Microstructure and strength of brazed joints of Ti3Al-base alloy with NiCrSiB

Brazing of Ti₃Al alloys with the filler metal NiCrSiB was carried out at 1273–1373 K for 60–1800 s. The relationship of brazing parameters and shear strength of the joints was discussed, and the optimum brazing parameters were obtained. When products are brazed, the optimum brazing parameters are as follows: brazing temperature is 1323–1373 K, brazing time is 250–300 s. The maximum shear strength of the joint is 240–250 MPa. Three kinds of reaction products were observed to have formed during the brazing of Ti₃Al alloys with the filler metal NiCrSiB, namely, TiAl₃ (TiB₂) intermetallic compounds formed close to the Ti₃Al alloy. TiAl₃+AlNi₂Ti (TiB₂) intermetallic compounds layer formed between TiAl₃ (TiB₂) intermetallic compounds and the filler metal and a Ni[s,s] solid solution formed in the middle of the joint. The interfacial structure of brazed Ti₃Al alloy joints with the filler metal NiCrSiB is Ti₃Al/TiAl₃ (TiB₂)/TiAl₃+AlNi₂Ti (TiB₂)/Ni[s,s] solid solution/TiAl₃+AlNi₂Ti (TiB₂)/TiAl₃ (TiB₂)/Ti₃Al, and this structure will not change with brazing time once it forms. The formation of over many intermetallic compounds TiAl₃+AlNi₂Ti (TiB₂) results in embrittlement of the joint and poor joint properties. The thickness of TiAl₃+AlNi₂Ti (TiB₂) intermetallic compounds increases with brazing time according to a parabolic law. The activation energy Q and the growth velocity K₀ of the reaction layer TiAl₃+AlNi₂Ti (TiB₂) in the brazed joints of Ti₃Al alloys with the filler metal NiCrSiB are 349 kJ/mol and 24.02 mm²/s, respectively, and the growth formula was y²=24.04exp(−41977.39/T)t. Careful control of the growth of the reaction layer TiAl₃+AlNi₂Ti (TiB₂) can influence the final joint strength.     

A new filler metal with low contents of Cu for high strength aluminum alloy brazed joints

The effect of Cu with low contents of 10, 12, 15 wt.% on the microstructure and melting point of Al–Si–Cu–Ni alloy has been investigated. Results showed that low-melting-point properties of Al–Si–Cu–Ni alloys with low contents of Cu were attributed to disappearance of Al–Si binary eutectic reaction and introduction of Al–Si–Cu–Ni quaternary reaction. With raising Cu content from 10 to 15 wt.%, the amount of complex eutectic phases formed during low temperature reactions (Al–Cu, Al–Si–Cu and Al–Si–Cu–Ni alloy reactions) increased and the melting temperature of Al–Si–Cu–Ni filler metals declined. Brazing of 6061 aluminum alloy with Al–10Si–15Cu–4Ni (all in wt.%) filler metal of a melting temperature range from 519.3 to 540.2 °C has been carried out successfully at 570 °C. Sound joints can be obtained with Al–10Si–15Cu–4Ni filler metal when brazed at 570 °C for holding time of 60 min or more, and achieved high shear strength up to 144.4 MPa.     

Microstructure and strength of high nitrogen steel joints brazed with Ni-Cr-B-Si filler

Brazing of high nitrogen austenitic stainless steels was carried out by using Ni-Cr-B-Si filler metal. The effects of brazing temperature (1020–1100°C) on the microstructure and shear strength of the joints were investigated. The results show that BN compounds with hexagonal structure are formed at the interface by the reaction of N from substrate and B from filler. The brittle Cr₅B₃ compounds with high microhardness are observed in the centre of brazing seam. The BN content increases and the Cr₅B₃ content decreases with the increase in brazing temperature. However, the content of BN compounds played a determinable role on the joint strength. The optimal shear strength of joints was 176.7?MPa when the joining temperature was 1020°C.     

Effect of Si3N4-particles addition in Ag-Cu-Ti filler alloy on Si3N4/TiAl brazed joint

A novel composite filler alloy was developed by introducing Si₃N_4p (p = particles) into Ag-Cu-Ti filler alloy. The brazing of Si₃N₄ ceramics and TiAl intermetallics was carried out using this composite filler alloy. The typical interfacial microstructure of brazed joints was: TiAl/AlCu₂Ti reaction layer/Ag_(s,s) + Al₄Cu₉ + Ti₅Si_3p + TiN_p/TiN + Ti₅Si₃ reaction layer/Si₃N₄. Effects of Si₃N_4p content in composite filler alloy on the interfacial microstructure and joining properties were investigated. The distribution of Ti₅Si_3p and TiN_p compounds in Ag-based solid solution led to the decrease of the mismatch of the coefficient of thermal expansion (CTE) and the Young's modulus between Si₃N₄ and TiAl substrate. The maximum shear strength of 115 MPa was obtained when 3 wt.% Si₃N_4p was added in the composite filler alloy. The fracture analysis showed that the addition of Si₃N_4p could improve the mechanical properties of the joint.     

Microstructures and mechanical properties of Ti3Al/Ni-based superalloy joints brazed with AuNi filler metal

For the purpose of high-temperature service and the weight reduction in aviation engineering applications, the dissimilar joining of Ti₃Al-based alloy to Ni-based superalloy (GH536) was conducted using Au-17.5Ni (wt%) brazing filler metal. The microstructure and chemical composition at the interfaces were investigated by scanning electron microscope, X-ray diffraction and transmission electron microscope. The diffusion behaviors of elements were analyzed as well. The results indicated that the Ti₃Al/GH536 joint microstructure was characterized by multiple layer structures. Element Ni from Au-Ni filler metal reacted with Ti₃Al base metal, leading to the formation of AlNi₂Ti and NiTi compounds. Element Ni from Ti₃Al base metal reacted with Ni and thus Ni₃Nb phase was detected in the joint central area. Due to the dissolution of Ni-based superalloy, (Ni,Au) solid solution ((Ni,Au)ss) and Ni-rich phase were visible adjacent to the superalloy side. The average tensile strength of all the joints brazed at 1253 K for 5–20 min was above 356 MPa at room-temperature. In particular, the joints brazed at 1253 K/15 min presented the maximum tensile strength of 434 MPa at room-temperature, and the strength of 314 MPa was maintained at 923 K. AlNi₂Ti compound resulted in the highest hardness area and the fracture of the samples subjected to the tensile test mainly occurred in this zone.     

Microstructure and brazing mechanism of porous Si3N4/Invar joint brazed with Ag-Cu-Ti/Cu/Ag-Cu multi-layered filler

Porous Si_3N_4 was brazed to Invar alloy in this study, and Ag-Cu-Ti/Cu/Ag-Cu multi-layered filler was designed to inhibit the formation of Fe_2Ti and Ni_3Ti intermetallic compounds. The effects of the brazing temperature and the thickness of Cu interlayer on the microstructure and mechanical properties of brazed joints were investigated. The typical microstructure of the joint brazed with multi-layered filler was porous Si_3N_4/TiN + Ti_5Si_3/Ag-Cu eutectic/Cu/Ag-Cu eutectic/Cu-rich layer + diffusion layer/Invar. When the brazing temperature increased, the reaction layer at the ceramic/filler interface grew thicker and the Cu interlayer turned thinner. As the thickness of Cu interlayer increased from 50 to 150μm, the joint strength first increased and then decreased. In this research, the maximum shear strength(73 MPa) was obtained when being brazed at 1173 K with a 100μm Cu interlayer applied in the filler, which was 55% higher than that brazed with single Ag-Cu-Ti brazing alloy and had reached 86% of the ceramic. The release of residual stress and the barrier effect of Cu interlayer to inhibit the formation of Fe_2Ti and Ni_3Ti intermetallics played the major role in the improvement of joint strength.     

Interfacial microstructure of Si3N4/Si3N4 brazing joint with Cu–Zn–Ti filler alloy

In this study, Si₃N₄ ceramic was jointed by a brazing technique with a Cu–Zn–Ti filler alloy. The interfacial microstructure between Si₃N₄ ceramic and filler alloy in the Si₃N₄/Si₃N₄ joint was observed and analyzed by using electron-probe microanalysis, X-ray diffraction and transmission electron microscopy. The results indicate that there are two reaction layers at the ceramic/filler interface in the joint, which was obtained by brazing at a temperature and holding time of 1223 K and 15 min, respectively. The layer nearby the Si₃N₄ ceramic is a TiN layer with an average grain size of 100 nm, and the layer nearby the filler alloy is a Ti₅Si₃N_x layer with an average grain size of 1–2 μm. Thickness of the TiN and Ti₅Si₃N_x layers is about 1 μm and 10 μm, respectively. The formation mechanism of the reaction layers was discussed. A model showing the microstructure from Si₃N₄ ceramic to filler alloy in the Si₃N₄/Si₃N₄ joint was provided as: Si₃N₄ ceramic/TiN reaction layer/Ti₅Si₃N_x reaction layer/Cu–Zn solution.     

电子束选区熔化成形Ti_(2)AlNb合金微观组织与性能EI北大核心CSCD

Ti_(2)AlNb基合金由于具有优异的高温比强度、高温抗蠕变性能和较高的断裂韧度,因而被认为是替代传统镍基高温合金最具潜力的材料。采用电子束选区熔化(selective electron beam melting,SEBM)技术成形Ti-22Al-25Nb合金,通过工艺优化获得高致密度(5.42-5.43 g/cm^(3))的成形试样。研究了沉积态和热等静压(hot isostatic pressing,HIP)态试样的显微组织演变、物相演变及其对力学性能的影响。结果表明:沉积态和HIP态组织呈现出沿成形方向的柱状晶结构,且均由B2,O和α_(2)相组成,沉积态试样中的O/α_(2)相自上而下逐渐增加,HIP后组织趋于均匀化,且相对沉积态,析出相的宽度缩小、数量减少。沉积态试样中析出相较多的下部区域具有更高的显微硬度((345.87±5.09)HV),HIP后试样硬度值增加至388.91-390.48HV。沉积态试样室温抗拉强度和伸长率分别为(1061±23.71)MPa和(3.67±1.15)%,HIP后抗拉强度增加至(1101±23.07)MPa,伸长率降低至3.5%。     

Joining of Cf/SiBCN composite with CuPd-V filler alloy

Two compositions of CuPd-V system filler alloy were designed for joining the Cf/SiBCN composite. Their dynamic wettability on the Cf/SiBCN composite was studied with the sessile drop method. The CuPd-8 V alloy exhibited a contact angle of 57° after holding at 1170℃ for 30 min, whereas for CuPd-13 V alloy,a lower contact angle of 28°can be achieved after heating at 1200 ℃ for 20 min. Sound C_f/SiBCN joints were successfully produced using the latter filler alloy under the brazing condition of(1170-1230)℃for 10 min. The results showed that the active element V strongly diffused to the surface of Cf/SiBCN composite, with the formation of V_2 C/VN reaction layer. The microstructure in the central part of the joint brazed at 1200 ℃ was characterized by the V_2 C/VN particles distributing scatteringly in CuPd matrix. The corresponding joints showed the maximum three-point bend strength of 82.4 MPa at room temperature.When the testing temperature was increased to 600 0 C, the joint strength was even elevated to 108.8 MPa.Furthermore, the joints exhibited the strength of 92.4 MPa and 39.8 MPa at 800 ℃ and 900 ℃, respectively.     

Formation of nanocrystallized and amorphous structures in the cavitation-eroded surface for Ti3Al–Nb alloy

Cavitation erosion of Ti₃Al–Nb alloy was investigated by using rotating disc equipment. It is showed that Ti–24Al–15Nb–1Mo alloy has excellent cavitation erosion resistance. The cavitation-eroded surface was observed by TEM and nanocrystallized and amorphous structures were found in some zones. On the basis of experimental results and analyses, the impacts of microjets can cause plastic deformation in the specimen surface layer. Because of the transient high temperature produced by the collapse of bubbles, some deformed zones are recrystallized and a nanocrystallized structure is formed. The nanocrystallized structure with lower melting point is then molten by transient high temperature and quickly solidified in water, which produces an amorphous structure.     

Microstructure Evolution and Tensile Properties of Ti3Al/Ni-based Superalloy Welded Joint

In the present work,the dissimilar joining of a Ti_3AI-based alloy to a Ni-based superalloy was attempted by gas tungsten arc(GTA) welding technology.Sound joints were successfully achieved by using a Cu—Ni alloy as filler material.According to X-ray energy dispersive spectroscopy and X-ray diffraction analysis results three transitional layers at the weld/Ti_3AI interface were verified as follows:Ti_2AINb phase dissolved with Cu and Ni;AI(Cu,Ni)_2Ti,(Cu,Ni)_2Ti and(Nb,Ti) solid solution;Cu-rich phase and a complex multi-element phase.The In718/weld interface is characterized by solid solutions of Ni,Cu,Cr,Fe and Nb.The average tensile strength of the as-welded joints at room temperature is 1 63 MPa,and after a post—weld heat treatment it is increased slightly to 177 MPa.The fracture occurred at the surfacial layer of the joined Ti_3AI base alloy,indicating that the Ti_2AINb layer dissolved with Cu and Ni is the weak link of the Ti_3AI/ln71 8 joint.     

TaC/Ti3SiC2复合材料的制备与性能

采用反应热压烧结法制备了TaC/Ti₃SiC₂复合材料,借助XRD、SEM、能谱仪以及热重分析等,研究了TaC含量对TaC/Ti₃SiC₂复合材料的相组成、显微结构、力学性能和抗氧化性的影响。结果表明: 采用反应热压烧结法可以制备出致密的TaC/Ti₃SiC₂复合材料,该复合材料的主晶相为Ti₃SiC₂和TaTiC₂,还含有少量的TiC;随着TaC含量的增加,TaC/Ti₃SiC₂复合材料的弯曲强度和断裂韧性呈现先增大后降低的变化趋势,当TaC含量为30wt%时,二者均达到最大值,此时弯曲强度为404 MPa,断裂韧性为4.10 MPa·m^1/2;TaC的引入,使TaC/Ti₃SiC₂复合材料抗氧化性能明显优于Ti₃SiC₂材料。     

渗氢对Ti-25Al-10Nb-3V-1Mo锻态合金显微组织的影响

对锻态Ti-25Al-10Nb-3V-1Mo合金进行了渗氢处理,研究了渗氢引起的合金显微组织的变化.实验结果表明,渗氢前的合金由α2相,O相和B2相组成,渗氢有效地促进α2相和B2相向O相的转变,且使O相组织中有γ氢化物析出.渗氢引起合金组织发生变化的本质原因是氢导致α2相和B2相的晶格畸变,以及α2相和B2相之间的元素再分配.     

Microstructure and strength of TiAl/steel joint induction brazed with Ag-Cu-Ti filler metal

Abstract

Intermetallic TiAl was induction brazed to steel in an induction furnace with Ag-Cu-Ti filler metal at 1143 K for 0·2–2·4 ks. Microstructural analysis indicates that Ti, Al, and C atoms in base metal diffuse to the interface and react strongly with the filler metal during brazing. The interface structure of the joint can be divided into three distinct zones: the reaction layer near TiAl, composed of Cu-Al-Ti compounds and Ag based solid solutions; the central zone of the interface, consisting of Ag based solid solutions in which Ag-Cu eutectic phases are dispersed; a TiC reaction layer adjacent to the steel. The relationship between brazing parameters and tensile strength of the joints is discussed, and the optimum induction brazing parameters obtained. When brazed at 1143 K for 0.9 ks, the tensile strength of the joint is 298 MPa.     

宏量制备层状Ti3C2及其超级电容的性能

将钛粉、铝粉、石墨粉和少量锡粉混合,用原位烧结技术宏量制备高纯度前驱体材料Ti₃AlC₂,再以浓氢氟酸为刻蚀剂进行选择性刻蚀,改变刻蚀时间宏量制备出层间距可调节的层状剥离Ti₃C₂。使用X射线衍射和场发射扫描电子显微镜分别表征了Ti₃AlC₂和Ti₃C₂的结构和层间距微观形貌,并对用Ti₃C₂制成的电极进行了电化学性能测试分析。结果表明,相比其它在相同条件下制备的电极其比容量大幅度提高,且具有良好的超级电容性能。     

全Cu_(3)Sn焊点在高温时效下的组织及力学性能EI北大核心CSCD

对全Cu_(3)Sn焊点进行620℃下不同持续时间的时效处理,研究时效过程中接头微观组织演变,并利用纳米压痕实验及剪切实验表征时效后焊点的力学性能变化。结果表明:在时效过程中,Cu/Cu_(3)Sn界面以平面状析出Cu_(20)Sn_(6)并持续生长,直至Cu_(3)Sn被完全消耗。随后Cu_(20)Sn_(6)向Cu_(20)Sn_(6)和Cu_(13.7)Sn组成的两相层转变,Cu_(13.7)Sn通过消耗两相层在Cu/两相层的界面处以波浪状析出并继续生长,直至占据整个界面区,该过程中伴随着焊缝中间位置孔洞数量和尺寸的生长,最终聚合成微裂纹。Cu_(20)Sn_(6),Cu_(3)Sn,Cu_(13.7)Sn相的硬度分别为9.62,7.15,4.67 GPa,弹性模量分别为146.5,134.0,133.2 GPa。随时效时间的增加,焊点的抗剪强度呈先增大后减小的趋势,在120 min内保持大于20.1 MPa;其断口形貌和断裂路径也随之发生变化。     

Effects of aging on martensitic transformation of Ti50Ni25Cu25 shape memory alloy

Martensitic transformation has been studied in Ti₅₀Ni₂₅Cu₂₅ shape memory alloy by internal friction (IF) measurement and X-ray diffraction. It shows that the martensitic transformation proceeds from B2 to B19 for the solution-treated Ti₅₀Ni₂₅Cu₂₅ alloy. B2 phase is stabilized, and aging the alloy at 723–923 K decreases internal friction values. Part of the remaining B2 parent phase transform to B19′ monoclinic martensite at much lower temperatures.     

钛表面激光熔覆原位制备Ti5Si3涂层结构及摩擦学性能

利用激光熔覆技术在钛表面预置硅粉原位制备了Ti5Si3涂层.用XRD、SEM和TEM分析了涂层的组成和组织结构.在UMT摩擦磨损试验机上对Ti5Si3涂层在不同载荷和不同滑动速度下的摩擦磨损性能进行了测试.实验结果表明:涂层的物相主要是Ti5Si3相和基材Ti相,涂层的显微结构为球状和块状晶,Ti5Si3涂层具有较高的显微硬度,涂层截面的平均显微硬度约为840 HV0.2,是钛基材的4.4倍;Ti5Si3涂层可显著提高钛基材的耐磨性能;Ti5Si3涂层的磨损机理为磨粒磨损和粘着磨损.