An 800-MHz embedded DRAM with a concurrent refresh mode

An 800-MHz embedded DRAM macro employs a memory cell utilizing a device from the 90-nm high-performance technology menu; a 2.2-nm gate oxide 1.5 V IO device. A concurrent refresh mode is designed to improve the memory utilization to over 99% for a 64 /spl mu/s data retention time. A concurrent refresh scheduler utilizes up-count and down-count registers to identify at least one array to be refreshed at every clock cycle, emulating a classical distributed refresh mode. A command multiplier employs low frequency phased clock signals to generate the clock, commands, and addresses at rates up to 4/spl times/ that of the tester frequency. The macro integrates masked redundancy allocation logic during at speed multibank test. The hardware results show a 312-MHz random access frequency and 800-MHz multibank frequency at 1.2 V, respectively.     

Block-based multiperiod dynamic memory design for low data-retention power

Dynamic random access memorys (DRAMs) are widely used in portable applications due to their high storage density. In standby mode, the main source of DRAM power dissipation is the refresh operation that periodically restores leaking charge in each memory cell to its correct level. Conventional DRAMs use a single refresh period determined by the cell with the largest leakage. This approach is simple but dissipative, because it forces unnecessary refreshes for the majority of the cells with small leakage. In this paper, we investigate a novel scheme that relies on small refresh blocks and multiple refresh periods to reduce DRAM dissipation by decreasing the number of cells refreshed too often. In contrast to conventional row-based refresh, small refresh blocks are used to increase worst case data retention times. Long periods are used to accommodate cells with small leakage. Retention times are further extended by adding a swap cell to each refresh block. We give a novel polynomial-time algorithm for computing an optimal set of refresh periods for block-based multiperiod refresh. Specifically, given an integer K and a distribution of data-retention times, in O(KN/sup 2/) steps our algorithm computes K refresh periods that minimize DRAM dissipation, where N is the number of refresh blocks in the memory. We describe and evaluate a scalable implementation of our refresh scheme whose overhead is asymptotically linear with memory size. In simulations with a 16-Mb DRAM, block-based multiperiod refresh reduces DRAM standby dissipation by a multiplicative factor of 4 with area overhead below 6%. Moreover, our proposed scheme is robust to semiconductor process variations, with power savings degrading no more than 7% over a 20-fold increase of leaky cells.     

A 250-Mb/s/pin, 1-Gb double-data-rate SDRAM with a bidirectionaldelay and an interbank shared redundancy scheme

This paper describes three circuit technologies indispensable for high-bandwidth multibank DRAM's. (1) A clock generator based on a bidirectional delay (BDD) eliminates the output skew. The BDD measures the cycle time as the quantity charged or discharged of an analog quantity, and replicates it in the next cycle. This achieves a 0.18-mm ², two-cycle-lock clock generator operating from 25 to 167 MHz with a 30-ps resolution. (2) A quad-coupled receiver eliminates the internal skew caused by the difference between a rise input and a fall input by 40%. (3) An interbank shared redundancy scheme (ISR) with a variable unit redundancy (VUR) efficiently increases yield in multibank DRAM's. The ISR allows redundancy match circuits to be shared with two or more banks. The VUR allows the number of units replaced to be variable. These circuit technologies achieved a 250-Mb/s/pin, 8-bank, 1-Gb double-data-rate synchronous DRAM     

A 32-bank 1 Gb self-strobing synchronous DRAM with 1 GByte/sbandwidth

This paper describes a 32-bank 1 Gb DRAM achieving 1 Gbyte/s (500 Mb/s/DQ pin) data bandwidth and the access time from RAS of 31 ns at V _cc=2.0 V and 25°C. The chip employs (1) a merged multibank architecture to minimize die area; (2) an extended small swing read operation and a single I/O line driving write scheme to reduce power consumption; (3) a self-strobing I/O schemes to achieve high bandwidth with low power dissipation; and (4) a block redundancy scheme with increased flexibility. The nonstitched chip with an area of 652 mm ² has been fabricated using 0.16 μm four-poly, four-metal CMOS process technology     

Refresh re-use based transparent test for detection of in-field permanent faults in DRAMs

In this paper, a transparent test technique for testing permanent faults developed during field operation of DRAMs has been proposed. A three pronged approach has been taken in this work. First, a word oriented transparent March test generation algorithm has been proposed that avoids signature based prediction phase; next the proposed transparent March test is structured in a way that facilitates its implementation during refresh cycles of the DRAM; finally the on-chip refresh circuit is modified to allow its re-use during implementation of the proposed transparent March test on DRAM. Re-use of refresh cycles for test purpose ensures periodic testing of DRAM without interruption. Thus, faults are not allowed to accumulate. Moreover, wait for idle cycles of the processor to perform the test are avoided and test finishes within a definite time. Re-using the refresh circuit for test purpose overcomes requirement of additional Design-For-Testability hardware and brings down the area overhead.Both analytic predictions and simulation results for the method proposed here indicate real estate benefits and test time savings in comparison to other reported techniques. The proposed refresh re-use based transparent test technique provides a cost effective solution by providing facility for periodic tests of DRAM without requiring additional test hardware.     

An access-sequence control scheme to enhance random-accessperformance of embedded DRAM's

An embedded DRAM enables a high data-transfer rate since it provides an on-chip wide-bus interconnection. However, the net data-transfer rate is reduced by page misses because of the inherently large row-access time of DRAM's. We previously proposed a multibank DRAM macro based on a micromodule architecture to overcome this problem. The pipelined access of the DRAM macro is especially useful for regular access in graphics applications. In this paper, we propose an access-sequence control scheme which enhances the random-access performance of embedded DRAMs. Access ID numbers, an access queue register, and a write-data buffer combined with the multibank DRAM enable out-of-sequence access which reduces the page-miss penalty during random access. In the case of four successive accesses, the estimated total access time was, respectively, reduced by up to 38 and 32% for one and two page misses, and for five successive accesses with one or two page misses, it was, respectively, reduced by up to 44 and 45%     

A 2.5-V, 72-Mbit, 2.0-GByte/s packet-based DRAM with a 1.0-Gbps/pininterface

A 2.5-V, 72-Mbit DRAM based on packet protocol has been developed using (1) a rotated hierarchical I/O architecture to reduce power noise and to minimize the chip-size penalty associated with an 8-bit prefetch architecture implemented with 16 internal banks and 144 I/O lines, (2) a delay-locked-loop circuit using a high-speed and small-swing differential clock to achieve the peak bandwidth of 2.0 GByte/s in a single chip with low noise sensitivity, and (3) a flexible column redundancy scheme to efficiently increase redundancy coverage using a shifted I/O line scheme for multibank architecture     

Cell-plate-line/bit-line complementary sensing (CBCS) architecturefor ultra low-power DRAMs

In the realization of gigabit scale DRAMs, one of the most serious problems is how to reduce the array power consumption without degradation of the operating margin and other characteristics. This paper proposes a new array architecture called cell-plate-line/bit-line complementary sensing (CBCS) architecture which realizes drastic array power reduction for both read/write operations and refresh operations, and develops a large readout voltage difference on the bit-line and cell-plate-line. For read/write operations, the array power reduces to only 0.2%, and for refresh operations becomes 36%, This architecture requires no unique process technology and no additional chip area. Using a test device with a 64-Mb DRAM process, the basic operation has been successfully demonstrated. This new memory core design realizes a high-density DRAM suitable for the 1-Gb level and beyond with power consumption significantly reduced     

Low-voltage DRAM sensing scheme with offset-cancellation sense amplifier

A novel bitline sensing scheme is proposed for low-voltage DRAM to achieve low power dissipation and compatibility with low-voltage CMOS. One of the major obstacles in low-voltage DRAM is the degradation of data-retention time due to low signal level at the memory cell, which requires power-consuming refresh operations more frequently. This paper proposes an offset-cancellation sense-amplifier scheme (OCSA) that improves data-retention time significantly even at low supply voltage. It also improves die efficiency, because the proposed scheme reduces the number of sense amplifiers by supporting more cells in each sense amplifier. Measurements show that the data-retention time of the proposed scheme at 1.5-V supply voltage is 2.4 times of the conventional scheme at 2.0 V.     

SOI-DRAM circuit technologies for low power high speed multigigascale memories

This paper describes a silicon on insulator (SOI) DRAM which has a body bias controlling technique for high-speed circuit operation and a new type of redundancy for low standby power operation, aimed at high yield. The body bias controlling technique contributes to super-body synchronous sensing and body-bias controlled logic. The super-body synchronous sensing achieves 3.0 ns faster sensing than body synchronous sensing and the body-bias controlled logic realizes 8.0 ns faster peripheral logic operation compared with a conventional logic scheme, at 1.5 V in a 4 Gb-level SOI DRAM. The body-bias controlled logic also realizes a body-bias change current reduction of 1/20, compared with a bulk well-structure. A new type of redundancy that overcomes the standby current failure resulting from a wordline-bitline short is also discussed in respect of yield and area penalty     

A 12-ns 8-Mbyte DRAM secondary cache for a 64-bit microprocessor

This paper describes three circuit technologies that have been developed for high-speed large-bandwidth on-chip DRAM secondary caches. They include a redundancy-array advanced activation scheme, a bus-assignment-exchangeable selector scheme and an address-zero access refresh scheme. By using these circuit technologies and new small subarray structures, a row-address access time of 12 ns and a row-address cycle time of 16 ns were obtained. An experimental chip made up of an 8-Mbyte DRAM and a 64-bit microprocessor was developed using 0.25-μm merged logic and DRAM process technology     

Dynamically shift-switched dataline redundancy suitable for DRAMmacro with wide data bus

A novel dataline redundancy suitable for an embedded DRAM macro with wide data bus is presented. This redundancy reduces the area required for spare cells from 6 to 1.6% of the area required for normal cells and improves chip yield from 50 to 80%. In addition, it provides a high-speed data path. An embedded DRAM macro adopting the redundancy achieves 200-MHz operation and provides 51.2-Gbit/s bandwidth. It has been fabricated with 0.25-μm technology     

A low-power 256-Mb SDRAM with an on-chip thermometer and biased reference line sensing scheme

In order to achieve small self-refresh current (ICC/sub 6/), the first 256-Mb SDRAM with an on-chip thermometer in the DRAM industry is implemented with a new self-refresh scheme. In addition, the biased reference line (BRL) sensing scheme improving refresh characteristics is proposed to increase refresh period and reduce ICC/sub 6/. The on-chip thermometer is characterized by a small area of 0.43 mm/sup 2/, low power consumption with less than 1-/spl mu/A average current, and good accuracy of 5.85/spl deg/C in the worst case. Good accuracy is achieved by incorporating many generic design techniques, including offset-free operational amplifiers and the chopping method, and small area is achieved by applying DRAM cell technology to integrating analog-digital converter. A 75% reduction in ICC/sub 6/ at 60/spl deg/C is achieved with on-chip thermometer and BRL sensing scheme improving 30% of refresh characteristic.     

Design of a 128-mb SOI DRAM using the floating body cell (FBC)

A 128-Mb SOI DRAM has been developed featuring the floating body cell (FBC). To keep the cell data state from being degraded by the word-line (WL) disturb due to the charge pumping and to reduce the refresh busy rate, a sense amplifier (S/A) is arranged for every bit-line (BL) and replenishes data "1" cells' bodies with holes which are lost by the disturb in every read and write cycle. The power is reduced by operating the S/As asymmetrically between the selected and the unselected thanks to that the number of holes to be replenished in the unselected S/As for charge pumping is two order of magnitude smaller than that required for writing the data "1". The multi-pair averaging of dummy cells generates a very accurate reference current for distinguishing the data "1" and "0" and a Monte Carlo simulation shows that it achieves a sensing scheme robust enough to realize all good parts of the DRAM with a reasonable amount of redundancy. The cell's feature of quasi-nondestructive read-out is also advantageous for making an SRAM interface of the DRAM or hiding refresh from uses without sacrificing the access time.     

基于FPGA技术的DRAM分时存取方法

介绍了一种基于现场可编程技术对DRAM进行读写和刷新操作的方法，根据现场可编程器件设计的特点，结合DRAM读写和刷新时序的要求，提出了同步化操作DRAM的思想，给出了具体同步化操作DRAM的实现方法，针对现场可编程器件设计中经常有多模块同时存取DRAM芯片的需求，提出了对DRAM芯片进行分时存取的方法，讨论了该方法的实现机制，结合具体的项目设计，给出了分时存取方法的关键时序，避开了复杂的DRAM控制器，节省了设计资源，简单方便地解决了DRAM操作的仲裁问题。     

A new extension method of retention time for memory cell on dynamic random access memory

Demands have been placed on dynamic random access memory (DRAM) to not only increase memory capacity and data transfer speed but also to reduce operating and standby currents. When a system uses DRAM, the restricted data retention time necessitates a refresh operation because each bit of the DRAM is stored as an amount of electrical charge in a storage capacitor. Power consumption for the refresh operation increases in proportion to memory capacity. A new method is proposed to reduce the refresh power consumption dynamically, when full memory capacity is not required, by effectively extending the memory cell retention time. Conversion from 1 cell/bit to 2^N cells/bit reduces the variation of retention times among memory cells. The proposed method reduces the frequency of disturbance and power consumption by two orders of magnitude. Furthermore, the conversion itself can be realized very simply from the structure of the DRAM array circuit, while maintaining all conventional functions and operations in the full array access mode.     

A configurable DRAM macro design for 2112 derivative organizationsto be synthesized using a memory generator

This paper describes a DRAM macro design from which 2112 configurations up to 32 Mb can be synthesized using a memory generator. The memory generator automatically creates the layout of a DRAM macro in accordance with specification inputs such as memory capacity, address count, bank count, and I/O bits count. An expandable floor layout scheme achieves the macro size comparable to that of handicraft-designed DRAM. The memory generator can customize a configurable redundancy scheme for various macro configurations. Unified testing circuits make it possible to test DRAM macros with more than 500 interface pins in a direct-memory-access mode with 33 test pads. Up to four macros on the same chip can be tested with them. Test chips with 4-Mb DRAM and with 20-Mb DRAM fabricated with 0.35-μm technology showed 150-MHz operation     

0.13-μm 32-Mb/64-Mb embedded DRAM core with high efficientredundancy and enhanced testability

This paper describes the 32-Mb and the 64-Mb embedded DRAM core with high efficient redundancy, which is fabricated using 0.13-μm triple-well 4-level Cu embedded DRAM technology. Core size of 18.9 mm ² and cell efficiency of 51.3% for the 32-Mb capacity, and core size of 33.4 mm² and cell efficiency of 58.1% for the 64-Mb capacity are realized. This core can achieve 230-MHz burst access at 1.0-V power-supply condition by adopting a new data bus architecture: merged shift column redundancy. We implemented four test functions to improve the testability of the embedded DRAM core. It realizes the DRAM core test in a logic test environment     

A 1.8-V embedded 18-Mb DRAM macro with a 9-ns RAS access time andmemory-cell area efficiency of 33%

A 1.8-V embedded 18-Mb DRAM macro with a 9-ns row-address-strobe access time and memory-cell area efficiency of 33% has been successfully developed with a single-side interface architecture, high-speed circuit design, and low-voltage design. In the high-speed circuit design, a multiword redundancy scheme and Y-select merged sense scheme are developed to achieve the performance goal. In the low-voltage design, a dual-complement charge-pump scheme and a decoupling capacitor utilizing a tantalum-oxide capacitor are developed to retain high performance at low supply voltage     

256-Mb DRAM circuit technologies for file applications

256-Mb DRAM circuit technologies characterized by low power and high fabrication yield for file applications are described. The newly proposed and developed circuits are a self-reverse-biasing circuit for word drivers and decoders to suppress the subthreshold current to 3% of the conventional scheme, and a subarray-replacement redundancy technique that doubles chip yield and consequently reduces manufacturing costs. An experimental 256-Mb DRAM has been designed and fabricated by combining the proposed circuit techniques and a 0.25-μm phase-shift optical lithography, and its basic operations are verified. A 0.72-μm² double-cylindrical recessed stacked-capacitor (RSTC) cell is used to ensure a storage capacitance of 25 fF/cell. A typical access time under a 2-V power supply voltage was 70 ns. With the proper device characteristics, the simulated performances of the 256-Mb DRAM operating with a 1.5-V power supply voltage are a data-retention current of 53 μA and an access time of 48 ns