氧含量与溅射气压对NiO薄膜形貌和结构的影响

利用直流反应磁控溅射在O2和Ar混合气氛下,在Si(111)衬底上沉积NiO薄膜,采用X射线衍射仪(XRD)和扫描电子显微镜(SEM)对薄膜晶体结构及形貌进行分析,研究了氧含量和溅射气压对NiO薄膜择优取向和表面形貌的影响。结果表明:低氧含量下,NiO(220)晶面择优生长,薄膜表面为典型的蠕状结构;较高氧含量下,薄膜择优(111)晶面生长,织构呈现有序状态;随着溅射气压的增高,择优取向先变差再变明显,薄膜晶粒先增大后减小。     

射频磁控反应溅射氧化硅薄膜微结构和电击穿场强研究

采用射频磁控反应溅射法在单晶硅片上制备了氧化硅(SiOx)薄膜,分析了薄膜的主要成分,研究了制备工艺对薄膜表面形貌和电击穿场强的影响.结果表明:薄膜的主要成分为氧化硅(SiOx);退火前后,薄膜的表面粗糙度由原来的1.058nm下降至0.785nm,峰与谷之间的高度差由原来的7.414nm降低至5.046nm;薄膜的电击穿场强随溅射功率的增加先增大后减小,通过800℃/100 s的快速热退火,在各种射频功率下制备的薄膜电击穿场强都有明显升高.薄膜的绝缘性能显著增强.     

NiFe层溅射气压对顶部钉扎NiFe/FeMn薄膜静态磁性能的影响

用直流磁控溅射制备了系列Ta/NiFe/FeMn/Ta薄膜样品。利用振动样品磁强计(VSM)、X射线衍射(XRD)等手段研究了溅射气压对NiFe层交换偏置场、矫顽力、截止温度的影响。结果表明,交换偏置场随NiFe层溅射气压和NiFe层厚度的增加均减小;在较低的NiFe层溅射气压下,可以获得具有较高交换偏置场He和较低矫顽力Hc的样品;截止温度Tb随着NiFe层溅射气压的减小而增高。通过对比研究0.8Pa、0.4Pa、0.2PaNiFe层溅射气压下NiFe/FeMn薄膜的静态磁性及微结构变化,发现以上现象是由于在较低的溅射气压能够获得较好织构的NiFe(111),进而诱导出较好取向的FeMn(111)。取向良好的NiFe/FeMn薄膜产生较大的交换偏置场和较小的矫顽力及更高的截止温度。     

反应溅射DyFeCo薄膜的界面特征及其对磁光特性的影响

采用RF磁控溅射方法制备了一系列AlN／DyFeCo／glass多层磁光薄膜。扫描电镜分析表明,随着溅射DyFeCo薄膜时氩气压的增大,AlN／DyFeCo界面的粗糙程度增大。进一步的研究表明,界面粗糙程度的改变对磁光多层膜的磁光特性影响很大,界面越粗糙,矫顽力从越大,反射率R越低,而克尔角θk首先随表面粗糙程度的增大而增大,到达一极大值然后再随表面粗糙程度的增大而减小。     

Ni65Co35薄膜各向异性磁电阻性能的研究

选用Ｎｉ６５Ｃｏ３５合金靶材，利用射频磁控溅射的方法成膜，采用四控针法测量磁电阻率，分别研究了溅射工艺参数（工艺气压、偏压、功率、基片温度等）对薄膜电阻性能的影响，并对影响的机理作了理论上的分析；另外还对Ｎｉ６５Ｃｏ３５薄膜的热处理动力学进行了研究，求取了激活能。研究结果表明，溅射工艺参数对Ｎｉ６５Ｃｏ３５薄膜的电阻力有较大的影响，适当的溅射参数能有效地提高磁电阻率；Ｎｉ６５Ｃｏ３５薄膜退火处理后     

Co/Cu非连续多层膜的制备和GMR性能的研究

采用磁控溅射法制备了系列[Co0.55nm/Cut]30(t=0.6,0.9,1.2,1.5,1.8,2.1,2.4,2.7,3.0)非连续多层膜样品,并利用四探针法研究了Cu层厚度、退火温度以及周期数对薄膜巨磁阻(GMR)效应的影响。磁电阻测量表明,随着非铁磁层Cu层厚度的增加,薄膜样品的GMR效应总体呈下降趋势,并出现了振荡现象;经退火处理后,薄膜的GMR效应呈先增大后减小的趋势,在350℃达到最大,为-5.1%;薄膜的GMR效应随着周期数的增加而增大,当周期数为50时趋于恒定。     

低温等离子体处理对变频牵引电机匝间绝缘性能影响

聚酰亚胺(polyimide,PI)因其优异的介电特性而应用于高速动车组牵引电机的匝间绝缘中。为了研究等离子体处理对其绝缘性能影响,采用介质阻挡放电(dielectric barrier discharge,DBD)在大气压空气中产生功率密度为24.5W/cm3低温等离子体,并对PI薄膜进行单、双面改性,通过测试接触角、傅里叶红外光谱(Fourier transform infrared spectroscopy,FTIR)、电晕击穿时间等来研究其性能变化。研究结果表明:随等离子体处理时间的增加,薄膜的接触角逐渐下降,而表面能则逐渐增加,等离子体在薄膜表面引入的—NH2、—COOH、—OH等极性亲水基团是其表面性能改变的主要原因;单层PI薄膜的耐电晕时间随改性时间的增加先增大后减小,且当改性时间为10 s时,其耐电晕时间最大,相对于未改性的PI膜提高了17.7%;双面改性双层叠加PI膜的耐电晕时间相较于未改性的双层叠加PI膜提高了30.3%。研究发现,一定程度的等离子体处理(小于10 s)可在PI膜表面引入极性基团,进而增强其表面电荷扩散能力,增大其表面电荷注入难度,提高单、双层薄膜的耐电晕能力。此外,双层薄膜的耐电晕性能的提高还与层间界面的改善有关。     

溅射功率对M型钡铁氧体薄膜磁性能的影响

采用射频磁控溅射法制备了c轴垂直膜面取向的M型钡铁氧体(BaM)薄膜,研究了溅射功率对BaM薄膜取向及磁性能的影响。结果表明,在溅射功率为80W、110W、140W和170W时所制备的BaM薄膜均具有一定程度的c轴垂直膜面取向,但溅射功率的增高会造成薄膜内晶粒取向混乱,导致薄膜磁晶各向异性降低;当溅射功率为140W时,薄膜具有最高饱和磁化强度(Ms)303kA/m和最小面外方向矫顽力(Hc⊥)191kA/m;适当低的溅射功率更有利于制得磁晶各向异性强的薄膜。     

电镀铜薄膜界面结合强度及氧化性能的研究

镀层与基体的结合强度是衡量镀层与基体表面结合牢固程度的重要指标,也是其各项性能得以实现的重要前提.采用电镀方法在PI膜上制备了铜(Cu)薄膜,并研究了工艺参数与结合强度的关系.同时,依据Cu薄膜方块电阻随氧化时间的变化情况,得到氧化产物厚度与氧化时间的关系.结果表明:镀层结合强度随着电流密度、温度及pH值的增大均先增加而后逐步减小.在低温下铜薄膜的氧化符合指数规律,高温下符合线性规律,温度越高,铜的氧化速率越快.     

B靶溅射功率对FeGaB薄膜磁性能的影响

采用磁控共溅射法制备FeGaB合金薄膜,FeGa靶的溅射功率为40 W,通过调整B靶的溅射功率来调控薄膜的成分.结果表明,制备出的FeGaB薄膜厚度均匀,呈非晶态,具有较小的矫顽力和较大的磁致伸缩系数.当B靶的射频溅射功率大于30 W时,薄膜的矫顽力Hc降低到2.1 Oe左右.B靶溅射功率增大时,B元素的含量增大,FeGaB薄膜的磁致伸缩系数先增大后减小.当溅射功率为40 W时、B元素含量为11.9％,FeGaB薄膜的磁致伸缩系数达到64 ppm.     

基片温度对Ni81Fe19薄膜结构和各向异性磁电阻的影响

利用磁控溅射方法制备了一系列Ta(x)/Ni81Fe19(100nm)/Ta(3nm)磁性薄膜。着重研究基片温度、缓冲层厚度对薄膜结构和各向异性磁电阻的影响。利用X射线衍射仪分析了薄膜结构、晶粒取向;用四探针法测量了薄膜的电阻率和各向异性磁电阻。结果表明,基片温度对薄膜的各向异性磁电阻及饱和场有显著影响,随着基片温度的升高,薄膜各向异性磁电阻随之增大,饱和场则相反。基片温度在400℃时制备的Ni81Fe19薄膜具有较大的各向异性磁电阻比和较低的磁化饱和场,薄膜最大各向异性磁电阻比为4.23%,最低磁化饱和场为739.67A/m;随着缓冲层厚度的增加,坡莫合金薄膜的AMR值先变大后减小,在x=5nm时达到最大值。     

Effects of sputtering pressure and thickness on properties of ZnO:Al films deposited on polymer substrates

Highly conducting and transparent aluminum doped zinc oxide (ZnO:Al) thin films have been deposited on polyimide substrate by r.f. magnetron sputtering at room temperature. The influence of sputter pressure and thickness on the structural, electrical, and optical properties of ZnO:Al films deposited on polyimide substrate is reported. The crystallinity and degree of orientation was increased by decreasing the sputter pressure. For higher sputtering pressures an increase on the resistivity was observed due to a decrease on the mobility and the carrier concentration. As the film thickness was increased, the crystallite sizes were increased, but the average transmittance in the wavelength range of the visible spectrum was decreased. The electrical performances of the ZnO:Al films deposited on glass substrates are slightly worse than the ones of the films deposited on polyimide substrates with same thickness. The lowest resistivity of 8.6?×?10^?4 Ω cm can be obtained for films deposited on glass substrate with the thickness of 800 nm.     

Structural and electrochemical properties of Nichrome anode thin films for lithium battery

Low cost anode materials having a high electrochemical efficiency have been critical in the success of thin film batteries that are applicable in ubiquitous environments as a portable energy source. Nichrome thin films are ideally suited for use in hybrid assemblies but their applications include precision integrated circuits in fields of telecommunications, instrumentation, power supplies, military and medical equipment where low noise and good power dissipation are required. With such a wide spectrum of applications, it is important to understand the electric behavior of the Nichrome alloy thin films by their microstructure. In this work, nanocrystalline films of nickel chromium alloys were deposited on alumina substrate by radio frequency (RF) magnetron sputtering technology. High purity nickel and chromium sputtering target were used for the deposition. First, aluminum was deposited on ceramic substrate acts as a current collector and over that NiCr was deposited by RF sputtering method. Both the layers were analyzed for structural and electrical properties using X-ray diffraction (XRD), energy dispersive X-ray analysis (EDS), atomic force microscopy (AFM), scanning electron microscopy (SEM) and cyclic voltammetry. The XRD peak confirms that deposited NiCr and Aluminum have tetragonal and cubic structures, respectively. The crystallite size was determined by full width at half maximum of XRD peaks. Structure, composition and the properties of the film are the major focus of this paper. Composition ratio between nickel and chrome obtained by EDS is 1:1. Particle size and microstructure of the film have been studied by SEM and AFM. Electrochemical properties of the films were analyzed. Reaction mechanism for the insertion and excretion is reported. After Lithium insertion and extraction the effect on the surface and structure of the thin film has been studied. The composition of equilibrium phases of NiCr as useful as attracting anode for the thin film battery. Nichrome on aluminum thin films as an anode has been attracted because it provides practical advantages including low cost production and competitive electrical performance.     

Ni0.25Zn0.15Fe2.6O4种子层对NiZn铁氧体双层膜性能的影响

采用旋转喷涂法在Si(100)基片上制备Ni0.25Zn0.15Fe2.6O4(100 nm)铁氧体薄膜作为种子层,然后在种子层上采用射频磁控溅射法沉积Ni0.25Cu0.09Zn0.66Fe1.998O4(600 nm)铁氧体薄膜。研究了种子层对NiZn铁氧体双层膜微观形貌、饱和磁化强度、矫顽力、磁导率及截止频率的影响。结果表明,Ni0.25Zn0.15Fe2.6O4种子层的引入促进了NiZn铁氧体双层膜尖晶石相的晶化和晶粒生长。NiZn铁氧体双层膜的饱和磁化强度Ms为420 kA/m,矫顽力Hc为5.9kA/m,截止频率fr为1.37 GHz,磁导率μ’(300 MHz)高达202。     

Pulsed laser deposition of single phase LiNbO3 thin film waveguides

We performed a parametric study to suppress secondary phases in lithium niobate thin films by using pulsed laser deposition (PLD). By reducing the growth rate and changing the ambient gas pressure respectively, we found that the main parameter suppressing secondary phases is controlling the plume strength. For investigating the relation between film phases and the plume strength, extensive parametric studies were performed by changing the oxygen ambient pressure, the target to substrate distance, and also the Li content in the target. The surface morphologies of single phase films obtained with different deposition parameters are compared and deposition parameters to achieve lower loss single-phase films are discussed.     

氮离子束能量对光伏新材料氮化碳薄膜的影响

将碳基材料应用于太阳电池半导体器件的研究已经在国内外得到重视和开展。采用离子束溅射反应沉积技术,在p型绒面硅和p型硅基片上沉积出用于制备太阳电池的氮化碳薄膜(a-C:N)。ID/IG比率,ISi/IG比率是研究氮化碳薄膜微结构的重要拉曼参数,对这些参数随氮离子束能量的变化进行了研究。能量散射光谱(EDS)和透射电子显微镜(TEM)测试显示随氮离子束能量增大,薄膜中氮原子含量下降,团簇尺寸大幅下降,非晶网络中团簇分布也趋于均匀。用真空热蒸镀工艺在氮化碳/硅异质结的氮化碳薄膜表面镀上一层半透明的铝薄膜,测得AM1.5标准光照下的开路电压随氮离子束能量的增加而增大。     

Study on the electrical and optical properties of ITO and AZO thin film by oxygen gas flow rate

Transparent conductive oxide (TCO) thin films such as tin doped indium oxide (ITO), zinc doped indium oxide (IZO) and Al doped zinc oxide (AZO) have been widely used as transparent electrode for display. ITO and AZO thin films for display was prepared by the facing targets sputtering (FTS) system. The FTS method is called a plasma-free sputter method because the substrate is located apart from plasma. This system can deposit the thin film with low bombardment by high energetic particles in plasma such as γ-electrons, negative ions and reflected Ar atoms. ITO and AZO thin films were deposited on glass substrate at room temperature with oxygen gas flow rate and input power. And the electrical, structural and optical properties of the thin films were investigated. As a result, the resistivity of ITO, AZO thin film is 6?×?10^?4 Ω cm, 1?×?10^?3 Ω cm, respectively. And the optical transmittance of as-deposited thin films is over 80% at visible range.     

溅射功率对CoFeB薄膜磁与结构特性的影响

以不同功率溅射制备了CoFeB合金薄膜样品并在高真空下退火处理。发现低功率生长的薄膜始终具有磁各向同性,而高功率生长的薄膜随着退火温度的升高,由起始的单轴磁各向异性逐渐向磁各向同性转变。X射线衍射分析也印证了CoFeB薄膜随退火温度的升高,薄膜由非晶态逐渐向结晶态转变。当退火温度高于400℃时,低功率生长的CoFeB样品的矫顽力大于高功率生长薄膜的矫顽力。同时发现低功率生长的CoFeB的(110)峰值高于高功率生长的样品峰值,表明低功率生长的薄膜晶粒尺寸更大。     

退火温度对Co_2FeAl薄膜磁与结构特性的影响

用磁控溅射法制备了一系列Co_2FeAl合金薄膜,并进行了退火处理。利用振动样品磁强计(VSM)和X射线衍射(XRD)对样品进行表征,研究了溅射功率和退火温度对Co_2FeAl薄膜磁与结构特性的影响。高功率下制备的沉积态薄膜就具有强磁性,同时也具有单轴磁各向异性;而对应的低功率下制备的沉积态薄膜则呈现出弱磁性。300℃退火后出现单轴磁各向异性;700℃退火后,所有薄膜均表现为磁各向同性。随着退火温度的升高,薄膜的矫顽力变大。X射线衍射分析表明,随着热处理温度升高,薄膜的晶粒尺寸增大,从而导致晶粒间磁耦合作用增强,这与薄膜的磁特性结果相一致。