Modeling and Analysis of Machinability Evaluation in the Wire Electrical Discharge Machining (WEDM) Process of Aluminum Oxide-Based Ceramic

The wire electrical discharge machining (WEDM) allowed success in the manufacture of the hard, fragile, and materials difficult to cut, especially for electroconductive ceramic materials. In this study, the mathematical models of material removal rate (MRR) and surface roughness (SR) used for the machinability evaluation in the WEDM process of aluminum oxide-based ceramic material (Al₂O₃ + TiC) have been carried out. The experimental plan adopts the face centered central composite design (CCD). The mathematical models using the response surface methodology (RSM) are developed so as to investigate the influences of four machining parameters, including the peak current, pulse on time, duty factor, and wire speed, on the performance characteristics of MRR and SR. It has been proved that the proposed mathematical models in this study would fit and predict values of the performance characteristics, which would be close to the readings recorded in experiment with a 95% confidence level. The significant parameters that critically affect the performance characteristics are examined.     

光学元件聚氨酯抛光特性研究

本文研究了应用于平面光学元件的快速抛光技术,从材料去除率、元件面形和表面粗糙度出发,对快速抛光技术应用于平面大口径元件的加工效果进行了探讨。研究了在快速抛光技术中压力和主轴转速对材料去除率的影响,验证了Preston公式在快速抛光中的适用性,快速抛光技术的去除效率可达10μm/h;其次,研究了聚氨酯抛光元件面形的精度,对于330mm×330mm元件可达～1.0λ（λ=632.8nm）;最后,对快速抛光系统中抛光粉颗粒大小及形态随使用时间的变化进行了观测,并测量了使用300目和500目抛光粉时快速抛光元件表面粗糙度以及其随抛光粉使用时间的变化。     

材料特性对亲水性固结磨料研磨垫加工性能的影响

为研究材料特性对亲水性固结磨料研磨垫的加工性能影响,本文研究了K9玻璃和硅片两种材料在不同加工顺序下研磨过程中的声发射信号和摩擦系数特征,采用扫描电镜分析磨屑的尺寸与形态.结果表明:不同加工顺序下工件的材料去除速率差别很大.与直接研磨硅片相比,先研磨K9玻璃再研磨硅片,硅片的材料去除速率大幅下降;相反,先研磨硅片再研磨K9玻璃,与直接研磨K9玻璃相比,K9玻璃的材料去除速率变化不大.无论采用哪种加工顺序,后研磨的工件表面粗糙度均比直接研磨的同种工件要大.扫描电镜的分析表明,硅片的磨屑尺寸集中在600 nm~1.5μm,磨屑大部分都棱角完整;而K9玻璃的磨屑尺寸集中在300 nm~500 nm左右,无明显棱角.硅片磨屑较大的尺寸与完整的棱角促进了研磨垫的自修正过程,所以硅片这类脆性较大的材料有利于研磨垫的自修正过程.     

Experimental Analysis of Cutting Forces in Microdrilling of Austenitic Stainless Steel (X5CrNi18-10)

This article presents an experimental investigation on microdrilling of austenitic stainless steel which is a difficult material for machining because of its properties like high strain-hardening rate, low thermal conductivity, and high fracture toughness. Microholes are produced on X5CrNi18-10 austenitic stainless steel workpiece using 0.5 mm diameter solid carbide microdrills. Two factors (cutting speed and feed) and three levels (low–center–high) full-factorial design of experiment are performed. Response surface methodology is used to developed mathematical models (quadratic and bilinear regression models) for cutting forces in microdrilling. The experimental analysis shows that feed affects the cutting force components (radial and thrust) significantly. Additionally, it also shows that there are only minor effects from cutting speed, square of cutting speed, square of feed and product of speed, and feed on the cutting forces. Finally, the optimized cutting conditions are proposed for minimum cutting forces.     

环境因子对磁性瓜环去除腐殖酸的影响及其稳定性研究

采用紫外可见分光技术研究了磁性瓜环(MQ[n])对水体污染物腐殖酸(HA)的去除性能、稳定性及磁性能。考察了MQ[n]的投加量、HA的初始浓度、溶液温度、作用时间及pH值等因素对去除HA的影响。结果表明,MQ[n]对HA具有很好的去除作用,其中,MQ[n]投加量与pH值对HA的去除效果影响较大。其较优条件为MQ[n]投加量20mg、HA初始质量浓度10 mg/L、吸附温度315 K、平衡时间360 min、pH值7.0,在此条件下,MQ[n]对HA的去除率达到98.73%。MQ[n]稳定性好,且易于磁性分离。     

不同磨料对微晶玻璃化学机械抛光的影响

为了提高微晶玻璃化学机械抛光(CMP)的材料去除速率(MRR),降低其表面粗糙度,利用自制的抛光液对微晶玻璃进行化学机械抛光,研究了4种含不同磨料(Si O2、Al2O3、Fe2O3、Ce O2)的抛光液对微晶玻璃化学机械抛光MRR和表面粗糙度的影响.利用纳米粒度仪检测抛光液中磨料的粒径分布和Zeta电位,利用原子力显微镜观察微晶玻璃抛光前后的表面形貌.实验结果表明,在相同条件下,采用Ce O2作为磨料进行化学机械抛光时可以获得最好的表面质量,抛光后材料的表面粗糙度Ra=0.4 nm,MRR=100.4 nm/min.进一步研究了抛光液中不同质量分数的Ce O2磨料对微晶玻璃化学机械抛光的影响,结果表明,当抛光液中Ce O2质量分数为7%时,最高MRR达到185 nm/min,表面粗糙度Ra=1.9 nm;而当抛光液中Ce O2质量分数为5%时,MRR=100.4 nm/min,表面粗糙度最低Ra=0.4 nm.Ce O2磨料抛光后的微晶玻璃能获得较低表面粗糙度和较高MRR.     

Effect of deep cryotreated tungsten carbide electrode and SiC powder on EDM performance of AISI 304

Abstract

Powder mixed electric discharge machining (PMEDM) is a further advancement of conventional EDM process in which electrically conductive powder is suspended in the dielectric fluid to enhance the material removal rate (MRR) along with the surface quality. Cryotreatment is introduced in this process for improving the cutting tool properties as well as tool life. In this investigation, EDM is performed for the machining of AISI 304 stainless steel using cryotreated double tempered tungsten carbide electrode when SiC powder is suspended in the kerosene dielectric. The influence of process parameters viz. pulse on time, peak current, duty cycle, gap voltage and powder concentration on tool wear rate (TWR), surface roughness (R_a), and MRR has been studied. Metallographic analysis was carried out for the machined surfaces. By the addition of powder concentration and cryotreated double tempered electrode, significant improvement in the machining efficiency has been found out. When cryotreated electrode used MRR, TWR and R_a decreased by 12%, 24% and 13.3%, respectively and when SiC powder used MRR increased by 23.2%, TWR and R_a decreased by about 25% and 14.2%, respectively.     

基于磨损行为的单晶硅片化学机械抛光材料的去除特性

为了掌握化学机械抛光（CMP）过程中硅片表面材料的去除行为,根据CMP过程中硅片表面材料的磨损行为,建立了硅片CMP时的材料去除率构成成分模型,设计了不同成分的抛光液并进行了材料去除率实验,得出了机械、化学及其交互作用所引起的材料去除率.结果显示,机械与化学的交互作用率为85.7%～99.1%.磨粒的机械作用率为69.5%～94.0%,磨粒的机械与化学交互作用率为55.1%～93.1%.由此可见,磨粒的机械作用是化学机械抛光中的主要机械作用,磨粒与抛光液的机械化学交互作用引起的材料去除率是主要的材料去除率.研究结果可为进一步研究硅片CMP时的材料去除机理提供理论参考依据.     

基于游离磨粒的化学机械抛光材料去除非均匀性形成机制(英文)

本文主要研究硬脆晶体材料化学机械抛光中基片内材料去除非均匀性的形成机理.首先分析了化学机械抛光时抛光机的运动参数对硅片表面上相对速度分布非均匀性、摩擦力分布非均匀性、接触压力分布非均匀性及磨粒运动轨迹密度分布非均匀性的影响规律.然后通过基片内材料去除非均匀性实验,得出了抛光机运动参数对基片表面材料去除非均匀性的影响.通过比较理论分析与实验结果,基片表面上相对速度分布非均匀性、摩擦力分布非均匀性及接触压力分布非均匀性随转速的变化趋势与基片表面材料去除非均匀性的实验结果相差较大,只有磨粒在基片表面上的运动轨迹分布非均匀性与基片表面材料去除非均匀性的实验结果趋势相同.研究结果表明,基片表面材料去除非均匀性是由磨粒在基片表面上的运动轨迹分布非均匀性造成的,充分说明了基片表面材料去除的机械作用主要是磨粒的机械作用.     

用锥形量热仪研究细水雾抑制熄灭PVC火

利用锥形量热仪和单流体细水雾系统研究了细水雾抑制PVC火的过程，并观察了重燃现象的发生，测量了实验中热释放速率及O2，CO2，CO和烟气的浓度变化，并对不同细水雾工作压力及不同热辐射流量下的结果进行了比较。由实验可知细水雾能快速扑灭PVC火，且压力越大灭火越迅速，但是在灭火后停止施加细水雾会发生重燃现象，且重燃发生的时间长短与作用在燃料表面的水量有关。     

二维超声振动辅助化学机械磨削技术及单晶硅实验

为了提高材料去除率和加工通用性,本文提出了工具施加二维超声波振动辅助的化学机械磨削(CMG)复合加工方式,开发具有伸缩和弯曲两种模态的二维超声波振动子及实验装置.以单晶硅片为加工对象,进行单点切削加工轨迹特性分析,并比较不同加工模式以及加工参数对表面粗糙度和材料去除率的影响.实验结果表明,二维超声辅助下的单点切削轨迹存在更多延性加工趋势.在同样普通机床精度条件下,随着时间的增加,二维超声辅助CMG表面粗糙度明显改善,达到纳米级.较无超声情况下二维超声波辅助CMG复合加工材料去除率提高约1倍,可获得最优表面粗糙度5 nm,一维径向超声辅助加工结果次之.     

Six sigma-based approach to optimize deep drawing operation variables

The six sigma approach has been increasingly adopted worldwide in the manufacturing sector in order to enhance the productivity and quality performance and to make the process robust to quality variations. This paper deals with one such application of six sigma methodology to improve the yield of deep drawing operations. The deep drawing operation has found extensive application in producing automotive components and many household items. The main issue of concern of the deep drawn products involves different critical process parameters and governing responses, which influences the yield of the operation. The effects of these parameters are analysed by the DMAIC (Define, Measurement, Analyse, Improve, Control)-based six sigma approach. A multiple response optimization model is formulated using the fuzzy-rule-based system. The functional relationship between the process variables and the responses is established, and thereafter their optimum setting is explored with the aid of response surface methodology (RSM). Rigorous experimentations have been carried out, and it is observed that the process capability of processes is enhanced significantly, after the successful deployment of the six sigma methodology.