1,2,3-苯并三氮唑铜缓蚀剂的研究进展

苯并三唑(BTAH)是一种非常有效的铜及其合金的缓蚀剂。到目前为止有许多关于BTAH缓蚀作用的研究,但其缓蚀机制仍然不为所知。对BTAH的缓蚀研究作出了总结,以便为进一步研究和开发新的高效缓蚀剂提供依据。     

原子力显微镜研究苯并三氮唑对铜的缓蚀作用

铜以及铜合金由于其优良的抗腐蚀性能,广泛用在冷却水系统中,苯并三氮唑(BTA)常常作为铜的缓蚀剂。将传统电化学方法和原子力显微镜(AFM)测试技术相结合,对人造海水中BTA作用于铜电极的缓蚀行为进行了研究。结果表明,BTA能够有效减缓铜在海水中的腐蚀,且随着缓蚀剂浓度的增加,缓蚀效果越明显,100 mg/L的BTA就能够高效的保护铜。电化学结果表明,BTA能够在铜的表面形成致密的保护膜[CuBTA]n;AFM测试表明,随着时间的进行,保护膜越来越致密,保护性能也越好。     

铜及铜合金用缓蚀剂——苯并三氮唑及其衍生物的发展

苯并三氮唑是一种优秀的金属缓蚀剂，为提高其对多种金属及各种介质中的缓蚀 效率，进一步对其衍生物的开发研究工作已经受到科技界的关注。专家黄魁元简要介绍了国内外金属缓蚀剂“苯并三氮唑及其衍生物”对铜及铜合金在腐蚀性介质中及不同工艺条件下的缓触效果，并指出笨并三氮唑及其衍生物在金属防护中的开发研究前景。     

苯并三氮唑及衍生物开发应用研究

介绍了苯并三氮唑及衍生物的开发,应用,研究进展情况,对合成的１０余种可聚合单体在不同方面的应用做了详细阐述,对其开发应用前景做了展望。     

苯并三氮唑-季铵盐体系缓蚀处理对铜耐腐蚀和抑菌性能的影响

采用由苯并三氮唑(BTA)和季铵盐QAS 1622组成的溶液对铜进行缓蚀处理。研究了BTA和QAS 1622的质量浓度及温度对所得膜层耐腐蚀性能和抑菌性能的影响。结果表明,BTA是一种有效的铜缓蚀剂,季铵盐的加入能够进一步提升其缓蚀效果。当采用3 g/L BTA和1 g/L QAS 1622组成的溶液在温度40°C下对铜处理10 min时,所得的膜层在中性3%NaCl溶液中具有最好的耐蚀性,对铜的缓蚀效率达到98.7%。覆膜法抑菌试验结果表明,3 g/L BTA缓蚀处理对铜的抑菌性能无明显影响,而加入1 g/L QSA 1622能够提升铜的抑菌性能,与大肠杆菌接触1 h的抑菌率达到99.9%。     

冷却水中苯并三氮唑的测定

本文对紫外光度法测定冷却水中苯并三氮唑含量进行了较详细的条件试验,表明酸度变化是干扰的主要来源,确定在pH4～6,波长265nm条件下可消除酸度的影响;用盐酸羟胺可消除NaNO_2的干扰,方法简便快速、准确可靠。     

硬脂酰苯并三氮唑的合成及其润滑性能研究

采用二环己基碳二亚胺缩合法由硬脂酸和苯并三氮唑合成了硬脂酰笨并三氮唑,产率85%,并通过FTIR证实获得了目标产物.采用四球实验机评价了硬脂酰苯并三氮唑作为润滑添加剂的抗磨减摩性能.结果表明,所合成的硬脂酰苯并三氮唑具有较高的稳定性和很高的抗极压性能,可以明显改善基础油的抗磨减摩性能.     

苯并三氮唑在有机合成中的应用

综述了苯并三氮唑的应用进展,主要是讨论了利用苯并三氮唑及其衍生物制备各类化合物的方法。     

苯并三氮唑合成的改进

介绍用邻硝基氯苯与水合肼为原料合成 1-羟基苯并三氮唑 ,再还原成苯并三氮唑。较好的工艺条件为反应温度为 85℃ ,时间为 4h ,用乙酸乙酯为萃取剂 ,铁粉分次加入。     

The effect of benzotriazole on mass transfer in the corrosion of a copper rotating disk electrode

The effect of benzotriazole, BTA, on mass transfer in dissolution-corrosion of the copper rotating disk electrode in 0.02 M Fe(III)–0.5 M H₂SO₄ has been studied by means of atomic absorption spectrometry. The mass transfer coefficient, K, was determined from the slope of ln(C ₀/C)_Fe(III) vs. time plots. In the absence of BTA the corrosion process can be described by the correlation Sh = KR/D = 4.47Re ^0.5. The difference in values between Sh and Sh _Levich, and the change in slope in the Arrenhius plot points to mixed control for the cathodic process Fe³⁺ + 1e^– Fe ²⁺ and charge transfer control for the anodic process, Cu Cu²⁺ + 2e. The average activation energies were 7.7 kJ mol^–1 and 19.5 kJ mol^–1 at (500–1500) and (2000–3000) rpm, respectively. At low concentration of BTA the inhibiting action of BTA increases with concentration and with rotation speed. For [BTA] 5 × 10^–3 M, the K value, 10^–4 cm s^–1, remains constant and is independent of rotation rate. The morphology of the copper rotating disk after corrosion in the absence and presence of BTA was examined using scanning electron microscopy (SEM).     

用扫描隧道显微镜研究铜表面苯并三氮唑吸附膜的结构形态

It is observed by scanning tunneling microscopy (STM) that the adsorbed Benzotriazole (BTA) on copper is long in shape and has an irregular rectangle.The growth of BTA on copper is in the from of polymeric chain and mainly in one dimension rather than two dimensions.The copper surface covered by BTA becomes flatter,smoother and the roughness was smaller than that of bare copper,so the corrosion is largely decreased.However,many grooves can be seen between BTA polymeric chains in which corrosion may exist to a degrees.     

Experimental and atomistic simulation studies of corrosion inhibition of copper by a new benzotriazole derivative in acid medium

The efficiency of N-(2-thiazolyl)-1H-benzotriazole-1-carbothioamide (TBC) as a non-toxic corrosion inhibitor for copper in 0.5 M HCl has been tested by weight loss and electrochemical techniques. Electrochemical techniques show that TBC is a mixed-type inhibitor and its inhibition mechanism on copper surface is adsorption assisted by H-bond formation. Impedance measurements show a wide peak presumably given by more than one time constant in the presence of TBC. Also, impedance results show that the values of CPEs (constant phase elements) tend to decrease and both polarization resistance and inhibition efficiency tend to increase with increasing of TBC concentration due to an increase in the electric double layer. Monte Carlo simulations incorporating molecular mechanics and molecular dynamics show that the TBC adsorb on the copper surface firmly through the thiazolyl and carbothioamide groups, the adsorption energy as well as hydrogen bond length have been calculated for both TBC and benzotriazole (BTA) for comparison. Quantum chemical calculations reveal that TBC has higher HOMO, lower LUMO, lower energy gap and lower dipole moment (μ) than BTA, which proves that TBC is better copper corrosion inhibitor compared with BTA in 0.5 M HCl.     

铜及铜合金电化学抛光

在酸性条件下对紫铜进行了电化学抛光,其工艺流程主要包括:除油,活化,电化学抛光和真空干燥.采用正交试验,讨论了抛光液中各组分及各工艺参数对抛光效果的影响,得出了最佳配方和工艺条件:30%硫酸 60%磷酸 5%去离子水 5%添加剂(即3%乙醇 1.8%尿素 0.2%苯并三氮唑),温度45℃,电流密度40A/dm2.     

聚天冬氨酸对铜缓蚀作用的光电化学研究

用光电化学方法研究了绿色水处理药剂聚天冬氨酸对铜的缓蚀作用,铜在硼酸-硼砂缓冲溶液（pH=9.2）中,表面的Cu₂O膜显p-型光响应,添加适量缓蚀剂聚天冬氨酸（PASP）后,PASP吸附在铜电极表面成膜促使Cu₂O膜增厚,体现在电位在负向扫描过程中Cu₂O膜的p-型光电流增大。 p-型光电流越大,缓蚀性能越好。当PASP浓度为3 mg·L^-1时,Cu₂O膜的p-型光电流最大,缓蚀性能最好。 Cl^-的存在会阻止PASP在铜电极表面的吸附,使Cu₂O膜暴露而受侵蚀,导致了PASP的缓蚀性能变差。     

Benzotriazole as inhibitor for copper with and without corrosion products in aqueous polyethylene glycol

Electrochemical methods, including polarization experiments and impedance spectroscopy, were used to evaluate the effectiveness of benzotriazole (BTA) in an aqueous solution of polyethylene glycol (PEG) in protecting polished archaeological copper or archaeological copper covered with corrosion products. The adsorption of PEG on the polished copper significantly limited the corrosion current. The presence of benzotriazole enhanced the protection of the polished copper, giving maximum protection at a concentration of 10^–2moll^–1 of BTA in 20 vol% PEG 400 solution. On the other hand, PEG solutions caused degradation of the corrosion products of the copper. This degradation increased with time. When BTA was added, the corrosion products were preserved and, the higher the BTA concentration, the more the corrosion current decreased. In PEG 400 solution protection of the corrosion products of the copper by BTA improved over time.     

铜材质酸洗复合缓蚀剂Lan-826和苯并三氮唑的最佳配比

详细考察了在对铜及铜合金进行酸洗过程中,单独加入Lan-826、苯并三氮唑以及按不同配比混合加入时腐蚀率的变化情况,确定了混合加入缓蚀剂的最佳配比。     

Corrosion inhibition of mild steel by benzotriazole derivatives in acidic medium

Benzotriazole derivatives, namely, N-[1-(benzotriazolo-1-yl)alkyl] aryl amine (BTMA), N-[1-(benzotriazolo-1-yl)aryl] aryl amine (BTBA), and 1-hydroxy methyl benzotriazole (HBTA), were synthesized and their inhibition behaviour on mild steel in 0.5 M H₂SO₄ at room temperature was investigated by various techniques. Preliminary screening of the inhibition efficiency (IE) was carried out using weight-loss measurements. Potentiodynamic polarization and AC impedance studies were used to investigate the inhibitor mechanism. Benzotriazole derivatives were found to act as mixed type inhibitors. Among the compounds studied, HBTA exhibited the best performance giving more than 95% IE in H₂SO₄ solutions. The passive film characterization was done using FTIR spectrum.     

Copper electrodeposition in sulphate solutions in the presence of benzotriazole

DC and pulse plating of copper in acidic sulphate solutions containing benzotriazole (BTA) has been studied. When BTA is the only additive present, it generally has a stronger effect than the plating mode and significantly enhances deposit morphology and surface brightness over that produced in additive-free solutions. XPS and voltammetry analyses indicate that BTA is present at the surface of the deposit, but not through the entire coating, and does not become depleted within the solution over the course of plating. This may help explain why the initial surface smoothness and brightness is maintained as the coating grows beyond 5 μm thick. Plating mode does have a strong effect on deposit morphology under specific conditions. Pulse current plating at low frequency (50 Hz) and low duty cycle (20%) produces deposits with poorer quality than that obtained by DC plating. Pulse reverse plating yields very coarse and dull coatings when the frequency is low enough for metal dissolution to occur during the reverse time. Regardless of the plating mode, the addition of Cl⁻ eliminates most of the beneficial effects of BTA and leads to very rough and dull deposits. The observed effects are discussed in light of previous research on the electrodeposition and corrosion of the Cu–BTA and Cu–BTA–Cl systems.