Electron beam curing of polymer composites

Electron‐beam (E‐Beam) curing of an epoxy polymer matrix and its composite (reinforced with IM7 Carbon fibers) was studied using a cationic photoinitiator. Photoinitiator concentration, dose, and process temperature were varied to understand their influence on E‐beam curing. Optimal photoinitiator concentration was found to be 5 phr. The curing was due to a primary α reaction with a strong dependence on dose, and a secondary β reaction with a weak dependence on dose and a strong dependence on initiator concentration. The extent of cure increased rapidly with dose until 100 kGy and it approached a plateau value beyond 100 kGy. This plateau value corresponded to incomplete curing by 27% for resin and 22% for composite at a process‐temperature of 22°C. The causes for incomplete curing appear to be the secondary β reaction and diffusional limitation. Increase in process temperature resulted in higher extent of cure at a dose level. The material used in this study was also found to be thermally curable and the reaction onset temperature (measured in a DSC ramp experiment) reduced from about 150°C at 0 kGy to about 50°C at 30 kGy. This indicates that simultaneous thermal curing during E‐beam curing of resin and composite is possible. After thermal post‐curing, the T_g of the E‐beam cured resin increased from 130°C at 200 kGy to a value greater than 370°C and the modulus decreased by 10%. The service temperature and the modulus of the 100% thermally cured resin and the thermally post‐cured (after E‐Beam irradiation) resin were comparable.     

Investigation of curing characteristics of carbon fiber/epoxy composites cured with low‐energy electron beam

To solve the penetration depth of carbon fiber/epoxy prepreg and irradiation dose uniformity by low‐energy E‐Beam under 125 keV, the both‐side irradiation curing of prepreg was investigated. The results show that there is little thermal effect during the low‐energy electron beam irradiation curing process, even though the irradiation dosage reached 300 kGy, only 46.2°C can be tested on the prepreg surface. Due to the low curing temperature, the degree of cure of prepreg was only 61.8% at 300 kGy level of irradiation, and the glass‐transition temperature (T_g) was only 48.6°C. The degree of cure and T_g can be increased sharply by thermal postcure. After being postcured at 160°C for 30 min, the degree of cure and the T_g of prepreg reached 98.5% and 170.4°C, respectively. Interlaminar shear strength testing result indicate that the fabrication process of the composite layer by layer curing by the low‐ energy E‐Beam is a promising cure approach. POLYM. COMPOS., 36:1731–1737, 2015. © 2014 Society of Plastics Engineers     

Homopolymerization effects in polymer layered silicate nanocomposites based upon epoxy resin: Implications for exfoliation

Exfoliation of polymer layered silicate nanocomposites based upon epoxy resin has previously been reported to be enhanced by allowing some homopolymerization of the resin to occur, catalyzed by the onium ion of the organically modified clay, before the addition of the cross‐linking agent and the curing of the nanocomposite. In this work we examine the effects of homopolymerization induced by pre‐conditioning the resin/clay mixtures by storing them at various temperatures, from room temperature to 100°C, prior to curing. It is found that pre‐conditioning results in similar increases in both the epoxy equivalent (EE) and the glass transition temperature (T_g) of the resin as a consequence of homopolymerization, with a linear relationship between EE and T_g that depends on the pre‐conditioning temperature. This is attributed to two different homopolymerization reaction mechanisms, activated monomer (AM) and activated chain end (ACE), the former dominating at high temperature and the latter at low temperature. The effects of these homopolymerization reactions on the network and nanostructure of the nanocomposite are discussed, the important aspect emerging being that the ACE mechanism is the one that most significantly enhances the exfoliation process. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Time–temperature–transformation cure diagrams of phenol–formaldehyde and lignin–phenol–formaldehyde novolac resins

In this study, the time–temperature– transformation (TTT) cure diagrams of the curing processes of several novolac resins were determined. Each diagram corresponded to a mixture of commercial phenol–formaldehyde novolac, lignin–phenol–formaldehyde novolac, and methylolated lignin–phenol–formaldehyde novolac resins with hexamethylenetetramine as a curing agent. Thermomechanical analysis and differential scanning calorimetry techniques were applied to study the resin gelation and the kinetics of the curing process to obtain the isoconversional curves. The temperature at which the material gelled and vitrified [the glass‐transition temperature at the gel point (_gelT_g)], the glass‐transition temperature of the uncured material (without crosslinking; T_g0), and the glass‐transition temperature with full crosslinking were also obtained. On the basis of the measured of conversion degree at gelation, the approximate glass‐transition temperature/conversion relationship, and the thermokinetic results of the curing process of the resins, TTT cure diagrams of the novolac samples were constructed. The TTT diagrams showed that the lignin–novolac and methylolated lignin–novolac resins presented lower T_g0 and _gelT_g values than the commercial resin. The TTT diagram is a suitable tool for understanding novolac resin behavior during the isothermal curing process. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Comparison of the curing kinetic behavior for two epoxy resin systems containing EPIKOTE 828–EPIKURE 3090 and DURATEK KLM 606A–DURATEK KLM 606B

The aim of the study is to determine the optimum cure temperatures and kinetics for two different epoxy resin systems without using solvent. Two resin systems consist of EPIKOTE 828® epoxy resin–EPIKURE® 3090 polyamidoamine curing agent and DURATEK® KLM 606A epoxy resin–DURATEK® KLM 606B polyamide curing agent. The ratio of resin to curing agent was kept as 1:1 for both the systems. Curing temperatures of both the systems were determined and kinetic parameters were calculated with respect to the experimental results following nth‐order kinetics. Then, a series of isothermal temperatures was applied to the resin systems in order to assess the cure process in terms of conversion, time, and temperature by using differential scanning calorimeter (DSC). The test results of both systems show that the rate of degree of cure for EPIKOTE 828® epoxy resin–EPIKURE® 3090 polyamidoamine curing agent system is approximately 10 times higher than that of DURATEK® KLM 606A epoxy resin–DURATEK® KLM 606B polyamide curing agent system at 230°C. POLYM. COMPOS., 28:762–770, 2007. © 2007 Society of Plastics Engineers     

Intercalation and exfoliation behavior of epoxy resin/curing agent/montmorillonite nanocomposite

The epoxy resin/curing agent/montmorillonite nanocomposite was prepared by a casting and curing process. The intercalation and exfoliation behaviors of epoxy resin in the presence of organophilic montmorillonite were investigated by X‐ray diffraction (XRD) and dynamic mechanical thermal analysis (DMTA). For the diethylenetriamine curing agent, the intercalated nanocomposite was obtained; and the exfoliated nanocomposite would be formed for tung oil anhydride curing agent. The curing condition does not affect the resulting kind of composite, both intercalation or exfoliation. For intercalated nanocomposite, the glass transition temperature T_g, measured by DMTA and affected by the curing temperature of matrix epoxy resin is corresponded to that of epoxy resin without a gallery. The α′ peak of the loss tangent will disappear if adding montmorillonite into the composite. It was also found that the T_g of the exfoliated nanocomposite decreases with increasing montmorillonite loading. © 2002 John Wiley & Sons, Inc. J Appl Polym Sci 84: 842–849, 2002; DOI 10.1002/app.10354     

Effect of cure history on dynamic mechanical properties of an epoxy resin

The effect of cure history on the dynamic thermomechanical properties of a high temperature curing epoxy resin has been studied using torsional braid analysis. In isothermal cures “full cure” is not possible except at temperatures above the maximum glass transition temperature (T_g) of the cured resin, hence the necessity of a “post-cure” after lower temperature isothermal cures. The highest T_g and maximum cross-linking in the cured resin was for a linear heating rate of 0.05°C/min from 30 to 200°C; higher heating rates lead to lower glass transition temperatures.     

Azo initiator selection to control the curing order in dimethacrylate/epoxy interpenetrating polymer networks

Differential Scanning calorimetry (DSC) and Fourier‐transform infrared (FT‐IR) spectroscopic studies have been undertaken of the cure of interpenetrating polymer networks (IPNs) formed with imidazole‐cured diglycidyl ether bisphenol‐A (DGEBA) and with either diethoxylated bisphenol‐A dimethacrylate (DEBPADM) or bisphenol‐A diglycidyl dimethacrylate (bisGMA), polymerized by a range of azo initiators (AIBN64, VAZ088, VR110 and AZO168). Due to the differing decomposition rates of the azo initiators, the neat dimethacrylate resin either cured faster than (with AIBN64 and VAZO88), or similar to (VR110), or slower than (AZO168), the neat epoxy resin. In the neat DGEBA/1‐methyl imidazole (1‐MeI), DEBPADM/AIBN64, DEBPADM/VAZO88 and DEBPADM/VR110 resins, close to full cure was achieved. For the neat, high‐temperature DEBPADM/AZO168 resin, full cure was not attained, possibly due to the compromise between using a high enough temperature for azo decomposition while avoiding depolymerization or decomposition of the methacrylate polymer. IPN cure studies showed that, by appropriate initiator selection, it was possible to interchange the order of cure of the components within the IPN so that either the dimethacrylate or epoxy cured first. In the isothermal cure of the 50:50 DEBPADM/AIBN64:DGEBA/1‐Mel IPN system, the cure rate of both species was less than in the parent resins, due to a dilution effect. For this system, the dimethacrylate cured first and to high conversion, due to plasticization by the unreacted epoxy, but the subsequent cure of the more slowly polymerizing epoxy component was restricted by the high crosslink density developed in the IPN. After post‐curing, however, high conversion of both reactive groups was observed and the fully cured IPN exhibited a single high‐temperature T_g, close to the T_g values of the parent resins. In the higher‐temperature, isothermal cure of the 50:50 DEBPADM/VR110:DGEBA/1‐Mel IPN system, the reactive groups cured at a similar rate and so the final conversions of both groups were restricted, while in the 50:50 DEBPADM/AZO168:DGEBA/1‐Mel system it was the epoxy which cured first. Both of these higher‐temperature azo‐initiated IPN systems exhibited single T_gs, indicating a single‐phase structure; however, the T_gs are significantly lower than expected, due to plasticization by residual methacrylate monomer and/or degradation products resulting from the high cure temperature. Copyright © 2004 Society of Chemical Industry     

Torsional braid analysis of the aromatic amine cure of epoxy resins

The cure behavior of diglycidyl ether of bisphenol A (DGEBA) type of epoxy resins with three aromatic diamines, 4,4′-diaminodiphenyl methane (DDM), 4,4′-diaminodiphenyl sulfone (44DDS), and 3,3′-diaminodiphenyl sulfone (33DDS) was studied by torsional braid analysis. For each curing agent the stoichiometry of the resin mixtures was varied from a two to one excess of amino hydrogens per epoxy group to a two to one excess of epoxy groups per amino hydrogen. Isothermal cures of the resin mixtures were carried out from 70 to 210°C (range depending on epoxy—amine mixture), followed by a temperature scan to determine the glass transition temperature (T_g). The times to the isothermal liquid-to-rubber transition were shortest for the DDM mixtures and longest for the 44DDS mixtures. The liquid-to-rubber transition times were also shortest for the amine excess mixtures when stoichiometry was varied. A relatively rapid reaction to the liquid-to-rubber transition was observed for the epoxy excess mixtures, followed by an exceedingly slow reaction process at cure temperatures well above the T_g. This slow process was only observed for epoxy excess mixtures and eventually led to significant increases in T_g. Using time—temperature shifts of the glass transition temperature vs. logarithm of time, activation energies approximately 50% higher were derived for this process compared to those derived from the liquid-to-rubber transition. The rate of this reaction was virtually independent of curing agent and was attributed to etherification taking place in the epoxy excess mixtures. © 1994 John Wiley & Sons, Inc.     

Transparent Surfactant/Epoxy Composite Coatings with Self‐Healing and Superhydrophilic Properties

In this paper, highly transparent, robust, and superhydrophilic polyethylene glycol tert‐octylphenyl ether nonionic surfactant/epoxy (Triton X‐100/epoxy, TXE) composite coatings are successfully prepared with a facile, one‐step drop‐casting method by mixing Triton X‐100 with an epoxy resin and an amine curing agent. The hydrogen bond reaction between the hydroxyl group of Triton X‐100 and the ether group of the epoxy resin improves the compatibility and reduces the glass transition temperature (T_g) of the TXE composite coatings. The free Triton X‐100 surfactant easily accumulates on the surface of the TXE composite coatings, which improves the hydrophilicity of the TXE composite coatings. The TXE composite coatings are self‐healable because of their low T_g and the migration of Triton X‐100 small molecule surfactant. Any damage arising from denting, cutting, or wiping by tetrahydrofuran can be healed, and the composite coating can regain its superhydrophilic properties through a heating process. The TXE composite coatings demonstrate excellent acid, alkali, salt, high temperature, and ultrasonic‐resistant properties. This facile preparation technique has the potential to be applied in the scalable fabrication of multifunctional coatings in anti‐fogging, oil–water separation, and optical–electric devices.     

Curing behavior and thermal property of epoxy resin with boron‐containing phenol‐formaldehyde resin

The curing reaction of bisphenol‐A epoxy resin (BPAER) with boron‐containing phenol–formaldehyde resin (BPFR) was studied by isothermal and dynamic differential scanning calorimetry (DSC). The kinetic reaction mechanism in the isothermal reaction of BPAER‐BPFR was shown to follow autocatalytic kinetics. The activation energy in the dynamic cure reaction was derived. The influence of the composition of BPAER and BPFR on the reaction was evaluated. In addition, the glass transition temperatures (T_gs) were measured for the BPAER‐BPFR samples cured partially at isothermal temperatures. With the curing conditions varying, different glass transition behaviors were observed. By monitoring the variation in these T_gs, the curing process and the thermal property of BPAER–BPFR are clearly illustrated. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 76: 1054–1061, 2000     

Influence of nanosilica particles on the cure and physical properties of an epoxy thermoset resin

Measurements are reported on the cure and physical properties of an epoxy resin created using a functionalised nanosilica filler. The filled bisphenol A epoxy (Nanopox A410) contained 40 wt% silica nanoparticles and was blended with two bisphenol A resins of molecular weights of 355 and 1075 g mol^?1, respectively. Cure was achieved using 3,3‐diaminodiphenylsulfone. The functionality of the mixture containing the epoxy nanoparticles was determined using NMR analysis. Cure times showed a progressive decrease with increasing silica level. Dynamic mechanical thermal analysis showed a decrease in the value of the glass transition temperature (T_g) with increasing silica level. T_g was further studied using differential scanning calorimetry. The ability of the nanosilica to create a stable network structure was demonstrated by the variation of the high‐temperature modulus with silica composition. Thermomechanical analysis carried out below and above T_g showed a progressive decrease in the expansion coefficients with increasing silica level, indicating the effectiveness of the functionalised silica nanoparticles in forming a network. The network formed during cure in the nano‐modified epoxy is unable to undergo the densification possible in the pure resin material and explains the observed lowering of T_g with increasing nanosilica content. Copyright © 2009 Society of Chemical Industry     

Modification of a two‐component system by introducing an epoxy‐reactive diluent: Construction of a time–temperature–transformation (TTT) diagram

Curing reactions of a three‐component system consisting of an epoxy resin diglycidyl ether of bisphenol A (DGEBA n = 0), 1,2‐diaminecyclohexane as curing agent, and vinylcyclohexene dioxide as a reactive diluent were studied to calculate a time–temperature–transformation isothermal cure diagram for this system. Differential scanning calorimetry (DSC) was used to calculate the vitrification times. DSC data show a one‐to‐one relationship between T_g and fractional conversion α, independent of cure temperature. As a consequence, T_g can be used as a measure of conversion. The activation energy for the polymerization overall reaction was calculated from the gel times obtained using the solubility test (58.5 ± 1.3 kJ/mol). This value was similar to the results obtained for other similar epoxy systems. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 1190–1198, 2004     

The boron trifluoride monoethyl amine complex cured epoxy resins

The curing exotherm pattern is affected by the equivalent ratio of curing agent, boron trifluoride monoethylamine complex (BF₃ · MEA), to epoxy resin. The diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) cures more slowly than the diglycidyl ether of bisphenol A (Epon 828). The glass transition temperatures (T_g's) of BF₃ · MEA cured Epon 828 are increased with inceasing concentration of curing agent (0.0450–0.1350 eq.) cured DGEBF. The activation energies for the thermal decomposition for BF₃ · MEA (0.0450–0.1350 eq.) cured DGEBF. The activation energies for the thermal decomposition for BF₃ · MEA (0.0450 eq./epoxy eq.) cured Epon 828 and DGEBF are almost equivalent 43 and 44 kcal/mol, respectively. DGEBF when added to DGEBA improves the T_g and char yield with the BF₃ · MEA curing system. The T_g of both resin systems can be increased by longer post cure, whereas the char yield does not appear to change significantly. No ester group formation is found for the BF₃ · MEA-cured DGEBF, although this has been previously reported for the DGEBA system. The BF₃ · MEA cure at 120°C is better than at 140°C because of vaporization and degradation of the curing agent at the higher temperature. The rapid gelation of the epoxy resin may be another reason for the lower degree of cure at high temperature.     

Synthesis and characterization of diphenylsilanediol modified epoxy resin and curing agent

A series of diphenylsilanediol modified epoxy resins and novel curing agents were synthesized. The modified epoxy resins were cured with regular curing agent diethylenetriamine (DETA); the curing agents were applied to cure unmodified diglycidyl ether of bisphenol A epoxy resin (DGEBA). The heat resistance, mechanical property, and toughness of all the curing products were investigated. The results showed that the application of modified resin and newly synthesized curing agents leads to curing products with lower thermal decomposition rate and only slightly decreased glass transition temperature (T_g), as well as improved tensile modulus and tensile strength. In particular, products cured with newly synthesized curing agents showed higher corresponding temperature to the maximum thermal decomposition rate, comparing with products of DGEBA cured by DETA. Scanning electron microscopy micro images proved that a ductile fracture happened on the cross sections of curing products obtained from modified epoxy resins and newly synthesized curing agents, indicating an effective toughening effect of silicon–oxygen bond.     

Cure kinetics and morphology of blends of epoxy resin with poly (ether ether ketone) containing pendant tertiary butyl groups

The cure kinetics and morphology of diglycidyl ether of bisphenol-A (DGEBA) epoxy resin modified with a poly (ether ether ketone) based on tertiary butyl hydroquinone (PEEK-T) cured with diamino diphenyl sulphone (DDS) were investigated using differential scanning calorimetry (DSC), scanning electron microscopy (SEM) and dynamic mechanical thermal analysis (DMTA). The results obtained from DSC were applied to autocatalytic and diffusion controlled kinetic models. The reaction mechanism broadly showed autocatalytic behaviour regardless of the presence of PEEK-T. At higher PEEK-T concentration, more diffusion controlled mechanism was observed. The rate of curing reaction decreased with increase in thermoplastic content and also with the lowering of curing temperature. The activation energies of the blends are higher than that of the neat resin. The blends showed a phase separated morphology. The dispersed phase showed a homogeneous particle size distribution. The T_g of the neat resin decreased with the decrease in cure temperature. Two T_g's corresponding to the epoxy rich and thermoplastic rich phases were observed in the dynamic mechanical spectrum. The storage modulus of 10 and 20 phr PEEK-T blends are found to be greater than the neat resin.     

Preparation of epoxy-based insulator and optimization of its thermal property by Taguchi robust design method in double base propellant grain application

Taguchi method (orthogonal array, OA₉) was used to design an epoxy insulator by evaluating its glass transition temperature (T _g) for using in a double base (DB) propellant grain. In this design method, three epoxy resins based on diglycidylether bisphenol A (DGEBA), three polyamine curing agents and a DGEBA-based reactive diluent agent were used. The curing process of epoxy resins with polyamines was studied by Fourier transform infrared spectroscopy. The results showed that the curing process was completed at room temperature. The effects of four parameters including resin type, curing agent type, curing agent concentration and diluent quantity were investigated to design a resin formulation with a highest T _g after curing. The obtained results were quantitatively evaluated by the analysis of variance (ANOVA). The results of ANOVA showed that the highest T _g of 86.0 ± 9.0 °C was obtained for the optimum formulation of MANA POX-95 as epoxy resin, H-30 as curing agent and 52 phr H-30. The T _g measured by the experiment was 78.0 ± 0.9 °C. In addition, the single lap shear strength (adhesion strength) of the optimized insulator was measured at 13.66 ± 1.02 MPa. Pull-off test performed on the surface of DB propellant resulted a 1.935 ± 0.003 MPa adhesion strength.     

Effect of NBR on epoxy/glass prepregs properties

Solid acrylonitrile‐butadiene rubber (NBR) was used in epoxy resin for toughening and also for increasing the tack of epoxy/glass prepregs. The NBR used in this study was a rubber with 33% acrylonitrile content. The changes in thermal and mechanical properties such as glass transition temperature (T_g), curing characteristics and lap‐shear strength have been studied. For this purpose, three types of prepregs with two levels of NBR content of 3 and 5%, were prepared. Prepregs were made by solvent type impregnation apparatus. In this method, resin impregnates satin textile glass fiber under the controlled and constant condition of line speed and oven temperature. Prepregs were B‐staged for about 3%. The cure characterization, T_g and flow behavior were evaluated using differential scanning calorimetry and rheological analysis. Results showed that increasing the rubber content caused the following effects: (a) delay in gel time of prepregs, (b) increase in activation energy of prepregs, and (c) decrease in total heat of curing reaction. It is interesting that NBR increased the tack of epoxy/glass prepreg but, had no effect on its resin flow behavior. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012