Behavior of oxygen diffusion in buffer layers for coated conductors

We have evaluated the effect of annealing in oxygen atmosphere on the structure, texture and phase transformation of LZO films deposited on YSZ (yttria-stabilized zirconia) (0 0 l) single crystal substrates and textured NiW substrates by metal-organic deposition (MOD) method. The results show that the structure stability of the LZO films is heavily dependent on the oxygen partial pressure in annealing process. Then we have in details studied the behavior of oxygen diffusion in three kinds of buffer layer architectures on NiW substrates by varying the temperature, oxygen partial pressure and dwelling time in the annealing process. The oxygen diffusion within buffer layers leads to the oxidation of substrate, and even the texture and structure of buffer layers are destroyed with the increase of the thickness of the oxides layer related to NiW substrate. It reveals that the relative volume of oxides related to NiW substrate increases exponentially with the annealing temperature, and increases linearly with the annealing time at logarithmic scale. The relative intensity of texture peaks of buffer layers decreases and even disappears with the increase of the oxygen partial pressure in annealing process because of the acceleration of the oxidation reaction of substrate. The influence of annealing temperature, oxygen partial pressure and dwelling time on the oxygen diffusion is related to the intrinsic oxygen diffusion coefficient of buffer layers materials. Compared with the increase of oxygen partial pressure, the elongation of dwelling time shows a less effect on the oxidation rate of NiW substrate and a weak destruction of the texture of buffer layers. Except choosing the oxide materials with small oxygen diffusion coefficient as buffer layers in coated conductors, the degree of oxidation about NiW substrate could be greatly controlled and it would result in the less destruction of texture and structure of buffer layers by adjusting the annealing temperature, oxygen partial pressure and dwelling time in the process of YBCO deposition.     

Residual stress analysis for hvof diamalloy 1005 coating on Ti-6Al-4V alloy

HVOF coating of diamalloy 1005 (similar to Inconel 625 alloy) is considered and residual stress developed in the coating is examined. The Finite Element Model (FEM) is used to predict the residual stress while the XRD technique and the curvature method are adopted to measure the residual stress levels in the coating. The FEM simulations resemble the actual experimental conditions. The analytical approximate method also is used to determine the residual stress in the coating. It is found that FEM predictions of residual stress agree with the measurement data, provided that some small differences in the magnitude of the residual stress occurred between the predictions and the experimental data. This is attributed to the assumption of the homogeneous coating structures in the simulations. The oxide compounds are formed around the splats during in-flight, which are scattered in the coating modifying the coating structure. In addition, the approximate solution for the residual stress reasonably agrees with the predictions.     

Fabrication of YBCO films on Ag substrate by TFA-MOD method

Biaxial aligned YBCO films have been successfully deposited on Ag { 110 } (110) textured polycrystalline substrates by metal-organic decomposition (MOD) method using Trifluoroacetate Salt (TFA). The influence of firing temperature and Ag surface defects on phase purity and texture, surface morphology of YBCO films was studied. Holding temperature at 900℃ for 30 rain benefits to improve orientation and connectivity of YBCO films. The surface of YBCO films deposited on unpolished Ag substrate has many holes and stripes, which are parallel to the rolling stripe on Ag substrates. To eliminate the rolling stripe on the Ag surface, Ag substrates were polished prior to films deposition. The film grown on polished Ag substrates has a smooth surface and good connectivity of grains without parallel stripes. The YBCO films have an onset of transition around 90K and critical current densities of 15000 A/cm^2.     

涂层导体用Ni-7%W合金基带的织构分析

采用先进的放电等离子烧结技术(SPS)制备Ni7W合金初始坯锭,通过优化高能球磨和烧结工艺以及后续和热处理工艺制备出高度立方织构的Ni7W合金基带.利用电子背散射衍射(EBSD)技术对Ni7W合金基带的晶粒取向、晶界特征等信息进行采集和分析,对其织构进行了表征.该基带无需抛光,即可获得高花样质量的电子背散射衍射图像.EBSD测试结果表明:该Ni7W基带表面10°以内立方织构晶粒质量分数高达99.4%,10°以内晶界长度质量分数为93.6%,具有高质量的立方织构.     

YBCO厚膜用立方织构Ni基带的X射线衍射研究

用冷轧和再结晶退火技术制备了ＹＢＣＯ超导厚膜用的立方织构Ｎｉ基带。并且对所制备的立方织构Ｎｉ基带进行了Ｘ射线衍射研究。提出并讨论了Ｎｉ基带立方织构质量评价实验中容量出现的问题。     

Tribological behaviour and residual stress of electrodeposited Ni/Cu multilayer films on stainless steel substrate

In the present study, [Ni (4.5 nm)/Cu (t_Cu = 2, 4 and 8 nm)] multilayers were pulse electrodeposited on stainless steel (AISI SS 304) substrate from sulphate based single bath technique. X-ray diffraction (XRD) was used to investigate the structure and stress of the Ni/Cu multilayer. The results from XRD analysis indicated that the deposited multilayers had a preferred crystal orientation of [111] and presence of satellite reflection suggested the formation of superlattice. The stress level within the deposited multilayers was found to be sensitive to the sublayer thickness. Sliding wear behaviour of electrodeposited Ni/Cu multilayer films has been investigated against a tungsten carbide (WC) ball as the counter body and compared with that of the constituents, Cu and Ni coatings. The wear tests were carried out by using a reciprocating ball-on-flat geometry at translation frequencies of 5 and 10 Hz, slip amplitude of 1 mm and at five different loads of 3, 5, 7, 9 and 11 N. Friction force was recorded on-line during the tests. At the end of the tests, the wear scars were examined by laser surface profilometry and scanning electron microscopy (SEM). Friction coefficient was found to be dependent on load and Cu layer thickness (t_Cu) and the values for multilayers were border between Ni and Cu. Among multilayers, sample with minimum t_Cu has shown the lowest friction coefficient and wear rate. With increasing t_Cu, the wear mechanism changes from pure abrasive wear at t_Cu = 2 nm, to particle entrapment at t_Cu = 4 nm to particle embedding at t_Cu = 8 nm. Detailed investigation of the wear scar morphology as well as wear rate measurement revealed that at low loads, (H/E) ratio and residual stress governed the wear rate and the principle wear mode was abrasive cutting. At intermediate loads, the role of residual stress became insignificant while wear was governed by (H/E) ratio and plastic deformation. However, at higher loads, plastic deformation played the major role.     

在金属Ni基带上用非真空涂覆工艺制备的YBCO厚膜的晶粒形貌

在金属Ni基带上，用旋转匀胶（spin)和刷涂（printing)工艺制备了具有c轴择优取向的YBCO厚膜，厚膜表面晶粒呈菊花和多边形状，菊花尺寸在0．2－0．5mm左右，最大尺寸达到1mm以上，多边形状晶粒常处在菊花的中心位置，MPMP（改进的粉末熔化工艺粉）试样中主要出现菊花状晶粒，多边形状晶粒基本不出现，PMP（粉末熔化工艺粉）试样中2种形貌晶粒一般同时存在。添加中间层（Ag)之后，菊花状晶粒消失或变得很不明显，X射线衍射分析表明，试样主要由Y123相组成并具有一定的C轴择优取向。     

Relation of Deposition Condition with Microstructure of YBCO Film and YSZ Buffer Layer on Metallic Substrate

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残余应力测量研究现状综述

针对残余应力测量的重要性,对其测量方法进行综述和展望。阐述传统的残余应力测量方法的原理及应用情况,包括传统机械释放法和非破坏性无损伤测量法;主要介绍几种新型的残余应力测量方法及其原理;并指出残余应力的测量技术正朝着无损、在线测量、绿色等方向发展。     

机械阻碍应力对铸造残余应力影响的研究

通过在实验室与生产条件下所进行的判断性试验确证,机械阻碍应力对铸造残余应力的大小、分布有着极为显著的影响.其影响机制就在于影响了铸造应力的产生与形成的全过程.其本身作为一类应力具有"临时性",而其对残余应力的影响是永久的.     

Residual stress evolution during the thermal cycling of plasma-sprayed zirconia coatings

X-ray diffraction has been used for the residual stress evaluation in two plasma-sprayed zirconia coatings: yttria-partially-stabilized zirconia and dysprosia-partially-stabilized zirconia. Following the evolution of these stresses with thermal cycling, an attempt at correlation between this evolution and the characteristics of the two coatings is undertaken.     

Residual stress analysis on silicon wafer surface layers induced by ultra-precision grinding

Grinding residual stresses of silicon wafers affect the performance of IC circuits. Based on the wafer rotation ultra-precision grinding ma-chine, the residual stress distribution along grinding marks and ground surface layer depth of the ground wafers are investigated using Raman microspectroscopy. The results show that the ground wafer surfaces mainly present compressive stress. The vicinity of pile-ups between two grinding marks presents higher a compressive stress. The stress value of the rough ground wafer is the least because the material is removed by the brittle fracture mode. The stress of the semi-fine ground wafer is the largest because the wafer surface presents stronger phase trans-formations and elastic-plastic deformation. The stress of the fine ground wafer is between the above two. The strained layer depths for the rough, semi-fine, and fine ground wafers are about 7.6 m, 2.6 m, and 1.1 m, respectively. The main reasons for generation of residual stresses are phase transformations and elastic-plastic deformation.     

球形封头热冲压成形残余应力分析

球形封头在其直边段易发生折皱和开裂,残余应力过大是造成其缺陷的根本原因之一.针对无损X射线衍射法、有损全释放法这两种残余应力测试方法的检测原理、测试方法及应用特点等方面进行了分析介绍.以12Cr2Mol R(H)材料为例,采用两种方法分别测量了球形封头热冲压成形后的外壁残余应力值.揭示了封头外壁残余应力分布规律:封头外壁的残余应力值由底部开始逐渐增大,过渡段为应力值转折区域,进入直边段后,残余应力值达到最大.通过对比发现:两种测量方法测得的残余应力变化规律相似;全释放法测得的残余应力值较大;残余应力值在封头外壁直边段部分达到最大.     

Residual stress relaxation in typical weld joints and its effect on fatigue and crack growth

Many factors influence the fatigue and crack growth behavior of welded joints. Some structures often undergo fairly large static loading before they enter service or variable amplitude cyclic loading when they are in service. The combined effect of both applied stress and high initial residual stress is expected to cause the residual stresses relaxation. Only a few papers seem to deal with appropriate procedures for fatigue analysis and crack growth by considering the combined effect of variable amplitude cyclic loading with residual stresses relaxation. In this article, some typical welded connections in ship-shaped structures are investigated with 3-D elastic-plastic finite element analysis. The effect of residual stress relaxation, initial residual stress, and the applied load after variable amplitude cyclic loading is revealed, and a formula for predicting the residual stress at hot spot quantitatively is proposed. Based on the formula, an improved fatigue procedure is introduced. Moreover, crack growth of typical weld joints considering residual stresses relaxation is studied.     

缓冲层对堆焊合金层性能的影响

在Q235A基体上采用药芯焊丝埋弧焊和自保护明弧焊方式依次堆焊了20Cr2Mn12Ni Mo N塑性缓冲层+含外加Ti C颗粒的耐磨层的堆焊合金,并与无缓冲层的堆焊合金进行分析比较。试验结果表明,增加塑性缓冲层一方面可降低耐磨层成分稀释影响,有利于耐磨合金层组织保持稳定;另一方面有效降低堆焊合金层的硬度梯度,使之避免残余应力集中而导致过早失效。     

基于神经网络的曲轴残余应力预测

基于曲轴强化的残余应力理论,将人工神经网络引入发动机曲轴圆角的残余应力预测中,首先利用DEFORM有限元软件对480Q曲轴进行滚压试验,得到数组不同滚压参数对应的残余应力,然后根据此数据建立了比较稳定的神经网络,并利用此网络预测曲轴圆角滚压后的残余应力.该神经网络与有限元分析结果比较接近,为曲轴滚压中残余应力预测提供了一种新方法.     

An alternative micro-area X-ray diffraction method for residual stress measurement of Pb(Zr,Ti)O3 film

An alternative X-ray diffraction method for micro-area residual stress measurement was proposed by means of the analysis of a single diffraction ring, which was performed on a laboratory X-ray microdiffraction system equipped with a 2D planar detector. The microdiffraction experiments were employed to evaluate the residual stress in sol-gel-derived Pb(Zr,Ti)O₃ film before and after Ag electrode deposition. The tensile stresses of about 2.3 GPa and 1.2 GPa were calculated in the micro-area of film without and with electrode, which was related to a top electrode stress relaxation effect.     

超声检测表面残余应力的研究与发展

金属表面与内部残余应力的存在对构件的力学性能有重大影响.介绍了超声检测残余应力的研究现状和应用领域,从分析超声检测残余应力的原理、方法和特点着手,为开发能满足现场使用要求的检测系统,对几个关键技术进行了重点分析,并指出超声检测残余应力的发展方向和广阔的应用前景,为开展进一步研究提供借鉴与指导.     

冷轧铜铝复合板结合界面残余应力分析

针对冷轧铜铝双层板金属的变形特征以及各轧制工艺下界面残余应力的分布情况,采用有限元计算方法,分别将轧制速度、异径同步、异径异步各工艺产生的界面残余应力进行分析。研究结果表明,冷轧铜铝双层板的复合变形过程可分为4部分;铜板复合面的应变直接影响复合效果;异径同步轧制铜铝复合板时,随着辊径比的增大,铜板复合面的总变形量增大,当辊径比大于1．6时,总变形的增量不明显,辊径比取1．4~1．6时,残余应力较小;异径异步轧制铜铝复合板时,随着辊径比的增大,铜板复合面的总变形量增大,轧制速比取1．2~1．4时,残余应力较小。