中波双色光伏型HgCdTe红外探测器模拟研究

基于二维数值模型,对光伏型中波(MW1/MW2)HgCdTe双色红外探测器作了模拟计算,器件采用n-p-p-p-n结构、同时工作模式.计算了双色器件光谱响应及量子效率,重点分析了两个波段间的信号串音问题,以及高组分势垒层的作用.模拟结果显示,MW1(中波1,波长较短)对MW2(中波2,波长较长)的串音是辐射透过MW1区在MW2区中吸收引起的,串音与光吸收比近似成正比,而载流子扩散效应可以忽略不计.高组分阻挡层对载流子扩散引起的串音有显著的抑制作用,如果没有势垒层,载流子扩散引起的串音十分明显,甚至成为串音的主导因素.对于60×60μm2探测单元MW1和MW2的结电容大约为1.75pF/pixel.     

热电制冷HgCdTe中波红外探测器的研制

利用碲镉汞(HgCdTe)体晶材料,采用HgCdTe材料拼接技术、磨抛技术等成熟的探测器芯片制备工艺以及三级热电制冷技术,设计并研制出了热电制冷型13元HgCdTe中波红外光导探测器.在-50℃时,峰值电压响应率可达2.7×104 V/W,峰值探测率达到2.3×1010 cm·Hz1/2·W-1,响应波段在3.0~4.6μm之间,峰值响应波长为4.2μm.     

多元多色HgCdTe红外探测器

简要介绍利用不同波段的微型滤光片和不同响应波段的多元ＨｇＣｄＴｅ红外探测器,叙述了通过精密镶嵌技术组合而成的四波段２１５～２２５μｍ、８４～８９μｍ、１０３～１１３μｍ和１１５～１２５μｍ８８元多元多色探测器的设计原理和特性,以及多元多色探测器的组合工艺,并给出了各个通道的响应光谱特性和探测器的工作性能。研制成功的８８元多色红外探测器每个通道的平均探测率和响应率分别为：Ｄ２．１５～２．２５＝１．２×１０１２ｃｍＨｚ１／２／Ｗ和Ｒ２．１５～２．２５＝５．０×１０６Ｖ／Ｗ,Ｄ８．４～８．９＝７．０×１０１０ｃｍＨｚ１／２／Ｗ和Ｒ８．４～８．９＝１．６×１０４Ｖ／Ｗ,Ｄ１０．３～１１．３＝４．０×１０１０ｃｍＨｚ１／２／Ｗ和Ｒ１０．３～１１．３＝４．３×１０３Ｖ／Ｗ,Ｄ１１．５～１２．５＝３．０×１０１０ｃｍＨｚ１／２／Ｗ和Ｒ１１．５～１２．５＝３．３×１０３Ｖ／Ｗ,文中对这些结果进行了分析和讨论。     

红外探测器材料和HgCdTe材料的发展现状

简要介绍了主要的红外探测器材料,包括半导体光电探测器材料,热释电材料和热敏电阻材料,回顾了ＨｇＣｄＴｅ材料的发展历史和现状,液相外延,分子束外延和金属有机物汽相外延是目前生长ＨｇＣｄＴｅ薄膜的３种主要技术,作者认为,薄膜材料是今后红外探测器材料的主要研究课题。     

非制冷势垒型InAsSb基高速中波红外探测器

高速响应的中波红外探测器在自由空间光通信和频率梳光谱学等新兴领域的需求逐渐增加。中长波XB_nn势垒型红外光探测器对暗电流等散粒噪声具有显著抑制作用。本文在GaSb衬底上采用分子束外延技术生长了nBn和pBn两种结构的InAsSb/AlAsSb/AlSb中波红外光探测器材料,并通过微纳加工工艺制备了可用于射频响应特性测试的GSG结构探测器。XRD和AFM的测试结果表明,两种结构的外延片都具有较好的晶体质量。器件暗电流测试结果表明,相较于nBn器件,在室温和反向偏压400 mV的工作条件下,直径90 μm的pBn器件表现出更低的暗电流密度0.145 A/cm2,说明该器件在室温非制冷环境下表现出较低的噪声水平。不同台面直径的探测器的暗电流测试表明,pBn器件的表面电阻率低于对照的nBn器件的表面电阻率。另外,根据探测器的电容测试结果,可零偏压工作的pBn探测器具有完全耗尽的势垒层和部分耗尽的吸收区,nBn的吸收区也存在部分耗尽。探测器的射频响应特性表明,直径90 μm的pBn器件的响应速度在室温和3 V反向偏压下可达2.62 GHz,对照的nBn器件的响应速度仅为2.02 GHz,响应速度提升了29.7%,初步实现了在中红外波段下可快速探测的室温非制冷势垒型光电探测器。     

采用叠盖电极的高性能光导HgCdTe红外探测器

介绍叠盖电极探测器的物理机理和结构，与标准结构探测器比较，其响应率和黑体探测率均有大的增长，实验结果表明响应率增长约１倍，赤体探测率增主３０％。无需改变现有工艺，成功制备实用工程探测器，性能明显提高。     

非制冷红外焦平面探测器研究进展与趋势

描述了国外高光谱红外焦平面探测器组件的发展状况和工程应用情况,并介绍了国内高光谱红外焦平面探测器组件的研究进展。通过分析高光谱红外焦平面探测器的性能特点,提出了高光谱红外焦平面探测器方面的研究重点。     

碲镉汞高温中波红外探测器的制备研究

采用CdTe/ZnS双层钝化工艺制备了640×512@15 μm碲镉汞中波探测器。研究了退火温度对CdTe/MCT界面及CdTe钝化膜质量的影响。经测试表明:本公司制备的碲镉汞HOT中波探测器可以在125 K稳定工作,但与国外的先进技术相比仍存在差距,需要在MCT材料改进和器件加工工艺上继续深入研究,才能提高探测器的工作温度和稳定性。     

中波红外焦平面列阵探测器γ辐照效应

报道了γ射线辐照对薄膜材料碲镉汞(Hg1-xCdxTe)制备的中波红外焦平面列阵探测器性能的影响.γ射线辐照的剂量依次为3×106 rad、9×106rad、2×107 rad.测量了器件在辐照前及各个剂量辐照后的I-V特性、黑体响应、噪声等性能参数.通过分析实验数据,发现器件的暗电流,噪声随辐照剂量的增加而增大,黑体响应随辐照剂量的增大而减小.其中I-V特性受辐照影响最大,黑体响应和噪声对辐照不是很敏感.这些表明随着辐照剂量的增加,器件的性能逐步衰退.     

MWIR DLPH HgCdTe photodiode performance dependence on substrate material

Mid wavelength infrared p-on-n double layer planar heterostructure (DLPH) photodiodes have been fabricated in HgCdTe double layers grown in situ by liquid phase epitaxy (LPE), on CdZnTe and for the first time on CdTe/sapphire (PACE-1). Characterization of these devices shed light on the nature of the material limits on device performance for devices performing near theoretical limits. LPE double layers on CdZnTe and on PACE-1 substrates were grown in a horizontal slider furnace. All the photodiodes are p-on-n heterostructures with indium as the n-type dopant and arsenic the p-type dopant. Incorporation of arsenic is via implantation followed by an annealing step that was the same for all the devices fabricated. The devices are passivated with MBE CdTe. Photodiodes have been characterized as a function of temperature. R₀A_imp values obtained between 300 and 78K are comparable for the two substrates and are approximately a factor of five below theoretical values calculated from measured material parameters. The data, for the PACE-1 substrate, indicates diffusion limited performance down to 110K. Area dependence gives further indications as to the origin of diffusion currents. Comparable R₀A_imp for various diode sizes indicates a p-side origin. R₀A and optical characteristics for the photodiodes grown on lattice-matched CdZnTe substrates and lattice mismatched PACE-1 are comparable. Howover, differences were observed in the noise characteristics of the photodiodes. Noise was measured on 50 × 50 μm devices held under a 100 mV reverse bias. At 110K, noise spectrum for devices from the two substrates is in the low 10⁻¹⁵ A/Hz^1/2 range. This value reflects the Johnson noise of the room temperature 10¹⁰ Ω feedback resistor in the current amplifier that limits the minimum measurable noise. Noise at 1 Hz, −100 mV and 120K for the 4.95 μm PACE-1 devices is in the 1–2 × 10⁻¹⁴ A/Hz^1/2, a factor of 5–10 lower than previously grown typical PACE-1 n⁺-on-p layers. Noise at 120K for the 4.60 μm PACE-1 and LPE on CdZnTe was again below the measurement technique limit. Greatest distinction in the noise characteristics for the different substrates was observed at 163K. No excess low frequency noise was observed for devices fabricated on layers grown by LPE on lattice-matched CdZnTe substrates. Photodiode noise measured at 1Hz, −100 mV and 163K in the 4.60 μm PACE-1 layer is in the 1–2×10⁻¹³ A/Hz^1/2, again a factor of 5–10 lower than previously grown PACE-1 n⁺-on-p layers. More variation in noise (4×10⁻¹³−2×10⁻¹² A/Hz^1/2) was observed for devices in the 4.95 μm PACE-1 layer. DLPH devices fabricated in HgCdTe layers grown by LPE on lattice-matched CdZnTe and on lattice-mismatched PACE-1 have comparable R₀A and quantum efficiency values. The distinguishing feature is that the noise is greater for devices fabricated in the layer grown on lattice mismatched substrates, suggesting dislocations inherent in lattice mismatched material affects excess low frequency noise but not zero bias impedance.     

具有组分梯度的HgCdTe探测器光电特性

PN结分别制备在HgCdTe外延薄膜材料的Cd组分非线性分布区和线性分布区的高组分端,研究了具有组分梯度的HgCdTe探测器的光电特性。计算不同温度下组分梯度产生的内建电场,结果显示Cd组分线性分布产生的内建电场在100～200 V/cm,而Cd组分非线性分布使得样品表面薄层的内建电场高达2 000 V/cm,推测组分梯度产生的内建电场对光生少子运动的影响是引起两个样品光电性能差异的主要原因。通过分析样品响应率随温度的三种不同变化趋势,提出利用温度调控组分梯度产生的内建电场,有利于降低空间电荷效应,为大注入下提高HgCdTe探测器的饱和阈值提供了一种新的设计思路。     

MBE growth of HgCdTe on silicon substrates for large format MWIR focal plane arrays

HgCdTe p-on-n double layer heterojunctions (DLHJs) for mid-wave infrared (MWIR) detector applications have been grown on 100 mm (4 inch) diameter (211) silicon substrates by molecular beam epitaxy (MBE). The structural quality of these films is excellent, as demonstrated by x-ray rocking curves with full widths at half maximum (FWHMs) of 80–100 arcsec, and etch pit densities from 1 10⁶ to 7 10⁶ cm⁻². Morphological defect densities for these layers are generally less than 1000 cm⁻². Improving Hg flux coverage of the wafer during growth can reduce void defects near the edges of the wafers. Improved tellurium source designs have resulted in better temporal flux stability and a reduction of the center to edge x-value variation from 9% to only 2%. Photovoltaic MWIR detectors have been fabricated from some of these 100mm wafers, and the devices show performance at 140 K which is comparable to other MWIR detectors grown on bulk CdZnTe substrates by MBE and by liquid phase epitaxy.     

高工作温度中波红外碲镉汞焦平面研究

该文报道了昆明物理研究所高工作温度中波红外碲镉汞焦平面探测器器件的研究情况。通过优化焦平面器件结构参数,采用As离子注入形成p-on-n平面结器件技术,在液相外延生长的高质量原位In掺杂的碲镉汞薄膜上制备了阵列规格为640×512@15μm的中波红外焦平面探测器。利用变温杜瓦测试了焦平面芯片在不同工作温度下的光谱响应、器件暗电流、噪声等效温差、有效像元率以及盲元分布等,测试结果表明器件具备180K以上工作温度的能力。     

Variable area MWIR diodes on HgCdTe/Si grown by molecular beam epitaxy

Molecular beam epitaxy technique has been used to grow double layer heterostructure mercury cadmium telluride materials on silicon substrates for infrared detection in the mid-wavelength infrared transmission band. Test structures containing square diodes with variable areas from 5.76 × 10⁻⁶ cm² to 2.5×10⁻³ cm² are fabricated on them. The p on n planar architecture is achieved by selective arsenic ion implantation. The absorber layer characteristics for the samples studied here include a full width at half maximum of 100–120 arcsec from x-ray rocking curve, the electron concentration of 1−2 × 10¹⁵ cm⁻³ and mobility 3−5 × 10⁴ cm²/V-s, respectively at 80 K from Hall measurements. The minority carrier lifetime measured by photoconductive decay measurements at 80 K varied from 1 to 1.2 μsec. A modified general model for the variable area I–V analysis is presented. The dark current-voltage measurements were carried out at 80 K and an analysis of the dependence of zero-bias impedance on the perimeter/area ratio based on bulk, surface generation-recombination, and lateral currents are presented. The results indicate state-of-the art performance of the diodes in the midwavelength infrared region.     

百万像素级红外焦平面器件倒装互连工艺研究

介绍了倒装互连技术的工艺原理,阐述了红外焦平面器件倒装互连的工艺特点。通过系列实验和分析,最终优化并确定了百万像素级红外焦平面器件倒装互连的工艺参数,获得了良好的互连效果。     

基于双吸收结构的谐振腔增强型光探测器

为了实现对传统谐振腔增强型（RCE）光探测器的优化,提出了一种具有双吸收结构的RCE光探测器。首先从理论上分析了它的量子效率和高速响应特性,然后将其与传统的RCE光探测器进行了比较。结果表明,双吸收结构RCE光探测器在保持高速响应特性的基础上,其量子效率较传统RCE光探测器得到了进一步提高。实验上成功制备了双吸收结构的...     

长波长线列碲镉汞焦平面器件拼接工艺研究

长波5000元长线列碲镉汞焦平面器件由5个长波1000元混成芯片在拼接基板上交错排列组成。本文采用拼接互连设备的正贴方法进行单模块与拼接基板的拼接,试验结果表明:该拼接方法的拼接位置精度在X和Y轴方向均小于8 μm,在Z轴方向小于15 μm,满足需求。     

替代衬底上的碲镉汞长波器件暗电流机理

基于暗电流模型,通过变温I-V分析长波器件(截止波长为9~10μm)的暗电流机理和主导机制.实验对比了不同衬底、不同成结方式、不同掺杂异质结构与暗电流成分的相关性.结果表明,对于B+离子注入的平面结汞空位n~+-on-p结构,替代衬底上的碲镉汞(HgCdTe)器件零偏阻抗(R0)在80 K以上与碲锌镉(CdZnTe)基碲镉汞器件结阻抗性能相当.但替代衬底上的HgCdTe因结区内较高的位错,使得从80 K开始缺陷辅助隧穿电流(I_(tat))超过产生复合电流(I_(g-r)),成为暗电流的主要成分.与平面n~+-on-p器件相比,采用原位掺杂组分异质结结构(DLHJ)的p~+-on-n台面器件,因吸收层为n型,少子迁移率较低,能够有效抑制器件的扩散电流.80 K下截止波长9.6μm,中心距30μm,替代衬底上的p~+-on-n台面器件品质参数(R0A)为38Ω·cm2,零偏阻抗较n-on-p结构的CdZnTe基碲镉汞器件高约15倍.但替代衬底上的p+-on-n台面器件仍受体内缺陷影响,在60 K以下较高的Itat成为暗电流主导成分,其R0A相比CdZnTe基n~+-on-p的HgCdTe差了一个数量级.