Microstructural, photocatalysis and electrochemical investigations on CeTi2O6 thin films

The properties of sol–gel derived CeTi₂O₆ thin films deposited using a solution of cerium chloride heptahydrate and titanium propoxide in ethanol are discussed. The effect of annealing temperature on structural, optical, photoluminescence, photocatalysis and electrochemical characteristics has been examined. Lowest annealing temperature for the formation of crystalline CeTi₂O₆ phase in these samples is identified as 580 °C. The optical transmittance of the films is observed to be independent of the annealing temperature. The optical energy bandgap of the 600 °C annealed film for indirect transition is influenced by the presence of anatase phase of TiO₂ in its structure. Fourier transform infrared spectroscopy investigations have evidenced increased bond strength of the Ti–O–Ti network in the films as a function of annealing temperature. The photoluminescence intensity of the films has shown dependence on the annealing temperature with the films fired at 450 °C exhibiting the maximum photoluminescence activity. The decomposition of methyl orange and eosin (yellow) under UV–visible light irradiation in the presence of crystalline CeTi₂O₆ films shows the presence of photoactivity in these films. The photocatalytic response of CeTi₂O₆ films is found to be superior to the TiO₂ films. In comparison to crystalline films, the amorphous films have shown superior electrochemical characteristics. The 500 °C annealed amorphous films have exhibited the most appropriate properties for incorporation in electrochromic devices comprising tungsten oxide as the primary electrochromic electrode.     

On the optical, structural, and morphological properties of ZrO2 and TiO2 dip-coated thin films supported on glass substrates

This article reports the optical and morphological properties of dip-coated TiO₂ and ZrO₂ thin films on soda-lime glass substrates by metal-organic decomposition (MOD) of titanium^IV and zirconium^IV acetylacetonates respectively. Thermogravimetric and differential thermal analysis (DTA–TG) were performed on the precursor powders, indicating pure TiO₂ anatase and tetragonal ZrO₂ phase formation. Phase crystallization processes took place in the range of 300–500 °C for anatase and of 410–500 °C for ZrO₂. Fourier Transform Infrared Spectroscopy (FT-IR) was used to confirm precursor bidentate ligand formation with keno-enolic equilibrium character. Deposited films were heated at different temperatures, and their structural, optical and morphological properties were studied by grazing-incidence X-ray Diffraction (GIXRD) and X-Ray Photoelectron Spectroscopy (XPS), Ultraviolet Visible Spectroscopy (UV-Vis), and Atomic Force Microscopy (AFM) respectively. Film thinning and crystalline phase formation were enhanced with increasing temperature upon chelate decomposition. The optimum annealing temperature for both pure anatase TiO₂ and tetragonal ZrO₂ thin films was found to be 500 °C since solid volume fraction increased with temperature and film refractive index values approached those of pure anatase and tetragonal zirconia. Conditions for clean stoichiometric film formation with an average roughness value of 2 nm are discussed in terms of material binding energies indicated by XPS analyses, refractive index and solid volume fraction obtained indirectly by UV-Vis spectra, and crystalline peak identification provided by GIXRD.     

Study of thermally-induced effects on Si–Ge amorphous layers using optical measurements

Thin films of elemental Si and Ge were grown one after another onto glass substrate using electron beam evaporation method. Optical measurements were used to probe the thermally-induced effects on Si–Ge layers upon annealing at 100 °C. Thermal treatment of the films was carried out under vacuum, to avoid oxidation of the films, at a temperature of 100 °C. X-ray diffraction, XRD, showed that the as-deposited layers are amorphous. The change of some optical parameters such as transmission and optical energy gap, as a result of the heat treatment, was explored. The optical energy gap as well as the optical transmission of the dual layer sample was found to increase with annealing time. The obtained results show the possibility of tailoring the layer structure to meet certain technological applications in terms of optical transmission and optical energy gap. Scanning Electron Microscope, SEM, was used to study the morphology of the as-deposited and annealed films. As-deposited films showed no crystalline features. However, the annealed films show some partial crystallization that increases with annealing time. The observed structural changes result in an increase of the optical energy gap with annealing.     

CdSe band-splitting on thermal annealed films

Semiconducting polycrystalline CdSe thin films were prepared on glass substrates by chemical bath at 65 °C. As-deposited films grew in the metastable cubic sphalerite (S) crystalline structure with good stoichiometry. Upon thermal annealing (TA) in Ar+Se₂ atmosphere at different temperatures in the range 200–500 °C, the gradual phase transformation from cubic modification to hexagonal wurtzite (W) stable phase could be observed. From optical absorption measurements the fundamental energy band gap (E_g) and the second electronic transition (E_g+ΔE_g) were calculated for as-deposited and thermal annealed films. For TA350 °C, S-phase dominates the crystalline structure and only the spin orbit (ΔE_so) contribution to ΔE_g is present. Above 350 °C, the W-phase dominates and the energy splitting (ΔE_cf), owed to crystal field contribution and originated by the loss of lattice symmetry, should be added to ΔE_so in order to complete ΔE_g in the W-phase. The values ΔE_so=0.389±0.011 eV and ΔE_cf=0.048±0.018 eV were found from our analysis, and T_c=350 °C was here defined as the critical point of the phase transformation.     

Annealing effects on microstructure and mechanical properties of chromium oxide coatings

Reactive radio frequency magnetron sputter-deposited chromium oxide coatings were annealed at different temperatures and times. The influence of annealing temperature on the microstructure, surface morphology and mechanical properties was examined by X-ray diffraction, nanoindentation, pin-on-disc wear and scratch tests, respectively. X-ray results show that the chromium oxide sputtered at room temperature in low oxygen flux is primarily amorphous. Annealing below 400 °C did not cause much change, while annealing at higher temperature of 500 °C caused a significant change in microstructure and mechanical properties. Hardness increased from 12.3 GPa to 26 GPa, and the wearability improved with higher annealing temperature due to the formation of crystalline Cr₂O₃ phase, which occurs at 470 °C. Annealing time had little effect on mechanical properties and microstructure, although coating surface roughness increased with a longer annealing time. Coating adhesion was improved by annealing, due to residual stress relief and possible interfacial interdiffusion.     

Investigation on the cross sensitivity of NO2 sensors based on In2O3 thin films prepared by sol-gel and vacuum thermal evaporation

In₂O₃ thin films have been prepared from commercially available pure In₂O₃ powders by high vacuum thermal evaporation (HVTE) and from indium iso-propoxide solutions by sol-gel techniques (SG). The films have been deposited on sapphire substrates provided with platinum interdigital sputtered electrodes. The as-deposited HVTE and SG films have been annealed at 500°C for 24 and 1 h, respectively. The film morphology, crystalline phase and chemical composition have been characterised by SEM, glancing angle XRD and XPS techniques. After annealing at 500°C the films’ microstructure turns from amorphous to crystalline with the development of highly crystalline cubic In₂O_3−x (JCPDS card 6-0416). XPS characterisation has revealed the formation of stoichiometric In₂O₃ (HVTE) and nearly stoichiometric In₂O_3−x (SG) after annealing. SEM characterisation has highlighted substantial morphological differences between the SG (highly porous microstructure) and HVTE (denser) films. All the films show the highest sensitivity to NO₂ gas (0.7–7 ppm concentration range), at 250°C working temperature. At this temperature and 0.7 ppm NO₂ the calculated sensitivities (S=R_g/R_a) yield S=10 and S=7 for SG and HVTE, respectively. No cross sensitivity have been found by exposing the In₂O₃ films to CO and CH₄. Negligible H₂O cross has resulted in the 40–80% relative humidity range, as well as to 1 ppm Cl₂ and 10 ppm NO. Only 1000 ppm C₂H₅OH has resulted to have a significant cross to the NO₂ response.     

Stresses in sputtered RUOx thin films

RuO_x thin films have been deposited by reactive sputtering in an O₂/Ar atmosphere. The films were characterized for their stress and resistivity as a function of deposition temperature (room temperature, 300°C) and the O₂ content (25–100%) in the sputtering gas. Additionally, the stresses in these films were determined as a function of annealing temperature (up to 600°C) using an in-situ curvature measurement technique. The as-deposited films were found to be under a state of compressive stress for all deposition conditions. The compressive stresses sharply increased with increasing deposition temperature from a value of around 200 MPa at 200°C to 1400 MPa at 300°C. This dramatic increase has been attributed to differences in microstructure at these deposition temperatures. The microstructural differences also led to the widely differing stress-temperature behavior during annealing of these films. For films deposited at temperatures lower than 200°C, the annealing process resulted in a decrease in the compressive stress and resistivity of the films. However, films deposited at a temperature of 300°C did not show any changes in the compressive stress or resistivity after annealing. The results of this study can be used to deposit RuO_x thin films with low resistivity and minimal stresses.     

Characterization of cobalt annealed on silicon-germanium epilayers

Cobalt-coated single-crystal Si-Ge layers grown epitaxially by ultrahigh vacuum chemical vapor deposition on silicon substrates were annealed by rapid thermal annealing in the temperature range from 450 °C to 800 °C for periods ranging from 1 to 3 min. The measured sheet resistivities of the films exhibit strong dependence on the annealing conditions. The Co-SiGe film annealed at 700 °C for 3 min had the lowest sheet resistivity (3Ω/p). Structural studies using cross-sectional transmission electron microscopy showed that the cobalt films reacted with the SiGe layer and the thickness of the resulting film increases with increasing annealing temperature or time. Electron diffraction and X-ray microanalysis using energy-dispersive spectrometry showed that CoSi₂ was formed during initial annealing. The detection of germanium in the reacted layer and the deviation of the reacted layer's lattice constant from that of CoSi₂ indicated that germanium diffused into the CoSi₂ and formed ternary compounds (Co_xSi_yGe_z) during further annealing.     

Reactions in Au/Nb bilayer thin films

The interdiffusion and intermetallic compound formation of Au/Nb bilayer thin films annealed at 200–400 °C have been investigated. The bilayer thin films were prepared by electron beam deposition. The Nb film was 50 nm thick and the Au film was 50–200 nm thick. The interdiffusion of annealed specimens was examined by measuring the electrical resistance and depth-composition profile and by transmission electron microscopy. Interdiffusion between the thin films was detected at temperatures above 325 °C in a vacuum of 10^-4 Pa. The intermetallic compound Au₂Nb₃ and other unknown phases form during annealing at over 400 °C. The apparent diffusion constants, determined from the penetration depth for annealing at 350 °C, are 3.5 × 10⁻¹⁵ m² s⁻¹ for Nb in Au and 8.6 × 110^7minus;15 m² s⁻¹ for Au in Nb. The Au surface of the bilayer films becomes uneven after annealing at over 400 °C due to the reaction.     

Structural, optical and electrical characterization of spray-deposited TiO2 thin films

Titanium oxide (TiO₂) thin films were deposited onto glass substrates by means of spray pyrolysis method using methanolic titanyl acetyl acetonate as precursor solution. The thin films were deposited at three different temperatures namely 350, 400 and 450 °C. As-deposited thin films were amorphous having 100–300 nm thickness. The thin films were subsequently annealed at 500 °C in air for 2 h. Structural, optical and electrical properties of TiO₂ thin films have been studied. Polycrystalline thin films with rutile crystal structure, as evidenced from X-ray diffraction pattern, were obtained with major reflexion along (1 1 0). Surface morphology and growth stages based on atomic force microscopy measurements are discussed. Electrical properties have been studied by means of electrical resistivity and thermoelectric power measurements. Optical study shows that TiO₂ possesses direct optical transition with band gap of 3.4 eV.     

Atmospheric plasma discharge chemical vapor deposition of SnOx thin films using various tin precursors

A series of 0.2–0.6 μm thick SnO_x films were deposited onto borosilicate and sodalime silica glass substrates by atmospheric plasma discharge chemical vapor deposition at 80 °C. SnO_x films deposited from monobutyltin trichloride contained a large percentage of SnCl₂:2H₂O, and therefore were partially soluble in water. SnO_x coatings deposited from tetrabutyltin were not soluble in water or organic solvents, had good adhesion even at growth rates as high as 2.3 nm/s, had high transparency of  90% and electrical resistivity of 10⁷ Ω cm. As-grown tin oxide coatings were amorphous with a small concentration of SnO₂, SnO and Sn crystalline phases as determined by grazing angle X-ray diffraction and X-ray photoelectron spectroscopy measurements. Upon annealing in air at 600 °C the resistivity of SnO_x films decreased to 5–7 Ω cm. Furthermore, optical and X-ray measurements indicated that SnO_x was converted into SnO₂ (cassiterite) with a direct band gap of 3.66 eV. Annealing of as-grown SnO_x films in vacuum at 340 °C led to formation of the p-type conductor SnO/SnO_x. The indirect band gap of SnO was calculated from the optical spectra to be 0.3 eV.     

Atmospheric pressure chemical vapour deposition of SnSe and SnSe2 thin films on glass

Atmospheric pressure chemical vapour deposition of tin monoselenide and tin diselenide films on glass substrate was achieved by reaction of diethyl selenide with tin tetrachloride at 350–650 °C. X-ray diffraction showed that all the films were crystalline and matched the reported pattern for SnSe and/or SnSe₂. Wavelength dispersive analysis by X-rays show a variable Sn:Se ratio from 1:1 to 1:2 depending on conditions. The deposition temperature, flow rates and position on the substrate determined whether mixed SnSe–SnSe₂, pure SnSe or pure SnSe₂ thin films could be obtained. SnSe films were obtained at 650 °C with a SnCl₄ to Et₂Se ratio greater than 10. The SnSe films were silver–black in appearance and adhesive. SnSe₂ films were obtained at 600–650 °C they had a black appearance and were composed of 10 to 80 μm sized adherent crystals. Films of SnSe only 100 nm thick showed complete absorbtion at 300–1100 nm.     

Characterization of ultrasonic spray pyrolyzed tungsten oxide thin films

The ultrasonic spray pyrolysis (USP) technique has been employed to deposit tungsten oxide (WO₃) thin films. The films were prepared by spraying 0.02 M ammonium metatungstate solution onto amorphous glass substrates kept at 250°C. These films were further annealed at 400°C for different time periods (1–5 h) in air. The films were characterized for structural, electrical and opto-electronic properties. X-ray diffraction technique was used to determine the crystallinity of the WO₃ films and identify the phases that form as a function of annealing time. The as-prepared WO₃ films were amorphous and crystallize when annealed at 400°C in air for 2 or more hours. From TEM, the grain size and lattice plane spacing are estimated. The films were further characterized by using time resolved microwave conductivity (TRMC) technique and decay time of the photogenerated charge carriers is calculated to be about 154 ns. The concentration and mobility of charge carriers are estimated from thermoelectric power (TEP) measurements.     

Nickel Enriched Diffusion Layers on a NiAl Alloy

The intermetallic phase NiAl is a perspective material for high-temperature and shape memory effect applications. Formation of Ni₅Al₃, Ni₂Al, Ni₃Al phases which influence the extent of martensitic transformation in NiAl have been studied up to now with controversial results. We have investigated (using SEM and local elemental analyses) the microstructure of nickel enriched surface layers on a Al-79 wt.% Ni alloy. The layers were prepared by diffusion annealing and subsequently given two different heat treatments: at 930°C outside the Ni₅Al₃ region and at 500°C within the Ni₅Al₃ region of the phase diagram. In the specimen which was only diffusion annealed separate islands of Ni₅Al₃ phase elongated in the direction of the concentration gradient could be recognized within the nickel enriched surface layer. In the samples additionally annealed at 500°C, a well defined continuous layer of the Ni₅Al₃ phase situated 0.4 mm below the specimen surface was found. In the samples annealed at 930°C, isolated Ni₃Al precipitates were observed. Their number and size gradually increased with increasing nickel content.     

The effect of rapid thermal annealing on structural and electrical properties of TiB2 thin films

This work reports on the effect of post-deposition rapid thermal annealing on the structural and electrical properties of deposited TiB₂ thin films. The TiB₂ thin films, thicknesses from 9 to 450 nm, were deposited by e-beam evaporation on high resistivity and thermally oxidized silicon wafers. The resistivity of as-deposited films varied from 1820 μΩ cm for the thinnest film to 267 μΩ cm for thicknesses greater than 100 nm. In the thickness range from 100 to 450 nm, the resistivity of TiB₂ films has a constant value of 267 μΩ cm.

A rapid thermal annealing (RTA) technique has been used to reduce the resistivity of deposited films. During vacuum annealing at 7 × 10⁻³ Pa, the film resistivity decreases from 267 μΩ cm at 200 °C to 16 μΩ cm at 1200 °C. Heating cycles during RTA were a sequence of 10 s. According to scanning tunneling microscopy analysis, the decrease in resistivity may be attributed to a grain growth through polycrystalline recrystallization, as well as to an increase in film density.

The grain size and mean surface roughness of annealed films increase with annealing temperature. At the same time, the conductivity of the annealed samples increases linearly with grain size. The obtained results show that RTA technique has a great potential for low resistivity TiB₂ formation.     

Morphological changes induced by thermal anneals in NiFe/Ag multilayers; their relation to the resistive and magnetoresistive properties

(Ti, Al)N films have drawn much attention as alternatives for TiN coatings, which are oxidized easily in air above 500 °C. We have investigated the effect of Al content on the oxidation resistance of (Ti_{1 − x}Al_x)N films prepared by r.f. reactive sputtering.

(Ti_{1 − x}Al_xN films (O ≤ x ≤ 0.55) were deposited onto fused quartz substrates by r.f. reactive sputtering. Composite targets with five kinds of Al-to-Ti area ratio were used. The sputtering gas was Ar (purity, 5 N) and N₂ (5 N). The flow rate of Ar and N₂ gas was kept constant at 0.8 and 1.2 sccm, respectively, resulting in a sputtering pressure of 0.4 Pa. The r.f. power was 300 W for all experiments. Substrates were not intentionally heated during deposition. The deposited films (thickness, 300 nm) were annealed in air at 600 900 °C and then subjected to X-ray diffractometer and Auger depth profiling.

The as-deposited (Ti_{1 − x}Al_x)N films had the same crystal structure as TiN (NaCl type). Al atoms seemed to substitute for Ti in lattice sites. The preferential orientation of the films changed with the Al content of the film, x. Oxide layers of the films grew during annealing and became thicker as the annealing temperature increased. The thickness of the oxide layer grown on the film surface decreased with increasing Al content in the film. For high Al content films an Al-rich oxide layer was grown on the surface, which seemed to prevent further oxidation. All of the films, however, were oxidized by 900 °C annealing, even if the Al content was increased up to 0.55.     

Structural, electrical, and optical studies on rapid thermally processed ferroelectric BaTiO3 thin films prepared by metallo-organic solution deposition technique

Polycrystalline BaTiO₃ thin films having the perovskite structure were successfully produced on platinum coated silicon, bare silicon, and fused quartz substrate by the combination of the metallo-organic solution deposition technique and post-deposition rapid thermal annealing treatment. The films exhibited good structural, electrical, and optical properties. The electrical measurements were conducted on metal-ferroelectric-metal (MFM) and metal-ferroelectric-semiconductor (MFS) capacitors. The typical measured small signal dielectric constant and dissipation factor at a frequency of 100 kHz were 255 and 0.025, respectively, and the remanent polarization and coercive field were 2.2 μC cm⁻² and 25 kV cm⁻¹, respectively. The resistivity was found to be in the range 10¹⁰–10¹² Ω·cm, up to an applied electric field of 100 kV cm⁻¹, for films annealed in the temperature range 550–700 °C. The films deposited on bare silicon substrates exhibited good film/substrate interface characteristics. The films deposited on fused quartz were highly transparent. An optical band gap of 3.5 eV and a refractive index of 2.05 (measured at 550 nm) was obtained for polycrystalline BaTiO₃ thin film on fused quartz substrate. The optical dispersion behavior of BaTiO₃ thin films was found to fit the Sellmeir dispersion formula well.     

-Fe2O3 thin films prepared by metalorganic deposition (MOD) from Fe(III) 2-ethylhexanoate

-Fe₂O₃ thin films were prepared by metalorganic deposition (MOD) using Fe(III) 2-ethylhexanoate as the metalorganic precursor. A series of experiments were conducted on the metalorganic spin-coated films and their correspondingly annealed samples by employing experimental techniques ranging from thermal gravimetric analysis, Fourier transform infrared spectroscopy (FTIR), X-ray diffraction (XRD) and scanning electron microscopy (SEM) to optical property characterization. In this way a better understanding has been achieved regarding the decomposition process of the metalorganic precursor, the solid state -Fe₂O₃ film formation and crystallization process, and the relationship between the structure and the optical properties of the prepared films. The conclusions of our experiments are the following. The decomposition of Fe(III) 2-ethylhexanoate is a multistep process that is characterized by distinct transition temperatures and thermogravimetric loss rates. Amorphous -Fe₂O₃ film is formed at an annealing temperature of around 460°C, further annealing at higher temperatures induces the amorphous-to-crystalline phase transition and grain growth. FTIR, XRD and SEM data for structural characterization are correlated and in good agreement. A new FTIR absorption band, peaking at 1085 cm^-1, is assigned to the vibration of crystalline Fe-O mode, therefore this peak is useful in monitoring the amorphous-to-crystalline phase transition of -Fe₂O₃ material. Instead of columnar structure in physical vapour deposition-prepared films a granular structure is typical of MOD prepared films, the grain size is much larger near the surface of the film than near the substrate. Optical characterization shows that the refractive index and extinction coefficient of the -Fe₂O₃ thin films increase with the increase of annealing temperatures. The potential interesting applications of the MOD-prepared -Fe₂O₃ thin films include gas sensor materials, photoelectrodes and storage media.     

Formation of strain-free GaAs-on-Si structures by annealing under ultrahigh pressure

Theoretical and experimental discussions on a novel method to solve the thermal mismatch problem in heteroepitaxial growth have been reviewed. It has been predicted theoretically for structures such as Ge/Si and GaAs/Si that the difference in thermal expansion coefficients can be compensated for by the elastic strain generated by hydrostatic pressure. This theoretical prediction has been verified experimentally using GaAs-on-Si structures, in which the structures are formed by metalorganic chemical vapor deposition and subsequently annealed under ultrahigh pressure. It has been found that for annealing at pressures up to 2.1 GPa, the strain in GaAs films decreases linearly with increasing pressure and becomes zero at a pressure of around 1.9 GPa. It has also been found that the strain depends weakly on the annealing temperature, which ranged from 300 to 500 °C. Concerning the crystalline quality of the annealed GaAs films, a slight increase in the minimum channeling yield in Rutherford backscattering spectrometry has been observed in the samples with broad-area GaAs films. It has been found, however, that degradation in the crystalline quality can be avoided by etching the GaAs films in a pattern of stripes 10 μm wide.     

Preparation, electrical and optical properties of (Pb,Ca)TiO3 thin films using a modified sol-gel technique

Calcium modified lead titanate sol was synthesized using lead acetate trihydrate, calcium nitrate tetrahydrate and titanium tetra-n-butoxide as starting materials, methanol and ethanolamine were selected as solvent and stabilizing or complexing agent, respectively. (Pb_0.76Ca_0.24)TiO₃ thin films were prepared on platinum-coated silicon and fused silica substrates with the solution using the spinning method. The surface morphology and crystal structure, surface compositions and chemical states, electrical and optical properties of the thin films were investigated. The films have good composition homogeneity and thickness uniformity. The dielectric constant and dissipation factor of 1 kHz at room temperature were found to be 280 and 0.027, respectively, for thin films with 0.5 μm thickness annealed at 600°C for 1 h. The remanent polarization and coervive field were 15 μC/cm² and 64 kV/cm, respectively. The thin films exhibited good optical transmissitivity, and had optical direct transitions. The dispersion relation of refractive index and wavelength followed the single electron oscillation model. The band gap of the film which annealed at 650°C was 3.68 eV. The results also confirmed that ethanolamine was very effective in preparing uniform and dense oxide films, owing to the superior stability of the sols during hydrolytic polycondensation.