一种高精度阈值可调过温保护电路的设计

设计了一种高精度阈值可调过温保护电路。该电路利用与温度无关的电压和一个具有负温度系数的电压相比较,实现温度的检测。通过基准分压得到高、低阈值电压可调的迟滞比较器,具有较高的精度。基于0.18μm BCD工艺模型,利用Hspice软件对电路进行仿真。仿真结果表明,在典型应用下,当温度高于150.5℃时,过温保护电路输出高电平,关断电路;当温度低于130.5℃时,电路重新开启,具有20℃迟滞量。在3~5.5 V电源电压范围内,过温电压阈值和迟滞温度最大偏移量小于0.02℃。     

一种新型过温保护电路

采用CSMC 0.5 μm工艺,设计了一种新型过温保护电路.从检测温度和控制温度两方面考虑,通过优化电路结构,提出一种新型系统解决方案.在不引入热振荡的前提下,实现稳定电路温度和输出关断信号的双重功能.采用Cadence的Spectre仿真器进行仿真,结果表明,温度在-50～200℃时,PTAT电压以10.5 mV/℃变化,过温保护开启温度为105℃,具有滞迟功能.成功流片后对芯片进行测试,结果显示,在20～130 ℃内,PTAT电压灵敏度约为10 mV/℃,过温保护开启温度的实测值与仿真值的偏差小于3℃,滞迟范围为20℃.该保护电路是开关电源IP的重要组成部分,在设计过程中时刻考虑其工艺健壮性和可重用性的约束条件,确保其可移植性.     

一种用于马达驱动芯片的新型过温保护电路

为简化电路结构,提高精度和降低功耗,提出了一种新型过温保护电路。该电路无需基准电压和比较器,利用PTAT电流源的正温度系数特性,对温度进行检测,同时设计迟滞回路,避免了热震荡的发生。基于HHNEC的0.35μm BCD工艺实现,在电源电压为3V~5.5V下进行测试结果表明,该电路热关断温度为165℃,温度迟滞量为15℃,误差为1℃,与仿真结果一致,可以广泛应用于功率集成芯片中。     

一种高精度过温保护电路的设计

设计了一种高精度的过温保护电路。利用晶体管基极和发射极的负温特性实现温度检测,通过将检测点电压和设定的电压相比较,检测是否过温。由于使用了一个高、低阈值可调的高精度滞回比较器,并且阈值电压点电压由与温度无关的带隙基准提供,因此实现较高的精度和可靠性。通过Cadence Spectre工具基于某公司0.35μm CMOS工艺进行了仿真验证。该设计具有20℃温度迟滞,热关断点为125℃,热开启点为105℃,在3~5.5 V的电压范围内,热关断点和热开启点温度最大漂移不超过0.4℃。     

基于迟滞比较器的过热保护电路设计

为了防止芯片过热,提高芯片可靠性和稳定性,采用0.5μm CMOS工艺,设计了一种具有迟滞比较器的过热保护电路。由于采用了折叠式运放,使得比较器输入范围更大,灵敏度和迟滞性能更好。利用Cadence Spectre仿真工具对电路进行了仿真,结果表明电源电压为4.5～7 V时,过温保护阈值变化量极小,表现出输出信号对电源的良好抑制。当温度超过130℃时,输出信号翻转,芯片停止工作;温度降低至90℃时,芯片恢复工作。此电路可以通过调整特定管子的尺寸而控制两个阈值电压的大小,从而避免热振荡的发生。     

投影机高精度过温保护电路的设计

基于UMC 0.25μm BiCMOS工艺,设计了一款投影机过温保护电路。利用三极管BE结电压的负温度特性实现温度的检测,与传统的过温保护电路不同,该保护电路巧妙地利用比较器的内部正反馈实现热滞回,提高了迟滞的精确度。HSPICE仿真结果表明,该电路能很好地抑制电源电压变化造成的热关断和迟滞阈值点的漂移,性能稳定、可靠。电路能在温度过高时准确地将系统关断,达到保护光源和液晶板的目的,最大限度地保证了投影机的使用寿命。     

一种高灵敏度过温保护电路的设计

提出了一种应用于LED驱动器的过温保护电路。该电路的温度检测模块通过调节电流镜两条支路上的电阻比值来提高温度系数,输出级采用共源共栅结构,具有温度系数高、受工艺参数变化影响小、电压稳定好等优点。基于CSMC 0.5 μm CMOS工艺,采用Hspice软件对电路进行仿真,结果表明,温度检测模块的工作范围为－45 ℃~135 ℃,CTAT输出电压线性度良好,最大偏差小于2%。当电源电压为5 V时,负温度系数达到11.2 mV/℃,温度感应转变时间小于20 ns;该过温保护电路能较好地抑制电源电压波动引起的阈值点漂移,其漂移系数仿真值小于2.5 ℃/V。     

一种用于马达驱动芯片的过热保护电路

设计了一种应用于马达驱动芯片的过热保护电路。该电路主要由使能电路、基准电压源、温度检测电路、比较输出电路四部分组成。其中,温度检测电路利用PNP晶体管的发射极-基极电压具有负温度系数的特点;为了防止热振荡发生,比较输出电路采用具有磁滞功能的电压比较器。HSPICE仿真结果表明,该电路温度灵敏度高,关闭和开启温度点受电源的影响很小。     

0.6m CMOS过温保护电路设计

采用CSMC5V0.6μm标准CMOS工艺设计研制了一种过温保护电路。该电路由三部分构成:PTAT(与热力学温度成正比)电压产生电路,带隙基准源电路和比较器电路。芯片测试结果表明在30～130℃温度范围内PTAT输出电压线性度良好(最大偏差小于1.6%),灵敏度约为10mV/℃;关断温度可由外接电阻设定,85℃以下实测值与设定值偏差小于5℃,85℃以上偏差稍大约为10℃。该过温保护芯片电路结构简单、面积小、功耗低,且具有良好的移植性,可广泛应用于LED照明驱动电路,电源管理芯片等场合,也可用于和MOS功率器件混合封装组成带过温保护的功率器件模块。     

一种高精度过温保护电路的设计

基于UMC 0.25um BCD工艺,设计了一款高精度过温保护电路。通过基准电路中三极管的基极-发射极电压的负温度特性实现温度检测,调节电阻的比值产生迟滞温度量,避免了电路热振荡现象。经过HSPICE仿真验证,电路在温度130℃时,过温保护信号发生翻转,关断芯片,待温度降低到99℃时再次开启,具有31℃迟滞量。在电源电压变化时,过温保护电路的过温阈值和迟滞温度量偏差最大仅为0.24℃。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.