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Satyam S. Sahay Kishor B. Joshi 《Journal of Materials Engineering and Performance》2003,12(2):157-164
The effects of heating rate on microstructural size and shape parameters during annealing of cold rolled aluminum killed steel
strips have been examined under non-isothermal condition. It is shown that decrease in the heating rate results in accelerated
grain growth behavior compared with the prediction by quasi-isothermal based kinetics. The {111} and {112} crystallographic
orientations, which enhance the normal anisotropy and deep drawability of cold rolled annealed sheets, are found to exhibit
a strong correlation with the grain shape anisotropy. This grain shape anisotropy itself is strongly dependent on heating
rates. Lower heating rates result in higher aspect ratios and thus better drawability of the cold rolled sheets. A Hall-Petch
type relationship is observed between grain size and hardness of the annealed samples. 相似文献
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对Fe-3%Si无取向电工钢冷轧板进行不同时间的退火处理,利用光学显微镜、EBSD等研究了退火过程的晶粒长大行为及其对磁性能的影响。结果表明,随着退火时间的增加,退火板中Goss以及γ织构晶粒占比降低,{114}<841>以及{001}<120>织构晶粒占比增大。在退火时间低于20 s时,退火织构以强γ和Goss织构为主。退火时间为60 s时,{001}<120>织构晶粒长大速率急剧增大,平均晶粒尺寸达到约105 μm。退火时间达到240 s时,退火织构以强{001}<120>以及{114}<841>织构为主。退火时间为30~60 s时轧向及横向磁感值迅速增大,60 s时轧向磁感达到最大值1.74 T,120 s时横向磁感达到最大值1.67 T,之后随着退火时间增加而轻微降低,并分别稳定在1.72 T和1.66 T左右。退火板45°方向磁感值先升高后降低,20 s时达到最大值1.67 T。各方向的铁损值均随退火时间的增加而降低,且磁各向异性逐渐减小。 相似文献
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研究冷拉拔AZ31镁合金线材在退火温度为200~450℃范围内显微组织的演变。研究结果表明:退火态材料的晶粒尺寸对退火温度和冷拉拔面积的减少敏感。在所有退火条件下,冷拉拔面积减少12.2%时的AZ31镁合金丝材晶粒尺寸均匀长大,而晶粒的3个不同变化过程:晶粒细化、正常长大和异常粗化,会随着退火温度的升高和冷拉拔面积减少(23.0%~60.5%)时逐步发生。随着拉拔面积的逐渐减少,3个阶段的临界退火温度降低,同时优先提高材料外表面剧烈拉拔部位异常长大晶粒的起始温度,在材料外表面大量的剪切应变构成了晶粒长大的驱动力。 相似文献
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对热轧态280VK微合金高强钢经冷轧后取样,在不同温度下进行退火处理。对退火试样组织进行SEM、TEM、EBSD观察,以及析出物含量测定和力学性能测试分析,揭示退火工艺对冷轧高强钢组织结构、织构演变和力学性能的影响。结果表明,试验钢经退火处理后,基体中产生大量TiC析出粒子;随着退火温度升高,基体晶粒度减小,析出粒子尺寸增大但数量减少,屈服强度、抗拉强度降低,伸长率升高。热力学计算表明,试验钢中析出相的优先级顺序为TiN>AlN>TiC,析出相以TiC为主。 相似文献
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采用强变形技术在金属间化合物Ni3Al表层制备了纳米晶,并对其进行了低温退火处理。采用X射线衍射仪、透射电镜和显微硬度计对变形态和退火态Ni3Al表层的相结构、晶粒形貌和显微硬度分布进行了研究。结果显示,350 ℃低温退火时,强变形时形成的fcc结构无序Ni固溶体重新有序化,部分转变为L12有序结构的Ni3Al相。退火后,纳米晶Ni3Al的晶粒尺寸没有明显长大,微观应变显著降低。退火后表层纳米晶的组织不均匀,细晶粒尺寸为10~20 nm,大晶粒尺寸仍小于100 nm。350 ℃退火后表层部分的显微硬度仍可达525 HV0.2,强变形的强化作用在低温退火后仍可保持。 相似文献
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试验研究了430不锈钢冷轧带钢等温退火过程中的晶粒长大规律及其对再结晶织构的影响。利用截线法测量了不同退火情况下的晶粒尺寸,并对其演变规律进行了定量分析;通过ODF图来分析晶粒长大过程中薄板内部晶粒宏观取向的变化。研究发现,低于850 ℃晶粒长大不明显; 875 ℃时晶粒长大较为明显,其长大过程主要集中在30 min时间;890 ℃退火长时间保温后冷却,材料内有马氏体生成;建立了430铁素体不锈钢晶粒长大动力学方程,晶粒长大指数和激活能分别为8.44和531.54 kJ/mol;晶粒长大过程储能较高的织构体积分数减弱,而储能较低的织构体积分数则变强。 相似文献
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针对一种0.14C-2.72Mn-1.29Si冷轧高强钢进行了轧制和不同等温时效温度的退火处理,得到了两种不同退火基体的组织特征,均具有较好的综合力学性能。利用FESEM、XRD、TEM和拉伸试验对比分析了不同退火基体试验钢的微观组织、力学性能和加工硬化行为。研究表明:试验钢在220~300℃等温时效后钢板的基体组织主要由铁素体和马氏体构成,240℃等温时效后钢板的综合性能最佳,屈服强度为672 MPa,抗拉强度为1333 MPa,总伸长率为13%,屈强比为0.50,组织中含有5.75%的残留奥氏体。而试验钢在390~430℃等温时效后钢板的基体组织主要由铁素体和贝氏体构成,在390℃等温时效后钢板的综合性能最佳,屈服强度为505 MPa,抗拉强度为1115 MPa,总伸长率为17%,屈强比为0.45,组织中含有11.17%的残留奥氏体。铁素体+马氏体基体退火钢优异的综合力学性能主要源于细晶强韧化;而铁素体+贝氏体基体退火钢优异的性能主要源于细晶强韧化和TRIP效应增塑,这两种机制的共同作用,使得钢板在高强度的同时,还具有较好的塑韧性。 相似文献
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对低温板坯加热工艺生产的以Cu2S为主要抑制剂的CGO硅钢的高温退火过程进行了试验,使用X射线衍射仪和电子背散射衍射技术对高温退火过程中不同阶段的织构演变规律进行了分析。结果表明:该工艺条件下CGO硅钢在700 ℃完成初次再结晶,1000 ℃时已经发生了二次再结晶,初次再结晶基体中以γ线织构和{112}<110>织构为主,Goss晶粒含量很少,平均位向偏差角为16°左右;二次再结晶发生后,Goss晶粒的位向偏差角降低到10°以下,随着退火温度的升高Goss晶粒的位向逐渐准确。 相似文献
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借助差示扫描量热法、扫描电镜等检测分析手段以及JMatPro热力学软件,研究了等温球化退火的奥氏体化温度和保温时间对GCr15SiMo轴承钢碳化物的影响。结果表明,随着奥氏体化温度的升高和保温时间的延长,GCr15SiMo轴承钢中碳化物趋于均匀化、细小化,且有利于GCr15SiMo轴承钢退火过程碳化物球化效果。在奥氏体化温度为800℃、保温时间为30 min的等温球化退火工艺下,GCr15SiMo轴承钢中碳化物数量多、尺寸小、弥散分布度高,且组织最为均匀致密,硬度较低,球化效果最好。 相似文献
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非晶态Ni-W-P镀层退火晶化和激光晶化组织结构的演变 总被引:1,自引:0,他引:1
用XRD定量分析法并结合扫描电镜形貌观察,研究化学沉积高磷(13.3%)含量的Ni-W-P镀层在不同热处理条件下的晶化程度、晶粒尺寸及晶格应变等组织结构的演变规律。结果表明:高磷非晶态镀层在退火晶化过程中,Ni3P相的体积分数始终高于Ni相的,700℃时,两相的体积分数之差显著增大,镀层仍有残存的非晶相;在400~500℃之间形成的Ni3P的晶粒尺寸大于Ni的;温度为500~700℃时,Ni相的尺寸大于Ni3P的,但均未超过纳米级。镀层晶格应变表现为随退火温度的升高而降低,镀态时晶格应变最大。激光晶化处理的非晶态Ni-W-P镀层的显微结构特征介于400~500℃之间退火的镀层晶化特征。随扫描速度增加,不仅Ni3P晶粒尺寸增大,而且两相的尺寸差变大。 相似文献
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冷轧低压电子铝箔退火加热过程中的再结晶和晶粒长大 总被引:3,自引:3,他引:3
采用EBSD微取向分析、织构定量分析、晶粒尺寸分析等手段研究了低压电子铝箔不同退火加热过程对再结晶和晶粒长大行为的影响,并利用再结晶理论对相关过程进行了讨论.初次再结晶前的回复处理会明显降低冷轧铝箔的储存能及再结晶驱动力,并对再结晶晶粒尺寸和立方织构量产生规律性影响.特定的退火加热过程会诱发电子铝箔的晶粒异常长大,并导致立方织构量的明显下降. 相似文献
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Thermally-evaporated 10 nm-Ni/1 nm-Ir/(poly)Si structures were fabricated in order to investigate the thermal stability of
Ir-inserted nickel silicide after additional annealing. The silicide samples underwent rapid thermal annealing at 300 ° C
to 1200 ° C for 40 s, followed by 30 min annealing at the given RTA temperatures. Silicides suitable for the salicide process
were formed on the top of the single crystal and polycrystalline silicon substrates, mimicking actives and gates. The sheet
resistance was measured using a four-point probe. High resolution x-ray diffraction and Auger depth profiling were used for
phase and chemical composition analysis, respectively. Transmission electron microscope and scanning probe microscope were
used to determine the cross-section structure and surface roughness. The silicide, which formed on single crystal silicon
substrate with surface agglomeration after additional annealing, could defer the transformation of Ni(Ir)Si to Ni(Ir)Si2 and
was stable at temperatures up to 1200 °C. Moreover, the silicide thickness doubled. There were no outstanding changes in the
silicide thickness on polycrystalline silicon. However, after additional annealing, the silicon-silicide mixing became serious
and showed high resistance at temperatures >700 °C. Auger depth profiling confirmed the increased thickness of the silicide
layers after additional annealing without a change in composition. For a single crystal silicon substrate, the sheet resistance
increased slightly due to the significant increases in surface roughness caused by surface agglomeration after additional
annealing. Otherwise, there were almost no changes in surface roughness on the polycrystalline silicon substrate. The Ir-inserted
nickel monosilicide was able to maintain a low resistance in a wide temperature range and is considered suitable for the nano-thick
silicide process. 相似文献
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The static recrystallization of hot-deformed magnesium alloy AZ31 during isothermal annealing was studied at temperature of 503 K by optical and SEM/EBSD metallographic observation. The grain size change during isothermal annealing is categorized into three regions, i.e. an incubation period for grain growth, rapid grain coarsening, and normal grain growth. The number of fine grains per unit area, however, decreases remarkably even in incubation period. This leads to grain coarsening taking place continuously in the whole period of annealing. In contrast, the deformation texture scarcely changes even after full annealing at high temperatures. It is concluded that the annealing processes operating in hot-deformed magnesium alloy with continuous dynamic recrystallized grain structures can be mainly controlled by grain coarsening without texture change, that is, continuous static recrystallization. 相似文献
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将冷轧法制备的Cu/Al复合材料在475-525℃温度下退火1-8min,采用有限元软件模拟了Cu/Al复合材料在退火过程中的温度场,并采用扫描电镜(SEM)、X射线衍射仪(XRD)、能谱仪(EDS)、电子背散射衍射(ESBD)、显微硬度计等研究了Cu/Al复合材料的显微组织与力学性能。结果表明:在Cu/Al复合材料界面依次生成了CuAl<sub>2</sub>、Cu<sub>9</sub>Al<sub>4</sub>和CuAl等3种金属间化合物,在Cu/Al界面层厚度小于4μm的退火工艺范围内,Cu和Al基体发生完全再结晶形成等轴晶,Cu、Al基体的显微硬度能够迅速的降低至低温长时间(350℃、1h)退火的硬度。另外,提出了金属间化合物初生相的形核机理,分析计算了高温短时退火工艺下的形核动力学,并提出了非等温条件下的金属间化合物生长厚度的经验数值方法。 相似文献
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对奥氏体不锈钢316L进行等效应变为1.02的6道次室温等通道挤压(ECAP)试验。结果表明,在ECAP挤压过程中316L发生了剪切滑移变形和孪生变形及晶粒碎化,经过4和6道次挤压后分别得到平均晶粒尺寸约80 nm和约61 nm的均匀分布的等轴晶粒。在1道次ECAP挤压后316L的抗拉强度由674 MPa增加到984 MPa, 规定塑性延伸强度则由594 MPa增加到922 MPa,维氏显微硬度由116.33 HV增加到328.31 HV,但是塑性下降严重,可以通过600 ℃后续退火处理进行改善。 相似文献
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A nanocrystalline layer was produced on the surface of Ni3Al intermetallic by means of surface mechanical attrition treatment. The surface nanocrystallites were annealed at 250-750 ℃ for 30 min. Microstructure evolution of nanocrystallites during annealing was studied by X-ray diffraction (XRD) and transmission electronic microscope (TEM). The experimental results show that long-rang order recovers rapidly when annealing temperature is below 250℃ and changes slowly at 350-550 ℃, and then it increases rapidly at 750℃. The grain size of nanocrystallites of Ni3Al keeps stable and crystal defects recover when they are annealed below 550℃. The grains grow normally in low temperature annealing and abnormal growth occurs at 750℃. 相似文献
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将冷轧Ti/Al层状复合材料在525~625℃温度范围内退火0~128 h,并对复合材料的界面显微组织演变进行研究.结果表明,仅金属间化合物TiAl3相在Ti/Al界面形成,大多数TiAl3晶粒为细小的等轴晶,其平均尺寸从数百纳米到数微米,且随温度和/或退火时间的增加而增加,其中退火温度对晶粒尺寸的影响远大于退火时间的... 相似文献