Experimental evaluation of a spherical aberration-corrected TEM and STEM

We have successfully developed a spherical aberration (Cs)-corrected electron microscope for probe- and image-forming systems using hexapole correctors. The performance of the microscope has been evaluated experimentally. The point resolution attained using the image-forming Cs-corrector is better than 0.12 nm. For scanning transmission electron microscopy, the Ronchigram flat area was >40 mrad in half-angle using the probe-forming Cs-corrector.     

First observation of SiO2/Si(100) interfaces by spherical aberration-corrected high-resolution transmission electron microscopy

SiO2/Si(100) interfaces were for the first time observed by a spherical aberration-corrected high-resolution transmission electron microscope in a cross-sectional mode. As the Fresnel fringes were not contrasted at the interfaces, the interfacial structures were clearly observed without the need for artificial image contrast. Atomic steps and defects on the Si(100) surfaces were accurately identified. Also, image simulations with the target imaging performance revealed oxygen atomic columns between silicon-silicon bonds. The present instrument is of potential use for semiconductor science and technology, even for the analysis of oxygen atoms at interfaces.     

GexSi1－x／Si超晶格PIN波导探测器结构及性能参数

从ＰＩＮ波导探测器性能参数的定义出发，阐述了各参数之间的内在联系，说明量子效率与带宽、灵敏度等物理量之间的矛盾现象。通过对具体结构及参数的分析比较，说明结构与参数之间的影响方式以及ＧｅｘＳｉ１－ｘ／Ｓｉ超晶格波导探测器的特有性质，进一步论证了波导探测器的优点     

Structural analysis of Ge x Si1−x /Si layers by remote plasma-enhanced chemical vapor deposition on Si (100)

In this work, remote plasma-enhanced chemical vapor deposition (RPCVD) has been used to grow Ge _x Si_1−x /Si layers on Si(100) substrates at 450° C. The RPCVD technique, unlike conventional plasma CVD, uses an Ar (or He) plasma remote from the substrate to indirectly excite the reactant gases (SiH₄ and GeH₄) and drive the chemical deposition reactions. In situ reflection high energy electron diffraction, selected area diffraction, and plan-view and cross-sectional transmission electron microscopy (XTEM) were used to confirm the single crystallinity of these heterostructures, and secondary ion mass spectroscopy was used to verify abrupt transitions in the Ge profile. XTEM shows very uniform layer thicknesses in the quantum well structures, suggesting a Frank/ van der Merwe 2-D growth mechanism. The layers were found to be devoid of extended crystal defects such as misfit dislocations, dislocation loops, and stacking faults, within the TEM detection limits (∼10⁵ dislocations/cm²). Ge _x Si_1−x /Si epitaxial films with various Ge mole fractions were grown, where the Ge contentx is linearly dependent on the GeH₄ partial pressure in the gas phase for at leastx = 0 − 0.3. The incorporation rate of Ge from the gas phase was observed to be slightly higher than that of Si (1.3:1).     

The study of relaxation in asymmetrically strained Si1−x Ge x Si superlattices

Asymmetrically strained Si/SiGe superlattices consisting of 12 nm Si/4 nm Si_0.65Ge_0.35 have been grown in Si(001) by molecular beam epitaxy (MBE) and studied as a function of thermal treatments. Results indicate that initially, the interdiffusion is very rapid and non-linear, and at later annealing stages a steady-state interdiffusion is attained. Raman spectroscopy has been used to determine the Ge content and the strain independently, and to show that in the very early annealing stages, strain relaxation occurs predominantly by interdiffusion. This is supported by transmission electron microscopy (TEM) which indicates that less than 10% of the initial strain relaxation is caused by dislocation formation. In addition, a low temperature relaxation has been observed which may be related to misoriented SiGe crystallites at the superlattice/substrate interface, and increased in size with annealing at 631‡ C.     

SiO_x、Si/Si_(1-x)Ge_x的横向磁阻和迁移率的无接触测量

用分子束外延技术在ｐ型Ｓｉ衬底上生长成了Ｓｉ／Ｓｉ１－ｘＧｅｘ应变层超晶格和掺铒（Ｅｒ）ＳｉＯｘ外延层,用无接触法测量了它们的横向磁阻,并且用拟合方法由横向磁阻计算了它们的迁移率。     

Electrical characteristics of diodes fabricated in selective Si/Si1−x Ge x epitaxial layers

Diodes have been fabricated in layers of Si_1−x Ge _x and silicon deposited selectively on patterned wafers, and the electrical characteristics of the diodes have been examined. For 50 nm thick Si_1−x Ge _x layers containing about 22% Ge, the forward characteristics of larger diodes are nearly ideal. However, the reverse leakage current is higher when the edges of the diode intersect the oxide defining the selectively deposited layers than when the diode edges are separated from this oxide. The diode characteristics are more ideal when the diode edges are aligned along the [100] directions than when aligned along the [110] directions. Higher-temperature hydrogen pre-treatments before epitaxial deposition can degrade the diode characteristics.     

Special features of the photoluminescence of self-assembled Ge(Si)/Si(001) islands grown on a strained Si1−x Gex layer

The effect of the predeposition of strained Si_{1 ? x} Ge_x layers (x ≤ 20%) on photoluminescence (PL) of self-assembled Ge(Si)/Si(001) islands is studied. A shift of the PL peak related to dome-shaped islands (domes) to lower energies, with respect to the PL peak related to pyramidal islands is observed; this shift is related to a much larger height of the domes compared to that of pyramids. It is found that, as the Ge content in the Si_{1 ? x} Ge_x layer (x) becomes higher than 0.1, two separate peaks appear in the broad PL band related to the islands; these peaks are attributed to the zero-phonon and phonon-assisted optical transitions in the islands. The appearance of these transitions is caused by a change of the TO-phonon type involved in radiative recombination: a TO_Ge-Ge phonon is replaced by a TO_Si-Ge phonon with a shorter wavelength.     

Comparison of GexSi1—x Grown by UHV／CVD from Si2H6／GeH4 and SiH4／GeH4

Using double crystal X-rays diffraction (DCXRD) and atomic force microscopy (AFM), the results of Ge x Si 1- x grown by UHV/CVD from Si 2H 6 and SiH 4 are analyzed and compared. Adsorbates can migrate to the energy-favoring position due to the slow growth rate from SiH 4. In this case, a Si buffer that isolates the effect of substrate on epilayer could not be grown, which results in a pit penetrating into epilayer and buffer. The FWHM is 0.055° in DCXRD from SiH 4. The presence of diffraction fringes is an indication of an excellent crystalline quality. The roughness of the surface is improved if grown by Si 2H 6; however, the crystal quality of the Ge x Si 1- x material became worse than that from SiH 4 due to much larger growth rate from Si 2H 6. The content of Ge is obtained from DCXRD, which indicates the growth rate from Si 2H 6 is largest, then GeH 4, and that from SiH 4 is least.     

Structural and electrical properties of the Ge x Si1−x /Si heterojunctions obtained by the method of direct bonding

The results of studying the structural and electrical properties of structures produced by the method of direct bonding of Ge _x Si_1?x and Si wafers are reported. The wafers were cut from the crystals grown by the Czochralski method. Continuity of the interface and the crystal-lattice defects were studied by X-ray methods using synchrotron radiation and by scanning electron microscopy. Measurements of the forward and reverse current-voltage characteristics of the p-Ge _x Si_1?x /n-Si diodes made it possible to assess the effect of the crystallattice defects on the electrical properties of heterojunctions. Satisfactory electrical parameters suggest that the technology of direct bonding is promising for the fabrication of large-area Ge _x Si_1?x /Si heterojunctions.     

Elimination of dislocations in heteroepitaxial MBE and RTCVD Ge x Si1-x grown on patterned Si substrates

We have grown Ge _x Si_1-x (0 <x < 0.20,1000–3000Å thick) on small growth areas etched in the Si substrate. Layers were grown using both molecular beam epitaxy (MBE) at 550° C and rapid thermal chemical vapor deposition (RTCVD) at 900° C. Electron beam induced current images (EBIC) (as well as defect etches and transmission electron microscopy) show that 2800Å-thick, MBE Ge_0.19Si_0.81 on 70-μm-wide mesas have zerothreading and nearly zero misfit dislocations. The Ge_0.19Si{0.81} grown on unpatterned, large areas is heavily dislocated. It is also evident from the images that heterogeneous nucleation of misfit dislocations is dominant in this composition range. 1000Å-thick, RTCVD Ge_0.14Si_0.86 films deposited on 70 μm-wide mesas are also nearly dislocation-free as shown by EBIC, whereas unpatterned areas are more heavily dislocated. Thus, despite the high growth temperatures, only heterogeneous nucleation of misfit dislocations occurs and patterning is still effective. Photoluminescence spectra from arrays of GeSi on Si mesas show that even when the interface dislocation density on the mesas is high, growth on small areas results in a lower dislocation density than growth on large areas.     

Electrical properties of Si1−x−yGexCy and Ge1−yCy alloys

The effects of carbon on the structural and electrical properties of Si_1−x−yGe_xC_y and Ge_1−yC_y alloys grown by the molecular beam epitaxy have been examined by Hall effect measurements, current-voltage measurements, x-ray diffraction, and atomic force microscopy. Hall effect measurements showed that the addition of carbon increased the hole mobility in GeC compared to pure Ge, we attributed this increase to improved crystalline quality and reduced surface roughness. Current-voltage characteristics of SiGeC/Si and GeC/Si heterojunction diodes showed that with increasing carbon, the reverse leakage current decreased and the forward turn-on voltage increased, attributed to the increase in bandgap energy and reduction of intrinsic carrier concentration n_i.     

Growth of (GaAs)1_x(Ge2)x by metalorganic chemical vapor deposition

We report deposition of (GaAs)_{1_x}(Ge₂)_x on GaAs substrates over the entire alloy range. Growth was performed by metalorganic chemical vapor deposition at temperatures of 675 to 750°C, at 50 and 760 Torr, using trimethylgallium, arsine, and germane at rates of 2–10 μ/h. Extrinsic doping was achieved using silane and dimethylzinc in hydrogen. Characterization methods include double-crystal x-ray rocking curve analysis, Auger electron spectroscopy, 5K photoluminescence, optical transmission spectra, Hall-effect, and Polaron profiling. Results achieved include an x-ray rocking curve full-width at half maximum as narrow as 12 arc-s, Auger compositions spanning the alloy range from x = 0.03 to x = 0.94, specular surface morphologies, and 5K photoluminescence to wavelengths as long as 1620 nm. Undoped films are n type, with n ≈ 1 × 10¹⁷ cm⁻³. Extrinsic doping with silane and dimethylzinc have resulted in films which are n type (10¹⁷ to 10¹⁸ cnr⁻³) or p type (5 × 10¹⁸ to 1 × 10²⁰ cm⁻³). Mobilities are generally ≈ 50 cm²/V-s and 500 cm²/V-s, for p and n films, respectively.     

Waveguided electro-optical intensity modulation in a Si/Ge/sub x/Si/sub 1-x//Si heterojunction bipolar transistor

Optical phase-and-amplitude modulation at 1.55 mu m in an electro-optic guided-wave Si/Ge/sub 0.2/Si/sub 0.8//Si HBT is investigated using computer-aided modelling and simulation. At an injection of 10/sup 19/ electrons per cm/sup 3/, an intensity modulation of 10 dB is predicted for an active length of 390 mu m.<>     

Implementation of both high-hole and electron mobility in strained Si/strained Si/sub 1-y/Ge/sub y/ on relaxed Si/sub 1-x/Ge/sub x/ (x

Jongwan Jung Lee  M.L. Shaofeng Yu Fitzgerald  E.A. Antoniadis  D.A. 《Electron Device Letters, IEEE》2003,24(7):460-462

Ge/Si(100)界面互扩散的喇曼光谱

利用喇曼光谱研究了不同温度下在Si(100)衬底上异质外延Ge层由于扩散引起的Ge/Si异质结界面互混以及表面活化剂Sb对其的影响.结果表明表面活化剂Sb的存在大大抑制了界面的互扩散,在650℃下也没有观察到明显的界面互混.没有Sb时,在500℃下已存在一定程度的界面互混,界面互混程度随外延层生长温度的增高而增强.这种互扩散的差别与成岛生长时应变释放有关     

Compositional modulation in In(x)Ga(1-x)N: TEM and X-ray studies

Transmission Electron Microscopy (TEM) and X-ray diffraction (XRD) have been used to study compositional modulation in In(x)Ga(1-x) N layers grown with compositions close to miscibility gap. The samples (0.34 < x < 0.8) were deposited by molecular beam epitaxy using either a 200 nm thick AlN or GaN buffer layer grown on a sapphire substrate. Periodic compositional modulation leads to extra electron diffraction spots and satellite reflections in XRD in the theta-2theta coupled geometry. The ordering period delta measured along c-axis was about delta = 45 A for x = 0.5 and delta = 66 A for x = 0.78 for samples grown on AlN buffer layer. TEM and XRD determinations of delta were in good agreement. Compositional modulation was not observed for the sample with x = 0.34 grown on a GaN buffer layer. Larger values of delta were observed for layers with higher In content and for those having larger mismatch with the underlying AlN buffer layer. The possibility that the roughness of the AlN growth surface promotes strong In segregation on particular crystallographic planes leading to compositional modulation is considered.     

Ge/Si(100)界面互扩散的喇曼光谱

利用喇曼光谱研究了不同温度下在Si(100)衬底上异质外延Ge层由于扩散引起的Ge/Si异质结界面互混以及表面活化剂Sb对其的影响.结果表明表面活化剂Sb的存在大大抑制了界面的互扩散,在650℃下也没有观察到明显的界面互混.没有Sb时,在500℃下已存在一定程度的界面互混,界面互混程度随外延层生长温度的增高而增强.这种互扩散的差别与成岛生长时应变释放有关.     

Magnetic investigations of Cd1−x ZnxTe (x=0.12, 0.21) wide-gap semiconductors

Semiconductors - The results of measuring the magnetization M and magnetic susceptibility χ of Cd1?x ZnxTe crystals are presented. The hysteresis of the M(H) dependence, which is caused...     

1.55μmSi_(1-x)Ge_x/Si光开关与光探测器集成的分析及设计

对１．５５μｍ波长的Ｓｉ１－ｘＧｅｘ光波导开关和Ｓｉ１－ｘＧｅｘ／Ｓｉ红外探测器的集成结构进行了系统的理论分析和优化设计。设计结果为：（１）对Ｓｉ１－ｘＧｅｘ光开关，Ｇｅ含量ｘ＝０．０５，波导的内脊高、脊宽和腐蚀深度分别为３，８．５和２．６μｍ，分支角为５～６°。要实现对１．５５μｍ波长光的开关作用，ｐｎ＋结上所需加的正向偏压值应为０．９７Ｖ；（２）对Ｓｉ１－ｘＧｅｘ／Ｓｉ探测器，Ｇｅ含量ｘ＝０．５，探测器由２３个周期的６ｎｍＳｉ０．５Ｇｅ０．５和１７ｎｍＳｉ交替组成厚度为５５０ｎｍ，长度约为１．５～２ｍｍ的超晶格，内量子效率达８０％以上。