Ti元素掺杂对Fe-3Si基软磁复合材料组织结构及磁特性的影响

采用气雾化制粉技术并结合模压成形方法制备xTi/Fe-3Si-0.5Al-2Ni（x=0,1,2）软磁复合材料,通过XRD、SEM、综合物性测量系统（PPMS）以及软磁交流测量仪等装置表征和分析了合金粉末的相结构、形貌、磁特性及Ti/Fe-3Si-0.5Al-2Ni软磁复合材料的磁性能,探讨了Ti元素掺杂对合金粉末居里温度、饱和磁化强度等性能的影响,并着重研究了Ti元素添加对Ti/Fe-3Si-0.5Al-2Ni软磁复合材料有效磁导率、功率损耗、矫顽力等动态磁学特性的影响。结果表明：气雾化合金粉末只存在单一的α-Fe（Si）固溶相,球形度高;Ti元素的掺杂可提高粉末居里温度,但饱和磁化强度有小幅度的弱化;另外,随着Ti元素含量的增加,Ti/Fe-3Si-0.5Al-2Ni软磁复合材料有效磁导率升高,而功率损耗和矫顽力降低,当Ti元素含量为2wt%时,软磁复合材料获得较佳的综合磁性能。     

Microwave hydrothermal synthesis of nanosize PbO added Mg-Cu-Zn ferrites

Lead oxide added Mg-Cu-Zn ferrite powders were prepared by a co-precipitation method in a microwave-hydrothermal (M-H) system. The synthesized ferrite samples were characterized by powder X-ray diffraction (XRD), Infrared spectroscopy (IR), transmission electron microscopy (TEM) and Differential scanning calorimeter (DSC). Nanophase ferrites (~10–20 nm) with high surface area were synthesized at a low temperature of 160°C after a treatment time of 1 hour. The nano-powder was sintered at 900°C/4h in air atmosphere. The variations of the sintered density, electrical resistivity, initial permeability, and saturation magnetization with additive concentration have been investigated and the obtained results were compared with one prepared by the conventional ceramic method. It is found that the addition of PbO improves sintered density, electrical resistivity and permeability.     

Comparative Studies on the Structure and Magnetic Properties of Ni–Zn Ferrite Powders Prepared by Glycine-Nitrate Auto-combustion Process and Solid State Reaction Method

Ni–Zn ferrite compositions (Ni_1?x Zn _x Fe₂O₄) are well known due to their remarkable soft magnetic properties, which potentially have a broad range of applications in many areas. In this study, Ni–Zn ferrite with the chemical formula of Ni_0.64Zn_0.36Fe₂O₄ was prepared by the glycine-nitrate autocombustion process (GNP) and solid state reaction method (SSRM). In order to achieve a desirable particle size, the SSRM powders were milled for 3 h at a milling rate of 200 rpm. The structure and magnetic properties of the ferrite powders, which were synthesized by both methods, were characterized and their properties were compared. The results indicate that a significant amount (～?90 wt.%) of nanocrystalline Ni_0.64Zn_0.36Fe₂O₄ ferrite with the average crystallite size of 47 nm, particle size of 200 nm, saturation magnetization of 73 emu/g and coercivity of 54 Oe has been formed by means of the glycine-nitrate process. The results also show that not only the saturation magnetization of the GNP ferrite powder is relatively similar to that of the milled SSRM powders, but also it is synthesized at a much shorter duration than that of the solid state reaction method.     

Influence of coated SiC particulates on the mechanical and magnetic behaviour of Fe–Co alloy composites

Near-equiatomic Fe–Co alloy composites containing 0, 5 and 10 vol% of uncoated and coated SiC particles were prepared by applying a uniaxial pressure of 80 MPa at 900 °C for 5 min in a spark plasma sintering furnace. The SiC particles used in this study were coarse, with an average particle size of 20 μm and their surfaces were coated with four different types of coatings, namely Ni–P, Cu, Co and duplex Cu and Ni–P by an electroless plating method. Quasi D.C. magnetic, bending and hardness tests were performed on the composites. The influence of particulate coatings on the magnetic and mechanical behaviour of the composites was investigated by correlating their properties with their microstructures as observed using scanning electron microscopy and optical microscopy and crystallographic information as obtained using X-ray diffraction. The cobalt coated particles were found to exhibit the best wettability with the matrix without the formation of deleterious intermetallic compounds at the interface. Because of the better interfacial bonding in the composites with Co coated particles, there was an enhancement in flexural strength and permeability compared to the uncoated and other coated particulate composites studied. In addition, inclusion of cobalt coated SiC particulates produced an increase in hardness and a decrease in coercivity compared to the monolithic material.     

Effect of powder processing and alloying additions (Al/ZrB2) on the microstructure,mechanical and electrical properties of Cu

The present work elucidates the effect of powder processing conditions (milling/mixing) and conductive alloying element (Al: aluminium) and ceramic (ZrB₂: zirconium diboride) reinforcement addition on the densification, microstructure and electrical conductivity of copper (Cu) processed via hot pressing route. Disregard of alloying element/reinforcement/content or powders preparation method, the density of Cu materials varied between 92.16 and 99.76% ρ_th (theoretical density) after hot pressing at a low temperature of 500 °C. In case of Cu-Al alloys, the powder processing method significantly influenced its microstructure and conductivity. Particularly the Cu-Al alloys processed using mixed powders consisted of various phases Cu, α-Cu, γ₁ (Cu₉Al₄), δ (Cu₃Al₂), ζ₁ (Cu₄Al₃), η₂ (CuAl) and θ (CuAl₂) and the Cu alloys prepared using milled powders composed of either only α-Cu or α-Cu and γ₁ (Cu₉Al₄) phases (depending on the Al content). Whereas, only Cu and ZrB₂ phases were observed with the Cu-ZrB₂ composites processed using either milled or mixed powers. In case of Cu-Al alloys, the hardness (0.88–3.41 GPa) and strength (540.30–1120.18 MPa) of Cu increased with the addition of Al. Interestingly, the hardness (0.88–2.55 GPa) and strength (508.50–970.60 MPa) of Cu increased upto 5 wt% ZrB₂ and then they lowered with further addition of ZrB₂. In particular, the hardness and strength of Cu-ZrB₂ composites are lower than Cu-Al alloys reflecting the effectiveness of solid solution strengthening in the Cu alloys as compared to dispersion strengthening mechanism in Cu composite. The pure Cu prepared using milled powders exhibited low conductivity (75.70% IACS) than Cu processed using as-received/un-milled powders (97.00% IACS). Also, the Cu-ZrB₂ composites measured with better electrical conductivity than Cu-Al alloys. Depending on the milling conditions and alloying/reinforcement amount, the conductivity of Cu-ZrB₂ composites varied between 44.10 and 88.70% IACS.     

Electrical and magnetic properties of Al3+ substituted Mn–Ni–Zn nanoferrites

Nanostructured Mn–Ni–Zn ferrites with composition Mn_0.1Ni_0.6Zn_0.3Al_xFe_(2?x)O₄ (where x = 0.05, 0.1, 0.15, 0.2) have been prepared by sol–gel method. The structural data obtained by X-ray diffraction (XRD) of all Mn–Ni–Zn nanoferrites confirmed the spinel structure. The XRD data was used to calculate the lattice parameter and grain size. The morphology of nanoferrites was studied using scanning electron microscopy. The elemental composition (atomic percentage) was determined with the help of energy dispersive X-ray analyser. The dielectric permeability, AC and DC resistivity for all compositions were measured and discussed. The highest resistivity was measured for the sample with concentration x = 0.1. Vibrating sample magnetometry was used to study the magnetic properties of nanoferrites. High saturation magnetization of value 38.7 emu/g, coercivity 7 Oe and highest initial permeability 83.7 are measured for the sample consisting x = 0.05 Al concentration. These nanoferrites have various applications in core materials and in electronic device technology.     

Thermoelectric properties of chromium disilicide prepared by mechanical alloying

CrSi and Cr_1?x Fe _x Si particles embedded in a CrSi₂ matrix have been prepared by hot pressing from CrSi_1.9, CrSi₂, and CrSi_2.1 powders produced by ball milling using either WC or stainless steel milling media. The samples were characterized by powder X-ray diffraction, scanning, and transmission electron microscopy and electron microprobe analysis. The final crystallite size of CrSi₂ obtained from the XRD patterns is about 40 and 80 nm for SS- and WC-milled powders, respectively, whereas the size of the second phase inclusions in the hot pressed samples is about 1–5 μm. The temperature dependence of the electrical resistivity, Seebeck coefficient, thermal conductivity, and figure of merit (ZT) were analyzed in the temperature range from 300 to 800 K. While the ball-milling process results in a lower electrical resistivity and thermal conductivity due to the presence of the inclusions and the refinement of the matrix microstructure, respectively, the Seebeck coefficient is negatively affected by the formation of the inclusions which leads to a modest improvement of ZT.     

Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin–silver–copper (Sn–Ag–Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates

Sn–Ag–Cu composite solder has been prepared by adding Ni nanoparticles. Interfacial reactions, the morphology of the intermetallic compounds (IMC) that were formed, the hardness between the solder joints and the plain Cu/immersion Ag-plated Cu pads depending on the number of the reflow cycles and the aging time have all been investigated. A scallop-shaped Cu₆Sn₅ IMC layer that adhered to the substrate surface was formed at the interfaces of the plain Sn–Ag–Cu solder joints during the early reflow cycles. A very thin Cu₃Sn IMC layer was found between the Cu₆Sn₅ IMC layer and the substrates after a lengthy reflow cycle and solid-state aging process. However, after adding Ni nanoparticles, a scallop-shaped (Cu, Ni)–Sn IMC layer was clearly observed at both of the substrate surfaces, without any Cu₃Sn IMC layer formation. Needle-shaped Ag₃Sn and sphere-shaped Cu₆Sn₅ IMC particles were clearly observed in the β-Sn matrix in the solder-ball region of the plain Sn–Ag–Cu solder joints. Additional fine (Cu, Ni)-Sn IMC particles were found to be homogeneously distributed in the β-Sn matrix of the solder joints containing the Ni nanoparticles. The Sn–Ag–Cu–0.5Ni composite solder joints consistently displayed higher hardness values than the plain Sn–Ag–Cu solder joints for any specific number of reflow cycles–on both substrates–due to their well-controlled, fine network-type microstructures and the homogeneous distribution of fine (Cu, Ni)–Sn IMC particles, which acted as second-phase strengthening mechanisms. The hardness values of Sn–Ag–Cu and Sn–Ag–Cu–0.5Ni on the Cu substrates after one reflow cycle were about 15.1 and 16.6 Hv, respectively–and about 12.2 and 14.4 Hv after sixteen reflow cycles, respectively. However, the hardness values of the plain Sn–Ag–Cu solder joint and solder joint containing 0.5 wt% Ni nanoparticles after one reflow cycle on the immersion Ag plated Cu substrates were about 17.7 and 18.7 Hv, respectively, and about 13.2 and 15.3 Hv after sixteen reflow cycles, respectively.     

Effects of copper and Al2O3 particles on characteristics of Cu–Al2O3 composites

High-energy milling was used for production of Cu–Al₂O₃ composites. The inert gas-atomized prealloyed copper powder containing 2 wt.%Al and the mixture of the different sized electrolytic copper powders with 4 wt.% commercial Al₂O₃ powders served as starting materials. Milling of prealloyed copper powders promotes formation of nano-sized Al₂O₃ particles by internal oxidation with oxygen from air. Hot-pressed compacts of composites obtained from 5 and 20 h milled powders were additionally subjected to the high-temperature exposure in argon at 800 °C for 1 and 5 h. Characterization of processed material was performed by optical and scanning electron microscopy (SEM), X-ray diffraction analysis (XRD), microhardness, as well as density and electrical conductivity measurements. Due to nano-sized Al₂O₃ particles microhardness and thermal stability of composite processed from milled prealloyed powders are higher than corresponding properties of composites processed from the milled powder mixtures. The results were discussed in terms of the effects of different size of starting copper powders and Al₂O₃ particles on the structure, strengthening of copper matrix, thermal stability and electrical conductivity of Cu–Al₂O₃ composites.     

The Effect of Variable Binder Content and Sintering Temperature on the Mechanical Properties of WC–Co–VC/Cr3C2 Nanocomposites

WC powders with an average crystallite size of 10 nm were successfully prepared by ball milling of micron-sized tungsten carbide powders. Grain growth inhibitors (VC and Cr₃C₂) with concentrations of 0.6 wt% each were added to nanocomposites of WC–9Co and WC–12Co, in both as-received and milled WC. Powder mixtures were then consolidated using spark plasma sintering technique at 1200 and 1300 °C for 10 min under high vacuum and pressure of 50 MPa. The influence of WC crystallite size, Co content, and sintering temperature over microstructure and mechanical properties of the resulting composites were studied through XRD and FESEM. Densification and attained grain sizes of the sintered products were measured by Archimedes principle and Scherrer procedure, respectively. Moreover, microhardness (H_v30) and fracture toughness were measured and compared for each composition to comparatively assess the individual effect. It was observed that the addition of VC and Cr₃C₂ resulted in decreased densification of the synthesized composites. These grain growth inhibitors were found to limit grain sizes to 131 nm with an average hardness of 1592 H_v30 and fracture toughness of 9.23 Mpam^1/2.     

AlN-BN复相陶瓷的热等静压制备与性能研究

以氮化铝(AlN)和氮化硼(BN)为原料, 无烧结助剂、热等静压烧结制备了AlN-BN复相陶瓷, 研究了热等静压温度和压强对两种不同原料配比(摩尔比)烧结试样的微观结构和性能的影响。结果表明: 增加BN的添加量对复相陶瓷的烧结致密化影响较小, 但逐渐降低硬度和热导率、增大体积电阻率。相同原料配比下, 复相陶瓷的密度越高, 其热导率、体积电阻率、硬度越高。热导率和体积电阻率的实测值与两相复合模型方程较为符合。当n_AlN:n_BN=75:25时, 在温度为1600℃、压强为90 MPa、保温3 h的热等静压工艺下可以制备出相对密度达98.03%、热导率为77.29 W/(m·K)、体积电阻率为1.35×10¹⁵ Ω·cm的复相陶瓷。     

Synthesis and conductive performance of antimony-doped tin oxide-coated TiO2 by the co-precipitation method

The synthesis of Sb–SnO₂/TiO₂ (SST) composites by assembling antimony-doped tin oxide (Sb–SnO₂) nanoparticles on the surface of titanium dioxide (TiO₂) is systematically investigated. X-ray diffraction data show that the SST composite materials with good crystallinity can be indexed as anatase TiO₂ phase and cassiterite SnO₂ phase. The scanning electron microscopy and transmission electron microscopy indicate that Sb–SnO₂ particles with average diameter of 25 nm have been successfully coated on the surface of TiO₂. In addition, the Ti–O–Sn band can be detected on the surface of TiO₂ through Fourier translation infrared spectroscopy. The influences of pH, Sn/Ti mole ratio, hydrolysis temperature and calcination temperature on the electrical resistivity of the SST powders are studied. Under the optimum experimental conditions, the electrical resistivity of the composite conductive powders is 2.546 × 10³ Ω cm. Therefore, the SST composite conductive powders are useful as conductive fillers for the application in antistatic materials.     

Microstructure,electromagnetic and microwave absorbing properties of plate-like LaCeNi powder

La_1?xCe_xNi₅ (x?=?0, 0.05, 0.10, 0.15) powders were prepared by arc melting and high-energy ball milling method. The structures and morphologies of LaCeNi powders were evaluated by X-ray diffraction and scanning electron microscopy. The saturation magnetization and electromagnetic parameters of the powders were characterized by using vibrating-sample magnetometry and vector network analysis, respectively. The results reveal that the La_1?xCe_xNi₅ (x?=?0, 0.05, 0.10, 0.15) powders consist of LaNi₅ single phase with different Ce contents. With the increase of Ce content, the particle size decreases and the saturation magnetization increases. The reflection-peak frequency shifts to lower frequency region upon Ce concentration. The minimum reflection loss and reflection peak frequency, for the sample with coating thickness of 1.8 mm, are ??19.7 dB and 8.16 GHz, respectively.     

Enhancing Ni electroplated matrix through mixed boron nitride–carbide reinforcement

Mixed Nitride–Carbide particles of boron as a reinforcement in Ni matrix has been used in an attempt to form three component composites of superior hardness. The colloidal form of the dispersed particles has pronounced effect on distribution of the particles and this can be traced back to their zeta potential which governs the agglomeration propensity of the particulates with direct bearing on hardness and resultant morphology. Specific steps must be taken for Ni–BN–B₄C formation and simultaneous deposition of two dissimilar compounds and thus getting the desired volume fraction of each in the coating. Copper as a well understood system when it comes to nickel plating was utilized as the substrate and Watts plating bath admixed with 1–10 g BN and 10–50 g B₄C powder at 30–60 mA/cm² was employed. To compare results without the possibility of elastic rebound effects from the substrate all experiments were performed on 50 micron thick composite layers. Microhardness and scanning electron microscope (SEM), X-ray diffraction (XRD), optical microscopy (OM) techniques were used to ascertain the role and advantages gained from co-deposition of mixed reinforcing powders and the overall conclusion was that superiority of such composites in strengthening hardness relies heavily on the regular and controlled distribution of the particulates.     

Thermal and mechanical properties of 3D printed boron nitride – ABS composites

The current work investigates the thermal conductivity and mechanical properties of Boron Nitride (BN)-Acrylonitrile Butadiene Styrene (ABS) composites prepared using both 3D printing and injection molding. The thermally conductive, yet electrically insulating composite material provides a unique combination of properties that make it desirable for heat dissipation and packaging applications in electronics. Materials were fabricated via melt mixing on a twin-screw compounder, then injection molded or extruded into filament for fused deposition modeling (FDM) 3D printing. Compositions of up to 35 wt.% BN in ABS were prepared, and the infill orientation of the 3D printed composites was varied to investigate the effect on properties. Injection molding produced a maximum in-plane conductivity of 1.45 W/m-K at 35 wt.% BN, whereas 3D printed samples of 35 wt.% BN showed a value of 0.93 W/m-K, over 5 times the conductivity of pure ABS. The resulting thermal conductivity is anisotropic; with the through-plane thermal conductivity lower by a factor of ~3 for injection molding and ~4 for 3D printing. Adding BN flakes caused a modest increase in the flexural modulus, but resulted in a large decrease in the flexural strength and impact toughness. It is shown that although injection molding produces parts with superior thermal and mechanical properties, BN shows much potential as a filler material for rapid prototyping of thermally conductive composites.     

A comparative study of the coated filler method and the admixture method of powder metallurgy for making metal–matrix composites

Copper–matrix composites were made by powder metallurgy (PM). The reinforcements were molybdenum particles, silicon carbide whiskers and titanium diboride platelets. The coated filler method, which involves a reinforcement coated with the matrix metal, was used. In contrast, conventional PM uses the admixture method, which involves a mixture of matrix powder and reinforcement. For all the composite systems, the coated filler method was found to be superior to the admixture method in providing composites with lower porosity, greater hardness, higher compressive yield strength, lower coefficient of thermal expansion (CTE), higher thermal conductivity and lower electrical resistivity, though the degree of superiority was greater for high than low reinforcement contents. In the coated filler method, the coating on the reinforcement separated reinforcement units from one another and provided a cleaner interface and stronger bond between reinforcement and matrix than the admixture method could provide. The highest reinforcement content attained in dense composites (<5% porosity) made by the coated filler method was 70 vol% Mo, 60 vol% TiB2 and 54 vol% SiC. The critical reinforcement volume fraction above which the porosity of composites made by the admixture method increases abruptly is 60% Mo, 42% TiB2 and 33% SiC. This fraction increases with decreasing aspect ratio of the reinforcement. Among Cu/Mo, Cu/TiB2 and Cu/SiC at the same reinforcement volume fraction (50%), Cu/Mo gave the lowest CTE, highest thermal conductivity and lowest electrical resistivity, while Cu/SiC gave the greatest hardness and Cu/TiB2 and Cu/SiC gave the highest compressive yield strength. Compared to Cu/SiC, Cu/TiB2 exhibited much higher thermal conductivity and much lower electrical resistivity. This revised version was published online in November 2006 with corrections to the Cover Date.     

Controllable SiO2 insulating layer and magnetic properties for intergranular insulating Fe-6.5wt.%Si/SiO2 composites

In this study, the intergranular insulating Fe-6.5wt.%Si/SiO₂ soft magnetic composites (SMCs) were prepared successfully using in-situ chemical deposition followed by the spark plasma sintering (SPS) process. The effects of ammonia concentration on the microstructure and magnetic properties of the composites have been studied systematically. The Fe-6.5wt.%Si alloy particles could be well insulated by the uniform SiO₂ insulating layer, and its thickness increases with increasing the ammonia concentration from 0 to 0.02?ml/g. However, further increasing the ammonia concentration to 0.03 and 0.04?ml/g would result in the discontinuous and uneven SiO₂ insulating layer. Correspondingly, the saturation magnetization and effective permeability of the composite compacts first decrease and then increase with increasing the ammonia concentration from 0.00 to 0.04?ml/g, whereas the coercivity and resistivity vary in the opposite tendency. Note that the overall performances such as the frequency stability of effective permeability, higher resistivity and lower total core loss, reach the optimal value for the sample with the ammonia concentration of 0.02?ml/g.     

Effect of different copper fillers on the electrical resistivity of conductive adhesives

The effects of different copper fillers with different morphology and particle size have been studied in terms of electrical resistivity and thermal stability on the electrically conductive adhesives. The copper fillers used in this study were prepared by wet chemical reduction, electrolytic and gas atomization method, respectively. The as cured ECAs filled with different type of Cu fillers showed significant difference in electrical resistivity. Cu filler with smaller particle size showed higher packing density and larger surface area, which would enhance formation of conductive channels and increased conductive network in the ECAs, leading to a lower electrical resistivity. In addition, thermal stability of the ECAs were investigated under high temperature exposure at 125 °C and high humidity aging at 85 °C/85% RH for 1,000 h. Results showed that ECAs with Cu fillers of relatively small particle size and rough particle surface have excellent thermal stability due to enhanced adhesion and contact area between Cu fillers and the polymer matrix. A very low resistivity at an order of magnitude of 10^?4 ?? cm could be maintained for these ECAs after 1,000 h at 125 and 85 °C/85% RH.     

Mechanical activation of pre-alloyed NiTi<Subscript>2</Subscript> and elemental Ni for the synthesis of NiTi alloys

This work reports on an efficient powder metallurgy method for the synthesis of NiTi alloys, involving mechanical activation of pre-alloyed NiTi₂ and elemental Ni powders (NiTi₂–Ni) followed by a press-and-sinter step. The idea is to take advantage of the brittle nature of NiTi₂ to promote a better efficiency of the mechanical activation process. The conventional mechanical activation route using elemental Ti and Ni powders (Ti–Ni) was also used for comparative purposes. Starting with (NiTi₂–Ni) powder mixtures resulted in the formation of a predominant amorphous structure after mechanical activation at 300 rpm for 2 h. A sintered specimen consisting mainly of NiTi phase was obtained after vacuum sintering at 1050 °C for 0.5 h. The produced NiTi phase exhibited the martensitic transformation behavior. Using elemental Ti powders instead of pre-alloyed NiTi₂ powders, the structural homogenization of the synthesized NiTi alloys was delayed. Performing the mechanical activation at 300 rpm for the (Ti–Ni) powder mixtures gave rise to the formation of composite particles consisting in dense areas of alternate fine layers of Ni and Ti. However, no significant structural modification was observed even after 16 h of mechanical activation. Only after vacuum sintering at 1050 °C for 6 h, the NiTi phase was observed to be the predominant phase. The higher reactivity of the mechanically activated (NiTi₂–Ni) powder particles can explain the different sintering behavior of those powders compared with the mechanically activated (Ti–Ni) powders. It is demonstrated that this innovative approach allows an effective time reduction in the mechanical activation and of the vacuum sintering step.     

A study of structural, ferroelectric, ferromagnetic, dielectric properties of NiFe2O4–BaTiO3 multiferroic composites

The mixed spinel-perovskite multiferroic composites of xNiFe₂O₄-(1 ? x)BaTiO₃ (x = 0.1, 0.2, 0.3, 0.4, 0.5, 0.6) have been prepared by sol–gel method. The structure and morphology of the composites were examined by means of X-ray diffraction and transmission electron microscope. High-resolution transmission electron microscope image indicates a clear view of ferrite and ferroelectric phase. Moreover, we observed a fine interface between the two phases, where the coupling effect of ferrite and ferroelectric phase happened. The composites show excellent ferromagnetic and ferroelectric properties. The saturation magnetization (M_s) reaches to 24.139 emu/g for x = 0.6 at room temperature, the magnetization is about 2.37 emu/g for x = 0.6 when the temperature decreases to 90 k, and the polarization reaches to 3.75 μC/cm² for x = 0.1. Frequency dependent variations of dielectric constant and loss tangent for xNiFe₂O₄-(1 ? x)BaTiO₃ were studied in detail.