不同Mg掺杂浓度的GaN材料的光致发光

研究了用低压金属有机物化学沉积方法生长得到的具有不同Mg掺杂浓度的GaN样品薄膜,经不同温度退火处理后的发光特性.实验发现随着退火温度的升高,不同掺杂浓度的Mg∶GaN材料的光致发光谱蓝带峰能量相差变小,经850℃退火后蓝带集中在2.92eV附近.利用Mg∶GaN材料内部补偿模型对此现象进行了分析,同时认为对于掺杂浓度较高的样品,850℃为最佳的退火温度.     

不同Mg掺杂浓度的GaN材料的光致发光

研究了用低压金属有机物化学沉积方法生长得到的具有不同Mg掺杂浓度的GaN样品薄膜,经不同温度退火处理后的发光特性.实验发现随着退火温度的升高,不同掺杂浓度的Mg∶GaN材料的光致发光谱蓝带峰能量相差变小,经850℃退火后蓝带集中在2.92eV附近.利用Mg∶GaN材料内部补偿模型对此现象进行了分析,同时认为对于掺杂浓度较高的样品,850℃为最佳的退火温度.     

MOCVD生长的GaN:Mg外延膜的光电性质

用MOCVD技术生长GaN:Mg外延膜,在550～950℃温度范围内,对样品进行热退火,并进行室温Hall、光致发光谱(PL)测试.Hall测试结果表明,850℃退火后空穴浓度达到8×1017 cm-3以上,电阻率降到0.8Ω·cm以下.室温PL谱有两个缺陷相关发光峰,位于2.8eV的蓝光峰(BL)以及3.27eV附近的紫外峰(UVL).蓝光峰对紫外峰的相对强度(BL/UVL)在550℃退火后升高,之后随着退火温度的升高(650～850℃)而下降,继续提高退火温度至950℃,BL/UVL急剧上升.空穴浓度先随着Mg掺杂浓度的增加而升高;但继续增加Mg掺杂浓度,空穴浓度反而下降.这些结果表明要实现空穴浓度达1018 cm-3,不仅要考虑H的钝化作用,还要考虑Mg受主的自补偿效应.     

MOCVD生长的GaN:Mg外延膜的光电性质

用MOCVD技术生长GaN:Mg外延膜,在550～950℃温度范围内,对样品进行热退火,并进行室温Hall、光致发光谱(PL)测试.Hall测试结果表明,850℃退火后空穴浓度达到8×1017 cm-3以上,电阻率降到0.8Ω·cm以下.室温PL谱有两个缺陷相关发光峰,位于2.8eV的蓝光峰(BL)以及3.27eV附近的紫外峰(UVL).蓝光峰对紫外峰的相对强度(BL/UVL)在550℃退火后升高,之后随着退火温度的升高(650～850℃)而下降,继续提高退火温度至950℃,BL/UVL急剧上升.空穴浓度先随着Mg掺杂浓度的增加而升高;但继续增加Mg掺杂浓度,空穴浓度反而下降.这些结果表明要实现空穴浓度达1018 cm-3,不仅要考虑H的钝化作用,还要考虑Mg受主的自补偿效应.     

InGaN与采用InGaN作为背势垒的双异质结的生长

我们研究了采用MOCVD生长了InGaN与InGaN和AlGaN/GaN/InGaN/GaN双异质结。我们发现InGaN的质量会严重影响AlGaN/GaN/InGaN/GaN双异质结的特性。通过优化生长压力与生长温度得到高结晶质量的InGaN薄膜。由于InGaN的极化方向与AlGaN的相反,使得GaN层与InGaN层之间出现了一个高势垒,提高了载流子的限域性并且降低了缓冲层的漏电。采用InGaN作为背势垒的双异质结的DIBL仅为1.5 mV/V。当VDS= 10 V时,测量得到的关态漏电流为2.6 µA/mm。     

InGaN:Mg薄膜的电学特性研究

利用MOCVD生长了InGaN:Mg薄膜,研究了生长温度、掺Mg量对InGaN:Mg薄膜电学特性的影响.结果表明,空穴浓度随着生长温度的降低而升高.在相同的生长温度下,空穴浓度随掺Mg量的增加,先升高后降低.通过对这两个生长条件的优化,在760℃、CP2Mg与TMGa摩尔流量之比为2.2‰时制备出了空穴浓度高达2.4×1019cm-3的p-InGaN:Mg薄膜.这对进一步提高GaN基电子器件与光电子器件的性能有重要意义.     

MOCVD生长Mg掺杂GaN的退火研究

用MOCVD技术在50mm蓝宝石衬底(0001)面上生长了GaN∶Mg外延膜,对样品进行热退火处理并作了Hall、双晶X射线衍射(DCXRD)和室温光致发光谱(PL)测试.Hall测试结果表明,950℃退火后空穴浓度达到5×1017cm-3以上,电阻率降到2.5Ω·cm;(0002)面DCXRD测试发现样品退火前、后的半峰宽均约为4′;室温PL谱中发光峰位于2.85eV处,退火后峰的强度比退火前增强了8倍以上,表明样品中大量被H钝化的受主Mg原子在退火后被激活.     

快速热退火对InGaAsSb/AlGaAsSb多量子阱材料发光特性的影响

I型InGaAsSb/AlGaAsSb量子阱是1.8～3μm波段锑化物半导体激光器的首选材料,为进一步提升分子束外延生长的InGaAsSb/AlGaAsSb量子阱材料的光学性能,本文对其进行了快速热退火处理,通过光致发光光谱研究了快速热退火对量子阱材料光致发光特性的影响。光致发光光谱测试结果表明,快速热退火会使量子阱结构中垒层、阱层异质界面处的原子互扩散,改善量子阱材料的晶体质量,促使结构释放应力,进而提高了量子阱材料的光学性能。随着退火温度升高,量子阱材料的室温光致发光谱峰位逐渐蓝移,在500,550,600℃退火后,量子阱材料光致发光谱的峰位分别蓝移了7,8,9 meV。通过变温及变功率光致发光光谱测试,确认了样品发光峰的来源,位于0.687 eV的发光峰为局域载流子的复合,位于0.701 eV的发光峰为自由激子的复合。对不同退火温度的样品进一步研究后发现,退火温度的升高降低了材料中局域态载流子复合的比例,在600℃退火温度下局域载流子与自由激子的强度比值降为500℃退火温度下的22.6%,这表明合适温度的快速热退火处理可以有效改善量子阱材料的光致发光特性。     

Fabrication and Emission Properties of a n-ZnO/p-GaN Heterojunction Light-Emitting Diode

报道了n-ZnO/p-GaN异质结构发光二极管的制备及其发光特性.采用金属有机气相外延技术在Mg掺杂p型GaN衬底上外延n型ZnO薄膜以形成p-n结.实验发现在一定配比的HF酸和NH4Cl溶液中,腐蚀深度和腐蚀时间呈线性关系,并且二氧化硅和ZnO的腐蚀速率得到很好的控制,这对器件制备的可靠性非常重要.电流-电压(I-V)特性测试显示该器件结构具有明显的整流特性.室温下,在正反向偏压状态下都可用肉眼观察到电致发光现象.同时,通过与光致发光谱进行比较,对电致发光谱中发光峰的起源和发光机制进行了探讨.     

InGaN/GaN多量子阱LED电致发光谱中双峰起源的研究

研究了MOCVD生长的具有双发射峰结构的InGaN/GaN多量子阱发光二极管(LED)的结构和发光特性.在透射电子显微镜(TEM)下可以发现量子阱的宽度不一致,电致发光谱(EL)发现了位于2.45eV的绿光发光峰和2.81eV处的蓝光发光峰.随着电流密度增加,双峰的峰位没有移动,直到注入电流密度达到2×104 mA/cm2时,绿光发光峰发生蓝移,而蓝光发光峰没有变化.单色的阴极荧光谱(CL)发现绿光发射对应的发光区包括絮状区域和发光点,而蓝光发射对应的发光区仅包含絮状区域.通过以上的结果,我们认为蓝光发射基本上源于InGaN量子阱发光,而绿光发射则起源于量子阱和量子点的发光.     

Valence-band discontinuities between InGaN and GaN evaluated by capacitance-voltage characteristics of p-InGaN/n-GaN diodes

Valence-band discontinuities between InGaN and GaN were evaluated using the capacitance-voltage characteristics of p-InGaN/n-GaN heterojunction diodes with high hole concentrations in p-InGaN. This capacitance-voltage method is effective to evaluate valence-band discontinuities because the influence of the piezoelectric charges at the heterojunction is ignored due to high acceptor concentrations. The built-in potential obtained from the capacitance-voltage measurements decreased with the In mole fraction of p-InGaN. This result indicates that the valence-band discontinuity (ΔE_V) increases with the In mole fraction (x) and is expressed as ΔE_V (eV)=0.85x for x≤0.28. The ΔE_V value obtained in this work is about 50% lower than that reported previously using the photoluminescence (PL) method.     

Exciton wavefunction coupled surface plasmon resonance for In-rich InGaN film with perforated aluminum cylindrical micropillar arrays

The optical characterization of excitons coupled with surface plasmon resonance (SPR) for InGaN/GaN heterostructures with perforated cylindrical micropillar arrays is investigated. We analyze the optical characteristics of excitons coupled with SPR for InGaN/GaN heterostructures with perforated cylindrical micropillars, as shown in measurements of the photoluminescence (PL) spectra over a broad range of temperatures between 20 and 300 K. From the temperature-dependent PL spectra, we observe the better SPR coupling effects, resulting in less carrier confinement in the InGaN energy band. The magnitude of the redshift of the emission peak shown by the sample with the coated aluminum (Al) pattern is larger than that shown by the sample with no metal film. This was due to the presence of more exciton coupling surface plasmons within the Al/InGaN interface. The enhancement of the PL intensity of the sample with the deposited Al pattern film can be attributed to a stronger SPR coupling interaction with the excitons. The experimental results indicate that a perforated Al cylindrical micropillar array can significantly affect carrier confinement, enhancing the quantum efficiency of Al/In-rich InGaN heterostructures due to the interaction of the SPR coupling effect between the InGaN quantum dot-like region and the Al film.     

Defect-related luminescence of GaN:Zn films thermally treated in a radio-frequency ammonia plasma

The effect of thermal annealing in nitrogen radicals obtained by the treatment of NH₃ in a radio-frequency discharge on the luminescence properties of GaN:Zn films grown by MOCVD/hydride epitaxy on sapphire (0001) substrates is investigated. As the thermal treatment temperature was increased, a steady weakening of the violet (2.88 eV) and near-edge (3.48 eV) photoluminescence bands was observed. As a result of the thermal treatment in nitrogen radicals at 500–750°C, new bands that peaked at 3.27 and 3.42 eV were detected; the intensities of these bands increased with increasing treatment temperature. The mechanism of formation and the origin of all the bands are analyzed comprehensively. It is found that the luminescence bands at 2.88, 3.42, and 3.27 eV are characteristic of the GaN films obtained by practically each technology and are associated with the simple structural defects. The participation of O in the formation of the band at 3.42 eV is proved experimentally.     

Growth of InxGa(1−x)N compound semiconductors and high-power InGaN/AlGaN double heterostructure violet-light-emitting diodes

In_xGa(_1−x)N films were grown on GaN films with an indium mole fraction x up to X = 0.33 at temperatures between 720°C and 850°C. The growth rate of InGaN films had to be decreased sharply to obtain high-quality InGan films when the growth temperature was decreased. Band-gap energies between 2.67 eV and 3.40 eV obtained by room-temperature photoluminescence measurements fit quite well to parabolic forms previously obtained by Osamura et al. on the indium mole fraction x assuming that the band-gap energies for GaN and InN are 3.40 and 1.95 eV, respectively. High-power InGaN/AlGaN double-heterostructure violet-light-emitting diodes were fabricated. The typical output power was 1000 μW and the external quantum efficiency was as high as 1.5% at a forward current of 20 mA at room temperature. The peak wavelength and the full width at half-maximum of the electroluminescence were 380 nm and 17 nm, respectively.     

InGaN/GaN light emitting diodes activated in O2 ambient

Mg-doped GaN epitaxial layers were annealed in pure O₂ and pure N₂. It was found that we could achieve a low-resistive p-type GaN by pure O₂ annealing at a temperature as low as 400°C. With a 500°C annealing temperature, it was found that the forward voltage and dynamic resistance of the InGaN/GaN light emitting diode (LED) annealed in pure O₂ were both smaller than those values observed from InGaN/GaN LED annealed in pure N₂. It was also found that an incomplete activation of Mg will result in a shorter LED lifetime     

Characterization of undoped and silicon-doped InGaN/GaN single quantum wells

We investigated the influence of doping and InGaN layer thickness on the emission wavelength and full width at half maximum (FWHM) of InGaN/GaN single quantum wells (SQW) of thicknesses between 1 nm and 5 nm by temperature and intensity resolved photoluminescence (PL). The crystalline quality of the GaN claddings was assessed by low temperature PL. The emission energy of 5 nm Si doped SQW could be tuned from 3.24 eV to 2.98 eV by reducing the deposition temperature. An increase of piezoelectric (PE) field screening with increasing deposition temperature is attributed to an increase of the SiH₄ decomposition efficiency. Piezoelectric (PE) fields between 0.5 MV/cm and 1.2 MV/cm in undoped structures of varying SQW thicknesses were calculated. Two activation energies of 15 meV and 46 meV of the SQW emission could be observed in temperature resolved measurements. The higher value was assigned to the confined exciton binding energy, whereas the activation energy of 15 meV is probably due to a decrease in carrier supply from the absorption zone in the GaN cladding into the SQW.     

Effect of Annealing on Luminescence of InGaN/GaN Structures Etched by a Focused Ion Beam

Semiconductors - The effect of annealing temperature and time on the luminescence intensity of the InGaN/GaN heterostructure subjected to ion beam etching was studied. We show that annealing at a...     

Shallow–Deep InGaN Multiple-Quantum-Well System for Dual-Wavelength Emission Grown on Semipolar ($$ 11\bar{2}2 $$) Facet GaN

We report growth and characterization of a shallow–deep InGaN/GaN multiple-quantum-well (MQW) system for dual-wavelength emission grown on semipolar (11[`2]2 11\bar{2}2 ) facet GaN. Structural and optical properties of the InGaN multiple-quantum-well system were investigated by scanning electron microscopy (SEM), cross-sectional scanning transmission electron microscopy (XSTEM), photoluminescence (PL), photoluminescence excitation (PLE), and time-resolved photoluminescence (TRPL) measurements. Cross-sectional transmission electron microscopy (XTEM) revealed that the growth rate of the InGaN well layers on the (0001) flat top microfacet (~500 nm) was about six times as fast as on the (11[`2]2 11\bar{2}2 ) inclined facet, whereas the growth rate of GaN barrier layers on the (0001) flat top facet was roughly 4.5 times as large as that on the (11[`2]2 11\bar{2}2 ) facet. A room-temperature PL spectrum showed dual-wavelength light emission of the shallow–deep InGaN multiple-quantum-well system situated at 2.720 eV (455 nm) and 2.967 eV (418 nm). The Stokes shifts between the two PL peaks and the two “effective bandgaps” were ~260 meV in energy for the deep quantum wells and ~233 meV for the shallow quantum wells. The TRPL decay demonstrated the short radiative recombination lifetime on the order of several nanoseconds in the InGaN MQW system. Realization of the shallow–deep InGaN multiple-quantum-well system with emission wavelength controllability would be useful to achieve III-nitride-based multicolor light-emitting devices for displays.     

MOCVD生长的InGaN薄膜的离子束背散射沟道及其光致发光

采用MOCVD技术以Al2O3为衬底在GaN膜上生长了InGaN薄膜.以卢瑟福背散射/沟道（RBS/Channeling）技术和光致发光（PL）技术对InxGa1-xN/GaN/Al2O3样品进行了测试,获得了合金层的组分、厚度、元素随深度分布、结晶品质及发光性能等信息.研究表明生长温度和TMIn/TEGa比对InGaN薄膜的In组分和生长速率影响很大.在一定范围内,降低TMIn/TEGa比,InGaN膜的生长速率增大,合金的In组分反而提高.降低生长温度,InGaN膜的In组分提高,但生长速率基本不变.InGaN薄膜的结晶品质随In组分的增大而显著下降,InGaN薄膜的In组分由0.04增大到0.26,其最低沟道产额比由4.1%增至51.2%.InGaN薄膜中In原子易处于替位位置,在所测试的In组分范围,In原子的替位率均在98%以上.得到的质量良好的In0.04Ga0.96N薄膜的最低产额为4.1%.研究结果还表明用RBS技术和光致发光技术测定InGaN中In组分的结果相差很大,InGaN的PL谱要受较多因素影响,很难准确测定In组分,而以RBS技术得到的结果是可靠的.     

纳米柱InGaN/GaN多量子阱的干法刻蚀制备技术

纳米柱GaN基多量子阱(MQW)拥有量子尺寸效应以及应变释放等特性,对于提高GaN基发光二极管(LED)的发光效率具有重要意义.采用快速热退火(RTA)形成的自组装Ni纳米颗粒作为刻蚀掩膜,利用电感耦合等离子体反应离子刻蚀(ICP-RIE)制备纳米柱InGaN/GaN MQW.通过改变RTA温度发现在800℃以上才能有效形成Ni纳米颗粒掩膜.不同的ICP和射频(RF)功率条件下制备的纳米柱MQW光致发光强度相比于相同结构的平面MQW会发生显著变化.通过优化ICP-RIE的刻蚀条件,可以获得发光强度显著提高的纳米柱MQW结构.同时,纳米柱MQW中压电极化场的减弱会形成光致发光峰位蓝移.