磁流体辅助抛光工件表面粗糙度研究

给出了磁流体辅助抛光的机理,以及依据Preston方程建立的磁流体辅助抛光的数学模型。并通过实验详细研究了磁流体辅助抛光后工件的抛光区形状,以及抛光区内表面粗糙度情况。最终加工出了表面粗糙度为0.76 nm(rms值)的光学元件,其高频表面粗糙度达到0.471 nm(rms值),满足了对一定短波段光学研究的要求。结果表明:磁流体辅助抛光可以用于对光学元件进行超光滑加工;在磁流体辅助抛光过程中,较大粒度的磁流体抛光液有利于工件表面粗糙度快速降低,较小粒度的磁流体抛光液可以获得更加光滑的光学表面。     

三相旋流抛光磨粒运动的测量与微气泡补偿

研究了气液固三相旋流流场抛光机理和规律。设计了三入口的抛光加工流道,对气液固三相旋流抛光流场进行了数值模拟。基于模拟结果设计了气液固三相磨粒流旋流流场测量平台,并通过粒子图像测速法(PIV)测量了微气泡补偿条件下气液固三相旋流抛光的流场参数,获得了微气泡补偿区域流场的运动图像、速度矢量图和涡量图。PIV测量试验数据显示:在微气泡补偿区域,磨粒速度主要集中在30m/s到80m/s,同一测量点高速磨粒出现频率明显增加,少数磨粒速度达到100m/s以上;磨粒平均速度从33.8m/s增大到44.2m/s,经4h抛光后硅片表面最大粗糙度从10.4μm下降到1.3μm。理论和试验研究表明,气液固三相旋流抛光流场中微气泡溃灭引发的空化冲击效应可增大磨粒动能,提高抛光效率,实现B区域的均匀化抛光。     

电流变抛光工艺研究

研究了电流变抛光工艺参数对工件表面粗糙度的影响。用SiC和Al2O3磨料分别对硬质合金和光学玻璃进行了抛光试验，考察了抛光时间、工具电极转速、电源电压、磨料浓度等工艺参数影响工件表面粗糙度的规律。试验结果表明，随着抛光时间、工具电极转速、电源电压的增加，工件表面粗糙度逐渐降低。随着磨料浓度增加，工件表面粗糙度先降低后升高。对于表面粗糙度而言，磨料浓度存在一个最佳值。     

Development and Polishing Process of a Mobile Robot Finishing Large Mold Surface

□ A novel self-determination polishing robot finishing large mold free-form surface is developed, and the finishing process method is researched. Contrary to traditional approaches, our premise is that a large mold surface can be polished by using a small robot. This robot system is mainly composed of a polishing robot part, a computer system and a visual positioning system. A type of robot with four uniform distribution wheels was designed, which has two driving wheels and two driven wheels. Active compliant control of the polishing tool was provided by a pneumatic servo system, and a new special compliant abrasive tool was proposed on the basis of robot characteristics. The process planning steps consisted of subdividing the free-form surface, choosing an abrasive tool, planning the polishing path and optimizing machining parameters. Based on the orthogonal experiment and the grey relational analysis method, the optimal parameter combination was obtained for polishing force, tool speed and feed rate. Aiming to polishing times, the surface roughness method and polishing efficiency method were studied in detail. The polishing experiments were carried out in the robot using process parameters obtained by the efficiency method. These research results provided significant theory foundation and experimental data for a mobile robot planning polishing to realize intelligible process parameter selection.     

Profile forming of a sub-micron radius circular cone-shaped diamond tool tip by ion sputter-machining

In making of the circular cone-shaped tip of a diamond tool having a sub-micron radius by ion sputter-machining, it is very important to investigate effects of the initially pre-finished shape of the diamond tool by diamond abrasive polishing on the finally finished shape by ion sputter-machining, and also develop prediction methods for obtaining the tip radius of a diamond tool by ion sputter-machining. Observation of the two-dimensional profile of a diamond tool tip using scanning electron microscopy showed the ion sputter-machining method to be applicable to this forming process. However, in order to obtain a symmetrical circular tip profile, the diamond tool must be pre-fisnished as much as possible by mechanical polishing as the symmetrical circular tip. The predicted values of tip radii by the straight line approximation method for the tip profile and the direct calculation method for the tip radius coincide with these experimentally obtained values. The profile and surface topography of the 2 μm tip radius diamond tool finished by ion sputter-machining is better than those finished by mechanical polishing     

硬质合金化学机械抛光工件-磨粒-抛光垫接触状态研究

基于弹塑性力学理论,对工件-磨粒-抛光垫间的接触状态进行理论分析,计算各状态下磨粒压入工件深度,建立接触状态临界条件的数学模型,并进行实验验证。研究结果表明：在硬质合金化学机械抛光过程中,工件-磨料-抛光垫间存在着非接触状态、部分接触状态和完全接触状态三种形式;不同接触状态下磨粒压入深度主要受抛光载荷、磨粒粒径以及工件表面软质层硬度影响,临界条件由抛光垫特性、磨粒质量分数以及抛光载荷共同决定。实验结果表明所建立的数学模型是可信的。     

含智能流变材料铝合金夹层板结构的动力学特性研究

通过对一种含电流变液铝合金夹层板智能结构的动力学实验与仿真，分析和研究该结构在外电场作用下的动力特性变化。实验发现，利用外部控制条件(电场强度)的变化，可以改变结构的固有特性，如自然频率、结构阻尼等，可实现对结构的主动控制。数值分析时采用粘弹性材料等效处理方法模拟电流变材料，计算得到的结构振动特性与实验结果吻合较好。实验与仿真计算结果均表明，随着电场强度的增大，结构固有频率也随之出现上升，且增幅与场强有关；同时，电流变材料对结构振动所产生的阻尼效应不仅受外加电场影响，还与外加激励频率有关，响应控制实验结果说明电流变材料对结构在固有频率附近所产生响应的控制效果要更为明显一些。     

A statistical model for material removal prediction in polishing

This paper develops analytically a statistical model for predicting the material removal in mechanical polishing of material surfaces (MS). The model was based on the statistical theory and the abrasive–MS contact mechanisms. The pad-MS and pad-abrasive-MS interactions in polishing were characterised by contact mechanics. Two types of active abrasive particles in the polishing system were considered, i.e., Type I – the particles that can slide and rotate between the pad and MS, and Type II – those embedded in the pad without a rigid body motion. Accordingly, the material removal is considered to be the sum of the contributions from the two types of abrasive interactions. It was found that the mechanical properties and microstructure of the polishing pad and polishing conditions have a significant effect on the material removal rate, such as the porosity and elastic modulus of the pad, polishing pressure, volume concentration of abrasives, particle size, pad asperity radius and pad roughness. It was also found that different types of active particles contribute quite differently to the material removal. When the mean particle radius is small, the material removal is mainly due to the Type II particles, but when the mean particle radius becomes large, the Type I particles remove more materials. The model predictions are well aligned with experimental results available in the literature and can be used for the material removal prediction in chemo-mechanical polishing if a proper treatment of the chemical effect is introduced.     

电流变夹层梁的动力稳定性分析

将电流变液等效为线性粘弹性材料，并假定在小变形情况下其储能模量和损耗因子与加在它上面的电场成正比，利用Hamilton原理和有限元方法建立电流变夹层梁的动力学方程。分析不同外加电场和厚度比情况下，电流变夹层梁的振动特性及动力稳定性。通过对单频轴向激励作用下电流变夹层悬臂梁的仿真计算显示，外加电场的增大能提高电流变夹层梁的刚度和阻尼损耗，减少不稳定区域的大小，而电流变层厚度的增加将使梁的固有频率降低，但提高了梁的稳定范围。表明合理设计电流变夹层梁可以有效抑制振动，提高系统的稳定性。     

电流变液体性能的试验研究

以SrTiO3/PANI合成粒子为分散颗粒,通过试验研究分析颗粒的体积分数、不同的分散介质和添加剂对基于SrTiO3/PANI合成粒子的电流变液体性能的影响。试验结果表明:蓖麻油作为分散介质与SrTiO3/PANI粒子组成的电流变液体其电流变性能良好。通过回归分析得出基于SrTiO3/PANI合成材料为粒子的电流变液体在上述条件下的屈服切应力与电场强度的关系表达式。研究结果将为同类电流变液体的工程应用提供理论依据。     

氧化铝复合磨粒的抛光特性研究

为提高氧化铝磨料分散稳定性,利用接枝聚合对氧化铝粒子进行了表面改性,并研究了改性后氧化铝粒子在数字光盘玻璃基片中的化学机械抛光特性。结果表明,氧化铝复合磨粒的抛光性能与其表面接枝率密切相关。接枝率上升,材料去除速率下降;试验条件下,当接枝率为2.93%时,氧化铝磨粒体现出较高的表面平整性、较低的表面粗糙度及较低的表面损伤。     

Active Profiling and Polishing Model and Validation Based on Rotor Spiral Groove

When a spiral groove is formed using superplastic molding, precision casting, additive manufacturing, or other non?mechanical processing technology, it is diffcult to meet the molding precision required for direct use, and the surface quality and accuracy of the shape need to be improved through a finishing process. In view of the poor reachability of the current tool?based polishing process, a tool?less polishing method using free?abrasive grains for complex spiral grooves is proposed. With this method, by controlling the movement of the workpiece, the design basis and relative motion of the abrasive particles along a helical path remain consistent, resulting in a better polishing profile. A spiral groove of a revolving body is taken as the research object; the influence of the installation method and the position of the parts, as well as the effect of the rotational speed of the abrasive ball on its relative motion along a helical trajectory, are studied, and the polishing cutting process of an abrasive ball is reasonably simplified. A consistent math?ematical model of the trajectory of an abrasive ball relative to the design helix is constructed. The grooved drum parts are verified through a polishing experiment. The spiral groove of the revolving body is modified and polished. Experiments show that the process not only corrects the shape a spiral groove error, but also reduces the surface roughness of a spiral groove. This study provides a theoretical basis for achieving free?abrasive, tool?free polishing.     

MAGIC抛光方法及其研究进展

MAGIC(MAGnetic Intelligent Compounds)是由包含磁性颗粒和磨粒的磁性流体固化形成的新型抛光材料。MAGIC中磁性颗粒形成的特殊排列可使磨粒均匀分布,因而MAGIC抛光可高效地获得小粗糙度的表面;另外,MAGIC可浇铸成形,故可用于复杂型面及狭小内表面的机械化抛光。简要介绍了MAGIC磨石的组成、制作方法、抛光效果以及目前的研究进展情况。     

硅晶片化学机械抛光材料去除机制与模型

通过分析软质层的形成、作用以及纳米磨料的自身变形对材料去除的影响,改进了CMP过程的接触力学模型;分析了纳米磨料自身变形量对磨料嵌入硅晶片基体材料的深度的影响,以及纳米磨料硬度对抛光表面粗糙度的影响。结果表明：软质层的存在增加了单个纳米磨料所去除材料的体积,且对基体材料有保护作用,减小了纳米磨料嵌入基体材料的深度;纳米磨料的自身变形抵消了纳米磨料嵌入基体材料的切削深度,从而也决定了抛光表面的粗糙度;纳米磨料的自身变形量与纳米磨料的硬度有关,硬度低的纳米磨料自身变形量大,因而切削深度小,抛光后表面的粗糙度值低。     

用于模具自由曲面的新型气囊抛光中磨粒场的分析

为提高模具自由曲面抛光的效率和品质,提出一种基于柔性抛光理念的新型气囊抛光技术。研究了气囊抛光接触区内磨粒的运动轨迹、压力分布和抛光力的分布情况,建立了气囊抛光接触区内磨粒的运动模型、压力模型,揭示了气囊抛光接触区内磨粒直径对抛光力和被加工工件内部剪切应力的影响规律,研究了抛光过程中工件内部的剪切应力分布,明确了材料疲劳去除机理。为气囊抛光的应用奠定了理论基础。     

磨粒流研抛伺服阀阀芯喷嘴的冲蚀磨损分析

为了研究固液两相磨粒流对伺服阀阀芯喷嘴的研抛性能,从冲蚀磨损的角度对比分析了不同磨粒硬度下的磨粒流研抛效果。利用计算流体力学方法,求解分析了磨粒流研抛伺服阀阀芯喷嘴时流场中的冲蚀磨损特性,采用电子显微镜以及扫描电镜仪检测伺服阀阀芯喷嘴零件经磨粒流研抛前后的表面粗糙度和表面形貌。实验结果表明:采用碳化硅磨粒和白刚玉磨粒加工后的伺服阀阀芯喷嘴主干通道、交叉孔以及小孔区域的粗糙度分别由1.1μm、0.823μm、0.743μm降低为0.735μm、0.721μm、0.571μm和1μm、0.747μm、0.696μm。在本试验中碳化硅磨粒的加工效果优于白刚玉磨粒,即具有高磨粒硬度的磨粒研抛效果好。检测结果显示,磨粒流研抛技术可有效改善伺服阀阀芯喷嘴的表面质量;提高磨粒硬度可提高磨粒流的研抛效果;伺服阀阀芯喷嘴的交叉孔以及小孔区域的表面质量要高于主干通道的表面质量。     

A novel polishing method for single-crystal silicon using the cavitation rotary abrasive flow

Traditional low-pressure abrasive flow polishing can produce highly smooth surfaces, but the efficiency of this method is too low for polishing of hard-brittle materials parts. This paper proposes a novel cavitation rotary abrasive flow polishing (CRAFP) method. The energy generated from the cavitation bubble collapse is used to increase the kinetic energy of the abrasive particles in the low-pressure abrasive flow and the motion randomness of the abrasive particles near the wall; thereby, the efficiency and quality of low-pressure abrasive flow polishing are improved. The CRAFP mechanism was first introduced, and then the characteristics of the CRAFP process were investigated using computational fluid dynamics (CFD)-based abrasive flow simulation. Subsequently, a single-crystal silicon wafer polishing test was carried outperformed to verify the validity of the CRAFP method. The polishing results were compared with those of the traditional low-pressure abrasive flow polishing method. After 8 h of polishing using the CRAFP method and the traditional low-pressure abrasive flow polishing method, the surface roughness of the workpiece decreased to7.87 nm and 10.53 nm, respectively. Furthermore, by starting at similar initial roughness values, the polishing time required to reduce the roughness to 12 nm was 3.5 h and 6 h, respectively. The experimental results demonstrated that CRAFP can satisfy the surface requirements of single-crystal silicon (R_a < 12 nm) and exhibit high polishing efficiency and good quality.     

介电泳效应磨粒流抛光中的电极形态

针对薄壁陶瓷工件内表面抛光,提出一种基于介电泳效应的磨粒流抛光方法。将非均匀电场布置于陶瓷工件外表面,极化磨粒,实现陶瓷工件内表面高效抛光。仿真分析发现:电极间隙比为2时,SiC磨粒具有最好的介电泳效应,参与抛光的磨粒最多。陶瓷工件初始内表面粗糙度值Ra为(208±5)nm时,抛光10 h后,无介电泳效应的磨粒流抛光工件内表面粗糙度值Ra为51 nm,有介电泳效应的磨粒流抛光工件内表面粗糙度值Ra为23 nm。     

耦合超声场的气液固三相磨粒流多物理场数值模拟研究

针对气液固三相磨粒流抛光研究中流场分布不均问题,对气液固三相磨粒流中的湍流分布、湍流峰值分布、能量分布、温度分布和加工质量等方面进行了研究,对气液固三相磨粒流的抛光方法和抛光问题进行了归纳,提出了一种耦合超声场的气液固三相磨粒多物理场数值模拟方法,利用超声场的交变声压增加了气液固三相磨粒流流场的扰动,改变了流场分布。研究结果表明:不同的超声频率和声压幅值会带来不同的流场分布,其中频率为20 k Hz、声压幅值为30 k Pa的超声场所得的流场分布最优。该研究成果对气液固三相磨粒流抛光方法的推广与实际运用具有重要意义。     

Effects of particle size, polishing pad and contact pressure in free abrasive polishing

The objective of this research is to better understand the mechanisms of material removal in the free abrasive polishing process. Experiments were carried out to understand the effects of particle size, polishing pad and nominal contact pressure on the wear rate and surface roughness of the polished surface. A theoretical model was developed to predict the relationship between the polishing parameters and the wear rate for the case of hard abrasive particles sandwiched between a soft pad and a workpiece (softer than the abrasive particles). Experimental results and theoretical predictions indicate that the wear rate increases with an increase in particle size, hardness of polishing pad and nominal contact pressure, and with a decrease in elastic modulus of the polishing pad. Surface roughness increases with an increase in particle size and hardness of polishing pad, and nominal contact pressure has little effect on the roughness. A dimensionless parameter, wear index which combines all of the preceding parameters, was introduced to give a semi-quantitative prediction for the wear rate in free abrasive polishing. It is also suggested that when polishing hard material, in order to achieve a high materials removal rate and a smooth surface, it is preferable to use diamond as the polishing particles because of their high deformation resistance.