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Printed electronics are an important enabling technology for the development of low‐cost, large‐area, and flexible optoelectronic devices. Transparent conductive films (TCFs) made from solution‐processable transparent conductive materials, such as metal nanoparticles/nanowires, carbon nanotubes, graphene, and conductive polymers, can simultaneously exhibit high mechanical flexibility, low cost, and better photoelectric properties compared to the commonly used sputtered indium‐tin‐oxide‐based TCFs, and are thus receiving great attention. This Review summarizes recent advances of large‐area flexible TCFs enabled by several roll‐to‐roll‐compatible printed techniques including inkjet printing, screen printing, offset printing, and gravure printing using the emerging transparent conductive materials. The preparation of TCFs including ink formulation, substrate treatment, patterning, and postprocessing, and their potential applications in solar cells, organic light‐emitting diodes, and touch panels are discussed in detail. The rational combination of a variety of printed techniques with emerging transparent conductive materials is believed to extend the opportunities for the development of printed electronics within the realm of flexible electronics and beyond.  相似文献   

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无颗粒型银导电墨水的制备及其性能研究   总被引:1,自引:1,他引:0  
周广洲  蔡亚果  张哲娟  孙卓  朴贤卿 《材料导报》2016,30(12):50-54, 60
首先以硝酸银作为银源,制备出柠檬酸银和碳酸银,然后以柠檬酸银和碳酸银为金属前驱体化合物,异丙胺为络合剂,甲醇为还原剂,另加入少量添加剂以调节粘度和表面张力等物理参数,制得无颗粒银导电墨水。该银导电墨水可以采用A4平板打印机在PET(Polyethylene terephthalate)上打印图案,并在较低的热处理温度下即可获得导电性较好的银膜。利用X射线衍射仪、扫描电子显微镜、四探针测试仪、接触角测量仪、傅里叶变换红外光谱仪、热分析仪对柠檬酸银、碳酸银、导电墨水及导电银膜进行测试表征。结果表明导电墨水经130℃热处理之后,导电银膜由均匀的纳米银颗粒组成;经130℃热处理40min后,得到的银膜的方块电阻可低至0.84Ω·□~(-1),可广泛用于电子印刷行业。  相似文献   

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Inkjet printing is a widely used technique in the field of printed electronics. Yet its reliability is limited because absent droplets induced by defective, e.g., clogged, nozzles can lead to pinholes in the printed layers causing a reduction of the quality of printed films or a breakdown of the functionality in microelectronic devices. Therefore, pinholes in inkjet‐printed layers need to be avoided. In this study the origins for pinholes in inkjet‐printed films are examined. It is found that single missing droplets cannot lead to pinholes but certain formations can. This paper presents the corresponding responsible combinations of defective nozzles necessary to create a pinhole. To enable a statistical approach the pinhole occurrence probabilities are computed depending on the number of broken nozzles as well as quality factors and step sizes with a Monte Carlo simulation. The model shows that by choosing the right print strategy the pinhole probability can be reduced by three orders of magnitude. Finally, a novel print strategy is suggested, which is not yet supported by default printer settings but can reduce the pinhole probability even further by a factor of over 2000 in total. This represents the smallest pinhole occurrence probability ever achieved.  相似文献   

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The printed electronics (PEs) market has witnessed substantial growth, reaching a valuation of USD 10.47 billion in the previous year. Driven by its extensive use in a multitude of applications, this growth trend is expected to continue with a projected compound annual growth rate of 22.3% from 2022 to 2032. Compared to screen printing, the adoption of inkjet printing (IJP) technology to manufacture PEs has been limited to laboratory-scale research only. The fact that IJP's inability to maintain consistent high-resolution quality over large printing areas has made transitioning IJP for commercial production arduous. Most of the previous literatures have focused on holistic discussion on material design for IJP, but this review provides insight into key aspects in material processing up to printing optimization to realize high-resolution PEs. This review also highlights the challenges in controlling the functional ink properties and their interaction with the substrate as well as printing parameters to deliver the desired quality of the droplets and final prints. Imminent application of IJP in PEs and future perspectives are also included in this review.  相似文献   

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Cellulose foil is a biodegradable and carbon neutral material that is a poor substrate for most conductive silver inks. Herein, it is reported that a simple solution of silver acetate in 1‐methylimidazole can be used to produce conductive patterns on a commercial packaging foil that is composed almost exclusively from cellulose. The reduction can be carried out thermally or by irradiation with UV light. In the latter case, the printed pattern may become conductive on both sides of the substrate and also exhibits conductivity across the cellulose foil, giving rise to fully printed vertical interconnect access. Control experiments confirm that the cellulose plays a crucial role in completing the reduction of the silver salt, obtaining conductive patterns.  相似文献   

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The world's ever increasing demand for energy necessitates technologies that generate electricity from inexhaustible and easily accessible energy sources. Silicon photovoltaics is a technology that can harvest the energy of sunlight. Its great characteristics have fueled research and development activities in this exciting field for many years now. One of the most important activities in the solar cell community is the investigation of alternative fabrication and structuring technologies, ideally serving both of the two main goals: device optimization and reduction of fabrication costs. Inkjet technology is practically evaluated along the whole process chain. Research activities cover many processes, such as surface texturing, emitter formation, or metallization. Furthermore, the inkjet technology itself is manifold as well. It can be used to apply inks that serve as a functional structure, present in the final device, as mask for subsequent structuring steps, or even serve as a reactant source to activate chemical etch reactions. This article reviews investigations of inkjet‐printing in the field of silicon photovoltaics. The focus is on the different inkjet processes for individual fabrication steps of a solar cell. A technological overview and suggestions about where future work will be focused on are also provided. The great variety of the investigated processes highlights the ability of the inkjet technology to find its way into many other areas of functional printing and printed electronics.  相似文献   

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Conductive inkjet printing with metal nanoparticles is irreversible because the particles are sintered into a continuous metal film. The resulting structures are difficult to remove or repair and prone to cracking. Here, a hybrid ink is used to obviate the sintering step and print interconnected particle networks that become highly conductive immediately after drying. It is shown that reversible conductive printing is possible on low‐cost cardboard samples after applying standard paper industry coats that are adapted in terms of surface energy and porosity. The conductivity of the printed films approaches that of sintered standard inks on the same substrate, but the mobility of the hybrid particle film makes them less sensitive to cracks during bending and folding of the substrate. Damages that occur can be partially repaired by wetting the film such that particle mobility is increased and particles move to bridge insulating gaps in the film. It is demonstrated that the conductive material can be recovered from the cardboard at the end of its life time and be redispersed to recycle the particles and reuse them in conductive inks.  相似文献   

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Printed electronics are striving for smaller size, increased functionality, and lower energy consumption, which impose critical demand for multilayered printed circuits. As a low‐cost and green substrate, cellulose paper has become the most attractive choice for the printing of sustainable and disposable electronics. However, the redundant processes of drilling holes and/or depositing of dielectric materials, when fabricating the vertical interconnect access (VIA) for these multilayered circuits, greatly increase the cost. In this paper, a simple, cost‐effective, and scalable method is proposed for fabricating high‐performance, multilayered paper‐based circuits which contain highly conductive VIAs without physically drilling holes or depositing additional dielectric material. Taking advantages of inkjet printing and electroless copper deposition, the metallization depth of the substrate can be controlled with ease. In the proposed method, the porous structure of cellulose paper, which is previously an obstacle to printed electronics, becomes an advantage by triggering the 3D copper deposition, resulting in an ultralow sheet resistance of ≈4.8 mΩ sq−1 for single layer traces and ≈2.6 mΩ sq−1 for VIAs. A functional double‐layered and battery‐free device with drill‐less VIA, featuring an energy harvesting function, is fabricated using the proposed method on paper for the first time.  相似文献   

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A nonvolatile memory thin film transistor (TFT) is an essential building block in all electronic applications for calculation and identification. In particular, organic memory TFTs using bilayered polymer electrets have attracted significant attention due to excellent mechanical flexibility and fast operating speed. However, the data retention characteristics over an extended period of time remains a major reliability issue for nonvolatile memory devices. Here, the enhancement of data retention in flexible and printed organic memory TFTs by introducing a phase‐separated tunneling layer is demonstrated. The tunneling layer is formed during an active layer printing process with a blend ink of small‐molecule organic semiconductor and polystyrene insulator. The effect of the dielectric tunneling layer on data retention characteristics is systematically investigated. The printed nonvolatile memory devices with the phase‐separated tunneling layer exhibit significantly improved data retention time of over 10 years, validating the feasibility of applying flexible memory into wearable electronics and smart Internet‐of‐Things devices.  相似文献   

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The rapid progression of portable and wearable electronics has necessitated the development of high-performing, miniaturized energy-storage devices with flexible form factors and high energy and power delivery. Printed micro-supercapacitors (MSCs), with in-plane interdigital configurations, is touted as a promising choice to fulfill these requirements. New printing technologies can assemble MSCs with fiscal and environmental benefits, large form factors, and at high throughputs, qualities not afforded with conventional microfabrication technologies. Here, recent progress in the preparation of functional ink systems for wearable MSCs, encompassing electrode materials, conductor materials, and electrolytes, is presented. First, a comprehensive background of the fundamentals of printing technology is introduced, with discussions focusing on methods of improving ink functionality while simultaneously retaining good printability. Second, various printing techniques to ensure manufacturable scaling of wearable MSCs with high areal electrochemical performance and small footprint are explored. Within the scope of these two topics, various issues that hinder the full materialization of widespread adoption of printed MSC and next steps to overcome these issues are discussed. Further deep dives in scientific and technical challenges are also presented, including limited functionality of the inks, low printing resolution, overlay accuracy, and complex encapsulation.  相似文献   

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Due to their complex formulation, conductive nanoparticle inks for inkjet printing are limited in terms of the types of metals and substrates that can be utilized. A new and simplified class of inks called metal salt decomposition (MSD) inks has the potential to introduce a multitude of metals, which can be printed directly onto a wide range of substrates. Here, the use of atmospheric oxygen plasma to develop polycrystalline Au and Pt films at processing temperatures near room temperature (≈33 °C) with excellent conductivities up to 105 S m−1 is demonstrated. The conformal nature of the ink allows metal films to be printed onto a broad range of temperature-sensitive substrates including polymers, papers, and fabric. The Au ink is then used to build a simple light-emitting diode circuit showing its flexibility, durability, and long-term stability as deposited thin metal films. Additionally, such inks cost less than one-third the price of similar nanoparticle inks highlighting their overall affordability and good stability.  相似文献   

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Organic electronic devices are often highlighted in terms of cost‐efficient solution processing and potential printability. However, few studies are reporting truly full‐solution‐processed devices taking into account the electrodes as well as all other layers. This results in a production method that only partially benefits from the cost efficiency of solution processing and that still depends on costly and elaborate techniques like evaporation and/or lithography. This lack of knowledge is addressed by presenting a truly fully printed light‐emitting electrochemical cell on ultraflexible parylene C substrates usable for conformable electronics. All device parts are fabricated by industrial relevant printing‐techniques under ambient atmosphere. Inkjet printing is used for the structuring of the device layout and is therefore able to implement and create arbitrary designs. Further layers are produced by blade coating which is well suited for the coating of large areas. The devices show stable operation at a luminance higher than 100 cd m−2 for 8.8 h, can reach a maximum brightness of 918 cd m−2, and exhibit a turn‐on time of 40 s to reach 100 cd m−2. Moreover, biocompatible and biodegradable materials are utilized to allow potential applications in life science and bioelectronics.  相似文献   

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Inkjet‐printing is one of the most important fabrication techniques in the field of printed electronics. Its main advantages include the possibility of fabricating, at ambient conditions and by employing a digital layout, a large variety of electronic devices on different types of substrates, including flexible plastic ones. In this paper, the utilization of inkjet‐printing as an important fabrication tool for the realization of organic transistors and circuits/sensing systems based on such type of transistors is reviewed. The most important aspects of the fabrication process, including ink formulation, printing deposition, and postprinting treatment, are described in detail. The most significant examples of inkjet‐printed organic transistors of different types (field‐effect, electrolyte‐gated, and electrochemical) are presented and finally an overview of their applications as building blocks of more complex electronic circuits and systems for the detection and quantification of specific measurands is provided.  相似文献   

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Functional inks enable manufacturing of flexible electronic devices by means of printing technology. Silver nanoparticle (Ag NP) ink is widely used for printing conductive components. A sintering process is required to obtain sufficient conductivity. Thermal sintering is the most commonly used method, but the heat must be carefully applied to avoid damaging low-temperature substrates such as polymer films. In this work, two alternative sintering methods, damp heat sintering and water sintering are systematically investigated for inkjet-printed Ag tracks on polymer substrates. Both methods allow sintering polyvinyl pyrrolidone (PVP) capped Ag NPs at 85°C. In this way, the resistance is significantly reduced to only 1.7 times that of the samples on polyimide sintered in an oven at 250°C. The microstructure of sintered Ag NPs is analyzed. Taking the states of the capping layer under different conditions into account, the explanation of the sintering mechanism of Ag NPs at low temperatures is presented. Overall, both damp heat sintering and water sintering are viable options for achieving high conductivity of printed Ag tracks. They can broaden the range of substrates available for flexible electronic device fabrication while mitigating substrate damage risks. The choice between them depends on the specific application and the substrate used.  相似文献   

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