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利用高分辨电感耦合等离子体质谱测定半导体级高纯硝酸中的痕量金属杂质,用膜去溶进样系统直接进样,用标准加入法进行上机检测,无需前处理,快速,避免了在样品前处理时的污染问题。高分辨电感耦合等离子体质谱可以消除多分子离子干扰,降低检出限,提高定量准确性。方法的检出限为0.69~23.73ng/L,加标回收率为88.2%~106.0%,方法简单,结果可靠,适用于高纯硝酸中痕量元素的快速测定。 相似文献
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用高分辨电感耦合等离子体质谱测定半导体级高纯双氧水中的痕量金属杂质,用直接稀释法,把高纯双氧水稀释10倍后,用标准加入法进行上机检测,前处理简单、快速,避免了在样品前处理时的污染问题。高分辨电感耦合等离子体质谱可以消除多分子离子干扰,降低检出限,提高定量准确性。方法的检出限为0.34~15.36 ng/L,加标法回收率为90.1%~102.5%。方法简单,结果可靠,适用于高纯双氧水中痕量元素的快速测定。 相似文献
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化合物半导体由于其复杂的基体效应,给表面定量分析带来了很大困难。如何提高分析精度,对痕量元素作出定量分析,是定量分析的一个难点。近年来,随着半导体集成电路工业的发展和表面分析技术的进一步提高,出现了一些适用于砷化镓及其它半导体材料二次离子质谱定量分析的新方法。这里简要介绍了它们的特点、分析计算步骤和分析精度。根据不同情况,有选择地运用这些方法,可对砷化镓材料的背景杂质浓度及掺杂元素分布进行定量分析,可获得较好的精度,从而实现对材料制备和器件制作等工艺过程的监控。 相似文献
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建立微波消解-石墨炉原子吸收光谱法(GF-AAS)测定纳米二氧化钛中痕量杂质砷的分析方法,以快速完全消解二氧化钛基体并且准确测定痕量杂质砷。方法采用氢氟酸、硝酸混合试剂结合高压密闭微波加热技术,解决二氧化钛难消解和低酸度溶液中高钛基体容易水解等难点。通过基体效应影响试验,优选采用热解涂层石墨管,优化石墨炉升温原子化控制程序以及原子吸收光谱仪工作条件等检测参数,消除热稳定性强的二氧化钛基体对测定易挥发痕量元素砷的影响。结果表明:方法检出限为0.02μg/L,回收率为93.0%~106.0%,相对标准偏差9.36%,与ICP-MS检测方法结果对照一致。 相似文献
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《现代测量与实验室管理》2017,(4)
高纯多晶硅中的痕量杂质能够影响多晶硅的少子寿命,影响多晶硅的光学电学性能,所以,检测控制多晶硅中痕量杂质是保证多晶硅质量的重要指标。为保证高纯多晶硅中痕量元素的检测准确性,对实验过程中涉及到的水、容器、温湿度等因素进行研究,以确定这些因素的影响。结果表明:使用聚四氟乙烯材质的容器能够降低空白值,使用Milli-Q制水机制出的超纯水中的杂质比厂区生产的纯水低等。同时,对实验容器的清洗,溶剂的选择,人员的优化提出了相应的控制措施,确保所用的器皿、试剂等不受污染,尽量减小空白值。 相似文献
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《现代测量与实验室管理》2018,(6)
应用电感耦合等离子体质谱仪(ICP-MS),对多晶硅料块表面金属杂质Fe,Cr,Ni,Cu,Zn,Na,元素进行检测。本文研究了样品的处理方法,确定了适宜的实验条件,使用该方法能准确、快速的检测多晶硅表面的金属杂质含量,适用于商用实验室中的检测,符合企业中工业化的检测需求。其检测方法对多晶硅中的金属杂质Fe,Cr,Ni,Cu,Zn,Na,元素的检出限达到0. 01ng/g左右,精密度较好,Fe的加标溶液的回收率为90!109%,满足痕量杂质检测的要求。 相似文献
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V. Balaram 《Bulletin of Materials Science》2005,28(4):345-348
With continual decrease of geometries used in modern IC devices, the trace metal impurities of process materials and chemicals
used in their manufacture are moving to increasingly lower levels, i.e. ng/g and pg/g levels. An attempt is made to give a
brief overview of the use of different analytical techniques in the analysis of trace metal impurities in ultrapure materials,
such as, high-purity tellurium (7N), high purity quartz, high-purity copper (6N), and high purity water and mineral acids.
In recent times mass spectrometric techniques such as ICP-MS, GD-MS and HR-ICP-MS with their characteristic high sensitivity
and less interference effects were proved to be extremely useful in this field. A few examples of such application studies
using these techniques are outlined. The usefulness of other analytical techniques such as F-AAS, GF-AAS, XRF, ICP-AES and
INAA was also described. Specific advantages of ICP-MS and HR-ICP-MS such as high sensitivity, limited interference effects,
element coverage and speed would make them powerful analytical tools for the characterization of ultrapure materials in future. 相似文献
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镓熔点是ITS-90国际温标中重要的定义固定点,在温度计量研究中起着重要作用。由于高纯镓从液态转化为固态时,体积膨胀约3.1%,传统玻璃外壳的镓熔点容器在冻制过程中很容易造成损坏。为了解决这一难题,设计了一种具有金属外壳的镓熔点装置,以该装置为对象,开展了2种不同镓熔点复现方法和2种不同复现装置对镓相变温坪影响方面的研究,并与国外同类型装置的性能进行了比较。实验结果表明:不同镓点容器复现的镓熔点温度在0.02 mK范围内一致,高纯镓中的微量杂质是造成差异的主要原因;外液-固界面复现方法比双液-固界面复现方法得到的温坪值低0.09 mK;不同复现装置对镓熔点温坪的影响较小。 相似文献
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Oxidation of non-precious metals nickel, chromium and copper, nickel-base alloys in an air atmosphere was studied under differential thermal analysis. The results suggest that adding chromium and copper to high-purity nickel metal reduces the amount of oxidation and gives a slower oxidation than in untreated high-purity metals. It is then shown that the activation energy for oxidation in nickel-base alloys is almost the same as that in high-purity nickel metal when alloying elements are added to nickel. 相似文献
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A. A. Vikharev G. G. Denisov Vl. V. Kocharovskiĭ S. V. Kuzikov V. V. Parshin N. Yu. Peskov A. N. Stepanov D. I. Sobolev M. Yu. Shmelev 《Technical Physics Letters》2007,33(9):735-737
A new microwave switch is proposed, in which the active element represents a metal reflector with a semiconductor plate on a mirror surface. The wave beam phase switching is ensured by a conducting layer formed in the semiconductor by laser radiation with quantum energy approximately equal to the bandgap width. Using a disk of high-purity silicon irradiated by a pulsed Ti:sapphire laser, a 180° phase switching in a 30-GHz wave beam has been studied. At a low microwave power level, the wave phase was effectively switched during a time on the order of several nanoseconds. 相似文献
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Pinpoint and bulk electrochemical reduction of insulating silicon dioxide to silicon 总被引:1,自引:0,他引:1
Silicon dioxide (SiO(2)) is conventionally reduced to silicon by carbothermal reduction, in which the oxygen is removed by a heterogeneous-homogeneous reaction sequence at approximately 1,700 degrees C. Here we report pinpoint and bulk electrochemical methods for removing oxygen from solid SiO(2) in a molten CaCl(2) electrolyte at 850 degrees C. This approach involves a 'contacting electrode', in which a metal wire supplies electrons to a selected region of the insulating SiO(2). Bulk reduction of SiO(2) is possible by increasing the number of contacting points. The same method was also demonstrated with molten LiCl-KCl-CaCl(2) at 500 degrees C. The novelty and relative simplicity of this method might lead to new processes in silicon semiconductor technology, as well as in high-purity silicon production. The methodology may be applicable to electrochemical processing of a wide variety of insulating materials, provided that the electrolyte dissolves the appropriate constituent ion(s) of the material. 相似文献
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This review summarizes the results of systematic studies aimed at developing processes for the preparation of high-purity gallium from semiconductor fabrication waste. A classification is proposed for Gacontaining waste materials according to the host and impurity compositions. We compare the efficiencies of different processes for the fine purification of crude gallium recovered from waste materials: wet-chemical processing, vacuum heat treatment, filtration, electrorefining, and directional solidification. Taking into account the behavior of impurities during the purification process and the nature of the waste materials, we have developed a multistep, environmentally safe process for preparing high-purity (99.9999%) gallium from unconventional raw materials. The product of this process compares well with gallium produced from conventional raw materials. We demonstrate that the use of semiconductor fabrication wastes as raw materials in large-scale-production of high-purity gallium and related microelectronic products is a commercially viable approach. 相似文献
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Hideharu Matsuura Miyuki Takahashi Shunji Nagata Kazuo Taniguchi 《Journal of Materials Science: Materials in Electronics》2008,19(8-9):810-814
In order to characterize traps in semi-insulating 4H-SiC and HgI2 regarded as an attractive semiconductor for X-ray detectors, we apply discharge current transient spectroscopy (DCTS), which is a graphical peak analysis method based on the transient reverse current of a diode. In high-purity semi-insulating 4H-SiC whose diode may detect X-rays or γ-rays, DCTS can detect two types of trap species, and can determine those densities and emission rates. The emission rates of detected traps are close to each other, suggesting that thermally stimulated current (TSC) may not distinguish between these two types of traps. In semi-insulating HgI2, the densities and emission rates of two types of trap species are also determined by DCTS. Therefore, it is demonstrated that DCTS is a powerful method for determining the densities and emission rates of traps in semi-insulating semiconductors 相似文献