Pd/Zn/Pd/Au ohmic contacts to ρ-Type InP

Low resistance ohmic contacts (ρ_c = 7 x 10^-5 Ω-cm ² ) have been fabricated to Zn-doped p-type InP using an annealed Pd/Zn/Pd/Au metallization. Palladium reacts with InP at low temperatures to form a Pd₂InP ternary phase, which is initially amorphous but crystallizes and grows epitaxially on InP. Zinc reacts with some of the overlying Pd to form PdZn (≅250° C), which decomposes at 400-425° C to form PdP₂, freeing up Zn to diffuse into Au as well as InP. The contact resistance reaches a minimum as the decomposition reaction takes place. The resultant ohmic contact is laterally uniform and consists of epitaxial Pd₂InP adjacent to InP, followed by a thin layer of PdP₂ and then the outer Au layer. Further annealing leads to a breakdown of the contact structure,i.e. decomposition of Pd₂InP, and an increase in contact resistance.     

Characterization of TiN/TiSi2 bilayer for application to ULSI

The properties of TiN/TiSi₂ bilayer formed by rapid thermal annealing (RTA) in an NH₃ ambient after the titanium film is deposited on the silicon substrate is investigated. It is found that the formation of TiN/TiSi₂ bilayer depends on the RTA temperature and a competitive reaction for the TiN/TiSi₂ bilayer occurs at 600°C. Both the TiN and TiSi₂ layers represent titanium-rich films at 600°C anneal. The TiN layer has a stable structure at 700°C anneal while the TiSi₂ layer has C₄₉ and C₅₄ phase. Both the TiN and TiSi₂ layers have stable structures and stoichiometries at 800°C anneal. When the TiN/TiSi₂ bilayer is formed, the redistribution of boron atoms within the TiSi₂ layer gets active as the anneal temperature is increased. According to secondary ion mass spectroscopy analysis, boron atoms pile up within the TiN layer and at the TiSi₂−Si interface. The electrical properties for n⁺ and p⁺ contacts are investigated. The n⁺ contact resistance increases slightly with increasing annealing temperature but the p⁺ contact resistance decreases. The leakage current indicates degradation of the contact at high annealing temperature for both n⁺ and p⁺ junctions.     

Electrical characteristics of palladium silicide

Resistivity and Hall mobility measurements were performed on Pd₂Si films grown on <100〉 and <111〉 oriented silicon substrates as a function of temperature and thickness of the films. The results show that Pd₂Si has metallic character. The Debye temperature of Pd₂Si was found to be 120±20°K and the concentration of the charge carriers, which are electrons, is 4 × 10²¹ cm^?3. The bulk value of the resistivity at room temperature is 25–30 ωΩcm and the Hall mobility is 50–60 cm² V^?1 sec^?1, both depending on the structure of Pd₂Si which is known to be epitaxial on <111〉 substrate but not on <100〉 substrate. This structural difference is clearly reflected by the electrical characteristics.     

Temperature dependence of contact resistance for Au-Ti-Pd<Subscript>2</Subscript>Si-<Emphasis Type="Italic">n</Emphasis><Superscript>+</Superscript>-Si ohmic contacts subjected to microwave irradiation

Based on a theoretical analysis of the temperature dependence of the contact resistance R _c for an Au-Ti-Pd₂Si-n ⁺-Si ohmic contact, a current-transfer mechanism explaining the experimentally observed increase in R _c in the temperature range 100–380 K is proposed. It is shown that microwave treatment of such contacts results in a decrease in the spread of R _c over the wafer and a decrease in the value of R _c whilst retaining an increase in R _c in the temperatures range 100–380 K.     

The specific contact resistance of Pd2Si contacts on n- and p-Si

The specific contact resistance ρ_c of Al and Pd₂Si contacts has been measured on p- and n-Si substrates of uniform resistivity. The variation of ρ_c with substrate resistivity is described by the following equations:

The specific contact resistance of Al contacts was found to be lower than the values of Pd₂Si contacts on p-Si. Pd₂Si contacts on both n- and p-Si, (111) orientation, become non-ohmic in the resistivity range $\text{0.020?0.10 Ω-}\text{cm}$.The data in this study are not sufficient to distinguish a variation in ρ_c with substrate orientation. Specific contact resistance values of Pd₂Si contacts on $\text{0.005 Ω-}\text{cm}\text{(100) n-}\text{Si}$ and $\text{0.010 Ω-}\text{cm}\text{(100) p-}\text{Si}$ were not significantly different from values expected for the (111) substrates.     

Chromium thin film as a barrier to the interaction of Pd2Si with Al

Backscattering spectrometry with 2.3 and 2.0 MeV ⁴He⁺ have been used to study the role of Cr as a barrier in the interaction of Pd₂Si with Al. Samples of palladium silicide (Pd₂Si) grown on Si 〈100〉 single crystal and Al evaporated on top, in that order, showed a substantial intermixture of Pd₂Si and Al, and a non-uniform erosion of the Pd₂SiSi interface when heated between 300 and 450°C. With a thin layer of Cr(300–1500 Å) interposed between Pd and Al intermixing of Pd₂Si and Al was suppressed for temperatures up to 500°C and times up to 2 hr. In these samples distinct sublayers of Pd₂Si, CrSi₂ and CrAl_x (where the values of x depends on the relative thicknesses of Al and Cr) are formed. We have noted that whenever there is a thin unreached Cr layer the spectra of the distinct sublayers show sharp boundaries.     

A study of Pd2Si films on silicon using Auger electron spectroscopy

Auger electron spectroscopy (AES) combined with in situ sputter etching is used to quantitatively evaluate the growth kinetics of thin films of Pd₂Si on 〈111〉 Si substrates. The growth of Pd₂Si is found to be diffusion limited and to be characterized by an activation energy of 1·4±0·2 eV in close agreement with previous results obtained on thicker Pd₂Si films. AES is also used to uniquely identify the silicide phase Pd₂Si. Measurement of the expansion occurring during Pd₂Si film formation indicates the Pd₂Si film is about 20% thicker than expected. Correlation of the AES results with careful electrical measurements of the Pd₂Si/Si interface reveals that the contact barrier energy φ_Bn decreases slightly with increasing thickness of the Pd₂Si film. A 3% decrease in φ_Bn was observed for complete conversion of 500 Å of Pd to Pd₂Si.     

Effect of rapid thermally nitrided titanium films contacting silicided and nonsilicided junctions

The effect of rapid thermally nitrided titanium films contacting silicided (titanium disilicided) and nonsilicided junctions has been studied in the temperature range of 800 to 900°C. The rapid thermal nitridation of titanium films used as diffusion barriers between aluminum and silicon, has a major impact on shallow junction complementary metal oxide semiconductor technologies. During the process of rapid thermal nitridation, the dopants in the junctions undergo a redistribution and affect the electrical properties of shallow junction structures. This work focuses on using novel contact resistance structures to measure the variation in electrical parameters for rapid thermally nitrided titanium films annealed at different temperatures. The self-aligned silicide (salicide) junctions in this study were formed using rapid thermally annealed titanium films. Electrical contact resistance testers were used to measure the interface contact resistance between the salicide and silicon, as well as between the metal and the salicide. The results show that the interface contact resistance to the p⁻ diffused salicided junctions increases with rapid thermal nitridation of the additional titanium film, whereas the interface contact resistance to the n⁻ diffused salicided junction shows a decrease. Further, as a function of the rapid thermal annealing temperature (for fixed titanium thickness), the nonsalicided diffusions show an increase in the interface contact resistance. The boron profiles at the TiSi₂/Si interface obtained using secondary ion mass spectroscopy show an excellent qualitative agreement with the electrical results for each of the conditions discussed. The films were also characterized using Rutherford back-scattering spectrometry and transmission electron microscopy and the results show good agreement with the measured variation in electrical parameters. These results also show that as the anneal temperature is increased, the TiN thickness increases, further the change in the silicide/silicon interface position with the nitridation of the additional titanium layer was verified. This work was carried out when the author was working at AT&T Bell Labs     

Effect of Pd Surface Roughness on the Bonding Process and High Temperature Reliability of Au Ball Bonds

A 0.3-μm-thick electrolytic Pd layer was plated on 1 μm of electroless Ni on 1 mm-thick polished and roughened Cu substrates with roughness values (R _a) of 0.08 μm and 0.5 μm, respectively. The rough substrates were produced with sand-blasting. Au wire bonding on the Ni/Pd surface was optimized, and the electrical reliability was investigated under a high temperature storage test (HTST) during 800 h at 250°C by measuring the ball bond contact resistance, R _c. The average value of R _c of optimized ball bonds on the rough substrate was 1.96 mΩ which was about 40.0% higher than that on the smooth substrate. The initial bondability increased for the rougher surface, so that only half of the original ultrasonic level was required, but the reliability was not affected by surface roughness. For both substrate types, HTST caused bond healing, reducing the average R _c by about 21% and 27%, respectively. Au diffusion into the Pd layer was observed in scanning transmission electron microscopy/ energy dispersive spectroscopy (STEM–EDS) line-scan analysis after HTST. It is considered that diffusion of Au or interdiffusion between Au and Pd can provide chemically strong bonding during HTST. This is supported by the R _c decrease measured as the aging time increased. Cu migration was indicated in the STEM–EDS analysis, but its effect on reliability can be ignored. Au and Pd tend to form a complete solid solution at the interface and can provide reliable interconnection for high temperature (250°C) applications.     

New challenges to the modelling and electrical characterisation of ohmic contacts for ULSI devices

Continuing developments in semiconductor process and materials technology have enabled significant reductions to be achieved in the contact resistance R_c of devices. This reduction is commonly assessed in terms of the specific contact resistance (SCR) parameter ρ_c (Ω cm²) of the metal–semiconductor interface. Such a reduction in SCR is essential, for as device dimensions decrease, then so also must ρ_c and the corresponding contact resistance in order not to compromise the down-scaled ULSI device performance. Thus the ability to accurately model contacts and measure ρ_c is essential to ohmic contact development. The cross kelvin resistor (CKR) test structure is commonly used to experimentally measure the Kelvin resistance of an ohmic contact and obtain the specific contact resistance ρ_c. The error correction curves generated from computer modelling of the CKR test structure are used to compensate for the semiconductor parasitic resistance, thus giving the SCR value. In this paper the increased difficulty in measuring lower ρ_c values, due to trends in technology, is discussed. The challenges presented by the presence of two interfaces in silicided contacts (metal-silicide–silicon) is also discussed. Experimental values of the SCR of an aluminium–titanium silicide interface is determined using multiple CKR test structures.     

The formation of low resistance electrical contacts to shallow junction InP devices without compromising emitter integrity

An investigation is made into the possibility of providing low resistance contacts to shallow junction InP devices which do not require sintering and which do not cause device degradation even when subjected to extended annealing at elevated temperatures. We show that the addition of In to Au contacts in amounts that exceed the solid solubility limit lowers the as-fabricated (unsintered) contact resistivityR _c to the 10^-5 ohm-cm² range. If the In content is made to correspond exactly to that required to form the intermediate compound Au₉ln₄, then the contacts so formed are stable, both electrically and metallurgically, even after extended annealing (12 hr) at 400° C. We next consider the contact system Au/Au₂P₃ which has been shown to exhibit as-fabricatedR _c values in the 10^-6 ohm-cm² range, but which fails quickly when heated. We show that the substitution of a refractory metal (W, Ta) for Au preserves the lowR _c values while preventing the destructive reactions that would normally take place in this system at high temperatures. We show, finally, thatR _c values in the 10 ohm-cm² range can be achievedwithout sintering by combining the effects of In or Ga additions to Au contacts with the effects of introducing a thin Au₂P₃ layer at the metal-InP interface.     

InxGa1-xAs ohmic contacts to n-type GaAs prepared by sputter deposition

Thermally stable, low contact resistance InAs/Ni/W contacts were previously prepared by sputter depositing InAs, Ni, and W targets in our laboratory. However, the optimum annealing temperature to provide low contact resistance (R_c) was high, resulting in rough contact surface. In the present experiment, the effects of the In concentrations of In_xGa_1-x As targets on the optimum annealing temperature to prepare low R_cand the surface morphology of the_xGa_1-x/ W contacts were studied. In addition, the electrical properties and the interfacial microstructure were correlated to search the optimum In concentration to provide the minimum R_c, where the interfacial microstructure was analyzed by x-ray diffraction and transmission electron microscopy and the contact resistances (R_cc) were measured by the transmission line method. The optimum annealing temperature to provide minimum R_c was reduced by 150°C by using the In_0.7Ga_0.3As targets instead of the previous targets. The contact resistance of 0.4 Ω-mm was obtained for the In_0.7Ga_0.3As/Ni/W contacts after annealing at temperatures of around 600°C. The R_c values did not deteriorate after annealing at 400°C for 2 h. Also, the surface of this contact was smooth and no evidence of In outdiffusion on the contact surface was seen. Finally, the effect of the In concentrations at the metal/GaAs interfaces on the electrical properties will be discussed.     

Development of Al-free ohmic contact to n-GaN

We have investigated the electrical properties and interfacial reactions of the Si/Ti-based ohmic contacts to Si-doped n-GaN grown by metal organic chemical vapor deposition and the electrical properties were related to the material reactions. Si/Ti contact system was selected because Ti silicides have a low work function comparable to Al and also Si was used widely as an n-type dopant. As the annealing temperature increased, the specific contact resistance of Si/Ti-based ohmic contacts decreased and showed minimum contact decreased and showed minimum contact resistance as low as 3.86 10^?6 cm² after annealing at 900°C for 3 min under N₂ ambient. Our experimental results show that the ohmic behavior of Si/Ti-based contact, were attributed to the low barrier height of Ti-silicide/GaN interface, which was formed through the interfacial reaction between Si and Ti layers. In order to clarify the current conduction mechanism of Si/Ti-based contact, temperature dependent contact resistance measurement was carried out for Au(1000 Å)/Ti(400 Å)/Si(1500 Å)/Ti(150 Å) contact system after annealing at 700°C for 3 min. The contact resistance of Si/Ti-based ohmic contact decreased exponentially with the measuring temperature and so it can be concluded that current flows over the low barrier height by thermionic emission.     

Pd-Ge contact to n-GaAs with the TiW diffusion barrier

Pd-Ge based ohmic contact to n-GaAs with a TiW diffusion barrier was investigated. Electrical analysis as well as Auger electron spectroscopy and the scanning electron microscopy were used to study the contact after it was subjected to different furnace and rapid thermal annealing and different aging steps. All analyses show that TiW can act as a good barrier metal for the Au/Ge/Pd/n-GaAs contact system. A value of 1.45 × 10⁻⁶ Ω-cm² for the specific contact resistance was obtained for the Au/TiW/Ge/Pd/n-GaAs contact after it was rapid thermally annealed at 425°C for 90 s. It can withstand a thermal aging at 350°C for 40 h with its ρ_c increasing to 2.94 × 10⁻⁶Ω-cm² and for an aging at 410°C for 40 h with its ρ_c increasing to 1.38 × 10⁻⁵ Ω-cm².     

The mechanism of contact-resistance formation on lapped n-Si surfaces

Anomalous temperature dependences of the specific contact resistance ρ _c (T) of Pd₂Si-Ti-Au ohmic contacts to lapped n-Si with dopant concentrations of 5 × 10¹⁶, 3 × 10¹⁷, and 8 × 10¹⁷ cm^?3 have been obtained. The anomalous dependences of ρ _c (T) have been accounted for under the assumption that the current flows along nanodimensional metallic shunts, which are combined with dislocations with a diffusionrelated limit in the supply of charge carriers taken into account. The densities of conducting and scattering dislocations in the surface region of the semiconductor are determined.     

Temperature dependence of Al/Ti-based Ohmic contact to GaN devices: HEMT and MOSFET

In this paper two types of Al/Ti-based Ohmic contacts to Gallium Nitride (GaN) based devices are presented; ImplantedN⁺GaN (like the ones found in the Source/Drain of GaN Metal Oxide Semiconductor Field Effect Transistors-MOSFET) and heterojunction (HJ) AlGaN/GaN contacts (Source/Drain of High Electron Mobility Transistors-HEMT). Sheet resistance (R_sh) and contact resistance (R_c) have been investigated in the temperature (T) range of 25-250 °C. It was found that the R_sh (850/700 Ω□) (25/250 °C) and R_c (2.2/0.7 Ωmm) decrease with T for ImplantedN⁺GaN contact and R_sh (400/850 Ω□) and R_c (0.2/0.4 Ωmm) (weakly for R_c) increase with T for HJAlGaN/GaN contact. Numerical computation based models are used to determine the theoretical R_sh and R_c behavior with T and to fit the experimental values.     

The ohmic contact formation mechanism of Au/Pt/Pd ohmic contact to p-ZnTe

The ohmic contact formation mechanism and the role of Pt layer of Au(500Å) Pt(500Å)/Pd(100Å) ohmic contact to p-ZnTe were investigated. The specific contact resistance of Au/Pt/Pd contact depended strongly on the annealing temperature. As the annealing temperature increased, the specific contact resistance decreased and reached a minimum value of 6×10^?6 Θcm² at 200°C. From the Hall measurement, the hole concentration increased with the annealing temperature and reached a maximum value of 2.3×10¹⁹ cm^?3 at 300°C. The Schottky barrier height decreased with the increase of annealing temperature and reached a minimum value of 0.34 eV at 200°C and it was due to the interfacial reaction of Pd and ZnTe. Therefore, the decrease of contact resistance was due to the increase of doping concentration as well as the decrease of Schottky barrier height by the interfacial reaction of Pd ZnTe. The specific contact resistances of Au Pd, Au/Pt/Pd and Au/Mo/Pd as a function of annealing time was investigated to clarify the role of Pt layer.     

Electrical properties of fine line printed and light‐induced plated contacts on silicon solar cells

The properties of fine‐line printed contacts on silicon solar cells, in combination with light‐induced plating (LIP), are presented. The seed layers are printed using an aerosol system and a new metallization ink called SISC developed at Fraunhofer ISE. The influence of multiple layer printing on the contact geometry is studied as well as the influence of the contact height on the line resistivity and on the contact resistance. The dependence between contact resistance and contact height is measured using the transfer length model (TLM). Further on, it is explained by taking SEM images of the metal–semiconductor interface, that a contact height of less than 1 µm or a minimum ink amount of only 4–6 mg is sufficient to contact a large area (15·6 cm × 15·6 cm) silicon solar cell on the front side and results in a contact resistance R_c × W < 0·5 Ω cm. As the line resistivity of fine‐line printed fingers needs to be reduced by LIP, three different plating solutions are tested on solar cells. The observed differences in line resistivity between ρ_f = 5 × 10⁻⁸ and 2 × 10⁻⁸ Ω m are explained by taking SEM pictures of the grown LIP‐silver. Finally, the optimum LIP height for different line resistivities is calculated and experimentally confirmed by processing solar cells with an increasing amount of LIP silver. Copyright © 2010 John Wiley & Sons, Ltd.     

NiGe-based ohmic contacts to n-type GaAs

Refractory NiGe ohmic contacts which have excellent thermal stability and smooth surface have been developed. To apply these contacts to the future very large scale integration GaAs devices, reduction of the contact resistance (R_c) of the NiGe contacts is mandatory. In the present paper, in order to obtain a guideline for the R_c reduction, the formation mechanism of the NiGe contacts was investigated. The NiGe contacts were found to have two different ohmic contact formation mechanisms. These mechanisms suggested that facilitation of heavy doping at the GaAs surface and/or in the Ge layer was very effective to reduce the R_c values of the NiGe contacts. Experimentally, the R_c reduction was demonstrated by adding a small amount of third elements. Direct doping elements (Sn, Sb, and Te) and indirect doping elements (Pd, Pt, Au, Ag, and Cu) were chosen as the third elements. In additon, the effect of addition of In, which forms alow barrier layer between metal and GaAs, was investigated. The contact resistance of these NiGe-based contacts were close to 0.3 Ω mm, and they provided smooth surface and shallow reaction depth. Finally, the NiGe-based contacts were compared with the conventional AuGeNi contact.     

Ultrasmall Pd‐Cu‐Pt Trimetallic Twin Icosahedrons Boost the Electrocatalytic Performance of Glycerol Oxidation at the Operating Temperature of Fuel Cells

Recently, in order to improve the energy conversion efficiency of direct polyol fuel cells, the engineering of effective Pd‐ and/or Pt‐based electrocatalysts to rupture C? C bonds has received increasing attention. Here, an example is shown to synthesize highly uniform sub‐10 nm Pd‐Cu‐Pt twin icosahedrons by controlling the nucleation phase. Because of the synergies of the electronic effect, synergistic effect, geometric effect, and abundant surface active sites originating from the formation of near surface alloy and special icosahedral shape, the Pd‐Cu‐Pt twin icosahedrons exhibit excellent electrocatalytic performance in glycerol electrocatalysis at the operating temperature of direct alcohol fuel cells (70 °C) in KOH electrolyte. The Pd_50.2Cu_38.4Pt_11.4 icosahedrons show mass activities of 9.7 A mg^?1_Pd+Pt and 13.7 A mg^?1_Pd. Furthermore, the Pd_50.2Cu_38.4Pt_11.4 icosahedrons demonstrate long‐term durability in current–time test for 36 000 s and high in situ anti‐CO poisoning performance. In addition, the introduction of CO can enhance electro‐oxidation endurance on Pd_50.2Cu_38.4Pt_11.4 icosahedrons, and the peak mass activity can reach to 14.4 A mg^?1_Pd+Pt. The in situ Fourier transform infrared spectroscopy spectra indicate that the Pd_50.2Cu_38.4Pt_11.4 icosahedrons possess a high capacity to break C? C bonds and may efficiently convert glycerol into CO₂, thus improving the utilization efficiency of energy‐containing molecule glycerol.