轧膜成形制备W-Cu层状功能梯度材料及其性能研究

以W粉和电解Cu粉为原料,聚乙烯醇缩丁醛(PVB)为粘结剂,通过有机基轧膜工艺制备出3种组成的单层生坯(Cu质量分数分别为25%、50%、75%),再叠层共轧,制备出了具有不同粘结剂含量的W-Cu层状梯度材料生坯,之后在H2气氛中烧结,获得了W-Cu层状梯度材料,考察了粘结剂含量与制备工艺条件对材料显微组织和性能的影响。结果表明,通过单层轧制、叠层共轧共烧可以制得层状梯度W-Cu复合材料;粘结剂含量对W-Cu层状梯度材料的致密度和性能有着明显的影响。当粘结剂质量分数为6%时,轧膜坯有较好的成形性,且成形坯的孔隙率较低;所得多层生坯经1 150℃烧结后相对密度达93.11%;所得梯度W-Cu材料有良好的物理、力学性能。     

钨铜复合材料的现状与发展

高导电导热性铜与高温强度、强抗电弧烧蚀钨的良好结合使钨铜复合材料具有一系列优异性能,广泛应用于电接触材料、电子封装和热沉材料。简要介绍了当前钨铜复合材料的应用、制备技术和致密化方法,阐述了钨铜复合材料的研究进展,指出了今后的应用发展前景。     

W-Cu材料室温强度和组织均匀性的影响因素

用浸透法对孔隙度为12%～17%的烧结钨进行了渗铜试验 ,研究了影响低铜含量的W -Cu材料室温бb及渗铜组织均匀性的因素 ,研究结果表明 ,铜对钨骨架的强化和韧化机制对提高W -Cu材料的室温бb 有重要作用 ;钨骨架具有合适的孔隙度是W -Cu材料获取均匀一致的渗铜组织的重要条件。     

钎焊温度和热处理对钨铜连接性能的影响

采用厚20 μm的非晶态Ti-Zr-Ni-Cu钎料,真空钎焊连接用于聚变堆面向等离子体部件的钨和铜铬锆合金,钎焊温度分别为860、880和900℃,对880℃下的钎焊样品进行热等静压(HIP)处理.采用SEM和EDS分析连接接头的形貌和成分,用静载剪切法测量焊接接头强度.测试结果表明在860～880℃下钎焊10 min能够获得较好的连接界面,经880℃钎焊后焊接接头的剪切强度为16.57 MPa,880℃钎焊后HIP处理的试样界面结合强度提高至142.73 MPa,说明真空钎焊后HIP处理可以显著改善接头的结合强度.     

W-Cu(Mo-Cu)复合材料的研究进展

W-Cu或Mo-Cu两相复合材料具有较高的导热性和较低的热膨胀系数,在大功率器件中被视为一种很好的热沉材料。近年来,有关W-Cu或Mo-Cu作为电子热沉材料的研究在国内外已有一些报道。作者主要就近几年钨铜复合材料研究的几个主要热点问题进行综述报道。分析认为,梯度结构功能材料、纳米结构材料以及注射成形工艺在钨铜复合材料领域中的应用是当今钨铜电子材料发展的主要方向,同时对国内外最新研究进行了归纳总结,指出了今后发展的主要动向。     

The effects of ultrasonic vibration on mechanical properties of tungsten particle-reinforced copper-matrix composites

W-Cu micro-powder mixtures usually have poor sinterability due to the relatively low solubility of W in both solid and liquid Cu. In fabricating W-Cu composites, an electroless copper plating process is often used to coat Cu on the W particle surface prior to the sintering process. Due to their small size W particles tend to agglomerate during the plating process, hence the individual particle may not be properly coated with Cu. In this study, ultrasonic vibration is applied in the electroless plating process to break up the agglomerations and restrain the powders from gathering, ensuring a uniform deposition of the Cu on individual W particle. W-Cu composite samples containing pure Cu and 6, 9 and 12 wt-% of Cu-coated W particles, respectively, are fabricated using a standard powder metallurgy technique. It is shown that the application of ultrasonic vibration in the activation and deposition steps of the electroless copper plating process prevents W powder agglomeration and ensures that each W particle is coated with Cu. As a result, the mechanical properties of the W-Cu composites are significantly improved. It is found that the optimal tensile strength and yield strength are obtained using a W reinforcement phase content of 9 wt-%.     

成形压力与粉末粒径对钨铜复合材料烧结性能的影响

为进一步提高钨铜合金的致密度和简化制备工艺,研究了粉末粒度与成形压力对无压烧结制备的W-15Cu复合材料致密度的影响.发现随着球磨时间延长,钨铜粉末发生明显的细化和圆化,粉末分布更为均匀,烧结活性有较大提高,合金性能更加优异,组织结构更加良好,致密度相应提高.通过对烧结试样密度和铜含量的测定,得到不同成形压力下材料致密度和铜含量随烧结温度的变化曲线,发现随着成形压力增大,材料的烧结致密度升高,铜流失的现象得到一定的控制.     

钨铜材料应用和生产的发展现状

介绍了钨铜材料目前主要的应用领域、使用特点及其在钨铜材料中所占的份额。叙述为满足钨铜材料新的应用在制取工艺上的研究发展情况。     

镍基双合金扩散偶的拉伸性能研究

采用热等静压(HIP)扩散连接工艺,获得了镍基单晶高温合金与粉末高温合金的扩散偶。研究了热等静压和热处理工艺对扩散偶的组织和拉伸性能的影响。结果表明,不同温度热等静压的扩散偶均实现了冶金结合,瞬时拉伸断口位置处于DD402侧,断裂面为{111}滑移面。随着HIP温度升高,DD402母材的γ′相粒子粗化,FGH95粉末合金母材的再结晶晶粒长大;1 166℃HIP扩散偶热处理后,FGH95粉末合金的γ′相由晶界大尺寸γ′相、晶粒内中等尺寸的和细小的γ′相组成。扩散偶试样的650℃抗拉强度受HIP温度影响小,而屈服强度随着HIP温度升高而降低。     

钨铜复合材料研究的新进展

介绍了近年来国内外钨铜复合材料在新品种开发上的进展 ,如梯度钨铜材料、纳米钨铜材料等。为了开发这些钨铜新材料 ,叙述了相应的制取工艺上的发展 ,且概述了钨铜复合材料的主要应用及具有应用潜力的领域。     

热等静压原位合成SiC–TiC复相陶瓷的微观组织与性能研究

采用纳米级β-SiC粉末、Si粉末、C粉末以及微米级TiH_2粉末为原料,利用热等静压原位合成工艺制备了SiC–TiC复相陶瓷,研究了不同原位合成反应和烧结工艺对复相陶瓷微观组织及力学性能的影响。结果表明:以SiC、TiH_2、C粉末为原料的原位合成反应,无明显副反应发生,更有益于制备成分符合预期、致密度良好且性能优秀的SiC–TiC复相陶瓷。在1600℃,120 MPa,4 h等静压烧结工艺下原位合成得到的体积分数为SiC–32%TiC复相陶瓷具有最好的致密度、硬度、三点弯曲强度以及良好的断裂韧性,分别达到98.7%、21.2 GPa、428 MPa和5.5 MPa·m1/2。提高热等静压压力有助于提高材料的烧结扩散活性,从而提高材料的致密度,有益于力学性能的提升。     

Ti6Al4V和Al2A12的扩散连接界面组织及力学性能

采用热等静压(HIP)工艺连接Al12A12和Ti6Al4V两种不同的航空航天用材料.利用扫描电镜、能谱仪和X射线衍射仪观察连接过渡区的微观组织和组成的演化,并测试其主要的力学性能.结果表明:采用热等静压制备这两种材料的界面连接好;Ti/Al反应层界面处形成了不同的金属间化合物,例如,Al₃ Ti、TiAl₂和TiAl;连接接头处硬度为163 HV,界面连接处剪切强度达到了23 MPa,比只添加镀层而无中间层的连接强度提高了约17.9%,但低于带有中间层的连接强度.由于过烧和孔隙的形成使得断裂方式是脆性断裂.由此可知,在热等静压成形过程中异种材料的元素发生了相互扩散,在扩散连接处形成了不同的金属间化合物,这些金属间化合物影响连接处的力学性能.      

钨粉粒度及预混合原料配比对渗铜方法制备W-Cu合金性能的影响

通过选择不同粒度的原料钨粉,采用预混合部分铜粉然后渗铜的方法制备一系列不同铜含量的W-Cu合金。研究了原料钨粉的粒度和预混合铜粉的配比对获得的W-Cu合金的成分,性能,组织等方面的影响及其规律。     

A model for the thermal properties

Thermal properties are important to several applications for powder metallurgy products. For example, liquid-phase sintered tungsten-copper composites are used in microelectronic packaging to obtain a high thermal conductivity in a low thermal expansion material. This article addresses modeling the thermal properties for composites fabricated by liquid-phase sintering. A computational cell is constructed with interlinked phases, consisting of a core of low thermal expansion material (tungsten) and a edge network of high thermal conductivity phase (copper). This structure is used to calculate the composition effects on the coefficients of thermal expansion and thermal conductivity. The results are applied to prior reports on W-Cu and used as a basis to identify several candidate high thermal conductivity systems for future development.     

Parametric studies of the hot isostatic pressing of rapidly solidified 304 stainless steel powder

The increasing importance of powder materials fabrication by use of hot isostatic pressing (HIP) has led to recent emphasis on analytical techniques for describing and understanding the process. Understanding of particle consolidation during the HIP process has been attempted through the modelling of densification behavior by considering the deformation of a representative particle due to forces transmitted through the particle contacts. However, the properties of HIPed material have not been thoroughly investigated in terms of their deformation maps and HIP parameters. Mechanical properties of a compact can be quite different depending on the location of various deformation map boundaries. Diffusional creep is involved not only in densification but also in bonding at particle contacts. HIP pressure increases mechanical contact and enhances density but not particle bonding per se. Discrepancies between experimental and calculated data points for shorter HIP times may have been affected by oxide film layer on the original powder.     

钨铜材料的生产、应用与发展

简单介绍了钨铜材料应用的发展概况,并以日本近20年钨铜合金生产及应用的发展具体数据说明钨铜材料的发展趋势。评述了钨铜材料各主要应用的特点和要求以及近期钨铜材料生产工艺的重要进展。最后简单评估了国内钨铜材料应用、生产和发展的现状和提出今后发展的建议。     

Effect of Copper Coating and Reinforcement Orientation on Mechanical Properties of LM6 Aluminium Alloy Composites Reinforced with Steel Mesh by Squeeze Casting

Uncoated and copper coated steel wire mesh reinforcing LM6 aluminium alloy composites have been produced using squeeze casting process by varying reinforcement orientation viz., 0°, 45° and 90° respectively. Microstructure of the castings has been examined and mechanical properties such as hardness, tensile strength and ductility have been investigated. Fracture surface of tensile specimens has been analysed using field emission scanning electron microscope. Microstructure of samples reveals that copper coating on steel wires improves the interface bonding between matrix and reinforcement. Average hardness values of 259 and 90 Hv have been observed in steel wire and matrix respectively. Tensile strength of composites increases with increasing angle of reinforcement orientation from 0° to 90°. Tensile strength increases up to 11% by reinforcing copper coated steel wire mesh at 90° orientation as compared to LM6 aluminium alloy. Fracture surface of composites shows pullout of steel wires in uncoated steel wire mesh composites and broken wires in copper coated steel wire mesh composites respectively. Dimples have been observed on the fracture surface of LM6 aluminium alloy. In general, copper coated steel wire mesh composites offer better hardness and tensile strength compared to uncoated steel wire mesh composites and LM6 aluminium alloy. This may be attributed to the copper coating on steel wires which results better interface bonding between matrix and reinforcement.     

高界面结合强度铜/钼/铜叠层复合材料的制备研究

采用非平衡态的高能铜离子注入技术,对钼芯材表面进行改性并一次覆铜形成过渡铜层,将原本不固溶的的钼/铜界面转化为铜/铜界面,制得高界面结合强度的铜/钼/铜叠层复合材料;采用近终形的热等静压复合技术进行二次覆铜,结合小变形量冷轧工艺进行复合板材精整,降低各层协同变形量,保证了叠层复合材料的板形、芯层质量、表面粗糙度及平行度。本方法所制备的铜/钼/铜叠层复合材料具有界面结合强度高、板形良好、芯层质量好且平行度好的优点,可作为一种电子封装材料或热沉材料应用于电子、信息技术领域。     

热等静压TiC_p/30CrNi4Mo钢基复合材料的组织与性能

采用球磨与热等静压相结合的方法制备TiC_p/30Cr Ni4Mo钢基复合材料,研究材料的显微组织、密度、硬度、常温和高温拉伸性能以及摩擦磨损性能。结果表明,TiC_p/30Cr Ni4Mo钢基复合材料的组织均匀细小,基体组织主要为细片状珠光体、铁素体和少量残余奥氏体,Ti C颗粒弥散分布在基体上,与基体结合牢固;复合材料的相对密度高达99.7%,硬度为49 HRC,抗拉强度高达1 266 MPa,伸长率为4.0%;复合材料具有较好的高温力学性能,400℃时复合材料抗拉强度仍高达1 135 MPa;在200 N载荷条件下,复合材料的耐磨损性能较原30Cr Ni4Mo材料提高约4倍,磨损形式主要表现为轻微的磨粒磨损;复合材料经950℃水淬和520℃回火后,抗拉强度高达1 325 MPa,伸长率为4.6%。     

Solid-phase sintering of ultrafine W(Mo)-Cu composite powders

Conclusions The solid-phase sintering of W-Cu composites can be markedly intensified by using ultrafine starting powder charges, the degree of intensification being a maximum with charges produced by reduction of oxide mixtures subjected to prior annealing in air. In this way it is possible to obtain virtually nonporous W-Cu composites with copper contents of 10–35%. The composition dependence of shrinkage in the solid-phase sintering of ultrafine W(Mo)-Cu powder composites is nonmonotonic in character. An anomaly is observed which would appear to be linked with the phenomenon of zonal isolation.Translated from Poroshkovaya Metallurgiya, No. 1(253), pp. 19–25, January, 1984.