共查询到20条相似文献,搜索用时 125 毫秒
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研究了国产结构参数近似的SiGe HBT与Si BJT在60Coγ射线辐照前和不同剂量辐照后性能的变化,并作了比较。辐照后集电极电流Ic变化很小,基极电流Ib明显增大,表明辐照后电流增益的下降主要是由于Ib的退化所导致。当辐照剂量达到10kGy(Si)时,SiGe HBT和Si BJT的最大电流增益分别下降为77%和55%,表明了SiGe HBT具有比Si BJT更好的抗γ射线辐照性能。对辐射损伤机理进行了探讨。 相似文献
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测量了SiGe HBT直流增益在60Coγ辐照过程中随剂量及器件电流注入水平的变化。实验结果显示在累计辐照剂量超过5 000 Gy(Si)后,器件电流增益变化与辐照剂量存在线性反比关系,且增益损伤系数与器件电流注入水平有关;器件在受到总剂量为2.78×104Gy(Si)辐照后,器件静态基极电流Ib、集电极电流Ic、静态直流增益及最大振荡频率fmax出现不同程度退化;但器件其他电参数如截止频率fT、交流增益|H21|及结电容(CCBO)与辐照前相比未出现显著退化。利用MEDICI数值模拟分析了SiGe HBT参数退化机理。 相似文献
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锗硅异质结双极晶体管(SiGe Heterojunction Bipolar Transistor,SiGe HBT)由于其优异的温度和频率特性,在航空航天等极端环境中具有良好的使用前景,其辐射效应得到了广泛关注。针对KT9041 SiGe HBT进行了瞬时γ射线及脉冲激光辐照实验,获得其瞬时剂量率效应(Transient Dose Rate Effect,TDRE)响应。实验结果表明,SiGe HBT收集极在辐照下会产生明显的光电流脉冲,并且存在着饱和阈值的现象。此外,在脉冲激光辐照实验中还进行了SiGe HBT总剂量效应与瞬时剂量率效应的协同效应研究。发现SiGe HBT在经过总剂量辐照后其产生的光电流幅值会变大。为了分析实验中观察到的现象,应用TCAD建立了KT9041 SiGe HBT的仿真模型,并进行了瞬时γ射线辐照以及总剂量效应仿真研究。仿真发现,SiGe HBT收集极光电流出现的饱和现象是由示波器端口50 Ω匹配电阻所造成的。而总剂量效应导致的光电流幅值变大则是由于总剂量效应会在SiGe HBT收集极电极处的Si/SiO2界面引入正电荷缺陷,正电荷缺陷产生的局部电场会对自由电子产生吸引作用,导致更多的自由电子被收集极收集,从而产生幅值更大的光电流。 相似文献
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Belyakov V. V. Pershenkov V. S. Zebrev G. I. Sogoyan A. V. Chumakov A. I. Nikiforov A. Y. Skorobogatov P. K. 《Russian Microelectronics》2003,32(1):25-39
Ionizing-radiation effects on space microelectronics are addressed. Major approaches to the radiation-hardness evaluation of IC components in terms of total-dose effects at low dose rates are reviewed. The main mechanisms and kinetic models of radiation degradation are discussed from the standpoint of the prediction of IC radiation response. 相似文献
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SIMOX埋氧层的总剂量辐射硬度对埋氧层中注氮剂量的敏感性 总被引:2,自引:0,他引:2
为了提高SIMOX(separation-by-implanted-oxygen)SOI(silicon-on-insulator)结构中埋氧层(BOX)的总剂量辐射硬度,埋氧层中分别注入了2×1015和3×1015cm-2剂量的氮.实验结果表明,在使用Co-60源对埋氧层进行较低总剂量的辐照时,埋氧层的总剂量辐射硬度对注氮剂量是非常敏感的.尽管埋氧层中注氮剂量的差别很小,但经5×104 rad(Si)剂量的辐照后,注入2×1015cm-2剂量氮的埋氧层表现出了比未注氮埋氧层高得多的辐射硬度,而注入3×1015cm-2剂量氮的埋氧层的辐射硬度却比未注氮埋氧层的辐射硬度还低.然而,随辐照剂量的增加(从5×104到5×105rad(Si)),这种埋氧层的总剂量辐射硬度对注氮剂量的敏感性降低了.采用去掉SOI顶硅层的MOS高频C-V技术来表征埋氧层的总剂量辐射硬度.另外,观察到了MSOS(metal-silicon-BOX-silicon)结构的异常高频C-V曲线,并对其进行了解释. 相似文献
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Douglas J. Fouts Gary R. McKerrow Gary K. Lum Sidney S. Noe Andrew S. Lambley 《Microelectronics Reliability》2000,40(6)
CMOS integrated circuits (ICs) operating in space or other radiation environments can suffer from three different reliability problems due to the radiation: total dose effects, dose rate effects, and single event effects. The two most significant total-dose reliability problems are subthreshold, gate, end-around leakage current and threshold voltage shift. This article documents the theory, design, implementation, and testing of new, second-layer polysilicon structures that can compensate for radiation-induced, subthreshold, gate, end-around, leakage current. Second-layer polysilicon is available in many commercial, bulk CMOS processes and is normally used for floating-gate devices, such as EEPROMs and FPLAs, and charge-coupled devices such as CCD focal plan arrays. The use of the described structures in CMOS ICs would allow radiation tolerant ICs to be fabricated with commercial, bulk CMOS processes, greatly reducing manufacturing costs when compared to the cost of fabricating ICs on dedicated, radiation-hardened process lines. 相似文献
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He Wei Zhang Zheng-xuan Zhang En-xia Yu Wen-jie Tian Hao Wang Xi 《Microelectronics Journal》2008,39(12):1829-1833
This paper presents the practical issues encountered in designing SRAM cell design on partially depleted SOI, including the effects of floating-body potential and parasitic bipolar. It also discusses the characteristics of single-event upsets (SEU) harden and total-dose radiation harden of SOI SRAM. A fully integrated solution, using a new type memory cell SRAM described. 相似文献
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A systemic solution for radiation hardened design is presented. Besides, a series of experiments have been carried out on the samples, and then the photoelectric response characteristic and spectral characteristic before and after the experiments have been comprehensively analyzed. The performance of the CMOS image sensor with the radiation hardened design technique realized total-dose resilience up to 300 krad(Si) and resilience to single-event latch up for LET up to110 MeV·cm2/mg. 相似文献
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/sup 60/Co gamma irradiation effects on n-GaN Schottky diodes 总被引:1,自引:0,他引:1
Umana-Membreno G.A. Dell J.M. Parish G. Nener B.D. Faraone L. Mishra U.K. 《Electron Devices, IEEE Transactions on》2003,50(12):2326-2334
The effect of /spl gamma/-ray exposure on the electrical characteristics of nickel/n-GaN Schottky barrier diodes has been investigated using current-voltage (I-V), capacitance-voltage (C-V), and deep-level transient spectroscopy (DLTS) measurements. The results indicate that /spl gamma/-irradiation induces an increase in the effective Schottky barrier height extracted from C-V measurements. Increasing radiation dose was found to degrade the reverse leakage current, whereas its effect on the forward I-V characteristics was negligible. Low temperature (/spl les/50) post-irradiation annealing after a cumulative irradiation dose of 21 Mrad(Si) was found to restore the reverse I-V characteristics to pre-irradiation levels without significantly affecting the radiation-induced changes in C-V and forward I-V characteristics. Three shallow radiation-induced defect centers with thermal activation energies of 88 104 and 144 meV were detected by DLTS with a combined production rate of 2.12 /spl times/ 10/sup -3/ cm/sup -1/. These centers are likely to be related to nitrogen-vacancies. The effect of high-energy radiation exposure on device characteristics is discussed taking into account possible contact inhomogeneities arising from dislocations and interfacial defects. The DLTS results indicate that GaN has an intrinsically low susceptibility to radiation-induced material degradation, yet the effects observed in the Schottky diode I-V and C-V characteristics indicate that the total-dose radiation hardness of GaN devices may be limited by susceptibility of the metal-GaN interface to radiation-induced damage. 相似文献
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《Electron Device Letters, IEEE》1986,7(5):324-326
The effects of total-dose radiation have been investigated for complementary junction field-effect transistors fabricated in zone-melting recrystallized Si films on SiO2 -coated Si substrates. With a - 5-V bias applied to the Si substrate during irradiation and device operation, both n- and p-channel devices show low threshold-voltage shift (<-0.09 and <-0.12 V, respectively), low leakage currents (<- 1- and <3-pA/µm channel width, respectively) and small transconductance degradation (<15 percent) for total doses up to 108rad (Si). 相似文献