well-stirred large (100 g) Te-rich Hg-Cd-Te solutions by the dipping method. Supercooling below the liquidus temperature in Te-rich solutions was studied by differential thermal analysis (DTA) and film growth results. Although supercooling of 20 to more than 100° C was routinely measured in small (2 g) sample melts, supercooling in larger melts (>100 g) was erratic and smaller. Factors affecting the degree of supercooling were identified and a Hg-reflux was found to be a major cause of erratic melt behavior. The LPE reactor was modified to correct the Hg-reflux action and a visual technique was developed for in situ determination of the liquidus temperature. A limited amount of supercooling was found in the melt after reactor modification but it was difficult to maintain for extended durations before spontaneous nucleation occurred. Consequently, programmed cooling rather than isothermal LPE was employed to grow many of the films reported here. Hg_1−xCd_xTe epitaxial layers ofx = 0.2 to 0.25 were grown on (111)B oriented CdTe substrates by cooling the melts only 1–2° C below the previously measured crystallization temperature. The small amount of cooling minimized composition variation with film thickness. Excellent surface morphology was obtained when slow cooling rates of 0.02–0.05° C/ min were used. Cooling rates greater than 0.2° C/min created rough, pitted surface. Precise substrate orientation was important in reducing surface terracing. Composition and thickness uniformities of the epitaxial films were excellent as a result of substrate rotation. Run-to-run reproducibility of film composition was ±0.01 inx. Hall measurements showed carrier concentrations in the range 2–20 × 10¹⁴ cm⁻³ with photoconductive lifetimes of 0.5–3.0 dms forx = 0.20 to 0.25.     

Charge-carrier lifetime in Hg1−x CdxTe (x=0.22) structures grown by molecular-beam epitaxy

Measurements of the charge carrier lifetime in epitaxial structures based on narrow-gap Hg_1−x Cd_xTe (x=0.22), grown by molecular-beam epitaxy with pulsed excitation using radiation at different wavelengths, are reported. It is shown that in p-type epitaxial films the lifetime is determined by the Auger recombination mechanism at temperatures corresponding to the impurity conductivity, and for n-type epitaxial films recombination via local centers is characteristic. Fiz. Tekh. Poluprovodn. 31, 774–776 (July 1997)     

Scanning electron microscopy and cathodoluminescence study of the epitaxial lateral overgrowth (ELO) process for gallium nitride

Traditional epitaxial growth of GaN by metalorganic vapor phase epitaxy (MOVPE) on mismatched substrates such as sapphire or SiC produces a columnar material consisting of many hexagonal grains ∼0.2–1.0 μm in diameter. The epitaxial-lateral-overgrowth (ELO) process for GaN creates a new material: single-crystal GaN. We have studied the ELO process for GaN grown by MOVPE in a vertical flow rotating substrate reactor. Characterization consisted of plan-view SEM and vertical-cross-section TEM studies, which revealed a large reduction in dislocation density in the overgrown regions of the GaN. Panchromatic and monochromatic cathodoluminescence images and spectra were used to study the spatial variation of the optical properties within the GaN ELO samples. The effects of growth temperature and stripe material on the overgrown layers were examined. Through the use of a higher substrate temperature during growth and the use of a SiN_x stripe material, the overgrown crystal shape has a smooth 2D top surface with vertical sidewalls. Applying a second ELO step, rotated by 60°, over a fully coalesced ELO layer yields a further reduction of defects in GaN overgrown surfaces.     

Epitaxial Growth of High-J c NdBa2Cu3O7−δ Films on RABiTS by Pulsed Laser Deposition

NdBa₂Cu₃O_7−δ (NdBCO) films were grown on rolling-assisted biaxially textured substrates (RABiTS) via pulsed laser deposition. c-Axis-oriented epitaxial NdBCO films with high performance were obtained under optimal deposition conditions. Transmission electron microscopy analysis shows that the NdBCO film grown on RABiTS has a clear interface with a CeO₂ cap layer and a nearly perfect lattice structure. The NdBCO film exhibits higher T _c of 93.7 K and better in-field J _c in magnetic fields and at all field orientations, compared to pure YBCO films.