MEMS领域中微结构机械参数在线测量方法的研究和进展

对微机电系统(MEMS)领域中微结构机械参数的在线测量方法研究和发展状况进行了论述。首先介绍了在线测量微结构机械参数的目的和意义,随后列举了几种在线测量机械参数的方法,包括静态偏转法、静态伸缩法、动态法等;对悬臂梁法进行了重点介绍,包括其研究发展的历史、现状、发展趋势、分析模型和新近取得的主要进展等。最后对在线测量微结构机械参数的方法进行了总结。     

MEMS加速度计微敏感结构的伽马辐照退化效应

抗辐射的微机电系统(MEMS)加速度计在航天飞行器和核工业中有着广泛应用。当前的研究主要集中在MEMS测控电路的抗辐射加固技术上,对MEMS微敏感结构的辐照退化机理还缺乏深入的认识。由于MEMS微敏感结构和测试电路必须工作在一起,目前研究的难点在于如何准确地辨别出MEMS敏感结构在整表中所贡献的辐照退化量占比,并基于微纳测量的方法辨析出其辐照退化机理。针对该问题,本文首先开发出了一种针对MEMS器件分部件的辐照退化测量技术,成功提取出MEMS敏感结构所产生的辐照退化量;然后采用专门制备的对照MEMS芯片和电学测试的方法来对其退化机理进行研究。测量结果发现：MEMS敏感结构的辐照退化并不来自于寄生电容层的充电效应或各类电阻参数变化效应,而主要来自于界面薄氧化层的充电效应。这些界面层俘获的电荷会对MEMS可动质量块产生一个附加的静电力从而导致MEMS加速度计的输出漂移。综上,本文基于微纳测量的手段明确推断出了MEMS敏感结构在电离辐照条件下的退化机理,为后续的MEMS器件抗辐射加固改进提供了重要的技术方向指导。     

基于24位置的MEMS惯性传感器快速标定方法

针对微惯性测量单元原始输出信息受零偏、标度因数、非正交误差等误差项干扰影响测量精度的问题,提出一种无需借助高精度转台的MEMS IMU快速原位标定方案。在分析MEMS惯性传感器输出特性的基础上建立传感器误差模型,利用六面体夹具设计IMU 24位置连续转停标定方案,以重力及各次旋转角度为参考信息完成传感器误差标定。针对加速度计零偏、标度因数、非正交误差9个参数构造标定模型,采用牛顿法估计误差参数最优值,考虑陀螺仪零偏与标度因数6个误差参数,利用最小二乘法计算误差参数最优估值。分别进行加速度计、陀螺标定补偿实验,实验结果表明,提出的MEMS IMU快速原位标定方法能快速得到传感器误差参数,提高了输出数据精度。     

MEMS中几何量的测试方法

MEMS测试技术及方法是MEMS设计、制造、仿真及质量控制和评价的关键环节之一，讨论了应用于MEMS几何量测量的微视觉、扫描探针、光切、干涉、共焦、光栅投影等方法及基于材料和微结构特性的特殊测量方法，并详细论述了在MEMS微几何量测量中的微视觉检测原理及方法。结合干涉测量技术的微视觉测试方法能够涵盖从纳米级到毫米级的几乎全部的微几何量分布范围。     

压电薄膜特性参数的测量方法

随着电子元器件向微型、高灵敏、集成等方向发展,薄膜材料及器件在微机电(MEMS)系统中得到广泛应用,而测量压电薄膜特性参数的方法与体材料相比有很大的不同.介绍了当前测量压电薄膜特性参数的两大类方法:直接测量法(包括气腔压力法、悬臂梁法、激光干涉法和激光多普勒振动法)和间接测量法(传统阻抗分析法),详细分析了这些方法的基本原理、测试表征、应用状况及存在的问题,比较了这些方法的优缺点,并对未来压电薄膜特性参数的测试表征作了展望.     

MEMS和微流体分析系统的发展

微机电系统(MEMS)是在微电子及微机械等学科基础上发展起来的新兴多学科交叉研究领域，是当今科学技术最具潜力的发展方向之一，而微型流体分析系统是这一研究领域中的热点。本文综述了MEMS技术以及作为MEMS技术一个重要研究方向的微型流体分析系统的起源及其广阔的市场应用前景．并对MEMS产品的市场化存在的问题进行了讨论。MEMS技术及微型流体分析系统的诞生必将对今后的化学、医学及生物学等领域的研究工作产生重大影响。     

一种基于间接标靶法的微小推力测量技术

提出了一种基于间接标靶法的微小推力的测量方法。对测量原理进行了分析。利用该测量方法对一系列利用微机械技术 (MEMS)制作的微喷管的性能进行了测量。给出了在不同燃烧室压强和喉部尺寸时 ,微喷管推力的测量结果 ,并与数值研究结果进行了比较     

微尺度下新型MEMS滤波器的研究

分析了MEMS共面波导结构,在MEMS共面波导的基础上设计了一种MEMS滤波器,研究了它的电磁学、热应力等微尺度效应.在这些微尺度条件下分析了器件的相关性能,这些参数为获取实际的MEMS滤波器提供了一些有意义的数据.若改变设计参数,可获取其它同类型的带阻、带通滤波器件,为无线通信中的MEMS器件研究在材料选择、器件设计等方面提供了一些理论依据及其实际经验.     

一种基于间接标靶法的微小推力测量技术

提出了一种基于间接标靶法的微小推力的测量方法.对测量原理进行了分析.利用该测量方法对一系列利用微机械技术(MEMS)制作的微喷管的性能进行了测量.给出了在不同燃烧室压强和喉部尺寸时,微喷管推力的测量结果,并与数值研究结果进行了比较.     

一种基于间接标靶法的微小推力测量技术

提出了一种基于间接标靶法的微小推力的测量方法。对测量原理进行了分析。利用该测量方法对一系列利用微机械技术(MEMS)制作的微喷管的性能进行了测量。给出了在不同燃烧室压强和喉部尺寸时,微喷管推力的测量结果,并与数值研究结果进行了比较。     

微机电系统(MEMS)的干涉测量方法的研究进展

目前大量的机械系统中应用了微电子机械设备，从而对微机电系统(MEMS)的测量提出了新的要求。现讨论了近几年MEMS主要的几种基于光干涉平台的位移和面形的测量方法。     

Silicon carbide MEMS for harsh environments

Silicon carbide (SiC) is a promising material for the development of high-temperature solid-state electronics and transducers, owing to its excellent electrical, mechanical, and chemical properties. This paper is a review of silicon carbide for microelectromechanical systems (SiC MEMS). Current efforts in developing SiC MEMS to extend the silicon-based MEMS technology to applications in harsh environments are discussed. A summary is presented of the material properties that make SiC an attractive material for use in such environments. Challenges faced in the development of processing techniques are also outlined. Last, a review of the current stare of SiC MEMS devices and issues facing future progress are presented     

Pseudorandom BIST for test and characterization of linear and nonlinear MEMS

In this paper we study the use of the pseudorandom (PR) technique for test and characterization of linear and nonlinear devices, in particular for micro electro mechanical systems (MEMS). The PR test technique leads to a digital built-in-self-test (BIST) technique that is accurate in the presence of parametric variations, noise tolerant, and has high-quality test metrics. We will describe the use of the PR test technique for testing linear and nonlinear MEMS, where impulse response samples of the device under test are considered to verify its functionality. Next, we illustrate and evaluate the application of this technique for linear and nonlinear MEMS characterization.     

SiC薄膜材料在MEMS中应用的研究进展

SiC材料具有极为优良的物理化学性能，以SiC材料替代传统Si材料制成的SiC微电子机械系统(MEMS)，克服了Si MEMS本身性能的局限性，可满足在高温、高腐蚀等极端条件下的应用。文章综述了近几年SiC薄膜在MEMS中应用的研究进展，详细讨论了薄膜的性能、主要制备方法及微机械加工技术在SiC MEMS的应用。最后，分别举例说明SiC薄膜材料在MEMS中作为保护层和结构层应用的研究现状。     

Nanotribology and nanomechanics of MEMS/NEMS and BioMEMS/BioNEMS materials and devices

The micro/nanoelectromechanical systems (MEMS/NEMS) need to be designed to perform expected functions typically in millisecond to picosecond range. Expected life of the devices for high speed contacts can vary from few hundred thousand to many billions of cycles, e.g., over a hundred billion cycles for digital micromirror devices (DMDs), which puts serious requirements on materials. For BioMEMS/BioNEMS, adhesion between biological molecular layers and the substrate, and friction and wear of biological layers may be important. There is a need for development of a fundamental understanding of adhesion, friction/stiction, wear, and the role of surface contamination, and environment. Most mechanical properties are known to be scale dependent. Therefore, the properties of nanoscale structures need to be measured. MEMS/NEMS materials need to exhibit good mechanical and tribological properties on the micro/nanoscale. There is a need to develop lubricants and identify lubrication methods that are suitable for MEMS/NEMS. Methods need to be developed to enhance adhesion between biomolecules and the device substrate. Component-level studies are required to provide a better understanding of the tribological phenomena occurring in MEMS/NEMS. The emergence of micro/nanotribology and atomic force microscopy-based techniques has provided researchers a viable approach to address these problems. This paper presents a review of micro/nanoscale adhesion, friction, and wear studies of materials and lubrication studies for MEMS/NEMS and BioMEMS/BioNEMS, and component-level studies of stiction phenomena in MEMS/NEMS devices.     

MEMS薄膜磁学特性的在线测试结构

为了能实时监控MEMS器件的一些重要指标,人们对器件包括热导率,断裂强度等材料的属性进行了深入研究。由于MEMS磁学特性的复杂性,对MEMS磁学特性在线测量研究得很少。本文分析了具有代表性的薄膜磁学特性测试结构的原理及优缺点,并结合MEMS在线测试的特点提出了一种比较适合MEMS在线测试的新结构。     

Failure mode analysis of MEMS suspended inductors under mechanical shock

Micro-electromechanical system (MEMS) suspended inductors have been widely studied in recent decades because of their excellent radio frequency performance. However, few studies have been performed on the failure analysis of MEMS suspended inductors under mechanical shock. In this study, the failure of MEMS suspended inductors with a planar spiral coil is investigated through analytical and experimental methods. We present a stress and deformation analysis to study the failure mode of the suspended inductors under shock. To verify the theoretical analysis, MEMS inductors are designed and fabricated, and shock tests are carried out. The shock tests show that the failure mode of the MEMS suspended inductors is a fracture that occurs at the ends of the inductor coil, and the test results agree with the theoretical analysis.     

基于计算机视觉的MEMS测试系统

根据MEMS测试的要求 ,设计并实现了一种基于计算机视觉的MEMS测试系统。该系统是一个典型的光、机、电、算集成的MEMS测试系统 ,已应用于MEMS微结构几何尺寸和动态特性等的测量。因采用了亚像元定位技术 ,系统具有较高的测量精度。应用表明该系统具有较好的灵活性和扩充性 ,测量速度快 ,测试简便 ,有较好的工程应用价值     

金刚石膜MEMS及其应用

由于金刚石膜优异的力学、电学、热学及化学性质,使其成为MEMS中的微型传感器和微型结构的重要的首选材料。利用金刚石膜作为MEMS材料和各种微型机械的技术正在引起极大的兴趣。本文主要综述了金刚石MEMS器件的技术和应用。     

Rare-earth-enabled universal solders for microelectromechanical systems and optical packaging

In packaging of microelectromechanical systems (MEMS), optical, and electronic devices, there is a need to directly bond a wide variety of inorganic materials, such as oxides, nitrides, and semiconductors. Such applications involve hermetic-sealing components, three-dimensional MEMS assembly components as well as active semiconductor or optical components, dielectric layers, diffusion barriers, waveguides, and heat sinks. These materials are known to be very difficult to wet and bond with low melting-point solders. New Sn-Ag- or Au-Sn-based universal solders doped with a small amount of rare-earth (RE) elements have been developed, which now allow direct and powerful bonding onto the surfaces of various MEMS, optical, or electronic device materials. The microstructure, interface properties, and mechanical behavior of the bonds as well as the potential packaging applications of these new solder materials for MEMS and optical fiber devices are described. Various packaging-related structural, thermal, or electrical issues in MEMS are also discussed.