Enhancing the mechanical–electrical property simultaneously in pure copper composites by using carbonized polymer dots

In the development of copper-based composite materials, the dilemma of improving the mechanical properties without affecting the electrical properties is an important issue that must be solved. Here, carbonized polymer dot (CPD), as a novel reinforcement, was employed to fabricate CPD/Cu (pure copper) composite via powder metallurgy technique for the first time. The microstructure analysis revealed that the CPD was uniformly dispersed in the copper matrix in the form of nanoclusters, and the nanoclusters of CPD are composed of a three-dimensional amorphous carbon (AC) network structure and inserted carbon dots (some of them have a typical graphene structure, while others not). More importantly, excellent interface combination between the CPD and copper matrix is observed due to the existing of plenty of chemical functional groups. Based on this special microstructure, our prepared CPD/Cu composite achieves excellent mechanical and electrical conductivity simultaneously. Compared to pure Cu, the ultra-tensile strength of 0.2CPD/Cu composite is increased by about 17.0%, while the elongation is only?~?2% lower. The electrical conductivity of the composite is?~?98% IACS, which is much higher than that of pure copper prepared under the same condition (only?~?92% IACS). New insights into how to prepare advanced copper matrix composites with simultaneously improved overall performance will be found from our research.

     

原位自生Ti-B-Si-C系复合材料的制备和性能

以Ti粉、B4C粉和SiC粉为原料,用真空热压烧结工艺制备了原位自生颗粒增强的Ti-B-Si-C系钛基复合材料,研究了复合材料的显微组织和力学性能。结果表明,使用的初始粉末不同,原位自生颗粒的组成不同,复合材料的性能也有明显的差别。     

Effect of size and shape of metal particles to improve hardness and electrical properties of carbon nanotube reinforced copper and copper alloy composites

Utilizing the extra-ordinary properties of carbon nanotube (CNT) in metal matrix composite (MMC) for macroscopic applications is still a big challenge for science and technology. Very few successful attempts have been made for commercial applications due to the difficulties incorporating CNTs in metals with up-scalable processes. CNT reinforced copper and copper alloy (bronze) composites have been fabricated by well-established hot-press sintering method of powder metallurgy. The parameters of CNT–metal powder mixing and hot-press sintering have been optimized and the matrix materials of the mixed powders and composites have been evaluated. However, the effect of shape and size of metal particles as well as selection of carbon nanotubes has significant influence on the mechanical and electrical properties of the composites. The hardness of copper matrix composite has improved up to 47% compared to that of pure copper, while the electrical conductivity of bronze composite has improved up to 20% compared to that of the pure alloy. Thus carbon nanotube can improve the mechanical properties of highly-conductive low-strength copper metals, whereas in low-conductivity high-strength copper alloys the electrical conductivity can be improved.     

铜基碳纳米管复合薄膜电沉积制备工艺

为获得碳纳米管分布均匀且导电性良好的铜基碳纳米管复合材料,用超声辅助搅拌复合电沉积方法制备了Cu/MWCNT复合薄膜.采用扫描电子显微镜(SEM)、四探针电阻率仪等研究了电沉积过程中复合电镀液中碳纳米管浓度、电镀液p H值、脉冲电流密度等各项电沉积工艺参数以及不同退火温度对复合薄膜的组织形貌和电阻率的影响规律.结果表明:改变镀液中碳纳米管含量和电镀液的p H值可以改变镀层中碳纳米管的含量及分布,MWCNTs质量浓度升高到2 g/L时,复合薄膜中MWCNTs的质量分数达2.17%;改变电流密度可以细化镀层组织并改善碳纳米管在镀层中的分布,从而提高镀膜的致密度并降低镀层的电阻率;合适的热处理温度可以改善薄膜结晶度和致密度,并提高导电性.镀液中MWCNTs质量浓度为2 g/L,电镀液p H为2,电流密度为20 A/dm2,电镀时温度在25℃且加入超声辅助搅拌时,所得到的复合镀膜经400℃退火后电阻率最低.     

石墨烯含量对铜基石墨烯复合材料力学和电学性能的影响

为改进铜基复合材料的力学和电学性能,向铜基体分别加入0.2%、0.3%、0.4%(质量分数)的石墨烯,充分混合后,采用放电等离子烧结技术(SPS)制备了石墨烯/铜(G/Cu)复合材料。通过扫描电镜(SEM)、拉曼(Raman)光谱和XRD等表征了复合材料微观结构,测试了其硬度、屈服强度、抗压强度和导电率等性能,以确定石墨烯在铜基体中的合适掺杂量。结果表明:随着石墨烯含量的降低,其力电性能显著提高。当石墨烯质量分数为0.2%时,G/Cu复合材料的综合性能(力学及电学性能)达到最好匹配,实现了铜基材料的高强度、高导电性:其抗压强度和屈服强度分别为557.23 MPa和256 MPa,相对于用SPS方法制备的纯铜分别提高了59.21%和70.7%;电导率为52.3 MS/m,其IACS高达91.8%。     

Preparation and structure development of NiO/YSZ nanocomposite powders by urea hydrolysis

NiO/YSZ composite powders, with various NiO contents, have been prepared by the urea hydrolysis method. The crystallization behavior and microstructure of composite powders has been studied in detail, using differential scanning calorimetry analysis, X-ray diffraction, and transmission electron microscope. The results indicated that the actual NiO content of the NiO/YSZ powders largely deviated from the nominal value, and finally reached a saturated value. The NiO addition would retard the crystallization of NiO/YSZ composite. When the calcination temperature was increased, the NiO crystallites first precipitated at around 500 °C, and then the YSZ phase presented at about 600 °C. The calcined powders consist of NiO/YSZ nanocomposite particles, which are comprised of nano-sized NiO and YSZ crystals. In addition, with the aid of H₂ plasma treatment, it is easier to distinguish the Ni and YSZ phases of Ni/YSZ cermets after sintering and subsequent reduction. This could reveal that such Ni/YSZ cermets exhibited a uniform microstructure that has fine Ni particles homogeneously dispersed within the YSZ matrix. As the NiO content was increased, the size and density number of the Ni phase within an YSZ matrix was increased.     

纳米Mg(OH)2-ZnO/聚酰亚胺复合薄膜的介电和热性能

采用反向沉淀法制备了Mg（OH）₂-ZnO纳米粒子,通过原位聚合和热亚胺化的方法成功制备了不同纳米Mg（OH）₂-ZnO粒子质量分数的纳米Mg（OH）₂-ZnO/聚酰亚胺（PI）复合薄膜,通过SEM、热重分析、介电谱测试仪和击穿场强测试仪对薄膜的表面形貌、热稳定性、介电性能和击穿强度进行表征和测试。结果表明：Mg（OH）₂-ZnO纳米粒子均匀地分散在PI基体中,Mg（OH）₂-ZnO/PI热稳定性下降,介电常数、介电损耗和电导率增加,击穿场强随纳米粒子增加先增加后减小,在纳米粒子含量为2%时,达到最大值296 kV/mm。     

Microstructure,mechanical properties,electrical conductivity and wear behavior of high volume TiC reinforced Cu-matrix composites

This study deals with the processing, microstructure, mechanical properties, electrical conductivity and wear behavior of high volume titanium carbide reinforced copper matrix composites. The microstructural study revealed that the titanium carbide particles were distributed uniformly in the matrix phase. No interface debonding and micro-cracks were observed in the composite. The addition of alloying elements in the copper considerably increased the sintered density and properties. The composite hardness and strength increased with titanium carbide content and alloying elements in the matrix phase. The electrical conductivities of the composites were predicted using three point upper bound and two phase self consistent predictive models. The wear resistance of the composites was studied against high speed steel. Wear mechanisms were discussed by means of microscope observations on the worn surfaces. The ratio of titanium carbide average grain size to the mean free path of the binder was introduced as a parameter to determine wear performance.     

A novel in-situ polymer derived nano ceramic MMC by friction stir processing

Friction stir processing (FSP) is a solid state technique used for material processing. Tool wear and the agglomeration of ceramic particles have been serious issues in FSP of metal matrix composites. In the present study, FSP has been employed to disperse the nanoscale particles of a polymer-derived silicon carbonitride (SiCN) ceramic phase into copper by an in-situ process. SiCN cross linked polymer particles were incorporated using multi-pass FSP into pure copper to form bulk particulate metal matrix composites. The polymer was then converted into ceramic through an in-situ pyrolysis process and dispersed by FSP. Multi-pass processing was carried out to remove porosity from the samples and also for the uniform dispersion of polymer derived ceramic particles. Microstructural observations were carried out using Field Emission Scanning Electron Microscopy (FE-SEM) and Transmission Electron Microscopy (TEM) of the composite. The results indicate a uniform distribution of ~ 100 nm size particles of the ceramic phase in the copper matrix after FSP. The nanocomposite exhibits a five fold increase in microhardness (260HV₁₀₀) which is attributed to the nano scale dispersion of ceramic particles. A mechanism has been proposed for the fracturing of PDC particles during multi-pass FSP.     

具有吸附特性3A沸石/PI复合膜的制备与性能

采用原位聚合法制备了具有吸附特性的3A沸石/聚酰亚胺(PI)复合膜,并考察了复合膜的亚胺化程度、微观形貌、力学性能、吸附/脱附行为。结果表明,复合膜亚胺化完全、力学性能优良;3A沸石均匀分散在PI基体内,二者之间界面结合良好;水为吸附质时,分散在PI基体中的3A沸石仍能保持对水的吸附性能,且最大脱附量达23.39 g H2O/100 g3A沸石。该复合膜在吸附分离、膜分离及包装等领域中具有潜在的用途。     

Poly(3- hydroxybutyrate)/Bioglass(®) composite films containing carbon nanotubes

Poly(3hydroxybutyrate) (P(3HB))/Bioglass(?)?composites incorporating multiwalled carbon nanotubes (MWCNTs) have been successfully prepared by the solvent casting technique. The microstructure, electrical properties and bioactivity of the composites were characterized using scanning electron microscopy, x-ray diffraction and current-voltage measurements. Different concentrations of MWCNTs were used to determine their effect on the electrical properties of the composites. MWCNTs and Bioglass(?) particles were found to be homogeneously dispersed throughout the P(3HB) matrix. The electrical resistance of the composite samples decreased on increasing the MWCNT concentration, as expected. An in vitro degradation study in simulated body fluid (SBF) was carried out on composite samples. The formation of hydroxyapatite on the surfaces of P(3HB)/Bioglass(?)/MWCNT composite films was confirmed after two months of immersion in SBF. This hydroxyapatite layer was not formed on the neat polymeric films and on composites containing MWCNTs only (without Bioglass(?)). It was found that the presence of MWCNTs did not hinder the bioactivity of the Bioglass(?) particles, as confirmed by SEM and XRD studies on composite samples.     

Influence of carbon nanotubes and dispersions of SiC on the physical and mechanical properties of pure copper and copper‐nickel alloy

This paper investigates the physical and mechanical properties of copper‐nickel alloy (at 50 wt.%–50 wt.%) and pure copper, mixed with various types of reinforcement materials such as carbon nanotubes (0.5 wt.%–2 wt.%) as nanoparticles, silicon carbide (1 wt.%–4 wt.%) as microparticles. The acquired composite specimens characteristics were estimated such as microstructure, density, electrical and thermal conductivity, hardness, and compression stress properties to determine the suitable reinforcement percentage that has the best physical and mechanical properties with different main matrix material whether copper‐nickel mechanical alloying or pure copper powder. The micron‐sized silicon carbide and nanosized carbon nanotubes were added to improve the mechanical and physical properties of the composite. The electrical and thermal conductivity of pure copper alloy enhanced compared with the copper‐nickel alloy matrix material. The hardness and compression yield stress of both pure copper and copper‐nickel composites have enhancement values and for copper‐nickel base composites hardness and compression yield stress have enhanced with the most positive enhancement values to examined an optimum percentage of reinforcing material.     

碳纤维增强铜基复合材料的性能研究

采用粉末冶金法制备了短碳纤维增强铜基复合材料。经对不同碳纤维含量试样的硬度及导电性能的测定，并在干摩擦的条件下研究了碳纤维增强铜基复合材料的摩擦磨损性能，同时对磨损表面的微观结构进行观察来分析其磨损机理。实验结果表明，随着碳纤维含量的增加，该材料的硬度和耐磨性均有所增加，但其导电性有所下降。     

Differential Sintering and Self-Stress Effects on YSZ Ionic Conductivity

Thermomechanical stress simulations are combined with experimental tests to assess the effects of rigid inclusions on the sintering of 8 mol% yttria-stabilized zirconia (8YSZ) green compacts and the phenomena of restricted and differential sintering on microstructure development and electrical properties are investigated. Rigid inclusions of sintered ceramic particles with different shapes (spherical and jagged) and compositions (alumina, 3YSZ, and 8YSZ) are added in different volume fractions (1, 5, and 15 vol%) to 8YSZ commercial powders, which are formed by isostatic pressing and sintered by conventional method. Restricted and differential sintering effects are observed in the development of the microstructure varying in function of volume fraction, shape, structural composition, and thermomechanical properties of the inclusions, resulting in different combinations of tensile and compressive strain states in the matrix, and varying electrical behaviors. The addition of 1 vol% of 8YSZ irregular rigid inclusions leads to an increase of 36% in total electrical conductivity and a 33% increase in power density under solid oxide fuel cells operation conditions compared to samples without inclusions.     

低热膨胀系数纳米碳化硅/聚酰亚胺复合薄膜的制备与性能

以原位分散聚合法制备出纳米碳化硅/聚酰亚胺(n-SiC/PI)复合薄膜, 采用SEM、热机械分析仪(TMA)、阻抗分析仪和热重分析(TG)研究了所制备薄膜的表面形貌、热膨胀、介电性能及热稳定性。结果表明: SiC粒子均匀分散在PI基体中, 复合薄膜的热膨胀系数(CTE)随着SiC含量的增加逐渐减小, SiC质量分数为15%时, CTE降低了11%, 且复合膜的热膨胀系数实验值比较接近于Kerner公式的计算值。复合膜的介电常数和介电损耗随着填料含量的变化而变化, 但始终维持在较低的范围内, 并在相当大的频率范围内保持稳定。      

FABRICATION AND CHARACTERIZATION OF Cu-SiCp COMPOSITES FOR ELECTRICAL DISCHARGE MACHINING APPLICATIONS

Cu-SiC_p composites made by the powder metallurgy method were investigated. To avoid the adverse effect of Cu-SiC_p reaction, sintering was controlled at a reaction temperature less than 1032 K. Electroless plating was employed to deposit a copper film on SiC_p powder before mixing with Cu powder in order to improve the bonding status between Cu and SiC particles during sintering. It was found that a continuous copper film could be deposited on SiC_p by electroless copper plating, and a uniform distribution of SiC_p in Cu matrix could be achieved after the sintering and extrusion process. The mechanical properties of Cu-SiC_p composites with SiC_p contents from 0.6 to 10 wt% were improved evidently, whereas electrical properties remained almost unchanged as compared with that of the pure copper counterpart. In the electrical discharge machining (EDM) test, the as-formed composite electrodes exhibited a character of lower electrode wear ratio, justifying its usage. The optimum conditions for EDM were Cu-2 wt% SiC_p composite electrode operating with a pulse time of 150 μsec.     

A micromechanical fracture analysis to investigate the effect of healing particles on the overall mechanical response of a self‐healing particulate composite

A computational fracture analysis is conducted on a self‐healing particulate composite employing a finite element model of an actual microstructure. The key objective is to quantify the effects of the actual morphology and the fracture properties of the healing particles on the overall mechanical behaviour of the (MoSi₂) particle‐dispersed Yttria Stabilised Zirconia (YSZ) composite. To simulate fracture, a cohesive zone approach is utilised whereby cohesive elements are embedded throughout the finite element mesh allowing for arbitrary crack initiation and propagation in the microstructure. The fracture behaviour in terms of the composite strength and the percentage of fractured particles is reported as a function of the mismatch in fracture properties between the healing particles and the matrix as well as a function of particle/matrix interface strength and fracture energy. The study can be used as a guiding tool for designing an extrinsic self‐healing material and understanding the effect of the healing particles on the overall mechanical properties of the material.     

纳米Cu-Al2O3复合材料的烧结法制备研究

研究了纳米Al2O3陶瓷颗粒增强铜基复合材料制备技术.选用纳米级Al2O3陶瓷颗粒作为增强相,采用超声波增强化学镀的方法完成对纳米Al2O3陶瓷颗粒金属铜包覆,热压烧结成纳米Al2O3陶瓷颗粒增强铜基复合材料,开采用XRD、TEM等分析测试技术对其组织性能进行研究.     

Toward High Strength and High Electrical Conductivity in Super‐Aligned Carbon Nanotubes Reinforced Copper

The miniaturization of electronic products is drawing higher demand in the strength and conductivity of conductors. This work demonstrates the possibility of substantially increasing the dislocation density in copper to enhance the strength of super‐aligned carbon nanotubes (SACNTs) reinforced copper matrix composites (SACNT/Cu) without compromising the electrical conductivity. High strain is introduced into pure copper and SACNT/Cu by accumulative roll‐bonding (ARB) process up to 16 cycles at ambient temperature. SACNTs with initial laminated distribution turn out to be dispersed uniformly with maintained directional arrangement inside the copper matrix after ARB, which can then effectively block the motion of dislocations. Therefore, large number of dislocations propagated by large strains can be accumulated without subdivision. The accumulated dislocations will result into strain hardening, which is the major strengthening mechanism in SACNT/Cu after ARB. Furthermore, the contribution of dislocations to resistivity increase is little, thus maintaining high electrical conductivity. As a result, a high tensile strength (505 MPa) combined with a high electrical conductivity (90% IACS) is achieved in large‐sized composite sheet.

     

Pressure-sensitive properties and microstructure of carbon nanotube reinforced cement composites

Carbon nanotubes (CNTs) treated by using a mixed solution of H₂SO₄ and HNO₃ were uniformly dispersed into cement paste by means of ultrasonic energy. Electrical resistivity and pressure-sensitive properties under cyclic compressive loading of this composite were analyzed and compared to that of untreated-CNT reinforced cement paste. Results show that the addition of treated or untreated CNTs to cement paste leads to a notable decrease in volume electrical resistivity and a distinct enhancement in compressive sensitivity. The microstructures of these cement composites were analyzed by using scanning electron microscope. The microscopic observation reveals that both treated and untreated CNTs were dispersed homogenously in the cement matrix. For untreated CNT-reinforced cement composites, the CNTs with glossy surface were zigzag and cling to cement matrix; the bridging of cracks and a well three-dimensional meshwork were also observed. For treated-CNT reinforced cement composites, the surface of CNTs was covered by C–S–H, which leads to a higher mechanical strength. The contact points of the treated-CNTs in composites were much fewer than that of the untreated-CNTs in cement matrix composites, which leads to a higher compressive sensitive properties and a lower electrical conductivity.