Investigation of curing characteristics of carbon fiber/epoxy composites cured with low‐energy electron beam

To solve the penetration depth of carbon fiber/epoxy prepreg and irradiation dose uniformity by low‐energy E‐Beam under 125 keV, the both‐side irradiation curing of prepreg was investigated. The results show that there is little thermal effect during the low‐energy electron beam irradiation curing process, even though the irradiation dosage reached 300 kGy, only 46.2°C can be tested on the prepreg surface. Due to the low curing temperature, the degree of cure of prepreg was only 61.8% at 300 kGy level of irradiation, and the glass‐transition temperature (T_g) was only 48.6°C. The degree of cure and T_g can be increased sharply by thermal postcure. After being postcured at 160°C for 30 min, the degree of cure and the T_g of prepreg reached 98.5% and 170.4°C, respectively. Interlaminar shear strength testing result indicate that the fabrication process of the composite layer by layer curing by the low‐ energy E‐Beam is a promising cure approach. POLYM. COMPOS., 36:1731–1737, 2015. © 2014 Society of Plastics Engineers     

Effects of the electron‐beam absorption dose on the glass transition,thermal expansion,dynamic mechanical properties,and water uptake of polycardanol containing epoxy groups cured by an electron beam

In this study, the glass transition, thermal expansion, dynamic mechanical properties, and water‐uptake behaviors of diepoxidized polycardanol (DEPC) cured by electron‐beam radiation in the presence of cationic photoinitiators were investigated. How the type and concentration of cationic photoinitiators and the electron‐beam absorption dose influenced the properties of the cured DEPC was also studied. Two types of cationic photoinitiators, triarylsulfonium hexafluorophosphate (simply referred to as phosphate type or P‐type) and triarylsulfonium hexafluoroantimonate (simply referred to as antimonate type or Sb‐type), were used. Electron‐beam absorption doses of 200, 300, 400, and 600 kGy were applied to the uncured diepoxidized cardanol (DEC) samples, respectively. It was revealed that the Sb‐type photoinitiator was preferable to the electron‐beam curing of DEC; this led to a lower photoinitiator concentration and/or a lower electron‐beam absorption dose compared to that in the phosphate‐type photoinitiator. As a result, the variations in the glass‐transition temperature, coefficient of thermal expansion, storage modulus, and water uptake of the cured DEPC were quite consistent with each other. We found that the optimal conditions for the enhanced properties of DEPC by electron‐beam curing were an Sb‐type photoinitiator at 2 wt % and an electron‐beam absorption dose of 600 kGy. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42570.     

Radiation-curable carbon fiber prepreg composites

Radiation processing is the utilization of ionizing radiation, usually photons or electron beams, to produce useful physical and chemical changes in a material. A potential application for electron beam processing for composite manufacturing is for curing carbon fiber prepregs. These prepregs, carbon fibers or fabrics preimpregnated with liquid polymer resin, are commonly used in the aircraft industry. Their use, however, can be time consuming and labor intensive. The advantages of radiation curing over thermal or chemical curing methods include improved rate control, reduced curing times, and curing at ambient temperature. There is no need for chemical initiators. A radiation-curable prepreg has been designed to meet the mechanical and physical property specifications of a leading aircraft manufacturing company. The resin is a mixture of an expoxy diacrylate, polybutadiene diacrylate, and a multifunctional monomer. This resin was used to impregnate a plain weave carbon fabric, at a loading of 35 percent (by mass), using a solvent process. Preliminary characterization studies show that the cured polymer produced by irradiation in air to a dose of 40 kGy is amorphous with a maximum gel fraction of 85 percent. The softening point of the polymer varied from 228°C (30-kGy sample) to 237°C (50-kGy sample). The linear thermal expansion coefficient of the polymer was 1.7 × 10⁻⁴ m/m°C from 25°C to 150°C and was unaffected by varying the applied dose from 30 to 50 kGy.     

Electron‐beam curing of bismaleimide‐reactive diluent resins

Electron‐beam (E‐beam) curing of 4,4′‐bismaleimidodiphenylmethane (BMPM)/BMI‐1,3‐tolyl/o,o′‐diallylbisphenol A (DABPA)–based bismaleimide (BMI) systems and their mixing with various reactive diluents, such as N‐vinylpyrrolidone (NVP) and styrene, were investigated to elucidate how temperature, electron‐beam dosage, and diluent concentration affect the cure extent. The effect of free‐radical initiator on the cure reactions was also studied. It was found that low‐intensity E‐beam exposures cannot cause the polymerization of BMI. High‐intensity E‐beam exposures give high reaction conversion attributed to a high temperature increase, which induced thermal curing. It was shown that the dilution and activation of NVP in BMI cause a more complete BMI cure reaction under E‐beam radiation. BMI/NVP can be initiated easily by low‐intensity E‐beam without thermal curing. FTIR studies indicate that about 70% of the reaction is complete for BMI/NVP with 200 kGy dosage exposure at 10 kGy per pass. The sample temperature only reaches about 75°C. The free‐radical initiator, dicumyl peroxide, can accelerate the reaction rate at the beginning of E‐beam exposure, but does not affect the final reaction conversion. The increase of the concentration of NVP in the BMI/NVP systems increases the reactive conversions almost linearly. © 2004 Wiley Periodicals Inc. J Appl Polym Sci 94: 2407‐2416, 2004     

Electron Beam Curing of the System Cycloaliphatic Diepoxide‐Epoxidized Natural Rubber‐Glycidyl Methacrylate in Presence of Cationic Initiators

Electron beam curing of the system cycloaliphatic diepoxide‐epoxidized natural rubber‐glycidyl methacrylate containing a cationic initiator was carried out. Storage modulus, glass transition temperature and pendulum hardness were measured as function of EB dose, photoinitiator concentration, content of epoxidized natural rubber, post cure temperature and post cure time. At electron beam doses larger than 100 kGy a highly cross‐linked polymer network is generated which shows a two phase morphology. Microscale elastomeric domains are incorporated into a continuous epoxy resin phase. Dynamical mechanical analysis and pendulum hardness measurement show that an increase of the ENR ratio leads to a more elastic polymer network. Post curing results in increased glass transition temperatures. This EB cured polymer system is believed to provide both toughness and favorable viscoelastic properties to be used as component of EB curable composites.     

Synthesis of a self‐emulsifiable waterborne epoxy curing agent based on glycidyl tertiary carboxylic ester and its cure characteristics

A novel self‐emulsifiable waterborne amine‐terminated curing agent for epoxy resin based on glycidyl tertiary carboxylic ester (GTCE) was synthesized through three steps of addition reaction, capping reaction, and salification reaction of triethylene tetramine (TETA) and liquid epoxy resin (E‐44). The curing agent with good emulsifying and curing properties was gradually obtained under condition of the molar ratio of TETA: E‐44 as 2.2: 1 at 65 °C for 4 h, 100% primary amine capped with GTCE at 70 °C for 3 h, and 20% salifiable rate with glacial acetic acid. The curing agent was characterized by Fourier transform‐infrared spectroscopy (FT‐IR). The curing behavior of the E‐44/GTCE‐TETA‐E‐44 system was studied with differential scanning calorimetry (DSC) and FT‐IR. Results showed that the optimal mass ratio for E‐44/GTCE‐TETA‐E‐44 system was 3 to 1, and the curing agent showed a relatively lower curing temperature. The cured film prepared by the self‐emulsifiable curing agent and epoxy resin under the optimal mass ratio displayed good thermal property, hardness, toughness, adhesion, and corrosion resistance. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44246.     

Investigation of influence factors in electron beam curing of epoxy resins using a calorimetry technique

Because of the complexity of the electron beam (EB) curing process, current understanding of EB curing of polymer resins and composites is limited. This article describes an investigation of different factors affecting EB curing of epoxy resin such as dose rate, time interval between irradiation doses, moisture, and photoinitiator concentration using a calorimetry technique. Results show that higher dose rate resulted in a higher and faster temperature increment in the uncured resin samples, and thus a higher degree of cure. In the multiple‐step EB irradiation, a shorter time interval between irradiation doses resulted in higher temperature in the resin samples and therefore higher degree of cure. Results indicate that moisture could delay crosslinking reaction in the early stages of the cure reaction, but accelerates it later in the curing process. Given a reasonable percentage of photoinitiator, experiments confirmed that samples with higher photoinitiator concentration reach higher degree of cure under same EB irradiation conditions. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Novel latent initiator for cationic polymerization of epoxides

A novel latent initiator for cationic polymerization of epoxides, a composite catalyst containing aluminum complexes and phenol derivatives protected with tert‐butoxycarbonyl groups (tBOC), is reported. At a certain temperature, protected phenols generate the parent phenols which are coinitiators with aluminum complexes. The deprotection temperature of the tBOC group depends on the structure of the phenol moieties. Bis(p‐t‐butoxycarbonyloxyphenyl)sulfone (Ph1) generates (p‐dihydroxyphenyl)sulfone (PhH1) at around 150°C, the temperature at which the curing of epoxides is conventionally carried out. The thermally generated PhH1 and aluminum complexes initiate the curing of epoxides. Epoxy resin compositions containing these composite catalysts have a long shelf life at room temperature and are cured at around 150°C, showing that the composite catalyst has excellent latent properties. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 181–187, 2001     

The influence of post‐cure on properties of carbon/phenolic resin cured composites and their final carbon/carbon composites

Two‐dimensional (2D) carbon/carbon (C/C) composites were prepared with phenol‐formaldehyde resin and graphite fabric. After curing, polymer composites were post‐cured in air at 160°C and 230°C for several hours and then all polymer composites were carbonized up to 1500°C. The effect of post‐cure on the microstructure and fracture behavior of the resultant carbon/carbon composites was studied. The post‐cure process was characterized by weight loss. This process promoted the crosslinking and condensation reactions and led to the formation of long‐chain, cross‐linked polymeric structures in the matrix. The post‐cured composites had a greater density than the unpost‐cured composite. This study indicates that a longer post‐curing time and higher post‐curing temperature would limit the shrinkage for the post‐cured composites during carbonization. The improvement in linear shrinkage was 22% to 44%. This process also limited the formation of open pores and decreased the weight loss of the resultant C/C composites. The resultant C/C composites developed from post‐cured composites had a greater flexural strength by 7 to 26% over that developed from unpost‐cured composite.     

Improving the curing process and thermal stability of phthalonitrile resin via novel mixed curing agents

High curing temperature (including post‐curing temperature) and long curing time of phthalonitrile resins make them thermally stable but difficult to process. In this paper, novel mixed curing agents (CuCl/4,4′‐diaminodiphenylsulfone (DDS) and ZnCl₂/DDS) were firstly designed for solving these problems. Bisphenol‐based phthalonitrile monomer (BP‐Ph; melting point: 228–235 °C) was synthesized and used as the curing precursor. Differential scanning calorimetry results indicated that BP‐Ph cured with CuCl/DDS and ZnCl₂/DDS exhibited curing temperatures close to the melting point of BP‐Ph with curing ending temperatures of 225.4 and 287.1 °C, respectively. Rheologic investigations demonstrated obvious curing reactions of BP‐Ph occurred with the mixed curing agents at 220 °C. Thermogravimetric analysis showed that BP‐Ph cured by CuCl/DDS or ZnCl₂/DDS maintained 95% mass at 573 or 546 °C, respectively, at a post‐curing temperature of 350 °C for 2 h. Reasonable long‐term thermo‐oxidative stability was also demonstrated. When the post‐curing temperature decreased to 290 °C, char yield at 800 °C of BP‐Ph cured by CuCl/DDS was 77.0%, suggesting the curing procedure can be milder when using mixed curing agents. © 2017 Society of Chemical Industry     

Phenolic‐epoxy matrix curable by click chemistry—synthesis,curing, and syntactic foam composite properties

Alkyne functional phenolic resin was cured by azide functional epoxy resins making use of alkyne‐azide click reaction. For this, propargylated novolac (PN) was reacted with bisphenol A bisazide (BABA) and azido hydroxy propyloxy novolac (AHPN) leading to triazole‐linked phenolic‐epoxy networks. The click cure reaction was initiated at 40–65°C in presence of Cu₂I₂. Glass transition temperature (Tg) of the cured networks varied from 70°C to 75°C in the case of BABA‐PN and 75°C to 80°C in the case of AHPN‐PN. DSC and rheological studies revealed a single stage curing pattern for both the systems. The cured BABA‐PN and AHPN‐PN blends showed mass loss above 300°C because of decomposition of the triazole rings and the novolac backbone. Silica fiber‐reinforced syntactic foam composites derived from these resins possessed comparable mechanical properties and superior impact resistance vis‐a‐vis their phenolic resin analogues. The mechanical properties could be tuned by regulating the reactant stoichiometry. These low temperature addition curable resins are suited for light weight polymer composite for related applications. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41254.     

Effect of curing temperature on the morphology of unsaturated polyester resin blended with poly(vinyl acetate)

Phase separation of unsaturated polyester/styrene (UPE/styrene) resin blended with 5 and 10 wt% of poly(vinyl acetate) (PVAc) cured at various temperatures ranging from 75°C to 150°C was studied using low angle laser light scattering (LALS) and scanning electron microscopy (SEM). For UPE/styrene resin blended with 5 wt% PVAc cured at a temperature below 90°C, a discrete phase‐separated structure was observed. As curing temperature was raised above 90°C, SEM micrographs revealed that more and more cured UPE globules fused together with increasing curing temperature. The LALS intensity profile became broader with increasing curing temperature, indicating a less discrete phase‐separated structure at a higher curing temperature. As PVAc content was increased to 10 wt%, SEM micrographs revealed a co‐continuous phase‐separated structure. The LALS intensity decayed slowly from the center of the scattering pattern to a high scattering angle without the appearance of maximum scattering peak intensity. The morphology of the cured sample did not change too much with curing temperature for UPE/styrene resin blended with 10 wt% of PVAc.     

Preparation and characterization of unsaturated poly(ester‐imide) based on 1,4‐bis[2′‐trifluoromethyl‐4′‐(4″‐glycolformate)‐trimellitimidophenoxy]benzene

A novel diimidodialcohol monomer, 1,4‐bis[2′‐trifluoromethyl‐4′‐(4″‐glycolformate)‐ trimellitimidophenoxy]benzene (BGTB), was synthesized and characterized. It was reacted with isophthalic acid, maleic anhydride and propylene glycol to produce a novel unsaturated poly(ester‐imide) (BGTB‐UPEI) with imide and trifluoromethyl groups in the polymer backbone. The BGTB‐UPEI resin was diluted with reactive monomer (styrene) to give a low‐viscous poly(ester‐imide)/styrene (BGTB‐UPEI/St) mixed solution, which was then thermally cured to yield thermosetting BGTB‐UPEI/St composite. The effect of processing parameters such as the curing temperature and curing time, reactive monomer concentration and initiator amount on the curing reaction was systematically investigated. Experimental results indicated that the thermally cured BGTB‐UPEI/St composite exhibited much better thermal, mechanical, electrical insulating properties and chemical resistance than the standard unsaturated polyester/polystyrene composite. Copyright © 2006 Society of Chemical Industry     

Bio-resourced eugenol derived phthalonitrile resin for high temperature composite

Eugenol (EG) is an abundant renewable compound that has been widely used in the synthesis of bio-based thermosetting resin, but there are few reports on the phthalonitrile (PN) resin derived from EG. In this study, a new kind of bio-based PN resin (MEG-PN) derived from EG derivative was successfully synthesized. PN is a traditional class of high-performance thermosets with poor processability for its ultra-high melting point and curing temperature. The MEG-PN resin possesses excellent processability: its melting temperature is much lower (77°C), and it can be cured at a moderate temperature (281°C) in the absence of curing agents. The cured MEG-PN resin exhibited great heat resistance according to its 5% weight loss temperature at 448°C and its char yield percentage as high as 75.6% at 800°C under nitrogen. The properties of the carbon-fiber reinforced MEG-PN composite were comparable to those of petroleum-based PN resins: the glass transition temperature was around 397°C; the flexural strength and modulus were as high as 756 MPa and 119 GPa, respectively. Overall, a bio-based PN thermoset with great comprehensive performance was synthesized possessing the potential in the application of advanced composite.     

Preparation and properties of a new polytriazole resin made from dialkyne and triazide compounds and its composite

A new kind of polytriazole resins were prepared from a triazide and a dialkyne compounds and characterized. These resins can be cured at 80 °C. The curing process for a resin was traced by FT-IR. The glass transition temperature T_g and thermal decomposition temperature T_d5 of the cured resin with the molar ratio of azide group to alkyne group [a]/[b]=1.0:1.0 reach 216 °C and 360 °C, respectively. The flexural strength of the cured resin and its glass fiber reinforced composite arrive at 183.6 MPa and 963.4 MPa, respectively. The resin would be a good candidate for the matrices of advanced composites.     

Synthesis and characterization of a novel silicon‐containing polytriazole resin

4,4′‐Diazidomethylbiphenyl (DAMBP) and poly(dimethylsilylene‐ethynylenephenyleneethynylene) (PDMSEPE) were thermally polymerized to form a novel silicon‐containing polytriazole resin (PDMSEPE‐DAMBP) by 1,3‐dipolar cycloaddition. Differential scanning calorimetry, FTIR, and ¹³C‐NMR were used to characterize the curing behaviors of PDMSEPE‐DAMBP resins. The results indicated that the resins could cure at temperatures as low as 80°C. Dynamic mechanical analysis showed that there was a glass transition at 302°C for the cured PDMSEPE‐DAMBP resin. The carbon fiber (T700) reinforced PDMSEPE‐DAMBP composites exhibited excellent mechanical properties at room temperature and high property retention at 250°C. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Cationic electron‐beam curing of a high‐functionality epoxy: effect of post‐curing on glass transition and conversion

This paper reports on the cationic electron‐beam curing of a high‐functionality SU8 epoxy resin, which is extensively used as a UV‐curing negative photoresist for micro‐electronics machine systems (MEMS) applications. Results show that elevated post‐curing treatment significantly increased both the conversion and the glass transition. The degree of conversion and the glass transition temperature were measured by using Fourier‐transform infrared (FTIR) spectroscopy and modulated differential scanning calorimetry (MDSC^®), respectively. The glass transition temperature (T_g), which has been observed to be dependent on the degree of conversion, reaches a maximum of 162 °C at 50 Mrad and post‐curing at 90 °C. The degradation pattern of the cured resin does not show much variation for exposure at 5 Mrad, but does show significant variation for 50 Mrad exposure at various post‐curing temperatures. A degree of conversion of more than 0.8 was achieved at a dosage of 30 Mrad with post curing at 80 °C, for the epoxy resin with an average functionality of 8 a feature simply not achievable when using UV‐curing. Copyright © 2004 Society of Chemical Industry     

Thermally stable bromobutyl rubber with a high crosslinking density based on a 4,4′‐bismaleimidodiphenylmethane curing agent

The development of thermally stable bromobutyl rubbers has been a challenge in rubber chemistry and engineering. In this circumstance, 4,4′‐bismaleimidodiphenylmethane (BMI) was newly applied as a novel crosslinking agent for thermally stable brominated isobutylene–isoprene rubber (BIIR) with a high crosslinking density. With oscillating disk rheometry and differential scanning calorimetry, the curing characteristics of BIIR were systematically investigated with respect to the content of BMI. We found that BMI alone could crosslink BIIR at higher temperature, and a corresponding possible chemical reaction mechanism was proposed. With the introduction of zinc oxide, the curing reaction of BIIR with BMI was significantly accelerated, and the resulting vulcanizate provided a higher state of curing with excellent overcure reversion stability even at a temperature of 190 °C for 2 h. The content of the dicumyl peroxide (DCP) reaction accelerator was also optimized to be BMI/DCP = 1:0.05 on the basis of considerations of the curing rate, scorch safety, maximum rheometric torque, and reversion resistance at 160 °C. Compared with the conventional sulfur‐cured BIIR, the BMI‐cured BIIR exhibited a higher crosslinking density with a superior low compression set property at elevated temperatures and an excellent thermal stability. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 44092.     

Kinetics of UV-curing of waterborne polyurethane acrylate dendrimer

In this study, a dendrimer with 19 sites was modified to form a waterborne oligomer with hydrophilic sites and polyurethane acrylate (PUA) sites. Two PU systems hexamethylene diisocyanate (HDI) and methylene-bis (4-cyclohexylisocyanate) (HMDI) were used; each of them had 5, 9, and 13 PUA sites, respectively. Experimental results revealed that the HDI system was more thermally stable than the HMDI system. The HMDI system, however, exhibited better hardness than the HDI system, even though the final curing conversion of HMDI was low. Additionally, more PUA sites of a dendrimer were associated with greater hardness of the cured resin. In a UV-curing study, simulations revealed that the autocatalysis model could describe the UV-curing mechanism of the PUA-dendrimer system. Both the reaction rate constant k and the final conversion α were highest at a concentration of the photoinitiator of approximately 3 wt% for both HDI and HMDI systems. The reaction rates of both systems were highest when the number of PUA sites was nine. The final conversion of both the systems, however, was optimal when the number of PUA sites was 13. The final conversion in the acrylic reaction increased with temperature up to 80 °C for both the systems, owing to an increase in the ratio of potentially active sites against nonactive sites, according to Arrhenius theory. The rate constant, k, however, was optimal at 60 °C because a higher temperature damaged the photoinitiator. Finally and most importantly, HMDI always had a lower rate constant k and final conversion α than HDI under similar conditions in studies that were conducted to examine the effects of photoinitiator concentration, number of PUA sites, and reaction temperature, revealing that the steric hindrance by the cyclohexane in HMDI negatively influenced its curing kinetics.     

含乙烯基有机硅树脂的电子束固化行为研究

以八甲基环四硅氧烷、四甲基四乙烯基环四硅氧烷为单体,六甲基二硅氧烷为封端剂,碱胶为催化剂,合成了含乙烯基有机硅树脂;并研究了电子束辐射剂量对其固化行为的影响和固化涂层的热性能。红外谱图及凝胶率测试结果表明,有机硅树脂中的碳碳双键吸收峰强度随辐射剂量的增加而减弱,辐射诱导交联网络结构的形成导致固化涂层的凝胶率随剂量的增加而显著增加;辐射剂量为30 kGy时,凝胶率为46.2%;辐射剂量增加至60 kGy时为70.1%和100 kGy时为85.9%。差示扫描量热分析和热质分析结果表明,固化涂层具有优良的耐低温性和热稳定性。