Electrical and Photoluminescence Studies of {LT-GaAs/GaAs:Si} Superlattices Grown by MBE on (100)- and (111)A-Oriented GaAs Substrates

Semiconductors - The results of studying semiconductor structures proposed for the first time and grown, which combine the properties of LT-GaAs with p-type conductivity upon doping with Si, are...     

Terahertz Emission from GaAs Films on Si(100) and Si(111) Substrates Grown by Molecular Beam Epitaxy

We report on the terahertz emission from femtosecond-laser-irradiated GaAs layers grown on Si(100) and Si(111) substrates. The results show that the terahertz emission from GaAs on Si is stronger than that of a semi-insulating bulk GaAs crystal. This increase is attributed to the strain field at the GaAs/Si interface. In the GaAs of the Si(100) sample, the stronger terahertz emission is observed compared with GaAs on Si(111). Moreover, the effect of changing the doping type of the Si substrate from n-type to semi-insulating was also studied and it was found that the terahertz emission intensity of GaAs on semi-insulating Si(100) is stronger than that of GaAs on n-type Si(100). Finally, strong terahertz emission from GaAs on semi-insulating Si(100) was observed not only in the reflection geometry but also in the transmission geometry. These results hold promise for new applications of terahertz optoelectronics.     

(113)B和(100)面InAs/GaAs量子点光致发光光谱特性研究

利用分子束外延技术在(100)和(113)B GaAs衬底上进行了有/无AlAs盖帽层量子点的生长,测量了其在4～100 K温度区间的PL光谱。通过对PL光谱的积分强度、峰值能量和半高宽进行分析进而研究载流子的热传输特性。无AlAs盖帽层的(113)B面量子点的PL光谱的热淬灭现象可以由载流子极易从量子点向浸润层逃逸来解释。然而,有AlAs盖帽层的(113)B量子点的PL热淬灭主要是由于载流子进入了量子点与势垒或者浸润层界面中的非辐射中心引起的。并且其PL的温度依存性与利用Varshni定律计算的体材料InAs的温度依存性吻合很好,表明载流子通过浸润层进行传输受到了抑制,由于AlAs引起的相分离机制(113)B量子点的浸润层已经消失或者减小了。(100)面有AlAs盖帽层的PL半高宽的温度依存性与无AlAs盖帽层的量子点大致相同,表明在相同外延条件下相分离机制在(100)面上不如(113)B面显著。     

Influence of Substrate Misorientation on the Composition and the Structural and Photoluminescence Properties of Epitaxial Layers Grown on GaAs(100)

The influence of the degree of misorientation and treatment of a GaAs substrate on the structural and optical characteristics of homoepitaxial GaAs/GaAs(100) structures grown by metal–organic chemicalvapor deposition is studied. From the data obtained by a series of structural and spectroscopic techniques, it is shown that the degree of deviation of the substrate from the exact orientation towards the [110] direction by an angle of up to 4° brings about stepwise growth of the GaAs film in the initial stage and a further increase in the degree of misorienration towards the [110] direction to 10° results in an increase in the number of structural defects in the epitaxial film. At the same time, the samples of homoepitaxial structures grown by metal–organic chemical-vapor deposition on GaAs(100) substrates misoriented by 4° towards the [110] direction possess the highest photoluminescence efficiency; it is ~15% higher than the corresponding quantity for structures grown on precisely oriented GaAs(100) substrates. Preliminary polishing of the GaAs substrate (removal of an oxide layer) also yields the intensification of photoluminescence emission compared to emission in the case of an unpolished substrate of the same type. For samples grown on substrates misoriented by 4°, such an increase in the photoluminescence efficiency is ~30%.     

ZnO纳米棒与Si(111)和Si(100)衬底的外延关系(英文)

运用热蒸发技术在Si(111)和Si(100)基片上制备了ZnO纳米棒。SEM表征显示,ZnO纳米棒的直径约100nm,长度均匀,大约3μm;XRD表征发现ZnO纳米棒沿[0001]晶向择优生长。通过实验结果与理论分析得出:对于Si(111)基片上的样品,大部分ZnO纳米棒沿6个对称方向生长,而且与基片之间的夹角为54.7°,ZnO与Si(111)的外延关系为[0001]ZnO‖[114]Si,[0001]ZnO‖[4]Si,[0001]ZnO‖[141]Si,[0001]ZnO‖[4]Si,[0001]ZnO‖[411]Si,或[0001]ZnO‖[4]Si。对于Si(100)基片上的样品,大部分ZnO纳米棒沿4个对称方向生长,与基片之间的夹角为70.5°,其外延关系为[0001]ZnO‖[114]Si,[0001]ZnO‖[4]Si,[0001]ZnO‖[14]Si,或[0001]ZnO‖[14]Si。通过比较分析得出Si基片可以控制ZnO纳米棒的生长方向。     

分子束外延GaAs/Si应变层的光致发光和光反射谱研究

研究了分子束外延GaAs/Si光致发光谱的激发强度和温度依赖关系。确定出2个本征发光峰,分别对应于导带至m_J=±3/2和m_J=±1/2价带的复合。这种价带的移动和分裂归因于由GaAs和Si的热膨胀系数不同所引起的GaAs层双轴张应力。还观测到4个非本征发光峰,分别为导带至m_J=±1/2碳受主态发光、可能与缺陷有关的发光以及可能由Mn和Cu受主杂质引起的发光。室温下将GaAs/Si和GaAs/GaAs材料的光反射谱进行比较,前者明显向低能移动约8meV,观测到3个特征谱结构,与光致发光结果相一致。     

ZnSe薄膜的激子光谱

采用分子束外延 (MBE)技术 ,在 Ga As(1 0 0 )衬底上生长了厚度从 0 .0 4 5到 1 .4μm的 Zn Se薄膜 .X射线衍射谱证实 ,随着薄膜厚度的增加 ,应变逐步弛豫 .测量了低温下样品的反射谱和光致发光谱 ,观察到轻重空穴的能级在不同应变下的分裂、移动和反转 ,以及激子极化激元 (Po-lariton)对反射谱的影响 .也观察到束缚激子发光随着薄膜厚度的变化规律 :束缚在中性受主杂质上的束缚激子发光 (I1峰 )随着薄膜厚度的增加逐渐变弱直至消失 ,而束缚在中性施主杂质上的束缚激子发光 (I2 峰 )则随着厚度增加逐渐增强 .     

ZnSe薄膜的激子光谱

采用分子束外延(MBE)技术,在GaAs(100)衬底上生长了厚度从O.045到1.4μm的ZnSe薄膜.X射线衍射谱证实,随着薄膜厚度的增加,应变逐步弛豫.测量了低温下样品的反射谱和光致发光谱,观察到轻重空穴的能级在不同应变下的分裂、移动和反转,以及激子极化激元(Polariton)对反射谱的影响.也观察到束缚激子发光随着薄膜厚度的变化规律:束缚在中性受主杂质上的束缚激子发光(I1峰)随着薄膜厚度的增加逐渐变弱直至消失,而束缚在中性施主杂质上的束缚激子发光(I2峰)则随着厚度增加逐渐增强.     

Electron-Microscopy Studies of the Structure of Thin Epitaxial Ge2Sb2Te5 Layers Grown on Si(111) Substrates

Semiconductors - For the creation of memory cells of new generation, structurally perfect epitaxial Ge2Sb2Te5 (GST) layers and multilayered crystalline structures based on GeTe/Sb2Te3 superlattices...     

MBE生长轻掺硅GaAs材料光荧光谱杂质特性研究

采用低温光荧光谱测试方法，研究了ＭＢＥ生长的轻掺硅ＧａＡｓ材料的杂质特性，并结合Ｈａｌｌ测量结果，讨论了ＭＢＥ关键生长条件Ⅴ／Ⅲ束流比等对Ｓｉ在ＧａＡｓ中掺杂特性的影响，研究表明掺杂元素Ｓｉ在ＧａＡｓ中起两性（施主或受主）杂质作用，适当提高Ⅴ／Ⅲ束流比可以抑制Ｓｉ的自补偿效应，从而减小载流子的补偿度，进一步提高迁移率。通过优化生长条件，本实验已获得了杂质浓度小于１０１２ｃｍ－３，７７Ｋ下迁移率大于１．６×１０５ｃｍ２／Ｖ·ｓ的高纯、高迁移率ＧａＡｓ材料。     

Photoelectric Properties of GaN Layers Grown by Plasma-Assisted Molecular-Beam Epitaxy on Si(111) Substrates and SiC/Si(111) Epitaxial Layers

Semiconductors - The photoelectric properties of GaN/SiC/Si(111) and GaN/Si(111) heterostructures grown by plasma-assisted molecular-beam epitaxy under the same growth conditions on identical...     

Si基热氧化Si1-x-yGexCy薄膜的室温光致发光特性

采用等离子体增强化学气相淀积(PECVD)法在Si(100)衬底上淀积一层厚度约为170nm的富Ge高C含量的Si1-x-yGex/Cy薄膜,然后将其分别在800℃和1100℃下湿氧氧化20min.在室温下观测到强烈的光致发光.室温下的光致发光谱(PL谱)测量显示,800℃下氧化后的样品在370nm和396nm附近有两个光致发光带,1100℃下氧化后的样品只在396nm附近有一个光致发光带.396nm附近的发光带可归之于由氧化薄膜中的缺陷O-Si-O(Si20)或O-Ge-O(Ge20)引起的,而370nm附近的发光带与薄膜中Ge-C对发光中心有关.     

Structural and Spectroscopic Studies of Epitaxial GaAs Layers Grown on Compliant Substrates Based on a Superstructure Layer and Protoporous Silicon

Semiconductors - The purpose of the study is to investigate the effect of a new type of compliant substrate based on an AlGaAs superstructure layer (SL) and a protoporous Si (proto-Si) layer formed...     

Si基热氧化Si1-x-yGexCy薄膜的室温光致发光特性

采用等离子体增强化学气相淀积（ＰＥＣＤ）法在Ｓｉ（１００）衬底上淀积一层厚度约为１７０ｎｍ的富Ｇｅ高Ｃ含量的Ｓｉ、－ｘ－７ＧｅｘＣｙ薄膜，然后将其分别在８００℃和１１００℃下湿氧氧化２０ｍｉｎ。在室温下观测到强烈的光致发光，室温下的光致发光谱（ＰＬ谱）测量显示，８００℃下氧化后的样品在３７０ｎｍ和３９６ｎｍ附近有两个光致发光带，１１００℃下氧化后的样品只在３９６ｎｍ附近有一光致发光带，３９６ｎｍ附     

室温下脉冲激光沉积制备高取向度AlN薄膜

用脉冲激光沉积(PLD)方法,在p-Si(100)衬底上、室温下和不同N2氛围中制备了高度取向的AlN薄膜,并利用X射线衍射(XRD)仪、傅立叶变换红外(FTIR)光谱仪和扫描电子显微镜(SEM)对样品的特征进行了研究.结果表明,在从5×10-6～5.0 Pa的N2气压范围内,制备的薄膜都呈现h＜100＞晶向,并且随着气压的升高,样品的结晶度有明显的提高.另外,随着N2浓度的增大,Al-N键的结合度增强,AlN晶粒的尺寸增大,在样品表面出现杂散晶粒,薄膜的粗糙度增大.     

Si(111)衬底上GaN外延材料的应力分析

对Si(111)衬底上GaN外延材料的应力随着低温AlN插入层数的变化进行了分析研究。通过喇曼散射谱在高频E2(TO)模式下的测试分析发现,随着低温AlN插入层数的增加,GaN材料的E2(TO)峰位逐渐接近体GaN材料的E2(TO)峰位(无应力体GaN材料的E2(TO)峰位为568cm-1),计算得出GaN材料的应力从1.09GPa减小到0.42GPa。同时,使用室温光荧光谱进行了分析验证。结果表明,Si衬底上GaN外延材料受到的是张应力,通过低温AlN插入层技术可以有效降低GaN材料的应力,并且最终实现了表面光亮的厚层无裂纹GaN材料。     

High Quality Carbon Nanotubes on Conductive Substrates Grown at Low Temperatures

For carbon nanotubes (CNTs) to be exploited in electronic applications, the growth of high quality material on conductive substrates at low temperatures (<450 °C) is required. CNT quality is known to be strongly degraded when growth is conducted on metallic surfaces, particularly at low temperatures using conventional chemical vapor deposition (CVD). Here, the production of high quality vertically‐aligned CNTs at low substrate temperatures (350–440 °C) on conductive TiN thin film using photo‐thermal CVD is demonstrated by confining the energy required for growth to just the catalyst using an array of optical lamps and by optimizing the thickness of the TiN under‐layer. The thickness of the TiN plays a crucial role in determining various properties including diameter, material quality, number of shells, and metallicity. The highest structural quality with a visible Raman D‐ to G‐band intensity ratio as low as 0.13 is achieved for 100 nm TiN thickness grown at 420 °C; a record low value for low temperature CVD grown CNTs. Electrical measurements of high density CNT arrays show the resistivity to be 1.25 × 10^‐2 Ω cm representing some of the lowest values reported. Finally, broader aspects of using this approach as a scalable technology for carbon nanomaterial production are also discussed.     

Determination of Critical Thickness for Epitaxial ZnTe Layers Grown by Molecular Beam Epitaxy on (211)B and (100) GaSb Substrates

Cross-section electron micrographs, cathodoluminescence images, and confocal photoluminescence (cPL) images have been acquired for ZnTe layers deposited to various thicknesses on GaSb substrates with (211)B and (100) orientations. The critical thickness of ZnTe on GaSb is predicted to range between 115 nm and 329 nm, depending on the theoretical approach chosen. For ZnTe layers grown on (211)B GaSb with thickness exceeding 150 nm, dark spots and lines are present in all images. We associate these with dislocations generated at the ZnTe/GaSb interface. The discrepancy between this thickness value and a critical thickness value (350 nm to 375 nm) obtained for the (211)B orientation in a previous study is related to the distinction between the onset of misfit dislocations and the onset of significant plastic deformation. The former requires a direct imaging technique, as strain-related measurements such as x-ray diffraction do not have the resolution to detect the effects of small numbers of dislocations. For ZnTe layers on (100) GaSb, x-ray diffraction measurements indicate an abrupt change characteristic of dislocation multiplication at a thickness value in the range from 250 nm to 275 nm. High-resolution electron micrographs of the ZnTe/GaSb interface indicate that deoxidation using atomic hydrogen produces GaSb surfaces suitable for ZnTe epitaxy. cPL images of a 1.2-μm-thick lattice-matched ZnTe_0.99Se _0.01 layer grown on a 150-nm-thick ZnTe buffer layer on a (211)B GaSb substrate yield a threading dislocation density of ～7 × 10⁴ cm^?2.     

Correlation of Charge Buildup and Stress-Induced Leakage Current in Cerium Oxide Films Grown on Ge (100) Substrates

High-$kappa$ films are currently deposited on Ge substrates to compensate the mobility loss, as Ge offers higher mobility compared with that of silicon. This paper deals with the reliability characteristics of cerium oxide films grown by molecular beam deposition on n-type Ge (100) substrates. MOS capacitors with Pt gate electrodes were subjected to constant voltage stress conditions at accumulation. The correlation of the charge-trapping characteristics and the stress-induced leakage current (SILC) to the applied field is observed and analyzed. The results suggest that one major problem for the potential use of rare earth oxides in future MOS technology is the existence of relaxation effects. The cross-sectional value of the bulk oxide traps is on the order of $hbox{10}^{-18} hbox{cm}^{2}$ , thus indicating neutral defects. Direct comparison to reported results on high- $kappa/hbox{Si}$ and $ hbox{SiO}_{2}/hbox{Si}$ structures shows that SILC properties are related to the quality of the dielectric layers; the semiconductor substrate is immaterial.      

溅射后退火反应法制备GaN薄膜的结构与发光性质

报道了用溅射后退火反应法在 Ga As (110 )衬底上制备 Ga N薄膜 .XRD、XPS、TEM测量结果表明该方法制备的 Ga N是沿 c轴方向生长的六角纤锌矿结构的多晶薄膜 .PL测量结果发现了位于 36 8nm处的室温光致发光峰.